CN109376714A - A kind of fingerprint recognition mould group and preparation method thereof - Google Patents
A kind of fingerprint recognition mould group and preparation method thereof Download PDFInfo
- Publication number
- CN109376714A CN109376714A CN201811525044.0A CN201811525044A CN109376714A CN 109376714 A CN109376714 A CN 109376714A CN 201811525044 A CN201811525044 A CN 201811525044A CN 109376714 A CN109376714 A CN 109376714A
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- China
- Prior art keywords
- layer
- mould group
- fingerprint recognition
- light shield
- recognition mould
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
Abstract
This application discloses a kind of fingerprint recognition mould group and preparation method thereof, the fingerprint recognition mould group includes substrate and the OLED device layer set on substrate any surface；Light shield layer, insulated barriers layer and optical fingerprint sensor layer are successively arranged between the OLED device layer and the finger contact surface of the fingerprint recognition mould group；Shading graph is carved on the light shield layer.Entire fingerprint recognition mould group is integrated on one piece of substrate by the technical solution of the application, integrated level is high and eliminates the processes such as the assembling in later period, manufacturing cost is saved while shortening process flow, light path is determined by substrate thickness completely in some embodiments simultaneously, avoiding the microcosmic influence factors in prior art later period assembling process influences the quality of fingerprint recognition mould group, yield is promoted to a certain extent, reduces unnecessary loss.
Description
Technical field
The present disclosure relates generally to fingerprint identification technology fields, and in particular to a kind of fingerprint recognition mould group and preparation method thereof.
Background technique
Existing optical finger print mould group is generally made of backlight, optical fingerprint sensor, protective layer and shell.Work as acquisition
When fingerprint image, finger is put on protective layer, and the light of backlight generates reflection and transmission in the contact surface of protective layer and finger,
Reflected light is passed on optical fingerprint sensor through protective layer, identifies fingerprint signal to achieve the purpose that fingerprint recognition, but
Used optical fingerprint sensor layer, backlight layer and protective layer needs to manufacture respectively, and carries out fitting assembling, work in the later period
Skill process is complicated and mould group itself is by assembling, and integrated level is low, and area occupied is big, while in currently available technology, utilizes
In the structure for the fingerprint recognition chip that optical principle is realized, there is no the arranging for taking for light source dispersion in structure design
It applies, noise ratio and the resolution for eventually leading to product are lower.
Summary of the invention
In view of drawbacks described above in the prior art or deficiency, it is intended to provide a kind of fingerprint recognition mould group and preparation method thereof.
In a first aspect, the application provides a kind of fingerprint recognition mould group, including substrate and set on the OLED of substrate any surface
Device layer；
Light shield layer, insulation resistance are successively arranged between the OLED device layer and the fingerprint contact surface of the fingerprint recognition mould group
Interlayer and optical fingerprint sensor layer；
Shading graph is carved on the light shield layer.
The seam between sensor according to technical solution provided by the embodiments of the present application, in the optical fingerprint sensor layer
Gap forms light conduction hole；The side wall in the light conduction hole is provided with side light shield layer.
According to technical solution provided by the embodiments of the present application, the hollow hole for light transmission is formed in the shading graph
Hole, the light conduction hole are aligned with the cut-out openings.
According to technical solution provided by the embodiments of the present application, any surface of the fingerprint recognition mould group or two sides are equipped with and protect
Sheath.
According to technical solution provided by the embodiments of the present application, the material of the light shield layer is opaque material；The insulation
The material of barrier layer is transparent insulation material.
Second aspect the application provides a kind of production method of fingerprint recognition mould group, comprising the following steps:
Opaque material, which is plated, in the first surface of substrate forms light shield layer；
Shading graph is lithographically formed according to setting shape on light shield layer；
Insulating materials is plated on light shield layer forms insulated barriers layer；
Interval is laid with TFT optical sensor on insulated barriers layer；
OLED device layer is made in the second surface of substrate.
Second aspect the application provides the production method of second of fingerprint recognition mould group, comprising the following steps:
TFT optical sensor, which is laid with, at any surface interval of substrate forms optical fingerprint sensor layer；
Insulating materials is plated on optical fingerprint sensor layer forms insulated barriers layer；
Opaque material is plated on insulated barriers layer forms light shield layer；
Shading graph is lithographically formed according to setting shape on light shield layer；
OLED device layer is made on light shield layer.
