CN109346609A - A kind of encapsulating structure of electronic product and preparation method thereof - Google Patents
A kind of encapsulating structure of electronic product and preparation method thereof Download PDFInfo
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- CN109346609A CN109346609A CN201810990088.4A CN201810990088A CN109346609A CN 109346609 A CN109346609 A CN 109346609A CN 201810990088 A CN201810990088 A CN 201810990088A CN 109346609 A CN109346609 A CN 109346609A
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- Prior art keywords
- electronic product
- barrier
- barrier film
- film
- substrate
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/88—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Photovoltaic Devices (AREA)
- Laminated Bodies (AREA)
Abstract
This application discloses encapsulating structures of a kind of electronic product and preparation method thereof, the embodiment of the present invention recycles adhesive layer, sealant etc. to be packaged the mode on the surface that barrier film is fixed on electronic product to electronic product using the barrier film including the substrate and barrier layer that are sequentially stacked first is prepared.It avoids carrying out high temperature or strong treatment with ultraviolet light directly on device, reduces influence of the encapsulation process to device performance, and simple process, be suitble to large area continuous production.
Description
Technical field
The present invention relates to encapsulation technology fields more particularly to a kind of encapsulating structure of electronic product and preparation method thereof.
Background technique
It is efficiently to solve the problems, such as lack of energy only using renewable energy technologies since non-renewable energy resources are increasingly exhausted
One outlet.Photovoltaic technology is one of current most important one technology, the attention by researcher.Flexible organic solar electricity
(Flexible Organic Solar Cell, FOSC) is using organic semiconductor as active layer, using flexible material as substrate system in pond
At organic solar batteries (Organic Solar Cell, OSC).This battery have light, simple process, it is at low cost, can
The features such as prepared by large area is suitable for the facilities such as Photovoltaic Building Integration, thus becomes the research heat of photovoltaic technology field in recent years
One of point.
One urgent problem of flexible organic solar batteries is exactly that stability is poor, the service life is short, this is mainly due to
Influence of the organic semiconductor active material vulnerable to external environment water, oxygen etc..Influence for external environment generallys use encapsulation skill
Art stops the water in air, oxygen to enter in device and reacts with film.Traditional metal, glass cover-plate encapsulation can destroy electricity
The flexibility of sub- product, and the thin-film packages mode such as some atomic layer depositions (Atomic Layer Deposition, ALD), deposition
Speed is slow, and process cycle is long.Although plasma enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor
Deposition, PECVD) film of preparation has good water sample barrier property, but its film surface defects is more, and
Because rigidity is larger, flexible film product encapsulation cannot be widely applied to.In addition, current technology means are by polysilazane
(Polysilazane, PSZ) solution coating is solidified using ultraviolet light on flexible organic solar batteries surface, then or is heated solid
The mode of change carries out curing process to polysilazane solution, and this method electronic product during encapsulation needs to bear high temperature
And ultraviolet lighting, electronic product can be destroyed, its performance is influenced.
Summary of the invention
In view of this, can be dropped the embodiment of the invention provides encapsulating structure of a kind of electronic product and preparation method thereof
Influence of the low encapsulation process to electronic product performance.
According to a first aspect of the embodiments of the present invention, a kind of preparation method of the encapsulating structure of electronic product is provided, comprising:
Form the barrier film of the substrate and barrier layer including being sequentially stacked；
By way of lamination, barrier film is fixed on to the surface of electronic product using adhesive layer；
With sealant be sealing adhesive layer and barrier film edge.
Further, the substrate material includes polyethylene terephthalate (Polyethylene glycol
Terephthalate, PET), polyethylene naphthalate (Polyethylene Naphthalate two formic
One of acid glycol ester, PEN) and polyimides (Polyimide, PI).
Further, the barrier film for forming substrate and barrier layer including being sequentially stacked includes:
By barrier layer solution coating in substrate；
Solidify the barrier layer solution；
The barrier layer solution includes one of silica gel and polysilazane (PSZ).
Further, the method for solidifying the barrier layer solution includes ultraviolet light solidification and/or is heating and curing.
Further, the sealant is one of light-cured resin, epoxy resin and polyurethane resin；The bonding
Layer material is ethylene-vinyl acetate copolymer (Ethylene-Vinyl Acetate copolymer, EVA) glue film and organosilicon
One of glue.
Further, the barrier film is fixed on the upper and lower surface of the electronic product.
Further, the electronic product is flexible organic solar batteries.
Further, the barrier layer solution is the polysilazane n-butyl ether solution that mass fraction is 2%~20%.
According to another aspect of an embodiment of the present invention, a kind of encapsulating structure of electronic product is provided, comprising: electronic product,
Electronic product upper and lower surface expose electronic product electrode the adhesive layer being sequentially stacked and barrier film, and be located at adhesive layer and
Obstruct the sealant of film edge, wherein the barrier film includes the substrate being sequentially stacked and barrier layer.
Further, the electronic product is flexible organic solar batteries.The embodiment of the present invention uses and first prepares barrier
Film, barrier film is fixed on electronic product surface, is not deposited on electronic product directly, is avoided directly enterprising in device
Row high temperature or strong treatment with ultraviolet light reduce influence of the encapsulation process to device performance.Barrier film is flexible material, for flexible electrical
Sub- product, this method will not reduce its flexibility, and preparation method is simple, be suitble to large-scale continuous production.
Detailed description of the invention
By referring to the drawings to the description of the embodiment of the present invention, the above and other purposes of the present invention, feature and
Advantage will be apparent from, in the accompanying drawings:
Fig. 1 is the preparation method flow chart of the embodiment of the present invention；
Fig. 2 is the schematic cross sectional views of the structure of the embodiment of the present invention.
Specific embodiment
Below based on embodiment, present invention is described, but the present invention is not restricted to these embodiments.Under
Text is detailed to describe some specific detail sections in datail description of the invention.Do not have for a person skilled in the art
The present invention can also be understood completely in the description of these detail sections.In order to avoid obscuring essence of the invention, well known method, mistake
There is no narrations in detail for journey, process, element and circuit.
In addition, it should be understood by one skilled in the art that provided herein attached drawing be provided to explanation purpose, and
What attached drawing was not necessarily drawn to scale.
Unless the context clearly requires otherwise, "include", "comprise" otherwise throughout the specification and claims etc. are similar
Word should be construed as the meaning for including rather than exclusive or exhaustive meaning；That is, be " including but not limited to " contains
Justice.In the description of the present invention, unless otherwise indicated, " multilayer " is meant that two layers or two layers or more.
It should be understood that when element or layer be referred to " ... on ", " with ... it is adjacent ", " being connected to " or " being coupled to " it is other
When element or layer, can directly on other elements or layer, it is adjacent thereto, be connected or coupled to other elements or layer, or
There may be elements or layer between two parties by person.On the contrary, when element is referred to as " on directly existing ... ", " with ... direct neighbor ", " directly
It is connected to " or " being directly coupled to " other elements or when layer, then there is no elements or layer between two parties.It for ease of description here can be with
Using " ... under ", " ... below ", "lower", " ... on ", the spatial relation terms such as "upper" to be to describe such as attached drawing
Shown in relationship between an elements or features and another (a little) elements or features.It should be appreciated that spatial relation term purport
In the different orientation for summarizing the device of device in use or operation in addition to being orientated shown in attached drawing.For example, if in attached drawing
Device turns, and the element for being described as " " other elements or feature " under " or " below " will be in other elements or spy
" top " of sign.Therefore, exemplary term " ... below " can cover above and below two kinds orientation.Device can be adopted
Other orientations (being rotated by 90 ° or in other orientations) are taken, are interpreted accordingly used herein of spatial relation description symbol.
Fig. 1 is the preparation method flow chart of the embodiment of the present invention.As shown in Figure 1, the preparation method of the present embodiment includes such as
Lower step:
S100, the barrier film 1 including the substrate 11 and barrier layer 12 that are sequentially stacked is formed.
Formed barrier film 1 method include: by barrier layer solution coating in substrate 11；Solidify the barrier layer solution,
Form barrier layer 12.
The material of substrate 11 includes polyethylene terephthalate (PET) film of high transparency, poly- naphthalenedicarboxylic acid second
Diol ester (PEN) film, ethylene-tetrafluoroethylene copolymer (ETFE) film, fluorinated ethylene propylene copolymer (FEP) film, chlorine
For perfluoroethylene copolymer (PCTFE) and polyimides (PI) film, preferably polyethylene terephthalate (PET) is thin
Film.11 thickness of substrate selects in 10~200 μ ms, and preferably 25~100 μm.
Barrier layer solution includes one of silica gel and polysilazane (PSZ), and the silica gel is preferably vulcanization type silicon rubber
(i.e. room temperature type RTV silicon rubber), the polysilazane (PSZ) they can be inorganic polysilazane, or organopolysilazane,
Preferably inorganic polysilazane.The thickness of barrier layer 12 is selected as 50~1500nm, but barrier layer 12 is easy under the conditions of thicker
It cracks and barrier property is caused to decline, while light transmittance reduces when film layer is thicker, therefore 12 thickness of barrier layer preferably 50~
1000nm, particularly preferred 400~800nm.As the coating film forming mode that the present invention uses, can select to revolve according to the actual situation
Painting, blade coating, micro- intaglio plate coating, the coating of item seam or other coating methods, wherein it is preferable to use blade coatings.Coating at
The curing process of film is not particularly limited, and ultraviolet light can be selected the modes such as to solidify, be heating and curing, and to solidify the barrier layer molten
Liquid forms barrier layer 12.
In an optional implementation, substrate 11 is selected with a thickness of 50 μm of polyethylene terephthalate
(PET) film, barrier layer solution select polysilazane solution.By polysilazane solution blade coating poly- to benzene two with a thickness of 50 μm
On formic acid glycol ester (PET) film, coating with a thickness of 1~2.5 μm.The mass percent of the polysilazane solution is 2
~20%, one of dimethylbenzene, butyl oxide, n-butyl ether, methylene chloride can be used and carry out concentration adjusting.Preferably, quality hundred
Score is 5~10%, and concentration regulator is n-butyl ether.The first surface drying 3h on substrate, then by PET/ polysilazane 80~120
8~16h is heated on DEG C warm table, obtains the barrier layer of 600 ± 200nm thickness, and in the present embodiment, barrier layer is carbon containing SiOx
Layer.Alternatively it is also possible to which the method for using the photocuring 1h in the case where wavelength is 365nm ultraviolet lamp solidifies the polysilazane solution.
It is further preferred that can also be jointly processed by using heat cure and ultraviolet light solidification, i.e., first handled on 80~120 DEG C of warm tables
0.5~1h, then ultraviolet light solidifies 0.5~1h again.In another optional implementation, substrate 11 is selected with a thickness of 50 μm
Polyethylene terephthalate (PET) film, barrier layer solution selects silica gel, preferably vulcanization type silica gel (i.e. room temperature type
RTV silica gel).By room temperature type RTV silica gel blade coating on polyethylene terephthalate (PET) film with a thickness of 50 μm, apply
Cover with a thickness of 1~2.5 μm.In 4~8h of room temperature curing.
It is also possible in 11 surface single side of substrate coating barrier layer 12 in about 11 substrate it should be understood that barrier film 1 can be
Surface dual coating barrier layer 12, preferably, single side coats barrier layer 12 in substrate 11.The layer of 11 surface barrier layer 12 of substrate
Number can be one layer and be also possible to multilayer, preferably one layer.
S200, by way of lamination, barrier film 1 is fixed on to the surface of electronic product 3 using adhesive layer 2.It will barrier
Film 1 is fixed on the upper and lower surface of electronic product 3, and barrier film 1 is consistent with the size of adhesive layer 2 and can cover in addition to electrode 5
Electronic product 3.
Adhesive layer 2 can be ethylene-vinyl acetate copolymer (EVA) one of glue film and/or organic silica gel.Adhesive layer
2 thickness generally selects 0.2~5 μm, wherein it is preferred that adhesive layer 2 with a thickness of 0.5~1 μm.
Electronic product 3 can be the electronics devices such as electronic chip, circuit board, solar battery, light-emitting component and display screen
Part, device architecture can be any one of positively fixed type, inversion type or laminated structure, preferably flexible electronic product, into
One step is preferably flexible organic solar batteries.
The modes of emplacement of barrier film 1 is barrier layer 12 towards on electronic device, substrate 11 towards air, meanwhile, encapsulation knot
It may include multilayer barrier film 1 in structure, depending on different electronic product 3 and different application condition.
In an optional implementation, the barrier film 1 that will be prepared is used ethylene-vinyl acetate copolymer (EVA)
Glue film is encapsulated in the upper and lower surface of electronic product 3 by way of lamination.
S300, be sealing adhesive 1 edge of layer 2 and barrier film with sealant 4.It is sealing adhesive 1 side of layer and barrier film with sealant 4
Edge forms the closed encapsulating structure of exposing electrode 5 as shown in Figure 2.
Sealant 4 can be two or more alone or in combination polyester resin, polyurethane based resin, esters of acrylic acid tree
Rouge, nitrocellulose resinoid, organic silicon resin, vinyl alcohol resin, light-cured resin, epoxy resin etc..Preferably light
Solidified resin.
In an optional implementation, upper sealant 4 is dripped in barrier film 1 and 2 marginal portion of adhesive layer, it is preferred that
Sealant 4 is light-cured resin, solidifies 30s using 365nm ultraviolet light.
The embodiment of the present invention, which passes through, first prepares barrier film, then barrier film is fixed on electronic product surface, to electronic product
It is packaged, compared with forming barrier layer directly on electronic product, avoids and carry out high temperature or strong directly on electronic product
Treatment with ultraviolet light reduces influence of the encapsulation process to device performance.Barrier film is flexible material, should for flexible electronic product
Method will not reduce its flexibility, and preparation method is simple, be suitble to large-scale continuous production.
The electronic product packaging structure of forming method preparation according to an embodiment of the present invention, as shown in Figure 2.The encapsulation knot
Structure includes: electronic product 3, exposes the adhesive layer 2 being sequentially stacked and barrier film 1, Yi Jiwei of electrode 5 on 3 surface of electronic product
Sealant 4 in 1 edge of adhesive layer 2 and barrier film, wherein the barrier film 2 includes the substrate 11 being sequentially stacked and barrier layer
12。
Preferably, the upper and lower surface of the adhesive layer 2 that is sequentially stacked and barrier film 1 in electronic product 3.
It should be understood that barrier film 1 can be constituted by substrate 11 and in multiple barrier layers 12 of 11 upper and lower surface of substrate.
The material of substrate 11 includes polyethylene terephthalate (PET) film of high transparency, poly- naphthalenedicarboxylic acid second
Diol ester (PEN) film, ethylene-tetrafluoroethylene copolymer (ETFE) film, fluorinated ethylene propylene copolymer (FEP) film, chlorine
For perfluoroethylene copolymer (PCTFE) and polyimides (PI) film, preferably polyethylene terephthalate (PET) film.
11 thickness of substrate selects in 10~200 μ ms, and preferably 25~100 μm.
12 material of barrier layer includes the SiO obtained after one of silica gel and polysilazane (PSZ) solidifyxLayer.Barrier
The thickness of layer 12 is selected as 50~1500nm, but barrier layer 12 is easy to produce crackle under the conditions of thicker and barrier property is caused to decline,
Light transmittance reduces when film layer is thicker simultaneously, therefore 12 thickness of barrier layer preferably 50~1000nm, particularly preferred 400~800nm.
Adhesive layer 2 can be ethylene-vinyl acetate copolymer (EVA) one of glue film and/or organic silica gel.Adhesive layer
2 thickness generally selects 0.2~5 μm, wherein it is preferred that 0.5~1 μm of 2 thickness of adhesive layer.
Electronic product 3 can be the electronics devices such as electronic chip, circuit board, solar battery, light-emitting component and display screen
Part, device architecture can be any one of positively fixed type, inversion type or laminated structure, preferably flexible electronic product, into
One step is preferably flexible organic solar batteries.
Sealant 4 can be two or more alone or in combination polyester resin, polyurethane based resin, esters of acrylic acid tree
Rouge, nitrocellulose resinoid, organic silicon resin, vinyl alcohol resin, light-cured resin, epoxy resin etc..Preferably light
Solidified resin.
In an optional implementation, the encapsulating structure of electronic product includes: electronic product 3, in 3 table of electronic product
Show out the adhesive layer 2 being sequentially stacked and barrier film 1 of electrode 5, and the sealant positioned at 1 edge of adhesive layer 2 and barrier film
4.The sealant 4 is light-cured resin, and the electronic product 3 is flexible organic solar batteries, and the adhesive layer 2 is second
Alkene-acetate ethylene copolymer (EVA) glue film, the barrier film 1 be include the polyethylene terephthalate being sequentially stacked
(PET) SiO that film and inorganic polysilazane (PSZ) solution are formed after solidifyingxLayer.
Just set or be inverted, preferably, barrier layer 12 and 2 phase of adhesive layer it should be understood that the modes of emplacement of barrier film 1 can be
Even.Meanwhile may include one or more layers barrier film 1 in encapsulating structure, depending on different electronic product 3 and different application condition
Depending on.
Compared with the prior art, the embodiment of the present invention, which passes through, first prepares barrier film, then barrier film is fixed on electronic product
Surface is packaged electronic product, compared with forming barrier layer directly on electronic product, avoids directly in electronic product
Upper progress high temperature or strong treatment with ultraviolet light reduce influence of the encapsulation process to device performance.Barrier film is flexible material, for soft
Property electronic product, this method will not reduce its flexibility, and preparation method is simple, is suitble to large-scale continuous production.
The above description is only a preferred embodiment of the present invention, is not intended to restrict the invention, for those skilled in the art
For, the invention can have various changes and changes.All any modifications made within the spirit and principles of the present invention are equal
Replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of preparation method of the encapsulating structure of electronic product characterized by comprising
Form the barrier film of the substrate and barrier layer including being sequentially stacked；
By way of lamination, barrier film is fixed on to the surface of electronic product using adhesive layer；
With sealant be sealing adhesive layer and barrier film edge.
2. the method as described in claim 1, which is characterized in that the substrate material includes polyethylene terephthalate
(PET), one of polyethylene naphthalate (PEN) and polyimides (PI).
3. the method as described in claim 1, which is characterized in that the resistance for forming the substrate and barrier layer including being sequentially stacked
Diaphragm includes:
By barrier layer solution coating in substrate；
Solidify the barrier layer solution；
The barrier solution includes one of silica gel and polysilazane (PSZ).
4. method as claimed in claim 3, which is characterized in that the solidification barrier layer solution includes ultraviolet light solidification
And/or it is heating and curing.
5. the method as described in claim 1, which is characterized in that the sealant is light-cured resin, epoxy resin and poly- ammonia
One of ester resin；The adhesive layer material is one in ethylene-vinyl acetate copolymer adhesive film (EVA) and organic silica gel
Kind.
6. the method as described in claim 1, which is characterized in that the barrier film is fixed on the upper following table of the electronic product
Face.
7. the method as described in claim 1, which is characterized in that the electronic product is flexible organic solar batteries.
8. method as claimed in claim 3, which is characterized in that it is 2%~20% that the barrier layer solution, which is mass fraction,
Polysilazane n-butyl ether solution.
9. a kind of encapsulating structure of electronic product characterized by comprising electronic product exposes in electronic product upper and lower surface
The adhesive layer being sequentially stacked and barrier film of electronic product electrode, and positioned at adhesive layer and barrier film edge sealant,
In, the barrier film includes the substrate being sequentially stacked and barrier layer.
10. a kind of encapsulating structure of electronic product as claimed in claim 8, which is characterized in that
The electronic product is flexible organic solar batteries.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810990088.4A CN109346609A (en) | 2018-08-28 | 2018-08-28 | A kind of encapsulating structure of electronic product and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810990088.4A CN109346609A (en) | 2018-08-28 | 2018-08-28 | A kind of encapsulating structure of electronic product and preparation method thereof |
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| Publication Number | Publication Date |
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| CN109346609A true CN109346609A (en) | 2019-02-15 |
Family
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102015936A (en) * | 2008-04-23 | 2011-04-13 | 科莱恩金融(Bvi)有限公司 | Polysilazane-containing coating for improving light conversion efficiency of encapsulated solar cells |
| CN102725865A (en) * | 2010-01-26 | 2012-10-10 | 积水化学工业株式会社 | Sealing material for solar cell, protective sheet for solar cell, process for production of solar cell module |
| CN102856403A (en) * | 2012-10-08 | 2013-01-02 | 深圳市创益科技发展有限公司 | Flexible solar battery component and packaging method thereof |
| CN106129258A (en) * | 2016-08-30 | 2016-11-16 | 中国乐凯集团有限公司 | Flexible solar battery encapsulation multi-layer compound film and application thereof |
-
2018
- 2018-08-28 CN CN201810990088.4A patent/CN109346609A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102015936A (en) * | 2008-04-23 | 2011-04-13 | 科莱恩金融(Bvi)有限公司 | Polysilazane-containing coating for improving light conversion efficiency of encapsulated solar cells |
| CN102725865A (en) * | 2010-01-26 | 2012-10-10 | 积水化学工业株式会社 | Sealing material for solar cell, protective sheet for solar cell, process for production of solar cell module |
| CN102856403A (en) * | 2012-10-08 | 2013-01-02 | 深圳市创益科技发展有限公司 | Flexible solar battery component and packaging method thereof |
| CN106129258A (en) * | 2016-08-30 | 2016-11-16 | 中国乐凯集团有限公司 | Flexible solar battery encapsulation multi-layer compound film and application thereof |
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Application publication date: 20190215 |