CN109354737A - A kind of high heat sink material and preparation method thereof for electronic product - Google Patents
A kind of high heat sink material and preparation method thereof for electronic product Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
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- C08K2003/0812—Aluminium
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C08L2205/00—Polymer mixtures characterised by other features
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- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
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Abstract
The high heat sink material and preparation method thereof that the invention discloses a kind of for electronic product, it is related to heat sink material technical field, which includes the raw material of following parts by weight: 30-40 parts of polyethylene, 18-24 parts of polyamide, 14-20 parts of dioctyl phthalate, 12-18 parts of aluminium copper, 10-16 parts of compound adhesive, 12-16 parts of modified plant fibers, 2-5 parts of phenols primary antioxidant, auxiliary antioxidant 1-4 parts Phosphorus, 3-7 parts of silane coupling agent, 1-3 parts of ethylenediamine；The preparation method of the heat sink material includes preparation initial material, mixing, compression moulding, curing step.The heat sink material has very outstanding heating conduction, and intensity is high, good flame retardation effect.
Description
Technical field
The invention belongs to heat sink material technical fields, and in particular to a kind of high heat sink material and its system for electronic product
Preparation Method.
Background technique
In the electronic equipments such as mobile phone, computer, primarily now using graphene and carbon nanotubes as heat sink material, although
Its heat dissipation effect is outstanding, but its cost is also very high, and graphite flake is in use, and be collided to hold very much
It is easy to fall off, and then internal electronic component is damaged, in addition with the miniaturization of electronic product and the diversification of function,
Integrated level is higher and higher, and the requirement to heat sink material is also higher and higher, and polymer uses extensively, low in cost, and has good
Good insulation performance, but its thermal coefficient is low, unsatisfactory used in electronic product direction heat dissipation effect, plastics can absorption equipment
The heat of generation is so as to cause overheat, and in the prior art, some material heat-sinking capabilities are poor, in some instances it may even be possible to it will lead to material combustion,
Therefore it is badly in need of a kind of material of perfect heat-dissipating.
Notification number is the Chinese invention patent of CN105199594B, discloses a kind of use for electronic products heat sink material and its system
Preparation Method is prepared from the following materials in parts by weight: polyaniline solutions, epoxy resin, flyash, slag, recycling silver powder,
Sodium hexatitanate, tricalcium phosphate, molybdenum powder, aluminosilicate cement, ferrophosphorus powder, diaminodiphenyl-methane, silane coupling agent KH-560
With suitable ethyl alcohol.Heat sink material adhesive force prepared by the invention is strong, not easily to fall off, compared to traditional graphite-based heat dissipation material
Expect more preferably stable in its use process.The thermal conductivity of heat sink material prepared by the invention is greater than 2W/ (mk), and used
The chemical stability of polyaniline is good, and antistatic effect is good, is very suitable to electronic product use.In addition, preparation method of the invention
Simple process is suitble to large-scale production.But the invention uses and the substances such as filler is added into material to promote its thermal conductivity,
Promotion effect is poor, and the intensity of material is low.
Notification number is the Chinese invention patent of CN106191781B, discloses a kind of high thermal conductivity height heat dissipation flexible graphite material
Preparation method, mainly comprise the steps of: step 1: making the surface of flexible graphite platelet raw by sputtering, the methods of chemistry
Long one layer of metallic film；Step 2: heating in a vacuum, so that metallic film becomes metallic particles；Step 3: being passed through hydrogen,
Continuous heating in a vacuum；Step 4: hydrogen is closed, is heated after being passed through organic gas；Step 5: resulting materials are thin with PET
Film is compound.The present invention strengthens the effect to radiate outside surface red while keeping graphite flake high thermal conductivity effect, can not have to gold
Belonging to radiator can reach ideal heat dissipation effect, greatly reduce the volume of electronic device, have to the extensive use of soft graphite
There is important meaning；But the invention forms one layer of metallic film on the surface of flexible graphite platelet, complex process is with high costs.
Summary of the invention
The high heat sink material and preparation method thereof that the object of the present invention is to provide a kind of for electronic product, the heat sink material
With very outstanding heating conduction, and intensity is high, good flame retardation effect.
To achieve the above object, the present invention provides the following technical solution:
A kind of high heat sink material for electronic product, the raw material including following parts by weight: 30-40 parts of polyethylene, polyamides
18-24 parts of amine, 14-20 parts of dioctyl phthalate, 12-18 parts of aluminium copper, 10-16 parts of compound adhesive, modified plant fibers
12-16 parts, 2-5 parts of phenols primary antioxidant, auxiliary antioxidant 1-4 parts Phosphorus, 3-7 parts of silane coupling agent, 1-3 parts of ethylenediamine, institute
The partial size for stating aluminium copper is 300-600 mesh.
Preferably, the raw material including following parts by weight: 32-38 parts of polyethylene, 20-22 parts of polyamide, phthalic acid two
16-18 parts of monooctyl ester, 14-16 parts of aluminium copper, 12-14 parts of compound adhesive, 13-15 parts of modified plant fibers, phenols primary antioxidant 3-4
Part, auxiliary antioxidant 2-3 parts Phosphorus, 4-6 parts of silane coupling agent, 1.2-2.8 parts of ethylenediamine.
Preferably, the raw material including following parts by weight: 35 parts of polyethylene, 21 parts of polyamide, dioctyl phthalate 17
Part, 15 parts of aluminium copper, 13 parts of compound adhesive, 14 parts of modified plant fibers, 3.5 parts of phenols primary antioxidant, Phosphorus auxiliary antioxidant
2.5 parts, 5 parts of silane coupling agent, 2 parts of ethylenediamine.
Preferably, in the aluminium copper, wherein copper component accounts for the 3-8% of aluminium copper mass fraction.
Preferably, the compound adhesive is made of the raw material of following parts by weight: 50-60 parts of polyvinyl acetate, polyvinyl alcohol
12-16 parts, 8-12 parts of potassium peroxydisulfate, 2-6 parts of polysorbate, 3-8 parts of magnesia, 1-3 parts of red phosphorus, 1-4 parts of sodium pyrophosphate, water 6-
12 parts.
Preferably, the modified plant fibers the preparation method comprises the following steps: 3:1 takes corn stover and rice straw in mass ratio,
The hydrochloric acid solution that volumetric concentration is 12-18% is added in stalk, is stirred 10-20 minutes with the speed of 80-180r/min, removal
It is cleaned after turbid solution using clear water, the sodium hydroxide solution that mass concentration is 12-18% is added, with the speed of 100-140r/min
Degree stirring 20-40 minutes uses clear water to wash the water to washing as neutrality, after draining, adds poly- four after removing turbid solution
Fluoride surface inorganic agent is impregnated 4-8 hours, then is dried, and modified plant fibers can be obtained.
Preferably, the usage amount of the hydrochloric acid solution, sodium hydroxide solution and ptfe surface inorganic agent is to make straw
Stalk can all be impregnated.
Preferably, the length of the modified plant fibers is 0.5-2.2mm.
A kind of preparation method of the high heat sink material for electronic product, comprising the following steps:
(1) raw material is weighed according to mass parts；
(2) polyethylene, polyamide and dioctyl phthalate are uniformly mixed, are placed into mixer, in 140-150
Mixing 20-30 minutes at DEG C, temperature is risen to 160-175 DEG C, aluminium copper mixing 6-8 times repeatedly is added, obtains initial material；
(3) phenols primary antioxidant and Phosphorus auxiliary antioxidant are mixed, then by itself and modified plant fibers mixing, until changing
Property plant fiber on be all covered in antioxidant and step (2) initial material mixing, mixing temperature be 40-50 DEG C, premixed
Material；
(4) premix in remaining raw material and step (3) is mixed again, heating stirring 30-40 points at 55-65 DEG C
Clock, then import in extruder and squeeze out, it imports in mold, compression moulding, after dehydration and drying, maintenance obtains the heat sink material.
Preferably, it is small that the step of mould inner wall is coated with saponified oil in the step (4), maintenance is included in maintenance 5 at 30 DEG C
When, promoted temperature to 50 DEG C conserve 1 hour, then be cooled to 40 DEG C conserve 2 hours, finally at normal temperature place 18 hours.
The invention has the benefit that the heat sink material has very outstanding heating conduction, and intensity is high, fire-retardant effect
Fruit is good；It is specific as follows:
(1) it is added to aluminium copper powder in the material as Heat Conduction Material in the present invention, aluminium copper heat resistance is excellent
Show, mechanical behavior under high temperature is high, and has the thermal coefficient more than 250W/ (mk), can be effectively by the heat in electronic component
Amount distributes, and alloy material has the advantages that simple substance aluminum material lightweight, cheap, and the mechanical strength with copper,
Metallicity is outstanding.
(2) phenols primary antioxidant and the anti-feeding agent of Phosphorus auxiliary are used in the present invention, can be acted synergistically, in antioxygen
During change, phenols primary antioxidant can capture peroxylradicals and generate hydroperoxides, and Phosphorus auxiliary antioxidant can be with
Hydroperoxide decomposition, and then the thermal oxide of material is prevented to decompose, in addition Phosphorus auxiliary antioxidant can also improve the resistance of material
The stability of combustion property and material.
(3) modified plant fibers are used in the present invention, and sour processing and alkali process are carried out to it, can be removed organic in stalk
Object retains the fibrous material of needs, can greatly improve the utilization rate to material, reuses ptfe surface inorganic agent, can
So that fibrous material has good chemical Optimality, corrosion resistance, electrical insulating property and good anti-aging property, in addition poly- four
The surface of vinyl fluoride can be low, to have extraordinary high temperature resistant property, maximum operation (service) temperature reaches 250 DEG C, allows to be quenched rapid
Heat is had excellent performance, and fibrous material can also improve the heat dissipation material finally prepared as filler to a certain extent
The mechanical mechanics property of material guarantees the intensity of material.
(4) Phosphorous species be also added in the present invention, can be used as fire retardant matter, when material is by high temperature, in material
Surface can generate the more stable crosslinking shape solid matter and carburization zone of structure, on the one hand the formation of carburization zone can prevent to gather
The further pyrolysis for closing object, can also faster distribute energy therein, but also can be excessively high to avoid electron temperature
And fire occurs, improve its security performance.
(5) it also added micro ethylenediamine in the present invention, the adhesive property and filler that compound can be improved are at it
In stability；The present invention has also carried out compacting, maintenance processing to material, further increases its mechanical strength and its is anti-ageing
Change performance.
Specific embodiment
Present invention will be further explained below with reference to specific examples.These embodiments are merely to illustrate the present invention and do not have to
In limiting the scope of the invention.
Embodiment 1
The present embodiment is related to a kind of high heat sink material for electronic product, the raw material including following parts by weight: polyethylene
30 parts, 18 parts of polyamide, 14 parts of dioctyl phthalate, 12 parts of aluminium copper, 10 parts of compound adhesive, modified plant fibers 12
Part, 2 parts of phenols primary antioxidant, 1 part of Phosphorus auxiliary antioxidant, 3 parts of silane coupling agent, 1 part of ethylenediamine, the grain of the aluminium copper
Diameter is 300 mesh.
Wherein, in the aluminium copper, wherein copper component accounts for the 3% of aluminium copper mass fraction.
Wherein, the compound adhesive is made of the raw material of following parts by weight: 50 parts of polyvinyl acetate, 12 parts of polyvinyl alcohol,
8 parts of potassium peroxydisulfate, 2 parts of polysorbate, 3 parts of magnesia, 1 part of red phosphorus, 1 part of sodium pyrophosphate, 6 parts of water.
Wherein, the modified plant fibers the preparation method comprises the following steps: 3:1 takes corn stover and rice straw in mass ratio,
The hydrochloric acid solution that volumetric concentration is 12% is added in stalk, is stirred 10 minutes with the speed of 80r/min, is used after removing turbid solution
Clear water is cleaned, and is added the sodium hydroxide solution that mass concentration is 12%, is stirred 20 minutes with the speed of 100r/min, is removed muddy
The water to washing is washed as neutrality using clear water after turbid, after draining, is added ptfe surface inorganic agent, is impregnated 4
Hour, then dry, modified plant fibers can be obtained.At the hydrochloric acid solution, sodium hydroxide solution and ptfe surface
The usage amount of reason agent is that impregnate stalk all can.
Wherein, the length of the modified plant fibers is 0.5mm.
The present embodiment further relates to a kind of preparation method of high heat sink material for electronic product, comprising the following steps:
(1) raw material is weighed according to mass parts；
(2) polyethylene, polyamide and dioctyl phthalate are uniformly mixed, are placed into mixer, at 140 DEG C
Mixing 20 minutes, temperature is risen to 160 DEG C, aluminium copper mixing 6 times repeatedly are added, obtain initial material；
(3) phenols primary antioxidant and Phosphorus auxiliary antioxidant are mixed, then by itself and modified plant fibers mixing, until changing
Property plant fiber on be all covered in antioxidant and step (2) initial material mixing, mixing temperature be 40 DEG C, obtain premix；
(4) premix in remaining raw material and step (3) is mixed again, heating stirring 30 minutes at 55 DEG C, then led
Enter in extruder and squeeze out, import in mold, compression moulding, after dehydration and drying, maintenance obtains the heat sink material；Wherein, mold
The step of inner wall is coated with saponified oil, maintenance, which is included at 30 DEG C, to be conserved 5 hours, is promoted temperature and is conserved 1 hour to 50 DEG C, then cools down
It conserves 2 hours to 40 DEG C, finally places 18 hours at normal temperature.
Embodiment 2
The present embodiment is related to a kind of high heat sink material for electronic product, the raw material including following parts by weight: polyethylene
40 parts, 24 parts of polyamide, 20 parts of dioctyl phthalate, 18 parts of aluminium copper, 16 parts of compound adhesive, modified plant fibers 16
Part, 5 parts of phenols primary antioxidant, 4 parts of Phosphorus auxiliary antioxidant, 7 parts of silane coupling agent, 3 parts of ethylenediamine, the grain of the aluminium copper
Diameter is 600 mesh.
Wherein, in the aluminium copper, wherein copper component accounts for the 8% of aluminium copper mass fraction.
Wherein, the compound adhesive is made of the raw material of following parts by weight: 60 parts of polyvinyl acetate, 16 parts of polyvinyl alcohol,
12 parts of potassium peroxydisulfate, 6 parts of polysorbate, 8 parts of magnesia, 3 parts of red phosphorus, 4 parts of sodium pyrophosphate, 12 parts of water.
Wherein, the modified plant fibers the preparation method comprises the following steps: 3:1 takes corn stover and rice straw in mass ratio,
The hydrochloric acid solution that volumetric concentration is 18% is added in stalk, is stirred 20 minutes with the speed of 180r/min, makes after removing turbid solution
It is cleaned with clear water, adds the sodium hydroxide solution that mass concentration is 18%, stirred 40 minutes with the speed of 140r/min, removal
The water to washing is washed as neutrality using clear water after turbid solution, after draining, is added ptfe surface inorganic agent, is impregnated
8 hours, then dry, modified plant fibers can be obtained.At the hydrochloric acid solution, sodium hydroxide solution and ptfe surface
The usage amount of reason agent is that impregnate stalk all can.
Wherein, the length of the modified plant fibers is 2.2mm.
The present embodiment further relates to a kind of preparation method of high heat sink material for electronic product, comprising the following steps:
(1) raw material is weighed according to mass parts；
(2) polyethylene, polyamide and dioctyl phthalate are uniformly mixed, are placed into mixer, at 150 DEG C
Mixing 30 minutes, temperature is risen to 175 DEG C, aluminium copper mixing 8 times repeatedly are added, obtain initial material；
(3) phenols primary antioxidant and Phosphorus auxiliary antioxidant are mixed, then by itself and modified plant fibers mixing, until changing
Property plant fiber on be all covered in antioxidant and step (2) initial material mixing, mixing temperature be 50 DEG C, obtain premix；
(4) premix in remaining raw material and step (3) is mixed again, heating stirring 40 minutes at 65 DEG C, then led
Enter in extruder and squeeze out, import in mold, compression moulding, after dehydration and drying, maintenance obtains the heat sink material.Wherein, mold
The step of inner wall is coated with saponified oil, maintenance, which is included at 30 DEG C, to be conserved 5 hours, is promoted temperature and is conserved 1 hour to 50 DEG C, then cools down
It conserves 2 hours to 40 DEG C, finally places 18 hours at normal temperature.
Embodiment 3
The present embodiment is related to a kind of high heat sink material for electronic product, the raw material including following parts by weight: polyethylene
32 parts, 20 parts of polyamide, 16 parts of dioctyl phthalate, 14 parts of aluminium copper, 12 parts of compound adhesive, modified plant fibers 13
Part, 3 parts of phenols primary antioxidant, 2 parts of Phosphorus auxiliary antioxidant, 4 parts of silane coupling agent, 1.2 parts of ethylenediamine, the aluminium copper
Partial size is 300 mesh.
Wherein, in the aluminium copper, wherein copper component accounts for the 3% of aluminium copper mass fraction.
Wherein, the compound adhesive is made of the raw material of following parts by weight: 50 parts of polyvinyl acetate, 12 parts of polyvinyl alcohol,
8 parts of potassium peroxydisulfate, 2 parts of polysorbate, 3 parts of magnesia, 1 part of red phosphorus, 1 part of sodium pyrophosphate, 6 parts of water.
Wherein, the modified plant fibers the preparation method comprises the following steps: 3:1 takes corn stover and rice straw in mass ratio,
The hydrochloric acid solution that volumetric concentration is 12% is added in stalk, is stirred 10 minutes with the speed of 80r/min, is used after removing turbid solution
Clear water is cleaned, and is added the sodium hydroxide solution that mass concentration is 12%, is stirred 20 minutes with the speed of 100r/min, is removed muddy
The water to washing is washed as neutrality using clear water after turbid, after draining, is added ptfe surface inorganic agent, is impregnated 4
Hour, then dry, modified plant fibers can be obtained.At the hydrochloric acid solution, sodium hydroxide solution and ptfe surface
The usage amount of reason agent is that impregnate stalk all can.
Wherein, the length of the modified plant fibers is 0.5mm.
The present embodiment further relates to a kind of preparation method of high heat sink material for electronic product, comprising the following steps:
(1) raw material is weighed according to mass parts；
(2) polyethylene, polyamide and dioctyl phthalate are uniformly mixed, are placed into mixer, at 140 DEG C
Mixing 20 minutes, temperature is risen to 160 DEG C, aluminium copper mixing 6 times repeatedly are added, obtain initial material；
(3) phenols primary antioxidant and Phosphorus auxiliary antioxidant are mixed, then by itself and modified plant fibers mixing, until changing
Property plant fiber on be all covered in antioxidant and step (2) initial material mixing, mixing temperature be 40 DEG C, obtain premix；
(4) premix in remaining raw material and step (3) is mixed again, heating stirring 30 minutes at 55 DEG C, then led
Enter in extruder and squeeze out, import in mold, compression moulding, after dehydration and drying, maintenance obtains the heat sink material.Wherein, mold
The step of inner wall is coated with saponified oil, maintenance, which is included at 30 DEG C, to be conserved 5 hours, is promoted temperature and is conserved 1 hour to 50 DEG C, then cools down
It conserves 2 hours to 40 DEG C, finally places 18 hours at normal temperature.
Embodiment 4
The present embodiment is related to a kind of high heat sink material for electronic product, the raw material including following parts by weight: polyethylene
38 parts, 22 parts of polyamide, 18 parts of dioctyl phthalate, 16 parts of aluminium copper, 14 parts of compound adhesive, modified plant fibers 15
2.8 parts of part, 4 parts of phenols primary antioxidant, 3 parts of Phosphorus auxiliary antioxidant, 6 parts of silane coupling agent, ethylenediamine aluminium coppers
Partial size is 600 mesh.
Wherein, in the aluminium copper, wherein copper component accounts for the 8% of aluminium copper mass fraction.
Wherein, the compound adhesive is made of the raw material of following parts by weight: 60 parts of polyvinyl acetate, 16 parts of polyvinyl alcohol,
12 parts of potassium peroxydisulfate, 6 parts of polysorbate, 8 parts of magnesia, 3 parts of red phosphorus, 4 parts of sodium pyrophosphate, 12 parts of water.
Wherein, the modified plant fibers the preparation method comprises the following steps: 3:1 takes corn stover and rice straw in mass ratio,
The hydrochloric acid solution that volumetric concentration is 18% is added in stalk, is stirred 20 minutes with the speed of 180r/min, makes after removing turbid solution
It is cleaned with clear water, adds the sodium hydroxide solution that mass concentration is 18%, stirred 40 minutes with the speed of 140r/min, removal
The water to washing is washed as neutrality using clear water after turbid solution, after draining, is added ptfe surface inorganic agent, is impregnated
8 hours, then dry, modified plant fibers can be obtained.At the hydrochloric acid solution, sodium hydroxide solution and ptfe surface
The usage amount of reason agent is that impregnate stalk all can.
Wherein, the length of the modified plant fibers is 2.2mm.
The present embodiment further relates to a kind of preparation method of high heat sink material for electronic product, comprising the following steps:
(1) raw material is weighed according to mass parts；
(2) polyethylene, polyamide and dioctyl phthalate are uniformly mixed, are placed into mixer, at 150 DEG C
Mixing 30 minutes, temperature is risen to 175 DEG C, aluminium copper mixing 8 times repeatedly are added, obtain initial material；
(3) phenols primary antioxidant and Phosphorus auxiliary antioxidant are mixed, then by itself and modified plant fibers mixing, until changing
Property plant fiber on be all covered in antioxidant and step (2) initial material mixing, mixing temperature be 50 DEG C, obtain premix；
(4) premix in remaining raw material and step (3) is mixed again, heating stirring 40 minutes at 65 DEG C, then led
Enter in extruder and squeeze out, import in mold, compression moulding, after dehydration and drying, maintenance obtains the heat sink material.Wherein, mold
The step of inner wall is coated with saponified oil, maintenance, which is included at 30 DEG C, to be conserved 5 hours, is promoted temperature and is conserved 1 hour to 50 DEG C, then cools down
It conserves 2 hours to 40 DEG C, finally places 18 hours at normal temperature.
Embodiment 5
The present embodiment is related to a kind of high heat sink material for electronic product, the raw material including following parts by weight: polyethylene
35 parts, 21 parts of polyamide, 17 parts of dioctyl phthalate, 15 parts of aluminium copper, 13 parts of compound adhesive, modified plant fibers 14
Part, 3.5 parts of phenols primary antioxidant, 2.5 parts of Phosphorus auxiliary antioxidant, 5 parts of silane coupling agent, 2 parts of ethylenediamine, the aluminium copper
Partial size be 450 mesh.
Wherein, in the aluminium copper, wherein copper component accounts for the 5.5% of aluminium copper mass fraction.
Wherein, the compound adhesive is made of the raw material of following parts by weight: 55 parts of polyvinyl acetate, 14 parts of polyvinyl alcohol,
10 parts of potassium peroxydisulfate, 4 parts of polysorbate, 5.5 parts of magnesia, 2 parts of red phosphorus, 2.5 parts of sodium pyrophosphate, 9 parts of water.
Wherein, the modified plant fibers the preparation method comprises the following steps: 3:1 takes corn stover and rice straw in mass ratio,
The hydrochloric acid solution that volumetric concentration is 15% is added in stalk, is stirred 15 minutes with the speed of 130r/min, makes after removing turbid solution
It is cleaned with clear water, adds the sodium hydroxide solution that mass concentration is 15%, stirred 30 minutes with the speed of 120r/min, removal
The water to washing is washed as neutrality using clear water after turbid solution, after draining, is added ptfe surface inorganic agent, is impregnated
6 hours, then dry, modified plant fibers can be obtained.At the hydrochloric acid solution, sodium hydroxide solution and ptfe surface
The usage amount of reason agent is that impregnate stalk all can.
Wherein, the length of the modified plant fibers is 1.3mm.
The present embodiment further relates to a kind of preparation method of high heat sink material for electronic product, comprising the following steps:
(1) raw material is weighed according to mass parts；
(2) polyethylene, polyamide and dioctyl phthalate are uniformly mixed, are placed into mixer, at 145 DEG C
Mixing 25 minutes, temperature is risen to 167 DEG C, aluminium copper mixing 7 times repeatedly are added, obtain initial material；
(3) phenols primary antioxidant and Phosphorus auxiliary antioxidant are mixed, then by itself and modified plant fibers mixing, until changing
Property plant fiber on be all covered in antioxidant and step (2) initial material mixing, mixing temperature be 45 DEG C, obtain premix；
(4) premix in remaining raw material and step (3) is mixed again, heating stirring 35 minutes at 60 DEG C, then led
Enter in extruder and squeeze out, import in mold, compression moulding, after dehydration and drying, maintenance obtains the heat sink material.Wherein, mold
The step of inner wall is coated with saponified oil, maintenance, which is included at 30 DEG C, to be conserved 5 hours, is promoted temperature and is conserved 1 hour to 50 DEG C, then cools down
It conserves 2 hours to 40 DEG C, finally places 18 hours at normal temperature.
Comparative example 1
Use heat sink material made from Chinese invention patent (notification number CN105199594B).
Comparative example 2
In addition to no aluminium copper, other raw materials, content and step and embodiment 1 are consistent.
Comparative example 3
In addition to no modified plant fibers, other raw materials, content and step and embodiment 1 are consistent.
Comparative example 4
In addition to no curing step, other raw materials, content and step and embodiment 1 are consistent.
Comparative example 5
Heat sink material made from the prior art.
Detection is sampled to above-described embodiment 1-5 and comparative example the 1-5 heat sink material prepared.Obtained performance parameter
It is as shown in table 1:
Table 1
From table 1 it follows that acting synergistically between each each raw material of step in the present invention, reach desired by the present invention jointly
High thermal conductivity effect so that improve the heat dissipation effect of material, the obtained material that radiates can all be made by lacking step or change raw material
The degradation of material lacks aluminium copper, modified plant fibers, curing step in conjunction with comparative example 2, comparative example 3 and comparative example 4
The thermal conductivity for the material prepared will be made to decline, mechanical mechanics property is deteriorated, and oxygen index (OI) also reduces, illustrates aluminium copper, changes
Property plant fiber, curing step play an important role in the material.
Processing by crop material through persalt, sodium hydroxide and polytetrafluoroethylene (PTFE), to make the modification prepared
Plant fibre surface can be low, and chemical property is outstanding；By the compounding of antioxidant, its antioxygenic property can be improved.
From table 1 it follows that embodiment 5 is highly preferred embodiment of the present invention, the heat sink material phase that the present invention prepares
It is conventionally all greatly improved, oxygen index (OI) maximum has reached 73% and improves compared with the existing technology
43%；Thermal conductivity maximum has reached 82.8W/ (mk), improves 79.7W/ (mk) compared with the existing technology；And tensile strength
It is up to 89Mpa, improves 81Mpa compared with the existing technology, high heat sink material prepared by the present invention comes compared with the existing technology
It says, is compounded with different components according to different ratios, various components play its advantage jointly, to make properties all
Significant progress is obtained.
Specific embodiments of the present invention are described above.It is to be appreciated that the invention is not limited to above-mentioned
Particular implementation, those skilled in the art can make various deformations or amendments within the scope of the claims, this not shadow
Ring substantive content of the invention.
Claims (10)
1. a kind of high heat sink material for electronic product, which is characterized in that the raw material including following parts by weight: polyethylene 30-
40 parts, 18-24 parts of polyamide, 14-20 parts of dioctyl phthalate, 12-18 parts of aluminium copper, 10-16 parts of compound adhesive, modification
12-16 parts of plant fiber, 2-5 parts of phenols primary antioxidant, auxiliary antioxidant 1-4 parts Phosphorus, 3-7 parts of silane coupling agent, ethylenediamine
1-3 parts, the partial size of the aluminium copper is 300-600 mesh.
2. the high heat sink material according to claim 1 for electronic product, which is characterized in that including following parts by weight
Raw material: 32-38 parts of polyethylene, 20-22 parts of polyamide, 16-18 parts of dioctyl phthalate, 14-16 parts of aluminium copper, compound
It is 12-14 parts of glue, 13-15 parts of modified plant fibers, 3-4 parts of phenols primary antioxidant, auxiliary antioxidant 2-3 parts Phosphorus, silane coupled
4-6 parts of agent, 1.2-2.8 parts of ethylenediamine.
3. the high heat sink material according to claim 1 for electronic product, which is characterized in that including following parts by weight
Raw material: 35 parts of polyethylene, 17 parts of dioctyl phthalate, 15 parts of aluminium copper, 13 parts of compound adhesive, is modified 21 parts of polyamide
14 parts of plant fiber, 3.5 parts of phenols primary antioxidant, 2.5 parts of Phosphorus auxiliary antioxidant, 5 parts of silane coupling agent, 2 parts of ethylenediamine.
4. the high heat sink material according to claim 1 for electronic product, which is characterized in that in the aluminium copper,
Wherein copper component accounts for the 3-8% of aluminium copper mass fraction.
5. the high heat sink material according to claim 1 for electronic product, which is characterized in that the compound adhesive is by following
The raw material of parts by weight forms: 50-60 parts of polyvinyl acetate, 12-16 parts of polyvinyl alcohol, 8-12 parts of potassium peroxydisulfate, polysorbate
2-6 parts, 3-8 parts of magnesia, 1-3 parts of red phosphorus, 1-4 parts of sodium pyrophosphate, 6-12 parts of water.
6. the high heat sink material according to claim 1 for electronic product, which is characterized in that the modified plant fibers
The preparation method comprises the following steps: 3:1 takes corn stover and rice straw in mass ratio, the salt that volumetric concentration is 12-18% is added in stalk
Acid solution is stirred 10-20 minutes with the speed of 80-180r/min, is cleaned after removing turbid solution using clear water, it is dense to add quality
Degree is the sodium hydroxide solution of 12-18%, is stirred 20-40 minutes with the speed of 100-140r/min, using clear after removal turbid solution
Water of the water washing to after washing is neutrality, after draining, adds ptfe surface inorganic agent, impregnates 4-8 hours, then dry
It is dry, modified plant fibers can be obtained.
7. the high heat sink material according to claim 6 for electronic product, which is characterized in that the hydrochloric acid solution, hydrogen
Sodium hydroxide solution and the usage amount of ptfe surface inorganic agent are that impregnate stalk all can.
8. the high heat sink material according to claim 1 for electronic product, which is characterized in that the modified plant fibers
Length be 0.5-2.2mm.
9. the preparation method described in a kind of any one of claim 1 to 8 for the high heat sink material of electronic product, special
Sign is, comprising the following steps:
(1) raw material is weighed according to mass parts；
(2) polyethylene, polyamide and dioctyl phthalate are uniformly mixed, are placed into mixer, at 140-150 DEG C
Mixing 20-30 minutes, temperature is risen to 160-175 DEG C, aluminium copper mixing 6-8 times repeatedly is added, obtains initial material；
(3) phenols primary antioxidant and Phosphorus auxiliary antioxidant are mixed, then by itself and modified plant fibers mixing, until modified plant
The initial material mixing being all covered in antioxidant and step (2) on fibres, mixing temperature are 40-50 DEG C, obtain premix；
(4) premix in remaining raw material and step (3) is mixed again, heating stirring 30-40 minutes at 55-65 DEG C, then
It imports in extruder and squeezes out, import in mold, compression moulding, after dehydration and drying, maintenance obtains the high heat sink material.
10. the preparation method of the high heat sink material according to claim 9 for electronic product, which is characterized in that described
The step of mould inner wall is coated with saponified oil in step (4), maintenance, which is included at 30 DEG C, to be conserved 5 hours, is promoted temperature and is supported to 50 DEG C
Shield 1 hour, then be cooled to 40 DEG C and conserve 2 hours, finally place 18 hours at normal temperature.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110835427A (en) * | 2019-11-15 | 2020-02-25 | 西安海的电子科技有限公司 | Preparation method of computer mainboard heat dissipation material |
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| CN102702602A (en) * | 2012-06-07 | 2012-10-03 | 天津聚贤达科技有限公司 | Novel wood-plastic composite material |
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| CN102702602A (en) * | 2012-06-07 | 2012-10-03 | 天津聚贤达科技有限公司 | Novel wood-plastic composite material |
| CN104017267A (en) * | 2014-06-13 | 2014-09-03 | 深圳市沃尔核材股份有限公司 | Heat-conducting wire cable electric-insulation material or sheath material |
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| CN110835427A (en) * | 2019-11-15 | 2020-02-25 | 西安海的电子科技有限公司 | Preparation method of computer mainboard heat dissipation material |
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Application publication date: 20190219 |