Second aspect the application provides the production method of the third fingerprint recognition mould group, comprising the following steps:
OLED device layer is made in any surface of substrate；
Insulating materials is plated on OLED device layer forms insulated barriers layer；
Opaque material, which is plated, in insulated barriers layer forms light shield layer；
Shading graph is lithographically formed according to setting shape on light shield layer；
Interval is laid with TFT optical sensor and forms optical fingerprint sensor layer on light shield layer.
According to the technical solution that the application specific embodiment provides, the above method further include:
Surrounding in the sensitization function area of the TFT optical sensor is lithographically formed side light shield layer.
According to the technical solution that the application specific embodiment provides, the above method further include:
Up-protective layer is plated in any surface in fingerprint recognition mould group or two sides.
Entire fingerprint recognition mould group is integrated on one piece of substrate by the technical solution of the application, and integrated level is high and eliminates
The processes such as the assembling in later period save manufacturing cost while shortening process flow, while in certain preferred embodiments of the application
In, the light path of the fingerprint recognition of section Example is largely determined by substrate thickness, avoids the assembling of prior art later period
Microcosmic influence factors in the process influence the quality of fingerprint recognition mould group, promote yield to a certain extent, reduce unnecessary damage
It loses.
Insulated barriers layer and light shield layer are used in the technical solution of the application simultaneously, is improved due to OLED light source dispersion
Caused by the fingerprint recognition chip noise when low phenomenon of resolution so that the recognition accuracy of fingerprint recognition mould group is higher；
Insulated barriers layer is also used to conductive material and optical sensor separating the problem of repairing light shield layer poor flatness simultaneously simultaneously；
According to technical solution provided by the embodiments of the present application, the surrounding photoetching in the light sensation area of optics optical flame detector has side shading
Layer preferably blocks and is directly incident on sensor from the light that OLED device layer comes out, and reduces spurious rays entrance
OLED device layer improves the induction sensitivity of fingerprint recognition mould group.
Detailed description of the invention
By reading a detailed description of non-restrictive embodiments in the light of the attached drawings below, the application's is other
Feature, objects and advantages will become more apparent upon:
Fig. 1 is the structural schematic diagram of the first embodiment of the application；
Fig. 2 is the structural schematic diagram of second of embodiment of the application；
Fig. 3 is the structural schematic diagram of the third embodiment of the application；
Fig. 4 is a kind of shading graph of light shield layer in the application；
Fig. 5 is another shading graph of light shield layer in the application；
Fig. 6 is the flow chart of the 4th kind of embodiment of the application；
Fig. 7 is the flow chart of the 5th kind of embodiment of the application；
Fig. 8 is the flow chart of the 6th kind of embodiment of the application；
10, substrate；20, OLED device layer；30, light shield layer；40, insulated barriers layer；50, optical fingerprint sensor layer；51,
Light conduction hole；52, side light shield layer；60, protective layer；70, finger；31, transparent area；32, insulated barriers area.
Specific embodiment
The application is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining related invention, rather than the restriction to the invention.It also should be noted that in order to
Convenient for description, part relevant to invention is illustrated only in attached drawing.
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The application is described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
Please refer to Fig. 1 be a kind of the first embodiment of fingerprint recognition mould group structural schematic diagram, a kind of fingerprint recognition mould group,
Including substrate 10 and set on the OLED device layer 20 of substrate any surface；The OLED device layer 20 and the fingerprint recognition mould group
Fingerprint contact surface between be successively arranged light shield layer 30, insulated barriers layer 40 and optical fingerprint sensor layer 50；The light shield layer
Shading graph is carved on 30.
For example, the lower surface of substrate 10 is arranged in OLED device layer 20 as shown in the first embodiment of Fig. 1 the application,
As shown by arrows in figure, the fingerprint contact surface of the fingerprint recognition mould group is located at upper surface, namely positioned at the upper surface of substrate 10；
At this point, the upper surface of substrate 10 is successively arranged light shield layer 30, insulated barriers layer 40 and optical fingerprint sensor layer 50；In this implementation
In example, the upper surface of optical fingerprint sensor layer 50 and the lower surface of OLED emission side are equipped with protection 60, and protective layer 60 improves
Caused by the dispersion of OLED light source the problem of identification veiling glare.
