CN109360863A - A kind of novel stacked wafer moudle - Google Patents
A kind of novel stacked wafer moudle Download PDFInfo
- Publication number
- CN109360863A CN109360863A CN201811329878.4A CN201811329878A CN109360863A CN 109360863 A CN109360863 A CN 109360863A CN 201811329878 A CN201811329878 A CN 201811329878A CN 109360863 A CN109360863 A CN 109360863A
- Authority
- CN
- China
- Prior art keywords
- stacked wafer
- wafer moudle
- piece
- ultra
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 claims abstract description 39
- 238000004806 packaging method and process Methods 0.000 claims description 14
- 239000011521 glass Substances 0.000 claims description 13
- 239000002313 adhesive film Substances 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 10
- 230000005611 electricity Effects 0.000 claims description 5
- 238000009738 saturating Methods 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 238000003475 lamination Methods 0.000 abstract description 16
- 238000000034 method Methods 0.000 abstract description 15
- 239000012634 fragment Substances 0.000 abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 2
- 230000000712 assembly Effects 0.000 abstract description 2
- 238000000429 assembly Methods 0.000 abstract description 2
- 239000013078 crystal Substances 0.000 abstract description 2
- 238000011161 development Methods 0.000 abstract description 2
- 238000011160 research Methods 0.000 abstract description 2
- 229910052710 silicon Inorganic materials 0.000 abstract description 2
- 239000010703 silicon Substances 0.000 abstract description 2
- 238000009412 basement excavation Methods 0.000 abstract 1
- 230000007423 decrease Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 17
- 230000000694 effects Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012827 research and development Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- JTCFNJXQEFODHE-UHFFFAOYSA-N [Ca].[Ti] Chemical compound [Ca].[Ti] JTCFNJXQEFODHE-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/043—Mechanically stacked PV cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/20—Light-sensitive devices
- H01G9/2068—Panels or arrays of photoelectrochemical cells, e.g. photovoltaic modules based on photoelectrochemical cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/542—Dye sensitized solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a kind of novel stacked wafer moudles, the component is on conventional photovoltaic assemblies, introduce stacked wafer moudle design concept, by using dicing technique and ultra-thin welding, small pieces photovoltaic cell after scribing is passed through into link before and after ultra-thin welding, front and back cell piece is arranged using imbricated way, overlapping widths 2-4mm.This patent stacked wafer moudle is suitable for the solar batteries such as crystal silicon battery, hull cell, dye-sensitized cell, perovskite.This stacked wafer moudle further decreases cell piece electric current by laserscribing, and the cell piece stacked tile type arrangement after slice eliminates component sheets spacing, increases the effective generating area of component, improves component power.Using ultra-thin welding, cell piece overlapping region thickness is reduced, reduces imbrication battery strings fragment rate, improves stacked wafer moudle reliability.This stacked wafer moudle has been compatible with the advantages of lamination techniques, expands Research idea, Study of Lifting space, excavation component development potentiality.
Description
Technical field
The invention belongs to solar-energy photo-voltaic cell fields, and in particular to a kind of novel stacked wafer moudle.
Background technique
As silicon materials and cell piece cost constantly drop, encapsulating material cost accounting rise, assembly end mention effect means by
Gradually become each Research Emphasis.Present mainstream component proposes effect technology diversification, including two-sided double glass technologies, reflective solder strip and anti-
Light Filming Technology, low resistance welding technology, more main grid technologies and lamination techniques.Wherein double glass, reflective solder strip and reflective pad pasting change
Kind encapsulating material, improves component optical gain；Low resistance welding reduces interconnecting strip electrical losses.It is main that components above proposes effect technology
Component power is improved from encapsulating material angle is improved.More main grids and lamination techniques then change traditional components encapsulation mode, by more
Main grid welding and lamination welding are to improve component efficiency.
