CN109346422B - Transducer fixing assembly, bonding head device and ultrasonic bonding machine - Google Patents
Transducer fixing assembly, bonding head device and ultrasonic bonding machine Download PDFInfo
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- CN109346422B CN109346422B CN201811148740.4A CN201811148740A CN109346422B CN 109346422 B CN109346422 B CN 109346422B CN 201811148740 A CN201811148740 A CN 201811148740A CN 109346422 B CN109346422 B CN 109346422B
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- 238000009434 installation Methods 0.000 claims abstract description 39
- 238000003466 welding Methods 0.000 claims description 30
- 238000001816 cooling Methods 0.000 claims description 19
- 238000004378 air conditioning Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 6
- 230000001133 acceleration Effects 0.000 description 5
- 230000000149 penetrating effect Effects 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
- H01L2224/78347—Piezoelectric transducers
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The application discloses a fixing component of a transducer, a bonding head device and an ultrasonic bonding machine, wherein the fixing component of the transducer comprises: the first mounting body is provided with a first abutting part; the second installation body is provided with a first installation hole for the transducer to penetrate through, the inner wall of the first installation hole is provided with a second installation hole, the outer wall of the first installation hole is provided with a connecting hole, the connecting hole is communicated with the second installation hole, and the first installation body is movably arranged in the second installation hole and the first abutting part faces the first installation hole; one end of the fastener penetrates through the second mounting hole to be connected with the first mounting body, the fastener can drive the first mounting body to move, the first abutting portion can protrude towards the direction inside the first mounting hole to be arranged in the first mounting hole, one end of the fastener penetrates through the second mounting hole to be connected with the first mounting body, and the first abutting portion is matched with the first mounting hole to form a fixing structure for fixing the transducer.
Description
Technical Field
The present application relates to the field of semiconductor technologies, and in particular, to a support assembly for a bonding head device, and an ultrasonic bonding machine.
Background
The wire bonding machine is a device for electrically connecting a wire to a semiconductor chip and a pin by using ultrasonic waves, pressure and temperature, and it applies ultrasonic vibration to the wire by using an ultrasonic generator and a chopper to form fusion on the chip or the pin in contact with the wire, thereby realizing firm electrical connection.
However, the conventional metal bonder transducer is not firmly mounted with the mounting seat, which affects the use.
Disclosure of Invention
Based on the above, aiming at the problems that the installation of the transducer and the mounting seat of the traditional metal bonding machine is unstable and the use is affected, it is necessary to provide a fixing component of the transducer, a bonding head device and an ultrasonic bonding machine, wherein the fixing component of the transducer can realize the stable installation of the transducer; the bonding head device comprises the fixing component of the transducer, so that the bonding head device can realize stable installation of the transducer; the ultrasonic bonding machine comprises the bonding head device, so that the bonding head device can realize stable installation of the transducer.
The specific technical scheme is as follows:
in one aspect, the application relates to a fastening assembly for a transducer, comprising: a first mounting body provided with a first abutting portion; the first mounting body is movably arranged in the second mounting hole, and the first abutting part faces the first mounting hole; and one end of the fastener penetrates through the second mounting hole to be connected with the first mounting body, the fastener can drive the first mounting body to move, when the first mounting body moves to a preset position, the first abutting part can protrude towards the direction inside the first mounting hole to be arranged in the first mounting hole, the side wall of the first mounting body abuts against the side wall of the second mounting hole, and the first abutting part is matched with the first mounting hole to form a fixing structure for fixing the transducer.
When the fixing assembly of the transducer is used, one end of the transducer is arranged in the first mounting hole in a penetrating mode, the fastener can drive the first mounting body to move, when the first mounting body moves to a preset position, the first abutting portion can protrude out of the first mounting hole in the direction of the inside of the first mounting hole, the side wall of the first mounting body is abutted to the side wall of the second mounting hole, so that the first mounting body can be abutted to the transducer more firmly, the first mounting body and the second mounting body can be locked with the transducer, and the fixing assembly of the transducer can be used for fixing the transducer more firmly.
The technical scheme is further described as follows:
in one embodiment, the fixing component of the transducer further comprises a first protrusion, one end of the first protrusion is fixedly arranged on the inner wall of the first mounting hole, a second abutting portion is arranged at the other end of the first protrusion, a second protrusion is arranged on the first mounting body, and the first abutting portion is arranged on the second protrusion.
In one embodiment, the first abutment and the second abutment are each arcuate in cross-section.
On the other hand, the application also relates to a bonding head device, which comprises a fixing component of the transducer, the transducer and a welding mechanism, wherein the welding mechanism comprises a welding head, one end of the transducer is arranged in the first mounting hole in a penetrating way, and the other end of the transducer is connected with the welding head.
When the bonding head device is used, one end of the transducer is connected with the welding head, so that the transducer converts electric energy into mechanical energy, namely ultrasonic wave, and then the mechanical energy is transmitted to the welding head; with the one end of transducer wears to locate first mounting hole, because the fastener can drive first installation body removes, works as when the first installation body removes to the default position, first butt portion can be towards the direction of the inside of first mounting hole is outstanding first mounting hole sets up, just the lateral wall of the first installation body with the lateral wall butt of second mounting hole, so, the first installation body can be more firm with transducer butt, the first installation body with the second installation body can be realized with transducer "locking", and then the fixed subassembly of transducer can be more firm fixed the transducer.
The technical scheme is further described as follows:
in one embodiment, the bonding head device further comprises an installation seat, a swinging seat and a driving mechanism, wherein the welding mechanism is fixedly arranged on the swinging seat, the swinging seat is rotatably arranged on the installation seat, and the driving mechanism is used for driving the swinging seat to rotate relative to the installation seat, so that the welding head can rotate in a direction close to or far away from a workpiece to be welded.
In one embodiment, the bonding head device further comprises an elastic reset mechanism, wherein the elastic reset mechanism comprises a rotating body and a fixed body, the rotating body can rotate back and forth in a preset angle range relative to the fixed body, the rotating body is connected with the swinging seat, and the fixed body is connected with the mounting seat.
In one embodiment, the elastic reset mechanism comprises a spring piece, one end of the spring piece is connected with the swing seat, and the other end of the spring piece is fixedly arranged on the mounting seat to be connected.
In one embodiment, the bonding head device further comprises an elastic member and an adjusting member, wherein one end of the elastic member is connected with the mounting seat, the other end of the elastic member is connected with one end of the adjusting member, and the other end of the adjusting member is movably arranged on the swinging seat and is used for adjusting the stretching length of the elastic member.
In one embodiment, the bonding head device further comprises a cooling member, the cooling member comprises an air inlet, an air flow channel and an air outlet groove, the air outlet groove is formed in the side wall of the cooling member along the length direction of the cooling member, an air outlet is formed in the side wall of the air outlet groove, an opening of the air outlet groove faces the driving mechanism, and the air outlet, the air flow channel and the air inlet are communicated.
On the other hand, the application also relates to an ultrasonic bonding machine which comprises the bonding head device.
When the ultrasonic bonding machine is used, one end of the transducer is connected with the welding head, so that electric energy is converted into mechanical energy, namely ultrasonic wave, through the transducer and then transmitted to the welding head; with the one end of transducer wears to locate first mounting hole, because the fastener can drive first installation body removes, works as when the first installation body removes to the default position, first butt portion can be towards the direction of the inside of first mounting hole is outstanding first mounting hole sets up, just the lateral wall of the first installation body with the lateral wall butt of second mounting hole, so, the first installation body can be more firm with transducer butt, the first installation body with the second installation body can be realized with transducer "locking", and then the fixed subassembly of transducer can be more firm fixed the transducer.
Drawings
FIG. 1 is a schematic structural view of a stationary assembly of a transducer;
FIG. 2 is a schematic structural view of another view of the stationary assembly of the transducer;
FIG. 3 is a cross-sectional view taken along line A-A in FIG. 2;
FIG. 4 is a schematic illustration of a transducer connected to a fixed assembly of transducers;
FIG. 5 is a schematic view of an assembled structure of a bond head apparatus;
FIG. 6 is an exploded view of the bond head device of FIG. 5;
FIG. 7 is a schematic view of a cooling member;
FIG. 8 is a schematic view of another angle of the cooling element;
fig. 9 is a sectional view taken along the direction B-B in fig. 8.
Reference numerals illustrate:
10. the bond head apparatus 100, the fixed assembly of the transducer, 110, the first mount, 112, the second protrusion, 114, the first abutment, 120, the second mount, 122, the first mounting hole, 124, the second mounting hole, 126, the first protrusion, 128, the second abutment, 130, the fastener, 200, the welding mechanism, 210, the bonding tool, 220, the transducer, 300, the wobble seat, 400, the mount, 410, the fourth mounting hole, 500, the voice coil motor, 610, the elastically resettable mechanism, 620, the spring piece, 630, the first platen, 640, the second platen, 650, the regulator, 660, the elastic member, 710, the grating scale, 720, the grating readhead, 800, the cooling member, 810, the air inlet, 820, the air flow path, 830, the air outlet groove.
Detailed Description
The present application will be further described in detail with reference to the drawings and the detailed description, in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the application.
It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "mounted" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
It will be understood that when an element is referred to as being "mounted" on another element, it can be integrated or be detachably connected.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Further, it is also to be understood that, in the present embodiment, the positional relationship indicated by the terms "lower", "upper", "front", "rear", "left", "right", "inner", "outer", "top", "bottom", "one side", "another side", "one end", "the other end", and the like are based on the positional relationship shown in the drawings; the terms "first," "second," and the like are used to distinguish between different structural components. These terms are only used to facilitate the description of the application and to simplify the description, and should not be construed as limiting the application.
As shown in fig. 1 to 4, a fixing assembly 100 of a transducer in an embodiment includes: a first mounting body 110, the first mounting body 110 being provided with a first abutment 114; the second mounting body 120, the second mounting body 120 is provided with a first mounting hole 122 for the transducer 220 to pass through, the inner wall of the first mounting hole 122 is provided with a second mounting hole 124, the outer wall of the first mounting hole 122 is provided with a connecting hole, the first mounting hole 122 and the connecting hole are communicated with the second mounting hole 124, the first mounting body 110 is movably arranged in the second mounting hole 124, and the first abutting part 114 faces the first mounting hole 122; and a fastener 130, wherein one end of the fastener 130 passes through the second mounting hole 124 to be connected with the first mounting body 110, and the fastener 130 can drive the first mounting body 110 to move, when the first mounting body 110 moves to a preset position, the first abutting portion 114 can protrude towards the first mounting hole 122 towards the direction inside the first mounting hole 122, and the side wall of the first mounting body 110 abuts against the side wall of the second mounting hole 124, and the first abutting portion 114 cooperates with the first mounting hole 122 to form a fixing structure for fixing the transducer 220.
When the fixing assembly 100 of the transducer is used, one end of the transducer 220 is inserted into the first mounting hole 122, and the fastener 130 can drive the first mounting body 110 to move, when the first mounting body 110 moves to the preset position, the first abutting portion 114 can protrude toward the first mounting hole 122 toward the direction inside the first mounting hole 122, and the side wall of the first mounting body 110 abuts against the side wall of the second mounting hole 124, so that the first mounting body 110 can be abutted against the transducer 220 more firmly, the first mounting body 110 and the second mounting body 120 can be locked against the transducer 220, and the fixing assembly 100 of the transducer can fix the transducer 220 more firmly. In this embodiment, the first mounting body 110 is provided with an internal thread hole, the fastener is a bolt, and the first mounting body 110 is driven to move by the cooperation of the bolt and the internal thread hole, and further, the first abutting portion 114 is provided so as to protrude from the first mounting hole 122 in the direction of the inside of the first mounting hole 122. During installation, a certain gap exists between the second installation hole 124 and the first installation body 110, and the size of the gap is set according to needs, but when the first installation body 110 needs to be moved to a preset position, the first abutting part 114 is provided with the second installation hole in a protruding mode, and the side wall of the first installation body 110 can abut against the side wall of the second installation hole 124.
As shown in fig. 1 and 3, the fixing assembly 100 of the transducer further includes a first protrusion 126, one end of the first protrusion 126 is fixedly disposed on the inner wall of the first mounting hole 122, the other end is provided with a second abutment 128, the first mounting body 110 is provided with a second protrusion 112, and the second protrusion 112 is provided with a first abutment 114. At this time, the transducer 220 abuts against the first protrusion 126 and the second protrusion 112, thus reducing the contact area between the transducer 220 and the first mounting body 110 and the second mounting body 120, and further reducing the friction between the transducer 220 and the inner wall of the first mounting hole 122. In this embodiment, the number of the first protrusions 126 is two, and when the second protrusions 112 protrude from the first mounting hole 122, the two first protrusions 126 and the second protrusions 112 are disposed along the same circumference at intervals, so that a "three-point" support is realized, and the fixing assembly 100 of the transducer is more firmly abutted to the side wall of the transducer 220. On the basis of this embodiment, the cross sections of the first abutting portion 114 and the second abutting portion 128 are each arc-shaped. In this way, the first abutting portion 114 with the arc-shaped cross section and the second abutting portion 128 with the arc-shaped cross section can be attached to the side wall of the transducer 220, and can be further firmly abutted to the transducer 220. In the present embodiment, the arc radius of the arc-shaped cross section of the first abutting portion 114 is equal to the arc radius of the arc-shaped cross section of the second abutting portion 128.
As shown in fig. 5 and 6, the present application further relates to a bonding head device 10, where the bonding head device 10 in one embodiment includes a transducer fixing assembly 100, a transducer 220, and a welding mechanism 200, and the welding mechanism 200 includes a welding head 210, where one end of the transducer 220 is disposed through the first mounting hole 122, and the other end is connected to the welding head 210.
In use, the bond head apparatus 10 described above, one end of the transducer 220 is coupled to the bonding tool 210, such that electrical energy is converted to mechanical energy, i.e., ultrasonic, by the transducer 220 and then transferred to the bonding tool 210; one end of the transducer 220 is arranged in the first mounting hole 122 in a penetrating manner, the fastener 130 can drive the first mounting body 110 to move, when the first mounting body 110 moves to a preset position, the first abutting portion 114 can protrude towards the first mounting hole 122 in the direction of the inside of the first mounting hole 122, the side wall of the first mounting body 110 is abutted with the side wall of the second mounting hole 124, so that the first mounting body 110 can be abutted with the transducer 220 more firmly, the first mounting body 110 and the second mounting body 120 can be locked with the transducer 220, and the transducer 220 can be fixed more firmly by the fixing assembly 100 of the transducer.
As shown in fig. 5 and 6, the bonding head apparatus 10 further includes a mounting base 400, a swinging base 300, and a driving mechanism, wherein the welding mechanism 200 is fixedly arranged on the swinging base 300, the swinging base 300 is rotatably arranged on the mounting base 400, and the driving mechanism is used for driving the swinging base 300 to rotate relative to the mounting base 400, so that the welding head 210 can rotate in a direction approaching or separating from the workpiece to be welded. In this way, the driving mechanism drives the swinging seat 300 to rotate relative to the mounting seat 400, the welding mechanism 200 is connected with the swinging seat 300, and the welding mechanism 200 comprises the welding head 210, so that the swinging seat 300 can drive the welding head 210 to rotate in a direction approaching or separating from the metal wire to be bonded; because the acceleration that can be achieved by the swinging is larger than the acceleration that can be achieved by the linear motion under the action of the same driving force; furthermore, the bonding head device 10 can enable the bonding head 210 to drive the bonding head 210 to move towards the metal wire to be bonded with high acceleration, so that the time for the bonding head 210 to move towards the metal wire to be bonded is short, and the bonding efficiency of the metal wire is improved. In this embodiment, the mounting base 400 further has a fourth mounting hole 410, and one end of the swing base 400 passes through the fourth mounting hole 410 to be connected to the driving mechanism.
As shown in fig. 5 and 6, the bonding head device 10 further includes an elastically resettable mechanism 610, where the elastically resettable mechanism 610 includes a rotating body and a fixed body, the rotating body can rotate back and forth within a predetermined angle range relative to the fixed body, the rotating body is connected to the swing seat 300, and the fixed body is connected to the mounting seat 400. Thus, when the driving mechanism is stopped, the elastic reset mechanism 610 can drive the swinging seat 300 to reset, that is, drive the welding head 210 to reset, so as to avoid collision when power is off; based on this embodiment, the elastically resettable mechanism 610 includes a spring 620, where one end of the spring 620 is connected to the swing seat 300, and the other end is fixed to the mounting seat 400. Thus, the reciprocating swing of the swing body is realized by the spring piece 620; in this embodiment, the number of the spring pieces 620 is 2, and the two spring pieces 620 are arranged at intervals, so long as the installation positions of the two spring pieces 620 are ensured, the elastic forces of the two spring pieces 620 can be ensured to be consistent; in this embodiment, the swing seat 300 further includes a first pressing plate 630 and a second pressing plate 640, wherein the first pressing plate 630 connects the rotating body of the spring piece 620 to the swing seat 300, and the second pressing plate 640 connects the fixed body to the mounting seat 400. Of course, in other embodiments, the resiliently return mechanism 610 may also be a cross spring bearing.
As shown in fig. 5 and 6, the bonding head device 10 further includes an elastic element 660 and an adjusting element 650, wherein one end of the elastic element 660 is connected with the mounting base 400, the other end is connected with one end of the adjusting element 650, and the other end of the adjusting element 650 is movably disposed on the swinging base 300 for adjusting the stretching length of the elastic element 660. Thus, the stretching length of the elastic element 660 can be adjusted by moving the adjusting element 650, at this time, the swing seat 300 can be stopped at a preset position, and at this time, the zero point adjustment of the swing seat 300 is facilitated. In this embodiment, the swing seat 300 is provided with a third mounting hole, one end of the adjusting member 650 is provided with an external thread structure, and one end of the adjusting member 650 is inserted into the third mounting hole and is fixed on the swing seat 300 by a nut. Specifically, the elastic member 660 may be an extension spring or rubber, and in this embodiment, the elastic member 660 is an extension spring. Of course, in other embodiments, the adjusting member 650 may also adjust the stretching length of the elastic member 650 in a telescopic manner.
As shown in fig. 5 and 6, the bond head device 10 further includes a displacement sensor for detecting a swinging distance of the swinging seat 300 relative to the mounting seat 400, based on any of the above embodiments. In this way, the displacement sensor monitors the swing distance of the swing seat 300, and sends the detected distance signal to the controller, and the controller judges the difference between the swing position of the swing seat 300 and the preset position according to the distance signal, so as to calibrate the swing position of the swing seat 300. On the basis of the embodiment, the displacement sensor comprises a grating scale 710 and a grating reading head 720, wherein the grating scale 710 is arranged on the swinging seat 300, and the grating reading head 720 is correspondingly arranged on the mounting seat 400. In this way, when the swinging seat 300 swings, the grating scale 710 is driven to move, and the grating reading head 720 can reflect the swinging distance of the swinging seat 300 by reading the reading of the grating scale 710.
As shown in fig. 7 to 9, the bonding head device 10 further includes a cooling member 800, the cooling member 800 includes an air inlet 810, an air flow channel 820 and an air outlet slot 830, the air outlet slot 830 is disposed on a sidewall of the cooling member 800 along a length direction of the cooling member 800, an air outlet is disposed on a sidewall of the air outlet slot 830, an opening of the air outlet slot 830 is disposed towards the driving mechanism, and the air outlet, the air flow channel 820 and the air inlet 810 are communicated. In this way, the cooling air flows through the air inlet 810 to the air outlet slot 830 via the air flow channel 820, and the air outlet slot 830 is disposed on the sidewall of the cooling member 800 along the length direction of the cooling member 800, so that the air outlet slot 830 can spray the cooling air to the driving mechanism in a form of an air outlet surface, and further can effectively cover and cool the driving mechanism.
On the basis of any one of the above embodiments, the driving mechanism includes a voice coil motor 500, the voice coil motor 500 includes a motor mover and a motor stator, the motor mover is connected with the swing seat 300, and the motor stator is connected with the mount 400. In this way, since the voice coil motor 500 has characteristics of simple structure, small volume, high speed, high acceleration response, and the like, the driving of the swinging seat 300 by the voice coil motor 500 can provide a high acceleration to the swinging seat 300.
In another aspect, the present application is also directed to an ultrasonic bonding machine comprising a bond head apparatus 10.
When the ultrasonic bonding machine is used, one end of the transducer 220 is connected with the welding head 210, so that the transducer 220 converts electric energy into mechanical energy, namely ultrasonic wave, and then the mechanical energy is transmitted to the welding head 210; one end of the transducer 220 is arranged in the first mounting hole 122 in a penetrating manner, the fastener 130 can drive the first mounting body 110 to move, when the first mounting body 110 moves to a preset position, the first abutting portion 114 can protrude towards the first mounting hole 122 in the direction of the inside of the first mounting hole 122, the side wall of the first mounting body 110 is abutted with the side wall of the second mounting hole 124, so that the first mounting body 110 can be abutted with the transducer 220 more firmly, the first mounting body 110 and the second mounting body 120 can be locked with the transducer 220, and the transducer 220 can be fixed more firmly by the fixing assembly 100 of the transducer.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
Claims (10)
1. A mounting assembly for a transducer, comprising:
a first mounting body provided with a first abutting portion;
the first mounting body is movably arranged in the second mounting hole, and the first abutting part faces the first mounting hole; a kind of electronic device with high-pressure air-conditioning system
The first abutting part can protrude towards the direction inside the first mounting hole to be arranged, the side wall of the first mounting body abuts against the side wall of the second mounting hole, and the first abutting part is matched with the first mounting hole to form a fixing structure for fixing the transducer;
the first protruding, the bellied one end set firmly in the inner wall of first mounting hole, the other end is equipped with second butt portion, the first installation body is equipped with the second arch, the second arch is equipped with first butt portion, the first installation body is equipped with the internal thread hole, the fastener is the bolt, the bolt is used for cooperating with the internal thread hole in order to drive the first installation body removes.
2. The transducer mounting assembly of claim 1, wherein the number of first protrusions is two, the two first protrusions and the second protrusions being spaced apart along the same circumference when the second protrusions protrude from the first mounting hole.
3. The transducer mounting assembly of claim 1, wherein the first abutment and the second abutment are each arcuate in cross-section.
4. A bond head apparatus comprising the transducer mounting assembly of any one of claims 1 to 3, further comprising a transducer and a welding mechanism, the welding mechanism comprising a welding head, one end of the transducer passing through the first mounting hole and the other end being connected to the welding head.
5. The bonding head apparatus according to claim 4, further comprising a mount, a swinging mount, and a driving mechanism, wherein the welding mechanism is fixedly provided to the swinging mount, the swinging mount is rotatably provided to the mount, and the driving mechanism is configured to drive the swinging mount to rotate relative to the mount, so that the welding head can rotate in a direction approaching or separating from the workpiece to be welded.
6. The bond head apparatus of claim 5 further comprising an elastically resettable mechanism comprising a rotator rotatable about a predetermined angular range relative to the rotator, the rotator coupled to the swing mount, and a retainer coupled to the mount.
7. The bonding head device according to claim 6, wherein the elastic restoring mechanism comprises a spring piece, one end of the spring piece is connected with the swinging seat, and the other end of the spring piece is fixedly arranged on the mounting seat.
8. The bonding head device according to claim 5, further comprising an elastic member and an adjusting member, wherein one end of the elastic member is connected to the mounting base, the other end of the elastic member is connected to one end of the adjusting member, and the other end of the adjusting member is movably disposed on the swinging base, for adjusting the stretching length of the elastic member.
9. The bond head apparatus of any one of claims 5 to 8, further comprising a cooling member, the cooling member comprising an air inlet, an air flow channel, and an air outlet groove, the air outlet groove being provided in a side wall of the cooling member along a length direction of the cooling member, the side wall of the air outlet groove being provided with an air outlet, an opening of the air outlet groove being provided toward the driving mechanism, the air outlet, the air flow channel, and the air inlet communicating.
10. An ultrasonic bonding machine comprising the bond head apparatus of any one of claims 4 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811148740.4A CN109346422B (en) | 2018-09-29 | 2018-09-29 | Transducer fixing assembly, bonding head device and ultrasonic bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811148740.4A CN109346422B (en) | 2018-09-29 | 2018-09-29 | Transducer fixing assembly, bonding head device and ultrasonic bonding machine |
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| Publication Number | Publication Date |
|---|---|
| CN109346422A CN109346422A (en) | 2019-02-15 |
| CN109346422B true CN109346422B (en) | 2023-12-12 |
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| CN201811148740.4A Active CN109346422B (en) | 2018-09-29 | 2018-09-29 | Transducer fixing assembly, bonding head device and ultrasonic bonding machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109346422A (en) | 2019-02-15 |
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