CN109387981B - Backlight module and liquid crystal display panel - Google Patents
Backlight module and liquid crystal display panel Download PDFInfo
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- CN109387981B CN109387981B CN201811565143.1A CN201811565143A CN109387981B CN 109387981 B CN109387981 B CN 109387981B CN 201811565143 A CN201811565143 A CN 201811565143A CN 109387981 B CN109387981 B CN 109387981B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133608—Direct backlight including particular frames or supporting means
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133612—Electrical details
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- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Planar Illumination Modules (AREA)
Abstract
The present invention provides a backlight module and a liquid crystal display panel,comprises a back plate, a plurality of through holes penetrating through the back plate; the circuit boards are spliced on the back plate, a splicing gap is formed between every two adjacent circuit boards, and the through holes correspond to the splicing gap; the supporting layer is filled in the through hole and the splicing gap; the lamp beads are uniformly distributed on each circuit board; on each circuit board, the distance between the centers of two adjacent lamp beads is P, and the distance between the center of the lamp bead close to the edge of the circuit board and the edge of the circuit board is L1The width of the splicing gap is H, wherein P is 2L1+ H. The invention has simple assembly, can realize the heavy processing of products and improve the light and taste effect of the liquid crystal display panel.
Description
Technical Field
The invention relates to a backlight module and a liquid crystal display panel.
Background
The Mini-LED is used for the LCD display backlight source in the market, and can realize ultrathin, multiple partitions and small-size chip products, so that the Mini-LED can be comparable to OLED products in the practical effect, and has more competitive advantages than the OLED products in the material cost and is proposed for use.
In the design process of the Mini-LED backlight, the size of the current Mini-LED binding machine is limited, and the size of a single Mini-LED backlight panel is limited. When a Mini-LED lamp panel is adopted in the backlight design of a large-size television, a plurality of Mini-LED lamp panels are spliced. The design distance of the nearest Mini-LED between the adjacent PCB boards is assumed to be L, and the distance of the adjacent lamp beads in the PCB boards is assumed to be P. In general, to ensure good taste, L ═ P is desirable to ensure a uniform brightness transition between panels. However, there is tolerance in the external dimensions of the PCB and assembly tolerance in the assembly process, which cannot effectively guarantee L ═ P. When L > P, the plates are highlighted as dark lines. Particularly, when the surface of the PCB is subjected to white paint treatment and the reflection of the abutted seam area is insufficient, the PCB shows a dark line state; when L < P, a bright line is highlighted between the plates.
Suppose that the distance between the edge LED in the lamp panel and the edge of the lamp panel is L1 at this time. If L1 is L/2, the requirement for PCB size control and assembly accuracy is very high to achieve L1 is P.
In addition, in the lamp panel overlapping process, in order to ensure flatness and realize ultrathin design as much as possible, an adhesive tape adhesion mode is usually adopted for fixing the lamp panel, and the mode can effectively ensure flatness and realize ultrathin design, but also has the problems of complex mounting process, difficulty in reworking and the like.
Disclosure of Invention
The invention aims to provide a backlight module and a liquid crystal display panel, which can effectively solve the problems of poor light quality, poor splicing, complex process, difficulty in reworking and the like.
In order to solve the above technical problems, the present invention provides a backlight module and a liquid crystal display panel, including a back plate having a plurality of through holes penetrating through the back plate; the circuit boards are spliced on the back plate, a splicing gap is formed between every two adjacent circuit boards, and the through holes correspond to the splicing gap; the supporting layer is filled in the through hole and the splicing gap; and the lamp beads are uniformly distributed on each circuit board.
Further, the support layer comprises a first support layer which is arranged in the through hole and forms a support part in the corresponding through hole; the second supporting layer is connected with the first supporting layer, filled in the splicing gap and used for bonding the circuit boards on two sides of the splicing gap, and is provided with supporting strips corresponding to the splicing gap; and the third supporting layer is connected with the second supporting layer and protrudes out of the surface of the circuit board, the third supporting layer is provided with a plurality of supporting salient points, and each supporting salient point is adhered to the circuit board on two sides of the splicing gap.
Further, in the through hole, the supporting part is a cylinder; in a concatenation gap, the support bar is the cuboid, and each support bar corresponds there is at least one supporting part.
Furthermore, the supporting salient points are hemispherical, and at least one supporting salient point is arranged in each supporting strip correspondingly in one splicing gap.
Furthermore, in all the splicing gaps, all the supporting bars are staggered with each other to form the second supporting layer with a grid-shaped structure.
Further, the width of the second supporting layer is 0.5-2 mm, and the height of the second supporting layer is 0.5-2 mm; the height of the third supporting layer is 1-2 mm, and the width of the third supporting layer is 1-3 mm.
Further, the support layer is polycarbonate plastic; the reflectivity of the support layer is 85%.
Furthermore, the circuit board is of a rectangular structure and comprises long edges and short edges; the number of the through holes between the adjacent long edges of the two adjacent circuit boards is 3-5; the number of the through holes between the adjacent short edges of the two adjacent circuit boards is 2-4.
Further, on each circuit board, the distance between the centers of two adjacent lamp beads is P, the distance between the center of the lamp bead close to the edge of the circuit board and the edge of the circuit board is L1, the width of the splicing gap is H, wherein P is 2L1+ H.
The invention also provides a liquid crystal display panel comprising the backlight module.
The invention has the beneficial effects that: the invention provides a backlight module and a liquid crystal display panel. Can realize easy operation, circuit board concatenation is effectual, and the distance that the distance was the same with the distance of adjacent lamp pearl on the lamp plate between the lamp pearl of utilizing the structure of supporting layer to control adjacent lamp plate can improve light taste effect.
Drawings
The invention is further described below with reference to the figures and examples.
FIG. 1 is a schematic view of a backlight module according to the present invention;
FIG. 2 is a schematic diagram of a circuit board assembly structure according to the present invention;
a backlight module 10; liquid crystal display panel 20
A back plate 11; a through hole 12; a circuit board 13;
a splicing gap 14; a support layer 15; a lamp bead 16;
a fluorescent film 17; a diffusion sheet 18; a brightness enhancement film 19;
a first support layer 151; a second support layer 152; a third support layer 153;
a support portion 1511; a support strip 1521; a bump 1531;
a lower polarizer 21; an array substrate 22; a liquid crystal 23;
a color film substrate 24; and an upper polarizing plate 25.
Detailed Description
The following description of the embodiments refers to the accompanying drawings for illustrating the specific embodiments in which the invention may be practiced. Directional phrases used herein, such as, for example, upper, lower, front, rear, left, right, inner, outer, lateral, etc., refer only to the orientation of the accompanying drawings. The names of the elements, such as the first, the second, etc., mentioned in the present invention are only used for distinguishing different elements and can be better expressed. In the drawings, elements having similar structures are denoted by the same reference numerals.
Embodiments of the present invention will be described in detail herein with reference to the accompanying drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. These embodiments are provided to explain the practical application of the invention and to enable others skilled in the art to understand the invention for various embodiments and with various modifications as are suited to the particular use contemplated.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1, the present invention provides a backlight module 10, which includes a back plate 11, a plurality of circuit boards 13, a supporting layer 15, beads 16, a fluorescent film 17, and a brightness enhancement film 19.
The circuit boards 13 are spliced on the back plate 11. In this embodiment, each circuit board 13 is a rectangular structure with the same size. Each circuit board 13 includes a long side and a short side. When the circuit boards are spliced, between two adjacent circuit boards 13, the long side 131a is aligned with the long side 131b, and the short side 132a is aligned with the short side 132b, so that the circuit board array structure is formed.
As shown in fig. 2, a splicing gap 14 is provided between two adjacent circuit boards, that is, a reserved splicing gap 14a is provided between long sides of two adjacent circuit boards, and similarly, a reserved splicing gap 14b is provided between short sides of two adjacent circuit boards. The splicing slits 14b corresponding to the short sides and the splicing slits 14a corresponding to the long sides are staggered horizontally and vertically to form a grid-shaped structure.
Referring to fig. 1 and fig. 2, the supporting layer 15 is filled in the splicing gaps 14, and meanwhile, in order to further increase the stability of the supporting column 15, in this embodiment, a plurality of through holes 12 are provided on the back plate 11, each through hole 12 corresponds to one of the splicing gaps 14, and the through hole 12 penetrates through the back plate 11. The support layer 15 also extends into the through hole 12 to enhance the stability and the firmness of the support layer 15 in the splicing gap 14.
Since the splicing gaps 14b corresponding to the short sides and the splicing gaps 14a corresponding to the long sides are staggered horizontally and vertically to form a grid-shaped structure, correspondingly, the supporting layer 15 also forms a network-shaped structure staggered horizontally and vertically.
Specifically, at least one through hole 12 is provided at a corresponding position of each splicing gap 14. The number of the positions of the splicing gaps 14a corresponding to the long sides of the circuit board 13 is set according to the length of the splicing gaps 14 a. In this embodiment, at the position corresponding to the splicing gap 14a, the number of the through holes 12 is set to 3-5, preferably 4, and of course, the number of the through holes 12 is also related to the diameter of the through holes 12, and in this embodiment, the number of the through holes 12 is set by comprehensively considering the length of the splicing gap 14 and the diameter of the through holes 12. Similarly, the number of the splicing gaps 14b corresponding to the short sides of the circuit board 13 is also set according to the length of the splicing gaps 14b, in this embodiment, the number of the through holes 12 is set to 2-4, preferably 3 or 4, at the corresponding positions of the splicing gaps 14 b.
In order to control the width of the splicing gap 14 between two adjacent circuit boards 13 and to enable the circuit boards 13 to be stably fixed on the back plate 11, the structure of the supporting layer 15 needs to be specially designed, and meanwhile, a certain performance requirement is also needed for the material of the supporting layer 15 to be able to effectively fix the circuit boards 13, and the width of the splicing gap 14 between the circuit boards 13 can be controlled to improve the light emitting performance of the backlight module 10.
In this embodiment, the supporting layer 15 is made of polycarbonate plastic, and the polycarbonate plastic has high strength and elastic coefficient, high impact strength, wide application temperature range, low forming shrinkage, good dimensional stability, good fatigue resistance, good weather resistance, excellent electrical characteristics, no odor, no harm to human body, and good hygienic safety; the reflectivity of the supporting layer 15 is 85%, and the backlight source of the backlight module 10 can be uniformly diffused. Thus, the support layer 15 may function as a better reflector when the surface of the PCB is white painted.
Further, the support layer 15 includes a first support layer 151, a second support layer 152, and a third support layer 153.
First supporting layer 151 is located in through-hole 12 to correspond form supporting part 1511 in through-hole 12, supporting part 1511 with through-hole 12 shape size is the same, supporting part 1511 is a cylinder, first supporting layer 151 is mainly through mould injecting glue or injection moulding, first supporting layer 151 plays whole supporting layer 15's fixed connection effect, in order to strengthen whole supporting layer 15's stability and fastness.
In this embodiment, when the circuit boards 13 are spliced, the circuit boards 13 are not adhered by using an adhesive, and the supporting layer 151 can fix the circuit boards 13 by using an adhesive, and can be conveniently detached and reprocessed.
The second support layer 152 is connected to the first support layer 151 and filled in the splicing gap 14 to bond the circuit boards 13 on both sides of the splicing gap 14, and the second support layer 152 is mainly formed by injecting glue or injection molding through a mold. The second supporting layer 152 is provided with a supporting strip 1521 corresponding to the splicing gap; in this embodiment, since the splicing gap 14 corresponding to each support bar 1521 is a long strip, each support bar 1521 is a rectangular parallelepiped structure.
The width of the supporting strip 1521 is greater than the diameter of the supporting portion 1511, so that in the actual design process, the diameter of the through hole 12 is smaller than the width of the splicing gap 14, that is, the through hole 12 completely falls into the splicing gap 14; in all of the splice slits 14, all of the support bars 1521 cross each other to form the second support layer 152 of the lattice structure.
In this embodiment, the width of the supporting strip 1521 is 0.5-2 mm, and is preferably 1mm in this embodiment, and certainly, the width of the supporting strip 1521 can also select 0.5mm, 1.5mm, or 2mm, and the specific width thereof is designed according to actual conditions. The height of the support strip 1521 is 1-2 mm, and is preferably 1.5mm in this embodiment, and of course, the height of the support strip 1521 may be 1mm, 1.6mm or 2 mm. In this embodiment, the height of the supporting strip 1521 is designed according to the thickness of the circuit board 13, and the height of the supporting strip 1521 is consistent with the thickness of the circuit board 13.
The third support layer 153 is connected to the second support layer 152 and protrudes from the surface of the circuit board 13, and the third support layer 153 is adhered to the circuit boards 13 on both sides of the splice gap 14. In this embodiment, the third supporting layer 153 is connected to the second supporting layer 152 and protrudes out of the surface of the circuit board 13, the third supporting layer 153 has a plurality of supporting bumps 1531, and each supporting bump 1531 is adhered to the circuit board 13 at two sides of the splicing gap 14.
Each support layer strip 1521 corresponds to at least one support bump 1531; the supporting bumps 1531 are mainly formed by injecting glue or injection molding through a mold. The support bumps 1531 have a hemispherical structure; the height of the supporting bumps 1531 is 1-2 mm, preferably 1.5mm in this embodiment, and the height of the supporting bumps 1531 may also be 1mm, 1.8mm or 2 mm; the width of the supporting bump 1531 is 1 to 3mm, preferably 2mm in this embodiment, and of course, the width of the supporting bump 1531 may also be 1mm, 1.5mm, 2.5mm or 3 mm.
Through the support layer 15 composed of the third support layer 153, the second support layer 152 and the first support layer 151, the circuit board 13 can be fixed, the original mode of alternate adhesion is eliminated, the flatness can be effectively guaranteed, the ultrathin design can be effectively realized, and the advantages of simplicity in operation, capability of reworking and the like can be realized. And may achieve a light source diffusing effect due to the reflective nature of the support layer 15.
A plurality of lamp beads 16 are uniformly distributed on each circuit board 13; the backlight module 10 is a direct type backlight source, the lamp beads 16 are controlled by the circuit board 13, and one or more points of the backlight source can be controlled to emit light independently. The beads 16 are typically LED light sources.
On the circuit board 13, the distance between the centers of two adjacent lamp beads 16 is P, and the distance between the center of the lamp bead 16 closest to the edge of the circuit board 13 and the edge of the circuit board 13 is L1The width of the splicing gap 14 is H, where P ═ 2L1+ H. At the time of design, L1Less than half of P, so that the circuit board 13 can be conveniently spliced and the defects of P and L in the prior art can be overcome1The problem of dark lines caused by unequal distances can effectively improve the effect of light taste. Due to the elasticity of the support layer 15, it is easier to adjust L when placing a circuit board1Such that P is 2L1+H。
The fluorescent film 17 covers the circuit board 13 and the lamp beads 16; the diffusion sheet 18 is coated on the fluorescent film 17; the brightness enhancing film 19 overlies the diffuser 18. The optical film group consisting of the fluorescent film 17, the diffusion sheet 18 and the brightness enhancement film 19 further realizes uniform light emission, so that light can be uniformly diffused and concentrated in the front view angle direction.
Referring to fig. 1, in the present embodiment, a liquid crystal display panel 30 is further provided, including the backlight module 10. The display panel can improve the light and taste effect and can be reworked; the light can be diffused uniformly, and the brightness of the liquid crystal display can be increased. Certainly, the liquid crystal display panel of this embodiment further includes a lower polarizer 21, an array substrate 22, a liquid crystal 23, a color film substrate 24, and an upper polarizer 25, and the main design point of the present invention lies in the backlight module 10, particularly in the splicing structure of the circuit board 13, the distribution structure of the beads 16, the structure of the supporting layer 15, and the connection structure between the supporting layer 15 and the circuit board 13, and therefore, other components of the liquid crystal display panel are not described in detail.
It should be noted that many variations and modifications of the embodiments of the present invention fully described are possible and are not to be considered as limited to the specific examples of the above embodiments. The above examples are intended to be illustrative of the invention and are not intended to be limiting. In conclusion, the scope of the present invention should include those changes or substitutions and modifications which are obvious to those of ordinary skill in the art.
Claims (10)
1. A backlight module is characterized by comprising
The back plate is provided with a plurality of through holes penetrating through the back plate;
the circuit boards are spliced on the back plate, a splicing gap is formed between every two adjacent circuit boards, and the through holes correspond to the splicing gap;
the supporting layer is filled in the through hole and the splicing gap;
and the lamp beads are uniformly distributed on each circuit board.
2. A backlight module according to claim 1, wherein the support layer comprises
The first supporting layer is arranged in the through hole and forms a supporting part in the corresponding through hole;
the second supporting layer is connected to the first supporting layer, filled in the splicing gap and used for bonding the circuit boards on two sides of the splicing gap, and is provided with supporting strips corresponding to the splicing gap;
and the third supporting layer is connected with the second supporting layer and protrudes out of the surface of the circuit board, the third supporting layer is provided with a plurality of supporting salient points, and each supporting salient point is adhered to the circuit board on two sides of the splicing gap.
3. The backlight module according to claim 2,
in the through hole, the supporting part is a cylinder;
in a concatenation gap, the support bar is the cuboid, and each support bar corresponds there is at least one supporting part.
4. The backlight module according to claim 3,
the supporting salient points are hemispheric, and each supporting strip is provided with at least one supporting salient point correspondingly in a splicing gap.
5. The backlight module according to claim 2,
in all the splicing gaps, all the support bars are staggered with each other to form the second support layer with a grid-shaped structure.
6. The backlight module according to claim 2,
the width of the supporting strip is 0.5-2 mm, and the height of the supporting strip is 0.5-2 mm
The height of the supporting salient points is 1-2 mm, and the width of the supporting salient points is 1-3 mm.
7. The backlight module according to claim 1,
the supporting layer is made of polycarbonate plastic; the reflectivity of the support layer is 85%.
8. The backlight module according to claim 1,
the circuit board is of a rectangular structure and comprises long edges and short edges;
the number of the through holes between the adjacent long edges of the two circuit boards is 3-5;
the number of the through holes between the adjacent short edges of the two circuit boards is 2-4.
9. The backlight module according to claim 1,
on each circuit board, the central distance of two adjacent lamp pearls is P, the distance of the center of the lamp pearl that is close to the circuit board edge with the circuit board edge is L1, the width of concatenation gap is H, wherein P2L 1+ H.
10. A liquid crystal display panel comprising the backlight module according to any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811565143.1A CN109387981B (en) | 2018-12-20 | 2018-12-20 | Backlight module and liquid crystal display panel |
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| CN201811565143.1A CN109387981B (en) | 2018-12-20 | 2018-12-20 | Backlight module and liquid crystal display panel |
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| CN109387981A CN109387981A (en) | 2019-02-26 |
| CN109387981B true CN109387981B (en) | 2021-07-06 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110061116B (en) * | 2019-04-29 | 2020-10-30 | 惠州市华星光电技术有限公司 | Mini-LED backlight and manufacturing method thereof |
| CN110133914B (en) * | 2019-05-29 | 2021-12-03 | 深圳市华星光电半导体显示技术有限公司 | Backlight structure, manufacturing method thereof and display device |
| CN110133917B (en) * | 2019-06-28 | 2023-04-28 | 厦门天马微电子有限公司 | Curved surface backlight module and display device |
| CN110361891B (en) * | 2019-07-29 | 2021-01-15 | 武汉华星光电技术有限公司 | Backlight module |
| CN110491866A (en) * | 2019-07-31 | 2019-11-22 | 武汉华星光电技术有限公司 | Backlight module and preparation method thereof |
| CN110610929B (en) * | 2019-08-16 | 2021-12-03 | 武汉华星光电技术有限公司 | Backlight module |
| CN110634400B (en) * | 2019-08-22 | 2021-04-27 | 武汉华星光电技术有限公司 | Backlight module, display device and manufacturing method of backlight module |
| CN110908188B (en) * | 2019-11-26 | 2022-11-08 | 深圳市华星光电半导体显示技术有限公司 | Backlight module and display device |
| CN113093434A (en) * | 2019-12-23 | 2021-07-09 | 海信视像科技股份有限公司 | Display device |
| WO2021134741A1 (en) * | 2020-01-02 | 2021-07-08 | 康佳集团股份有限公司 | Method for improving bright line of splicing seam of display screen |
| CN111323968A (en) * | 2020-04-07 | 2020-06-23 | Tcl华星光电技术有限公司 | Backlight module and display device |
| CN112599030B (en) * | 2020-12-11 | 2022-09-30 | 季华实验室 | Splicing gap filling device and LED display screen |
| CN114527599B (en) * | 2022-02-28 | 2023-10-31 | 武汉华星光电技术有限公司 | Backlight module and liquid crystal display device |
| CN114627749A (en) | 2022-03-16 | 2022-06-14 | 广州华星光电半导体显示技术有限公司 | Backlight module and display device |
| CN115755460B (en) * | 2022-08-12 | 2024-04-12 | 苏州华星光电技术有限公司 | Backlight module and display device |
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