Two kinds of technology paths of more main grids and lamination have certain developing history and development result, and MBB technology shows more families shape
At mature industry chain, lamination techniques also have more families to put goods on the market successively.Two kinds of technologies have their own advantages and limitation, incompatible,
And respectively there is feature:
(1) more main grid technologies reduce cell piece equivalent series resistance, improve cell piece photoelectric conversion effect by increasing main gate line
Rate, while main gate line increases reduces electric current on every welding, and welding resistance loss is greatly reduced, and improves component power, but single
Pure MBB technology power ascension limited extent, and packaging cost remains high；
(2) lamination techniques use laserscribing, cell piece is divided into 1/5 or 1/6, after just with conductive chains such as conducting resinls
Medium is connect, cell piece front and rear panel is piled up according to imbricated way, forms the battery strings without piece spacing, by saving piece
Spacing makes component accommodate more cell pieces, to improve the effective generating area of spare part, improves component power, but stacked wafer moudle electricity
Piece thin grid line resistance in pond is higher, and stitch welding stabilization of equipment performance and conductive material matching degree are still immature.The loss of laminated batteries piece silver paste
Amount is big, cell piece higher cost.
Compatible half chip technology of general components, but incompatible conventional lamination techniques.Each component mentions effect technology early period all
There are huge equipment and Innovation Input, many medium-sized and small enterprises face the problem of technology path alternative.
Summary of the invention
To solve the above problems, with dicing technique and being surpassed the invention discloses a kind of novel stacked wafer moudle by laser
Small pieces photovoltaic cell imbricated way after scribing is arranged, and is linked by ultra-thin welding by thin welding, reduces cell piece electricity
Stream eliminates component sheets spacing, increases the effective generating area of component, reduces imbrication battery strings fragment rate, and improving stacked wafer moudle can
By property, component power is improved.
In order to achieve the above objectives, technical scheme is as follows:
A kind of novel stacked wafer moudle, including battery component, ultra-thin welding, packaging adhesive film, glass, backboard, the battery component be
It being formed in series and parallel by battery strings, the battery strings are to connect to be formed according to imbricated way by the baby battery piece after scribing, one
A cell piece is divided into the baby battery piece of 1/2-1/10, is connected between baby battery piece by ultra-thin welding, and single ultra-thin welding connects
Connect previous baby battery piece front and the latter baby battery piece back side, be not turned on before and after same baby battery piece, the battery component it is upper
Packaging adhesive film is had, glass is arranged in the top of upper layer packaging adhesive film, and backboard, the lamination is arranged in the lower section of lower layer's packaging adhesive film
Component periphery is equipped with frame, and the stacked wafer moudle back side is equipped with terminal box.
The present invention uses laser scribing means, and it is even smaller small that photovoltaic cell is divided into 1/2,1/3,1/4,1/5
Cell piece is connected the baby battery piece after scribing according to imbricated way by ultra-thin welding, forms a lamination without piece spacing
Battery component is finally packaged by battery strings, several battery strings by forming battery component in series and parallel.
This patent advantage is:
1. the advantages of novel stacked wafer moudle of this patent design combines ultra-thin welding technology and lamination techniques, using imbrication
Baby battery piece arrangement eliminates component sheets spacing, improves the effective generating area of component；This patent introduces ultra-thin welding design,
Ultra-thin welding not only reduces stacked wafer moudle adjacent cell piece overlapping segment thickness for lamination process, can also effectively disperse pressed and overlapped
Power reduces stacked wafer moudle fragment rate, improves assembly reliability；Novel lamination techniques can keep original size of components constant or small
Under conditions of width increases size of components, so that component is accommodated more cell pieces and meet efficient component to improve component power and want
It asks, the lifting assembly market competitiveness；This patent stacked wafer moudle is suitable for crystal silicon battery, hull cell, dye-sensitized cell, calcium titanium
The solar batteries such as mine.
2. this patent is suitable for conventional batteries piece, compatible lamination techniques advantage is improved by eliminating cell piece piece spacing
The effective electric surface base of component improves component power；By laserscribing, cell piece is divided into small pieces, by reducing electricity
Pond piece area reduces size of current on every welding, to reduce component electrical losses.This patent breaks general components and lamination
The incompatible barrier of technology has expanded the research and development route of lamination techniques, opens up the new R&D direction of photovoltaic module technology.
