CN109378276A - The manufacturing method and Electronic Packaging module of Electronic Packaging module - Google Patents
The manufacturing method and Electronic Packaging module of Electronic Packaging module Download PDFInfo
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- CN109378276A CN109378276A CN201811221255.5A CN201811221255A CN109378276A CN 109378276 A CN109378276 A CN 109378276A CN 201811221255 A CN201811221255 A CN 201811221255A CN 109378276 A CN109378276 A CN 109378276A
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Abstract
The invention discloses the manufacturing methods and its structure of a kind of Electronic Packaging module, method includes the following steps: providing a circuit base plate, which there is an assembling plane and an at least ground mat, multiple electronics to be set in the assembling plane；Form at least one first the multiple electronic component of molding body covered section；A first screen layer is formed, the first molding body is covered and contacts the circuit base plate；It forms one second molding body and covers the first molding body, the multiple electronic component, the assembling plane；Part the first molding body and part the second molding body are removed, with the expose portion first screen layer；And a secondary shielding layer is formed, the first molding body, the second molding body are covered, and be electrically connected the first screen layer.The present invention completely can protect electronic component to be protected from electromagnetic interference.
Description
The application be Riyeguang Semiconductor Manufacturing Co., Ltd Chinese invention patent application (applying date be 2014
August 8 days, application No. is 201410389354.X, and entitled " manufacturing method and electronic seal of Electronic Packaging module are die-filling
Block ") divisional application.
Technical field
The present invention relates to the manufacturing methods and its structure of a kind of Electronic Packaging module, in particular to a kind of to utilize two stages mould
Envelope and the Electronic Packaging module manufacturing methods and its structure for utilizing two stages shielding.
Background technique
Electronic Packaging module generally includes the electronic component of a circuit board and multiple installings on circuit boards at present
(electronic component).These electronic components are, for example, chip packing-body (chip package) or passive element
(passive component) etc..In addition, most of Electronic Packaging module also typically includes molding block (molding
Compound), to coat (encapsulating) above-mentioned electronic component, to protect electronic component.
Electronic component is increasingly complicated, and user for speed up processing (processing speed) and reduces element
The demand of size also increasingly increases.Electronic product now stress it is light and short so that the distribution density of electronic component and route
Excessively high, which increase some problems, such as electromagnetic interference (Electromagnetic interference, EMI).In particular, such as
The electromagnetic armouring structure that multi-tiling is where formed on electronic component and the densely distributed circuit board of route, also that is, forming multiple electricity
Magnetic screen compartment becomes the demand of existing communication product.
A kind of well-known technique is first to form molding block in large area on circuit boards, the then grooving on molding block, then at
Filling metal material is in slot to form compartment.However, these manufacturing process are easy to insert in slot caused by the depth-to-width ratio because of grooving
Metal material can not be distributed evenly in slot, for example, the metal material in filling slot can not contact the route base of grooving bottom
Plate, or there is hole, airspace etc..Therefore, metal compartment is formed by with this and has been easy conductive bad or conductive unevenness
The problem of, also, the size-constrained depth-to-width ratio in grooving of metal compartment, it is difficult to it reduces.
In addition, US patent publication US2008/0055878, disclose a kind of electricity with electromagnetic armouring structure
Subcomponent, does not have a shielding construction of metal compartment, and the thickness of the electronic component is limited to the thickness of molding material and difficult
To reduce.
Summary of the invention
The present invention provides a kind of manufacturing method of Electronic Packaging module, and energy two stages molding and two stages plating are coated with formation
Shielding, without being limited to the depth-to-width ratio of shielded layer, can completely protect the electromagnetic interference between electronic component.
A kind of manufacturing method of Electronic Packaging module, comprising the following steps: provide a circuit base plate, circuit base plate has group
Plane and an at least ground mat are filled, multiple electronic components are set in assembling plane；Form at least one first molding body covering portion
Divide electronic component；First screen layer is formed, the first molding body is covered and contacts the circuit base plate；Form the second molding body covering the
One molding body, electronic component, assembling plane；Part the first molding body and part the second molding body are removed, with expose portion the
One shielded layer；And secondary shielding layer is formed, the first molding body, the second molding body are covered, and be electrically connected first screen
Cover layer.