The light of OLED device layer 20 pass through after substrate 10 by the transparent area 31 of light shield layer 30 and TFT optical sensor it
Between the light conduction hole 51 that is formed of gap after reflect through finger 70 and identified by TFT optical sensor on TFT optical sensor.
For example, the lower surface of substrate 10 is arranged in OLED device layer 20 as shown in second of embodiment of Fig. 2 the application,
As shown by arrows in figure, the fingerprint contact surface of the fingerprint recognition mould group is located at upper surface, namely positioned at the upper surface of substrate 10；
At this point, being successively arranged light shield layer 30, insulated barriers layer 40 and optical fingerprint sensor layer between OLED device layer 20 and substrate 10
50；In the present embodiment, the upper surface of substrate and the lower surface of OLED device layer are all provided with matcoveredn 60, for improving oled light
Caused by the dispersion in source the problem of identification veiling glare.
The gap between transparent area 31 and TFT optical sensor that the light of OLED device layer 20 passes through light shield layer 30 is formed
Light conduction hole 51 after, pass through substrate 10, through finger 70 reflection after be then passed through substrate 10 on TFT optical sensor by TFT
Optical sensor identification.
For example, the lower surface of substrate 10 is arranged in OLED device layer, such as shown in the third embodiment of Fig. 3 the application
In figure shown in arrow, the fingerprint contact surface of the fingerprint recognition mould group is located at lower surface, namely the following table positioned at OLED device layer
Face；The lower surface of OLED device layer 20 is successively arranged light shield layer 30, insulated barriers layer 40 and optical fingerprint sensor layer 50；At this
The upper surface of substrate and the lower surface of optical fingerprint sensor layer are all provided with matcoveredn 60 in embodiment, for improving OLED light source
Dispersion caused by identification veiling glare the problem of.
The gap between transparent area 31 and TFT optical sensor that the light of OLED device layer 20 passes through light shield layer 30 is formed
Light conduction hole 51 after, be then passed through substrate 10 on TFT optical sensor after the reflection of finger 70 and known by TFT optical sensor
Not.
In embodiment one into embodiment three, OLED device layer includes: first electrode layer, organic function layer and second electrode
Layer, organic function layer can include but is not limited to hole transmission layer, organic material luminescent layer and electron transfer layer etc..
In the above-described embodiments, the material of light shield layer 30 is the lighttight metal materials such as the aluminium of photoetching；In certain implementations
In example, lighttight photoresist is also can be selected in the material of light shield layer 30；In other embodiments, the material of the light shield layer 30
Other opaque materials can be selected.
In the above-described embodiments, the material of insulated barriers layer 40 is transparent photomask glue (PI)；In certain embodiments, it insulate
The sull that the material of barrier layer 40 can for example select CVD technique to make；In other embodiments, the insulated barriers
Other transparent insulating materials also can be selected in the material of layer 40.
Optical fingerprint sensor layer is set up directly on OLED illuminating board or its OLED device layer, saves space,
A possibility that bigger is provided for later product design, each functional layer is assembled without being gone after, reduces processing route.
In embodiment one into embodiment two, the light path of optical finger print identification sensor is by substrate in fingerprint recognition mould group
Thickness determines that eliminating in assembling process influences product quality due to microcosmic influence factors.
Preferably, the gap between the sensor in the optical fingerprint sensor layer 50 forms light conduction hole 51；Institute
The surrounding for stating light conduction hole 51 is provided with side light shield layer 52, side light shield layer 52 using opaque photoresist or other be able to maintain
The opaque material of high precision position covering.Side light shield layer 52 and insulated barriers layer 40 improve caused by the dispersion of OLED light source
The problem of identifying veiling glare.
Preferably, be formed with the cut-out openings for light transmission in the shading graph, the light conduction hole 51 with it is described
Cut-out openings alignment.It is transparent area 31 in cut-out openings, is insulated barriers area 32 in shading graph.
It is illustrated in figure 4 a kind of structural schematic diagram of embodiment of the application light shield layer, shading graph is latticed；Such as figure
The structural schematic diagram of second of embodiment of 5 light shield layers, the shading graph are striated, in other embodiments, light shield layer
30 figure is also possible to other shapes.