3. this patent combination cell piece numerical simulation, CTM model calculate, can complex optimum cell piece halftone, main grid line number
Amount, scribing the piece number, ultra-thin welding size, component are electrically arranged, and comprehensively consider each side during component package by establishing model
Face factor chooses optimization design scheme.
Detailed description of the invention
Fig. 1 stacked wafer moudle schematic diagram of the present invention.
Fig. 2 stacked wafer moudle cell piece lap detail view.
Fig. 3 stacked wafer moudle package structure diagram.
Specific embodiment
With reference to the accompanying drawings and detailed description, the present invention is furture elucidated, it should be understood that following specific embodiments are only
For illustrating the present invention rather than limiting the scope of the invention.It should be noted that word " preceding " used in the following description,
" rear ", "left", "right", "up" and "down" refer to that the direction in attached drawing, word "inner" and "outside" refer respectively to direction or remote
Direction from geometric center of specific component.
The present invention introduces stacked wafer moudle design concept on conventional photovoltaic assemblies, by using laser scribing means,
Photovoltaic cell is divided into 1/2,1/3,1/4,1/5 or even smaller baby battery piece, by ultra-thin welding, by the electricity after scribing
Pond piece is connected according to imbricated way, forms a laminated batteries string without piece spacing, and the battery strings of no piece spacing pass through series-parallel
Stacked wafer moudle is formed, type is then packaged as.
Fig. 1 is 60 editions type stacked wafer moudle arrangement schematic diagrams, and 12BB cell piece divides 1/4 small pieces by laser scribing device,
12BB1/4 baby battery piece (1-1) after cutting is connected by ultra-thin welding (1-2), and single ultra-thin welding connects previous baby battery
Piece front and the latter baby battery piece back side, same baby battery piece front and back are not turned on, and front and back baby battery piece overlapping widths are 2-4mm,
43 1/4 slice 12BB baby battery piece stitch welding are connected at a string of battery strings without piece spacing, battery strings both ends by busbar (1-3)
It connects, component is using conventional full wafer component series arrangement, bus bar sizes 5x0.25mm.Fig. 1 embodiment component glass is using conventional
1634x986x3.2mm accommodating full wafer cell piece quantity is 64.5.Embodiment illustrates a kind of size of components of stacked wafer moudle
With electrical arrangement, the non-display bezel of Fig. 1, terminal box and diode arrangement.
Fig. 2 is two adjacent laminates cell piece detail views in embodiment, anter cell piece (2-1) and rear piece cell piece (2-
2) it being linked by ultra-thin welding (2-3), front and back cell piece overlapping widths are 2mm, and MBB laminated batteries piece main grid line number is 12BB,
Also preferable 9BB, 14BB, 16BB, 18BB or 20BB, the preferred 0.1-0.7mm of width, the preferred 1/2-1/ of cell piece scribing size
10.Ultra-thin welding thickness of the present invention is much smaller than the tin plating welding of conventional welding, and thickness is less than 0.2mm, preferably 0.05-
0.15mm, width determine that ultra-thin welding width is than cell piece main grid line width 0.1-0.2mm according to cell piece main grid line width.
Fig. 3 shows stacked wafer moudle main part encapsulating structure sectional view, and stacked wafer moudle theme part is by MBB cell piece
(3-1), ultra-thin welding (3-2), packaging adhesive film (3-3), glass (3-4) and backboard (3-5) composition.Embodiment is using single glass component
Packaging method can replace with backboard (3-5) glass (3-4) when component is double glass；Packaging adhesive film (3-3) is divided into upper and lower two
Layer, upper layer glue film are connect with MBB laminated batteries string (3-1 and 3-2) and glass (3-4) respectively, and upper layer glue film is using high saturating
EVA, PVB or POE glue film, the preferred 0.4-0.5mm of thickness；Lower layer's glue film connects with MBB laminated batteries string and backboard (3-5) respectively
It connects, high saturating or conventional glue film can be used in lower layer's glue film, also can choose white glue film, the preferred 0.4- of lower layer's film thickness
0.7mm。
Novel stacked wafer moudle of the present invention is by cell piece scribing and eliminates piece spacing mode, reduces pack clearance,
The effective generating area of component is improved, component is made to accommodate more batteries under the premise of keeping original size or size to be only slightly increased
Piece.The present invention can be greatly reduced every welding using laserscribing and divide electric current, reduce because using ultra-thin welding bring
Additional electrical losses.