A kind of Electronic Packaging modular structure, comprising: circuit base plate, the circuit base plate have assembling plane and ground mat；Electricity
Subcomponent is set in assembling plane；First molding body and one second molding body are respectively coated by a part of electronic component；First
Shielded layer the first molding body of conformal covering is simultaneously electrically connected ground mat, and the first molding body and the second molding body are with first screen layer
It is isolated；And secondary shielding layer, it covers the first molding body and is electrically connected first screen layer；Wherein, first screen layer is in shape
It first completes before at the second molding body.
In order to be further understood that technology, method and effect adopted by the present invention, please refer to below in connection with the present invention
Detailed description, attached drawing, it is believed that feature and feature of the invention, when can thus be able to deeply and it is specific understand, however it is appended
Attached drawing is only for reference and description with attachment, the person of being not intended to limit the present invention.
Detailed description of the invention
Fig. 1 is the diagrammatic cross-section of the Electronic Packaging modular structure of one embodiment of the invention.
Fig. 2 to Fig. 8 shows the diagrammatic cross-section of Electronic Packaging modular structure in the fabrication process in Fig. 1.
Fig. 9 is the flow chart of the manufacturing method of the Electronic Packaging module of one embodiment of the invention.
Wherein, the reference numerals are as follows:
Electronic Packaging modular structure 1
Circuit base plate 11
Assemble plane 111
Ground mat 12
First electronic component 131
Second electronic component 132,132 '
First initial molding body 141 '
First molding body 141
First screen layer 151
Second initial molding body 161 '
Second molding body 161
Secondary shielding layer 171
Sacrificial layer 181
Underfill 191
Mask 2
Step S1~S6
Specific embodiment
Various elements may be described herein using term first, second, third, etc., but these elements should not be by these
Term limitation.These terms are to distinguish an element and another element.Therefore, the first element being discussed herein below can be described as second
Teaching of the element without departing from concept of the present invention.
Referring to FIG. 1, Fig. 1 is the diagrammatic cross-section of the Electronic Packaging modular structure of one embodiment of the invention.The present invention is real
It applies example and provides a kind of Electronic Packaging modular structure 1, Electronic Packaging modular structure 1 includes circuit base plate 11, multiple electronic components
(such as first electronic component 131, the second electronic component 132,132 '), first screen layer 151, secondary shielding layer 171, the first mould
Seal body 141 and the second molding body 161 adjacent to the first molding body 141.Circuit base plate 11 has assembling plane 111, assembling
Plane 111 includes first area (figure is not painted) and second area (figure is not painted).Circuit base plate 11 further includes multiple ground connection
Pad 12, part of ground mat 12 are exposed to the assembling plane 111 of circuit base plate 11, and partial earthing pad 12 can be selected according to design requirement
Selecting property is arranged and is exposed to the side of circuit base plate 11.
First electronic component 131 is positioned at the first area of assembling plane 111, and the second electronic component 132,132 ' is located at group
Fill the second area of plane 111.First molding body 141 is positioned at first area and to coat the first electronic component 131；Second molding
Body 161 is in the assembling plane 111 except molding body 141.The ground connection of the electric connection circuit base plate 11 of first screen layer 151
Pad 12, and the first molding body 141 with the second molding body 161 is isolated with first screen layer 151.Secondary shielding layer 171 is comprehensive
Property be formed in the top of circuit base plate 11, with cover the first molding body 141, the second molding body 161, assembling plane 111 and
The second electronic component of part, and it is directly contacted with first screen layer 151.Secondary shielding layer 171 can also directly be electrically connected to and connect
Ground cushion 12, or even the ground mat 12 comprising being exposed to 11 side of circuit base plate.In other embodiments, the first electronic component can also
It can be exposed from the first molding body 141 and directly contact secondary shielding layer 171.
It is above-mentioned using be correspondingly formed the first molding body region as first area, be correspondingly formed the second molding body region
The explanation of first area and second area, such as the first mould are not limited to for second area to facilitate explanation and understand
Envelope body is also possible to the package material of integrated antenna package (IC package).If therefore the second electronic component 132 ' is integrated circuit
The electronic component or semiconductor chip for encapsulating (IC package) are stacked and are installed in route base in a manner of chip bonding
On plate 11, do not covered by the second molding body, then its region is alternatively referred to as first area.
It will transmit through embodiment below to explain a kind of manufacturing method of Electronic Packaging module of the invention.Please refer to Fig. 2 extremely
Fig. 8, Fig. 2 show the diagrammatic cross-section of Electronic Packaging modular structure in the fabrication process in Fig. 1 to Fig. 8.
As shown in Figure 1, circuit base plate 11 has an assembling (such as route of plane 111 firstly, providing a circuit base plate 11
The upper surface of substrate 11).Assembling plane 111 includes first area and second area (figure is not painted).
Circuit base plate 11 simultaneously has multiple pre-set ground mats 12 and line layer (not being painted).Ground mat 12 is conductive
Made by material, to be electrically connected to conducting wire (not being painted) or ground plane (not being painted).Wherein, ground mat 12 and route
Layer is all located in assembling plane 111 or embedment substrate, ground mat 12 are further exposed to the side of circuit base plate 11.
Then, electronic component is installed on circuit base plate 11, assembling mode can utilize surface adhering technical
(Surface Mount Technology, SMT) is carried out, and but not limited to this.
It please join Fig. 3, then, the first initial molding body 141 ' be provided in first area, to coat the first electronic component 131.
First initial molding body 141 ' is, for example, to carry out a sealing manufacture to first area with molding material (molding material)
Technique is formed, and the first initial molding body 141 ' is around the first electronic component 131 of cladding and the first electronic component 131
A part assembling plane 111.It should be noted that in the present embodiment, the first initial molding body 141 ' of the offer the step of
After completion, it is to be exposed to assembling plane that at least one ground mat 12 of neighbouring first electronic component 131, which has at least part,
111, without being covered by the first initial molding body 141 '.Sealing manufacturing process of the present invention is for example, by using injection-compression molding, die cavity
Injecting glue shapes (mold chase), drape forming manufacturing process (over-molding process), transfer forming mode
(transfer molding), backform plastic packaging manufacturing process (top-gate molding), dispenser (dispenser).And institute
The material for being used to form molding body is, for example, epoxy resin, plastic packaging material (molding compound), epoxy molding compound
(Epoxy Molding Compound, EMC), polyimides (Polyimide, PI), phenolic resin (Phenolics), silica gel
Or silicone resin (Silicones) etc..
In addition, can provide underfill 191 simultaneously in the above-mentioned sealing manufacturing process the step of and coat the second electronics member
The exposed conducting pin of part 132 ', with the first screen layer for protecting these conductive connecting pins and making these conductive connecting pins and being subsequently formed
151 (Fig. 5) electrically completely cut off.
Then, as shown in figure 4, providing 181 the second electronic component of covered section 132 of sacrificial layer.For example, it can pass through tool
There is the mask 2 of design to carry out sacrificial layer 181 to circuit base plate 11 and be coated with manufacturing process, provides sacrifice according to the pattern of mask 2
181 the second electronic component of covered section 132 of layer and part assembling plane 111.Sacrificial layer 181 is to remove subsequent manufacture work
Skill is formed in the substance of 181 top of sacrificial layer, and the second electronic component of part 132 for protecting sacrificial layer 181 to be coated.Sacrificial layer
181 material may include acryl (acrylic) glue or silica gel.In another embodiment, the material of sacrificial layer 181 may include sense
The ink of photo-curable resin or Thermocurable resin composition, such as liquid photosensitive type ink, and can be by using organic solvent
It is simply removed, but not limited to this.
Then, first screen layer 151 is formed.First screen layer 151 can be used as between different electronic components in vertical direction
Metallic shield, imply that isolation adjacent electronic elements between electromagnetic interference.As shown in figure 5, whole face and conformal (conformal)
First screen layer 151 is formed, is filled out with the first initial molding body 141 ' of covering, sacrificial layer 181, the second electronic component 132 ', bottom
Glue 191, and part assembling plane 111 are filled, and contacts the ground mat 12 of circuit base plate 11 to be electrically connected to ground mat 12.Shape
At the method such as spraying plating (spray coating) of first screen layer 151, plating (electroplating), electroless plating
(electroless plating), vapor deposition or sputter (sputtering) etc..Those skilled in the art are it is found that conformal
(conformal) refer to that it is formed by object and the outer profile of its covering person and has same shape, with Fig. 5 embodiment
For, i.e. the outer profile of first screen layer 151 and the first initial molding body 141 ', sacrificial layer 181, the second electronic component 132 '
Outer profile is identical.
Then, as shown in fig. 6, sacrificial layer 181 is removed, to remove the first screen layer that 181 top of sacrificial layer is covered
151, and the second electronic component 132 is exposed.In this way, can completely cut off electronic component 131 in Electronic Packaging modular structure 1,
132, the electromagnetic interference between 132 '.
Method of the patterned sacrificial layer 181 of above-mentioned Fig. 4-6 collocation to form first screen layer 151, can also use figure instead
The mask (mask) of case covers entire assembling plane, then carries out metal spraying (spray coating) and solidified and shape
At first screen layer 151.
Then, as shown in fig. 7, the second initial molding body 161 ' is provided in assembling plane 111, to coat the first initial molding
Body 141 ', the second electronic component 132,132 ', first screen layer 151 and part assembling plane 111.Wherein the first initial molding
It is mutually isolated with first screen layer 151 between body 141 ' and the second initial molding body 161 ', that is to say, that first screen layer
151 are embedded in molding material.Second initial molding body 161 ' is, for example, to be carried out with molding material to entire assembling plane 111
One sealing manufacturing process is formed, the sealing manufacturing process for example, by using covering molding, general metaideophone molding, injection-compression molding or
It is the mode of die cavity injecting glue forming (mold chase), and the material of the second initial molding body 161 ' can be with the first initial molding
The material of body 141 ' is identical, for example, epoxy resin or silica gel.
Then, as shown in figure 8, removing the initial molding body 141 ' in part first and the initial molding body 161 ' in part second,
With the first screen layer 151 of exposure a part, it is formed simultaneously the first molding body 141 and the second molding body 161 such as Fig. 1.Example
Such as in the way of grinding (grinding) or laser processing processing (Laser trimming), the first introductory die of part is eliminated
Body 141 ' and the initial molding body 161 ' in part second are sealed, reduces the whole height of Electronic Packaging modular structure 1 whereby.First molding
The height of body 141 is smaller than the height of the first initial molding body 141 ', and the height of the second molding body 161 is smaller than second initially
The height of molding body 161 ', the upper surface of the first molding body 141 can be trimmed in the upper surface of the second molding body 161.Meanwhile one
The first screen layer 151 divided also is removed together, the first screen layer 151 being not removed shape between electronic component 131,132
At the shielding construction with certain altitude.
Then, secondary shielding layer 171 is formed, as shown in Figure 1, forming secondary shielding layer to whole face in the present embodiment
171, to cover the first molding body 141,132 ' upper surface of the second molding body 161 and the second electronic component.Secondary shielding layer 171
And it can completely coat the side of circuit base plate 11 and be electrically connected the ground mat 12 of side.Form the manufacturing process of the second shielding layer
Such as metal spraying (Spray coating), electroless plating manufacturing process (electroless plating) or sputter system can be used
Make technique (Sputtering) etc. it is common metal coating manufacturing process, can also be used and paste the modes such as conductive tape, but not with
This is limited.
Above-described embodiment can summarize the manufacturing method of the Electronic Packaging module of one embodiment of the invention, please refer to Fig. 9.Step
Rapid S1, provides circuit base plate, and there is circuit base plate assembling plane and ground mat, multiple electronic components to be set to the assembling plane
On；Step S2 forms the first molding body covered section electronic component；Step S3 forms first screen layer, covers the first molding body
And contact the ground mat in assembling plane；Step S4, formed the second molding body cover the first molding body and assembling plane on not by
The electronic component of molding body covering；Step S5 removes part molding body and expose portion first screen layer；Step S6 forms the
Two shielded layers cover entire molding external surface and are electrically connected first screen layer.
In another embodiment, before above-mentioned formation secondary shielding layer 171, the initial molding body 141 ' in part first is being removed
And the initial molding body 161 ' in part second step when, region caused by the drop using molding body different height provides it
Its electronic component or electronic module do three-dimensional stack and electric connection.It specifically, can be in advance by the lower element of height
Design in a region and the design of higher element in another region, the molding body being so subsequently formed, distance from top is lower
The distance of the higher electronic component of more another distance of the distance of electronic component is big, therefore the mould above a lower height of element area
Feng Tike eliminates more, to form the region that molding body has different height.It can be first in the mould of a lower height of element area
Feng Tizhong forms conductive structure with connecting electronic component, the ground mat 12 or line layer of circuit base plate 11, or in molding according to design
Configuration is formed above body, then is electrically connected the electronic component or electronic module for stacking and putting thereon, finally re-forms second
Shielded layer 171 is electrically connected ground mat 12.Actual practice is for example: multiple holes is formed in molding body, wherein the exposure of each hole
The electricity connection end of ground mat or electronic component out；Multiple metal columns are formed in hole, and form the first metal pattern
Layer is above molding body and metal column, wherein each metal column is electrically connected the electricity connection end of ground mat or electronic component.
Then, then electronic component or electronic module are stacked above molding body, and is electrically connected at the first metal pattern layer or metal column.
Later, it forms molding body to cover comprehensively above assembling plane, electronic component or electronic module, established mould including heap poststack
Feng Ti.
The present invention is respectively formed first screen layer, secondary shielding layer using two stages, and utilizes two stages molding, a
Metallic shield between other electronic component in selectively formed vertical direction, the method are formed by metallic shield compartment and do not have public affairs
Know the bad or uneven problem of conduction caused by metallic shield compartment depth-to-width ratio, the followed by secondary shielding at the top of collocation molding body
After layer, completely electronic component can be protected to be protected from electromagnetic interference.Also, it through part molding body is eliminated, can drop simultaneously
Low Electronic Packaging modular structure whole height.Furthermore Electronic Packaging modular structure 1 can efficiently use the height between electronic component
Difference, and the structure stacked for solid is provided.Thus the present invention can provide the configuration factor (form with relatively small thickness
factor)。
The above description is only an embodiment of the present invention, the scope of patent protection being not intended to limit the invention.Any
The technical staff in field, without departing from the spirit and scope of the invention, the equivalence replacement of made change and retouching is still this
In the scope of patent protection of invention.
Claims (10)
1. a kind of manufacturing method of Electronic Packaging module, which comprises the following steps:
A circuit base plate is provided, which there is an assembling plane and an at least ground mat, multiple electronic building bricks to be set to
In the assembling plane；
Form at least one first the multiple electronic building brick of molding body covered section；
A first screen layer is formed, the first molding body is covered and contacts the circuit base plate；
It forms one second molding body and covers the first molding body, the multiple electronic building brick, the assembling plane；
Remove part the second molding body；And
A secondary shielding layer is formed, the first molding body, the second molding body are covered.
2. the manufacturing method of Electronic Packaging module as described in claim 1, wherein the method for forming the first screen layer includes:
The entire assembling plane is covered using a patterned shielding, then carries out a metal spraying and solidification.
3. the manufacturing method of Electronic Packaging module as described in claim 1, wherein the method for forming the first screen layer includes:
One the multiple electronic building brick of sacrificial layer covered section is provided；
The first screen layer is formed conformally and covers the first molding body, the sacrificial layer, and is electrically connected the multiple ground mat
One of them；And
Remove the sacrificial layer.
4. the manufacturing method of Electronic Packaging module as described in claim 1, wherein further including the removal part first screen layer.
5. the manufacturing method of Electronic Packaging module as claimed in claim 4, wherein further including removal part the first molding body.
6. a kind of Electronic Packaging module, which is characterized in that the Electronic Packaging module includes:
One circuit base plate, the circuit base plate have an assembling plane；
An at least electronic building brick is set in the assembling plane；
One first molding body and one second molding body are respectively coated by the part electronic building brick；
One first screen layer surround the first molding body, and the first molding body with the second molding body with the first screen layer phase
Isolation；And
One secondary shielding layer covers the first molding body and the second molding body and is electrically connected at the first screen layer.
7. Electronic Packaging module as claimed in claim 6, wherein circuit base plate has an at least ground mat, the first screen layer
It is electrically connected one of the multiple ground mat.
8. a kind of Electronic Packaging module, which is characterized in that the Electronic Packaging module includes:
One circuit base plate, the circuit base plate have an assembling plane；
An at least electronic building brick is set in the assembling plane；
The one first molding body covered section electronic building brick；
Conformal covering the first molding body of one first screen layer；And
One second molding body covers the first molding body and the first screen layer, and the first screen layer of exposure a part.
9. Electronic Packaging module as claimed in claim 8, further includes a secondary shielding layer, the first molding body is covered.
10. Electronic Packaging module as claimed in claim 9, wherein the secondary shielding layer covers and connects exposure second molding
The first screen layer of body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811221255.5A CN109378276B (en) | 2014-08-08 | 2014-08-08 | Method for manufacturing electronic packaging module and electronic packaging module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811221255.5A CN109378276B (en) | 2014-08-08 | 2014-08-08 | Method for manufacturing electronic packaging module and electronic packaging module |
| CN201410389354.XA CN105336629B (en) | 2014-08-08 | 2014-08-08 | The manufacturing method and Electronic Packaging module of Electronic Packaging module |
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| CN201410389354.XA Division CN105336629B (en) | 2014-08-08 | 2014-08-08 | The manufacturing method and Electronic Packaging module of Electronic Packaging module |
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| CN109378276A true CN109378276A (en) | 2019-02-22 |
| CN109378276B CN109378276B (en) | 2022-07-05 |
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| CN201410389354.XA Active CN105336629B (en) | 2014-08-08 | 2014-08-08 | The manufacturing method and Electronic Packaging module of Electronic Packaging module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI676259B (en) * | 2016-09-02 | 2019-11-01 | 矽品精密工業股份有限公司 | Electronic package and method for fabricating the same |
| TWI637364B (en) * | 2017-12-15 | 2018-10-01 | 友達光電股份有限公司 | Electronic device |
| CN110972389B (en) * | 2018-09-29 | 2023-07-21 | 鹏鼎控股(深圳)股份有限公司 | Circuit board |
| KR102621099B1 (en) * | 2018-11-07 | 2024-01-04 | 삼성전자주식회사 | Semiconductor package |
| WO2021017896A1 (en) * | 2019-07-26 | 2021-02-04 | Tongfu Microelectronics Co., Ltd. | Packaging structure and fabrication method thereof |
| CN111158521B (en) * | 2019-12-30 | 2022-03-11 | 合肥微晶材料科技有限公司 | Anti-interference touch control induction layer and touch screen based on same |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN109378276B (en) | 2022-07-05 |
| CN105336629B (en) | 2018-11-27 |
| CN105336629A (en) | 2016-02-17 |
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