It is illustrated in figure 6 a kind of flow chart of the production method of fingerprint recognition mould group of the 4th kind of embodiment of the application, is referred to
Line identify mould group production method the following steps are included:
S10, substrate 10 first surface plate opaque material formed light shield layer 30；
S20, foundation setting shape is lithographically formed shading graph on light shield layer 30, and light shield layer is due to light refraction direction
A variety of figures can be used in difference, such as square hole transmission region designed in Fig. 4 can be arranged more by the position of shading
Sensor is suitable for manufacture high security fingerprint recognition chip or width shown in fig. 5 seams meter and can reduce technology difficulty
The fingerprint recognition product of general safety；
S30, insulating materials formation insulated barriers layer 40 is plated on light shield layer 30, lead since light shield layer 30 may use
Electric material and there may be the problem of surface smoothness difference, insulated barriers layer is used to divide conductive material and optical sensor
The problem of opening while repairing light shield layer poor flatness；
S40, interval is laid with TFT optical sensor on insulated barriers layer 40, and there are certain intervals to be formed between sensor
Light conduction hole 51；
S50, the second surface production OLED device layer 20 in substrate 10, are finally sealed substrate with materials such as PI or glass
Dress.
Specific step is as follows for the production of OLED device layer 20 in the present embodiment: first in the second surface photoetching of substrate 10
First electrode is made, organic function layer then is deposited in the first electrode surface of institute's photoetching, is finally prepared on organic function layer
Second electrode.In other embodiments, the making step of the OLED device layer 20 may be: first the second of substrate 10
Photomask surface makes second electrode, organic function layer then is deposited in the second electrode surface of institute's photoetching, finally in organic functions
First electrode is prepared on layer.
It is illustrated in figure 7 a kind of flow chart of the production method of fingerprint recognition mould group of the 5th kind of embodiment of the application, is referred to
Line identify mould group production method the following steps are included:
S1, TFT optical sensor formation optical fingerprint sensor layer 50 is laid at any surface interval of substrate 10；
S2, insulating materials formation insulated barriers layer 40 is plated on optical fingerprint sensor layer 50；
S3, opaque material formation light shield layer 30 is plated on insulated barriers layer 40；
S4, foundation setting shape is lithographically formed shading graph on light shield layer 30；
S5, OLED device layer 20 is made on light shield layer 30.
Specific step is as follows for the production of OLED device layer 20 in the present embodiment: photoetching making first on light shield layer 30
Then organic function layer is deposited in the first electrode surface of institute's photoetching in one electrode, finally the second electricity of preparation on organic function layer
Pole.In other embodiments, the making step of the OLED device layer 20 may be: the photoetching making first on light shield layer 30
Then second electrode is deposited organic function layer in the second electrode surface of institute's photoetching, first is finally prepared on organic function layer
Electrode.
It is illustrated in figure 8 a kind of flow chart of the production method of fingerprint recognition mould group of the 6th kind of embodiment of the application, is referred to
Line identify mould group production method the following steps are included:
S100, any surface production OLED device layer 20 in substrate 10；
Specific step is as follows for the production of OLED device layer 20 in the present embodiment: first in any surface photoetching of substrate 10
First electrode is made, organic function layer then is deposited in the first electrode surface of institute's photoetching, is finally prepared on organic function layer
Second electrode.In other embodiments, the making step of the OLED device layer 20 is also possible to: first in any of substrate 10
Photomask surface makes second electrode, organic function layer then is deposited in the second electrode surface of institute's photoetching, finally in organic functions
First electrode is prepared on layer.
S200, insulating materials formation insulated barriers layer 40 is plated on OLED device layer 20；
S300, opaque material formation light shield layer 30 is plated in insulated barriers layer 40；
S400, foundation setting shape is lithographically formed shading graph on light shield layer 30；
S500, interval is laid with TFT optical sensor formation optical fingerprint sensor layer 50 on light shield layer 30.
Preferably, the above method can also after the step s40 of example IV or the step s1 of embodiment five it
Afterwards, or after the step s500 of embodiment six following steps are also set up:
S41, the surrounding in the sensitization function area of the TFT optical sensor are lithographically formed side light shield layer 52.
Preferably, the above method can also be after the step s50 of example IV or the step s5 of embodiment five or real
Following steps are arranged later in the step s500 for applying example six again:
S60, up-protective layer is plated on the surface of the optical fingerprint sensor layer 50 and/or OLED device layer 20.
Finally, by bonding FPC in two sides is carried out after the substrate cut after the completion of technique, it can be on final OLED lighting screen
It uses.
Above description is only the preferred embodiment of the application and the explanation to institute's application technology principle.Those skilled in the art
Member is it should be appreciated that invention scope involved in the application, however it is not limited to technology made of the specific combination of above-mentioned technical characteristic
Scheme, while should also cover in the case where not departing from the inventive concept, it is carried out by above-mentioned technical characteristic or its equivalent feature
Any combination and the other technical solutions formed.Such as features described above has similar function with (but being not limited to) disclosed herein
Can technical characteristic replaced mutually and the technical solution that is formed.
Claims (10)
1. a kind of fingerprint recognition mould group characterized by comprising
Substrate 10 and OLED device layer 20 set on substrate any surface；
Light shield layer 30, insulation resistance are successively arranged between the OLED device layer 20 and the fingerprint contact surface of the fingerprint recognition mould group
Interlayer 40 and optical fingerprint sensor layer 50；
Shading graph is carved on the light shield layer 30.
2. fingerprint recognition mould group according to claim 1, which is characterized in that
Gap between sensor in the optical fingerprint sensor layer 50 forms light conduction hole 51；The light conduction hole
51 side wall is provided with side light shield layer 52.
3. fingerprint recognition mould group according to claim 2, which is characterized in that
The cut-out openings for light transmission, the light conduction hole 51 and the cut-out openings pair are formed in the shading graph
Together.
4. fingerprint recognition mould group according to claim 1 or 2, which is characterized in that
Any surface of the fingerprint recognition mould group or two sides are equipped with protective layer 60.
5. according to claim 1 to fingerprint recognition mould group described in 3 any one, which is characterized in that the material of the light shield layer 30
Material is opaque material；The material of the insulated barriers layer 40 is transparent insulation material.
6. a kind of production method of fingerprint recognition mould group, which comprises the following steps:
Opaque material, which is plated, in the first surface of substrate 10 forms light shield layer 30；
Shading graph is lithographically formed according to setting shape on light shield layer 30；
Insulating materials is plated on light shield layer 30 forms insulated barriers layer 40；
Interval is laid with TFT optical sensor on insulated barriers layer 40；
OLED device layer 20 is made in the second surface of substrate 10.
7. a kind of production method of fingerprint recognition mould group, which is characterized in that
TFT optical sensor, which is laid with, at any surface interval of substrate 10 forms optical fingerprint sensor layer 50；
Insulating materials is plated on optical fingerprint sensor layer 50 forms insulated barriers layer 40；
Opaque material is plated on insulated barriers layer 40 forms light shield layer 30；
Shading graph is lithographically formed according to setting shape on light shield layer 30；
OLED device layer 20 is made on light shield layer 30.
8. a kind of production method of fingerprint recognition mould group, which is characterized in that
OLED device layer 20 is made in any surface of substrate 10；
Insulating materials is plated on OLED device layer 20 forms insulated barriers layer 40；
Opaque material, which is plated, in insulated barriers layer 40 forms light shield layer 30；
Shading graph is lithographically formed according to setting shape on light shield layer 30；
Interval is laid with TFT optical sensor and forms optical fingerprint sensor layer 50 on light shield layer 30.
9. according to the production method of the fingerprint recognition mould group of OLED lighting screen described in claim 6 to 8 any one, feature
It is, further includes:
Surrounding in the sensitization function area of the TFT optical sensor is lithographically formed side light shield layer 52.
10. the production method of the fingerprint recognition mould group of OLED lighting screen according to claim 9, which is characterized in that also wrap
It includes:
Up-protective layer 60 is plated in any surface in fingerprint recognition mould group or two sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811525044.0A CN109376714A (en) | 2018-12-13 | 2018-12-13 | A kind of fingerprint recognition mould group and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811525044.0A CN109376714A (en) | 2018-12-13 | 2018-12-13 | A kind of fingerprint recognition mould group and preparation method thereof |
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| WO2021073013A1 (en) * | 2019-10-17 | 2021-04-22 | Shenzhen GOODIX Technology Co., Ltd. | Anti-spoofing of two-dimensional fake objects with bright-dark reversal imaging in optical sensing modules |
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Application publication date: 20190222 |