The technical means disclosed in the embodiments of the present invention is not limited only to technological means disclosed in above embodiment, further includes
Technical solution consisting of any combination of the above technical features.
Claims (8)
1. a kind of novel stacked wafer moudle, including battery component, ultra-thin welding, packaging adhesive film, glass, backboard, it is characterised in that: institute
Stating battery component is formed in series and parallel by battery strings, and the battery strings are by the baby battery piece after scribing according to imbricated way
Series connection is formed, and a cell piece is divided into the baby battery piece of 1/2-1/10, is connected between baby battery piece by ultra-thin welding, single
Ultra-thin welding connection previous baby battery piece front and the latter baby battery piece back side, same baby battery piece front and back are not turned on, the electricity
Packaging adhesive film is had on the component of pond, glass is arranged in the top of upper layer packaging adhesive film, and back is arranged in the lower section of lower layer's packaging adhesive film
Plate, the stacked wafer moudle periphery are equipped with frame, and the stacked wafer moudle back side is equipped with terminal box.
2. a kind of novel stacked wafer moudle according to claim 1, it is characterised in that: front and back baby battery piece overlapping widths are 2-
4mm。
3. a kind of novel stacked wafer moudle according to claim 1, it is characterised in that: the cell piece main grid line number be 5BB,
6BB, 7BB, 9BB, 12BB, 14BB, 16BB, 18BB or 20BB, width 0.1-0.7mm, main gate line quantity and size are unrestricted
System.
4. a kind of novel stacked wafer moudle according to claim 1, it is characterised in that: the ultra-thin welding is with a thickness of 0.05-
0.15mm。
5. a kind of novel stacked wafer moudle according to claim 1, it is characterised in that: the ultra-thin welding width compares cell piece
Main grid line width 0.1-0.2mm.
6. a kind of novel stacked wafer moudle according to claim 1, it is characterised in that: the backboard be high molecular polymer or
Person's glass.
7. a kind of novel stacked wafer moudle according to claim 1, it is characterised in that: upper layer packaging adhesive film be high EVA thoroughly,
PVB POE glue film, with a thickness of 0.4-0.5mm；Lower layer's packaging adhesive film is high saturating, conventional glue film or white glue film, lower layer's envelope
Dress film thickness is 0.4-0.7mm.
8. a kind of preparation method of novel stacked wafer moudle described in claim 1, it is characterised in that: laser scribing means are used,
Photovoltaic cell is divided into the baby battery piece of 1/2-1/10, by ultra-thin welding, by the baby battery piece after scribing according to imbrication
Mode is connected, and a laminated batteries string without piece spacing is formed, and several battery strings finally will by forming battery component in series and parallel
Battery component is packaged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811329878.4A CN109360863A (en) | 2018-11-09 | 2018-11-09 | A kind of novel stacked wafer moudle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811329878.4A CN109360863A (en) | 2018-11-09 | 2018-11-09 | A kind of novel stacked wafer moudle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109360863A true CN109360863A (en) | 2019-02-19 |
Family
ID=65344575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811329878.4A Pending CN109360863A (en) | 2018-11-09 | 2018-11-09 | A kind of novel stacked wafer moudle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109360863A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110137303A (en) * | 2019-04-19 | 2019-08-16 | 泰州隆基乐叶光伏科技有限公司 | It is sliced cell piece and overlaps method |
| CN110571287A (en) * | 2019-09-30 | 2019-12-13 | 天合光能股份有限公司 | Photovoltaic module of large-size solar cell |
| CN110828598A (en) * | 2019-10-30 | 2020-02-21 | 江苏朗道新能源有限公司 | Half laminated tile assembly and manufacturing method thereof |
| CN110838527A (en) * | 2019-10-30 | 2020-02-25 | 江苏朗道新能源有限公司 | Cell for half-laminated tile photovoltaic module and manufacturing method of module |
| CN112411889A (en) * | 2020-12-10 | 2021-02-26 | 汉摩尼(江苏)光电科技有限公司 | Installation of plane crystal silicon shingled photovoltaic tile and seal structure |
| WO2021051862A1 (en) * | 2019-09-18 | 2021-03-25 | 天合光能股份有限公司 | Sliced cell photovoltaic module |
| WO2021063008A1 (en) * | 2019-09-30 | 2021-04-08 | 天合光能股份有限公司 | Photovoltaic assembly applicable to solar cell |
| CN115241294A (en) * | 2022-07-21 | 2022-10-25 | 常州时创能源股份有限公司 | Photovoltaic laminated tile assembly and preparation method thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106298985A (en) * | 2016-08-31 | 2017-01-04 | 连云港神舟新能源有限公司 | A kind of generating electricity on two sides solar double-glass assemblies |
| WO2018018908A1 (en) * | 2016-07-29 | 2018-02-01 | 无锡嘉瑞光伏有限公司 | Solar battery cell and assembly, and preparation process therefor |
| CN107910396A (en) * | 2017-12-22 | 2018-04-13 | 泰州隆基乐叶光伏科技有限公司 | A kind of two-sided monocrystalline lamination photovoltaic module and its manufacture method |
| CN207690809U (en) * | 2017-12-05 | 2018-08-03 | 上海山晟太阳能科技有限公司 | Photovoltaic imbrication battery component and photovoltaic power generation apparatus |
| CN207800614U (en) * | 2017-08-17 | 2018-08-31 | 泰州隆基乐叶光伏科技有限公司 | A kind of stacked tile type solar photovoltaic assembly |
| CN207947297U (en) * | 2018-03-27 | 2018-10-09 | 泰州隆基乐叶光伏科技有限公司 | A kind of stacked wafer moudle promoting transfer efficiency using reflected light |
| CN108649088A (en) * | 2018-05-18 | 2018-10-12 | 东腾投资集团有限公司 | A kind of connection method of HIT solar battery sheets and HIT photovoltaic modulies |
| CN108682700A (en) * | 2018-06-04 | 2018-10-19 | 浙江宝利特新能源股份有限公司 | A kind of more main grid cell piece stacked wafer moudles of MBB and photovoltaic module |
| CN209471979U (en) * | 2018-11-09 | 2019-10-08 | 连云港神舟新能源有限公司 | A kind of novel stacked wafer moudle |
-
2018
- 2018-11-09 CN CN201811329878.4A patent/CN109360863A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018018908A1 (en) * | 2016-07-29 | 2018-02-01 | 无锡嘉瑞光伏有限公司 | Solar battery cell and assembly, and preparation process therefor |
| CN106298985A (en) * | 2016-08-31 | 2017-01-04 | 连云港神舟新能源有限公司 | A kind of generating electricity on two sides solar double-glass assemblies |
| CN207800614U (en) * | 2017-08-17 | 2018-08-31 | 泰州隆基乐叶光伏科技有限公司 | A kind of stacked tile type solar photovoltaic assembly |
| CN207690809U (en) * | 2017-12-05 | 2018-08-03 | 上海山晟太阳能科技有限公司 | Photovoltaic imbrication battery component and photovoltaic power generation apparatus |
| CN107910396A (en) * | 2017-12-22 | 2018-04-13 | 泰州隆基乐叶光伏科技有限公司 | A kind of two-sided monocrystalline lamination photovoltaic module and its manufacture method |
| CN207947297U (en) * | 2018-03-27 | 2018-10-09 | 泰州隆基乐叶光伏科技有限公司 | A kind of stacked wafer moudle promoting transfer efficiency using reflected light |
| CN108649088A (en) * | 2018-05-18 | 2018-10-12 | 东腾投资集团有限公司 | A kind of connection method of HIT solar battery sheets and HIT photovoltaic modulies |
| CN108682700A (en) * | 2018-06-04 | 2018-10-19 | 浙江宝利特新能源股份有限公司 | A kind of more main grid cell piece stacked wafer moudles of MBB and photovoltaic module |
| CN209471979U (en) * | 2018-11-09 | 2019-10-08 | 连云港神舟新能源有限公司 | A kind of novel stacked wafer moudle |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110137303A (en) * | 2019-04-19 | 2019-08-16 | 泰州隆基乐叶光伏科技有限公司 | It is sliced cell piece and overlaps method |
| CN110137303B (en) * | 2019-04-19 | 2021-10-22 | 泰州隆基乐叶光伏科技有限公司 | Sliced cell overlapping method |
| WO2021051862A1 (en) * | 2019-09-18 | 2021-03-25 | 天合光能股份有限公司 | Sliced cell photovoltaic module |
| CN110571287A (en) * | 2019-09-30 | 2019-12-13 | 天合光能股份有限公司 | Photovoltaic module of large-size solar cell |
| WO2021063008A1 (en) * | 2019-09-30 | 2021-04-08 | 天合光能股份有限公司 | Photovoltaic assembly applicable to solar cell |
| CN110828598A (en) * | 2019-10-30 | 2020-02-21 | 江苏朗道新能源有限公司 | Half laminated tile assembly and manufacturing method thereof |
| CN110838527A (en) * | 2019-10-30 | 2020-02-25 | 江苏朗道新能源有限公司 | Cell for half-laminated tile photovoltaic module and manufacturing method of module |
| CN110838527B (en) * | 2019-10-30 | 2024-03-08 | 江苏朗道新能源有限公司 | Cell for half-sheet shingled photovoltaic module and manufacturing method of module |
| CN110828598B (en) * | 2019-10-30 | 2024-03-08 | 江苏朗道新能源有限公司 | Half-sheet laminated tile assembly and manufacturing method thereof |
| CN112411889A (en) * | 2020-12-10 | 2021-02-26 | 汉摩尼(江苏)光电科技有限公司 | Installation of plane crystal silicon shingled photovoltaic tile and seal structure |
| CN115241294A (en) * | 2022-07-21 | 2022-10-25 | 常州时创能源股份有限公司 | Photovoltaic laminated tile assembly and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109360863A (en) | A kind of novel stacked wafer moudle | |
| CN207800614U (en) | A kind of stacked tile type solar photovoltaic assembly | |
| CN205376541U (en) | Photovoltaic structure and solar module | |
| CN104465892A (en) | Method for manufacturing photovoltaic modules interconnected on same sides of adjacent solar cells in solar cell string | |
| CN108649087A (en) | A kind of solar cell module and preparation method thereof | |
| CN107799615B (en) | Solar cell unit, photovoltaic cell module and preparation process thereof | |
| CN109301004A (en) | A kind of imbrication photovoltaic module and manufacturing method | |
| CN106784105A (en) | A kind of high mechanical load solar cell module and preparation method thereof | |
| WO2021008474A1 (en) | Solar cell and photovoltaic module | |
| CN210692545U (en) | Photovoltaic module without main grid | |
| CN107958943A (en) | A kind of photovoltaic module and production method based on IBC cell packages | |
| JP3219129U (en) | Solar module | |
| CN205609550U (en) | Double -sided solar battery component | |
| CN209471979U (en) | A kind of novel stacked wafer moudle | |
| CN209071344U (en) | A kind of imbrication photovoltaic module | |
| CN208352314U (en) | A kind of photovoltaic cell string and photovoltaic module | |
| CN108428767A (en) | A kind of more main grid half stacked wafer moudle row string methods | |
| CN109166939A (en) | Photovoltaic glass and photovoltaic module | |
| WO2023202648A1 (en) | Photovoltaic module manufacturing method, and photovoltaic module | |
| CN107958942A (en) | A kind of two-sided photovoltaic power generation apparatus using single side solar cell | |
| CN110649119A (en) | Solar power generation assembly based on crystalline silicon and preparation method thereof | |
| CN210182396U (en) | Solar cell and photovoltaic module | |
| CN108461559A (en) | The two-sided photovoltaic stacked wafer moudle that compatible terminal box is blocked | |
| CN104952958B (en) | Exempt to weld photovoltaic module and processing method | |
| CN210866217U (en) | Photovoltaic module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |