CN109346360B

CN109346360B - Dual function circuit assembly for light emitting key and method of manufacturing the same

Info

Publication number: CN109346360B
Application number: CN201811137833.7A
Authority: CN
Inventors: 陈在宇; 郑鸿川
Original assignee: Darfon Electronics Suzhou Co Ltd
Current assignee: Darfon Electronics Suzhou Co Ltd
Priority date: 2018-05-23
Filing date: 2018-09-28
Publication date: 2020-03-27
Anticipated expiration: 2038-09-28
Also published as: CN109346360A

Abstract

The invention discloses a dual-function circuit assembly for a luminous key and a manufacturing method thereof. The dual-function circuit assembly comprises a first insulating substrate, a first circuit formed on the first insulating substrate, and a second circuit formed on the second insulating substrate and including at least two switch contacts; the second polymer film is provided with a first broken hole and at least one second broken hole, each second broken hole corresponds to a pair of pins, the second insulating substrate is attached to the insulating layer, at least two switch contacts are arranged in the first broken holes, and each pair of pins is arranged in the corresponding second broken hole; each LED assembly is fixed in the corresponding second broken hole, and the butt pins of each LED assembly are welded with the corresponding butt pins respectively; the elastic actuator is arranged at the periphery of the first broken hole and enables the tail end of the actuating column to face at least two switch contacts. The dual-function circuit assembly has the functions of a film switch and a light source circuit board.

Description

Dual function circuit assembly for light emitting key and method of manufacturing the same

Technical Field

The present invention relates to a dual-function circuit assembly for a light-emitting key and a method for manufacturing the same, and more particularly, to a dual-function circuit assembly having a membrane switch function and a light source circuit board function and a method for manufacturing the same.

Background

An illuminated keyboard is a common input peripheral device on the market. The prior art light-emitting keyboard includes a membrane switch assembly, a light source circuit board welded with a light-emitting diode assembly, a light guide plate, a base plate, etc. Regarding the assembly of the light emitting keyboard, the membrane switch assembly, the flexible circuit board welded with the light emitting diode assembly, the light guide plate, other assemblies and components are sequentially arranged on the bottom plate.

However, the thickness of the membrane switch assembly, the light source circuit board and the light guide plate does not account for the whole thickness of the thin light-emitting keyboard. Therefore, the whole thickness of the prior art thin luminous keyboard is difficult to be thinned.

In addition, the assembly procedure of the prior art light-emitting keyboard is also complicated.

Disclosure of Invention

Therefore, the present invention is directed to a dual-function circuit assembly for a light-emitting key and a method for manufacturing the same. The dual-function circuit assembly has the functions of a film switch and a light source circuit board. Therefore, the whole thickness of the luminous keyboard comprising the plurality of luminous keys adopting the dual-function circuit component of the invention is thinner than that of the prior art thinned luminous keyboard.

In order to achieve the above object, the present invention provides a dual-function circuit assembly for a light-emitting key, the light-emitting key including an elastic actuator, the elastic actuator including an actuating column, at least an end of the actuating column being a conductive end, the dual-function circuit assembly including: the light emitting diode comprises a first insulating substrate, a first circuit, an insulating layer, a second circuit, a second insulating substrate and at least one light emitting diode component. The first circuit is formed on the upper surface of the first insulating substrate and comprises at least one pair of pins, wherein a first circuit area is defined on the upper surface of the first insulating substrate, the first circuit comprises a first conductive slurry layer and a metal layer, the first conductive slurry layer is covered on the first circuit area, and the metal layer is deposited on the first conductive slurry layer through a chemical plating process; an insulating layer is formed and covers the first circuit and the upper surface of the first insulating substrate, and at least one pair of pins are exposed; the second circuit is formed on the insulating layer and comprises at least two switch contacts; the second insulating substrate is provided with a first broken hole and at least one second broken hole, each second broken hole corresponds to one of the at least one pair of pins, the second insulating substrate is attached to the insulating layer, at least two switch contacts are arranged in the first broken holes, and each pair of pins is arranged in the corresponding second broken hole; each LED component corresponds to one pair of pins in the at least one pair of pins and one second broken hole, each LED component comprises a pair of pins, each LED component is fixed in the corresponding second broken hole, and the butt joint pin of each LED component is welded with the corresponding butt joint pin of each LED component; the elastic actuator is arranged on the periphery of the first broken hole, and the tail end of the actuating column faces to the at least two switch contacts.

In addition, the present invention further provides a dual function circuit assembly for a light emitting key, the light emitting key includes an elastic actuator, the elastic actuator includes an actuating column, the dual function circuit assembly includes: the light-emitting diode comprises an insulating substrate, a first circuit, an insulating layer, a second circuit, an isolating layer, a polymer film, a third circuit and at least one light-emitting diode component. The first circuit is formed on the upper surface of the insulating base material, the first circuit comprises at least one pair of pins, wherein a first circuit area is defined on the upper surface of the insulating base material, the first circuit comprises a first conductive paste layer and a metal layer, the first conductive paste layer is covered on the first circuit area, and the metal layer is deposited on the first conductive paste layer through a chemical plating process; an insulating layer is formed and covers the first circuit and the upper surface of the insulating substrate, and at least one pair of pins are exposed; the second circuit is formed on the insulating layer and comprises at least one lower switch contact; the isolation layer is provided with a first broken hole and at least one second broken hole, each second broken hole corresponds to one pair of pins in the at least one pair of pins, the isolation layer is attached to the insulation layer, at least one lower switch contact is arranged in the first broken hole, and each pair of pins is arranged in the corresponding second broken hole; the polymer film is provided with at least one third hole, and each third hole corresponds to one second hole; the third circuit is formed on the lower surface of the polymer film and comprises at least one upper switch contact, wherein the lower surface of the polymer film is attached to the isolation layer, the at least one upper switch contact is arranged in the first broken hole and aligned with the at least one lower switch contact, and each third broken hole is aligned with the corresponding second broken hole; each LED assembly corresponds to a pair of pins in at least one pair of pins, a third broken hole and a second broken hole, each LED assembly comprises a pair of pins, each LED assembly is fixed in the corresponding third broken hole and the second broken hole, and the pair of pins and the corresponding pair of pins are respectively welded together; the elastic actuator is arranged on the polymer film and is aligned with the first broken hole, and the tail end of the actuating column faces to the at least one upper switch contact and the at least one lower switch contact.

In addition, the present invention further provides a third dual-function circuit assembly for a light-emitting key, the light-emitting key includes an elastic actuator, the elastic actuator includes an actuating column, at least an end of the actuating column is a conductive end, the dual-function circuit assembly includes: the light emitting diode device comprises a first insulating substrate, a first circuit, an insulating layer, at least one light emitting diode component, a second circuit and a second insulating substrate. The first circuit is formed on the lower surface of the first insulating substrate and comprises at least one pair of pins, wherein a first circuit area is defined on the lower surface of the first insulating substrate, the first circuit comprises a first conductive slurry layer and a metal layer, the first conductive slurry layer is covered on the first circuit area, and the metal layer is deposited on the first conductive slurry layer through a chemical plating process; an insulating layer is formed and covers the first circuit and the lower surface of the first insulating substrate, and at least one pair of pins are exposed; each LED component corresponds to one pair of pins in at least one pair of pins and comprises a pair of pins, and the pair of pins of each LED component and the corresponding pair of pins are respectively welded together; the second circuit is formed on the upper surface of the first insulating substrate and comprises at least two switch contacts; the second insulating base material is provided with a broken hole, the second insulating base material is attached to the upper surface of the first insulating base material, and the at least two switch contacts are arranged in the broken hole; the elastic actuator is arranged at the periphery of the broken hole, and the tail end of the actuating column faces to the at least two switch contacts.

In addition, the present invention further provides a fourth dual-function circuit assembly for a light-emitting key, wherein the light-emitting key comprises an elastic actuator, the elastic actuator comprises an actuating column, and the dual-function circuit assembly comprises: the light-emitting diode comprises an insulating substrate, a first circuit, an insulating layer, at least one light-emitting diode component, a second circuit, an isolating layer, a high polymer film and a third circuit; the first circuit is formed on the first lower surface of the insulating substrate and comprises at least one pair of pins, wherein a first circuit area is defined on the first lower surface of the insulating substrate, the first circuit comprises a first conductive slurry layer and a metal layer, the first conductive slurry layer is covered on the first circuit area, and the metal layer is deposited on the first conductive slurry layer through a chemical plating process; an insulating layer is formed and covers the first circuit and the first lower surface of the insulating substrate, and at least one pair of pins are exposed; each LED component corresponds to one pair of pins in at least one pair of pins and comprises a pair of pins, and the pair of pins of each LED component and the corresponding pair of pins are respectively welded together; a second circuit formed on the upper surface of the insulating substrate, the second circuit comprising at least one lower switch contact; the isolation layer is provided with a broken hole, the isolation layer is attached to the upper surface of the insulating base material, and at least one lower switch contact is arranged in the broken hole; the third circuit is formed on the second lower surface of the polymer film and comprises at least one upper switch contact, wherein the polymer film is attached to the isolation layer through the second lower surface, and the at least one upper switch contact is arranged in the broken hole and aligned with the at least one lower switch contact; the elastic actuator is arranged on the polymer film and aligned with the broken hole, and the tail end of the actuating column faces to the at least one upper switch contact and the at least one lower switch contact.

In addition, the present invention further provides a fifth dual-function circuit assembly for a light-emitting key, wherein the light-emitting key comprises an elastic actuator, the elastic actuator comprises an actuating column, at least the end of the actuating column is a conductive end, and the dual-function circuit assembly comprises: the light emitting diode comprises a metal substrate, a first insulating layer, a first circuit, a second insulating layer, a second circuit, an insulating substrate and at least one light emitting diode component. A first insulating layer is formed and covers the upper surface of the metal base material; the first circuit is formed on a first insulating layer, the first circuit comprises at least one pair of pins, a first circuit area is defined on the first insulating layer, the first circuit comprises a first conductive slurry layer and a metal layer, the first conductive slurry layer is covered on the first circuit area, and the metal layer is deposited on the first conductive slurry layer through a chemical plating process; a second insulating layer is formed and covers the first circuit and the first insulating layer, and at least one pair of pins is exposed; the second circuit is formed on the second insulating layer and comprises at least two switch contacts; the insulating substrate is provided with a first broken hole and at least one second broken hole, each second broken hole corresponds to one pair of pins in the at least one pair of pins, the insulating substrate is attached to the second insulating layer, at least two switch contacts are arranged in the first broken hole, and each pair of pins is arranged in the corresponding second broken hole; each LED component corresponds to one pair of pins of the at least one pair of pins and one second broken hole and comprises a pair of pins, each LED component is fixed in the corresponding second broken hole, and the pair of pins and the corresponding pair of pins are respectively welded together; the elastic actuator is arranged on the periphery of the first broken hole, and the tail end of the actuating column faces to the at least two switch contacts.

In addition, the present invention further provides a sixth dual-function circuit assembly for a light-emitting key, wherein the light-emitting key comprises an elastic actuator, the elastic actuator comprises an actuating column, and the dual-function circuit assembly comprises: the light-emitting diode comprises a metal substrate, a first insulating layer, a first circuit, a second insulating layer, a second circuit, an isolating layer, a high polymer film, a third circuit and at least one light-emitting diode component. A first insulating layer is formed and covers the upper surface of the metal base material; the first circuit is formed on a first insulating layer, the first circuit comprises at least one pair of pins, a first circuit area is defined on the first insulating layer, the first circuit comprises a first conductive slurry layer and a metal layer, the first conductive slurry layer is covered on the first circuit area, and the metal layer is deposited on the first conductive slurry layer through a chemical plating process; a second insulating layer is formed and covers the first circuit and the first insulating layer, and at least one pair of pins is exposed; the second circuit is formed on the second insulating layer and comprises at least one lower switch contact; the isolating layer is provided with a first broken hole and at least one second broken hole, each second broken hole corresponds to one pair of pins in the at least one pair of pins, the isolating layer is attached to the second insulating layer, at least one lower switch contact is arranged in the first broken hole, and each pair of pins is arranged in the corresponding second broken hole; the polymer film is provided with at least one third hole, and each third hole corresponds to one second hole; the third circuit is formed on the lower surface of the polymer film and comprises at least one upper switch contact, wherein the lower surface of the polymer film is attached to the isolation layer, the at least one upper switch contact is arranged in the first broken hole and aligned with the at least one lower switch contact, and each third broken hole is aligned with the corresponding second broken hole; each LED assembly corresponds to a pair of pins in at least one pair of pins, a third broken hole and a second broken hole, each LED assembly comprises a pair of pins, each LED assembly is fixed in the corresponding third broken hole and the second broken hole, and the pair of pins and the corresponding pair of pins are respectively welded together; the elastic actuator is arranged on the polymer film and is aligned with the first broken hole, and the tail end of the actuating column faces to the at least one upper switch contact and the at least one lower switch contact.

In addition, the present invention further provides a seventh dual-function circuit assembly for a light-emitting key, the light-emitting key includes an elastic actuator, the elastic actuator includes an actuating column, at least an end of the actuating column is a conductive end, the dual-function circuit assembly includes: the light-emitting diode comprises a metal substrate, a first insulating layer, a first circuit, a second insulating layer, at least one light-emitting diode component, a third insulating layer, a second circuit and an insulating substrate. The first insulating layer is formed and covers the lower surface of the metal base material; the first circuit is formed on a first insulating layer, the first circuit comprises at least one pair of pins, a first circuit area is defined on the first insulating layer, the first circuit comprises a first conductive slurry layer and a metal layer, the first conductive slurry layer is covered on the first circuit area, and the metal layer is deposited on the first conductive slurry layer through a chemical plating process; a second insulating layer is formed and covers the first circuit and the first insulating layer, and at least one pair of pins is exposed; each LED component corresponds to one pair of pins in at least one pair of pins and comprises a pair of pins, and the pair of pins of each LED component and the corresponding pair of pins are respectively welded together; a third insulating layer is formed and covers the upper surface of the metal base material; the second circuit is formed on the third insulating layer and comprises at least two switch contacts; the insulating substrate is provided with a broken hole, is attached to the third insulating layer and enables at least two switch contacts to be arranged in the broken hole; the elastic actuator is arranged at the periphery of the broken hole, and the tail end of the actuating column faces to the at least two switch contacts.

In addition, the present invention further provides an eighth dual-function circuit assembly for a light-emitting key, wherein the light-emitting key comprises an elastic actuator, the elastic actuator comprises an actuating column, and the dual-function circuit assembly comprises: the light-emitting diode comprises a metal substrate, a first insulating layer, a first circuit, a second insulating layer, at least one light-emitting diode component, a third insulating layer, a second circuit, an isolating layer, a high polymer film and a third circuit. The first insulating layer is formed and covers the first lower surface of the metal base material; the first circuit is formed on a first insulating layer, the first circuit comprises at least one pair of pins, a first circuit area is defined on the first insulating layer, the first circuit comprises a first conductive slurry layer and a metal layer, the first conductive slurry layer is covered on the first circuit area, and the metal layer is deposited on the first conductive slurry layer through a chemical plating process; a second insulating layer is formed and covers the first circuit and the first insulating layer, and at least one pair of pins is exposed; each LED component corresponds to one pair of pins in at least one pair of pins and comprises a pair of pins, and the pair of pins of each LED component and the corresponding pair of pins are respectively welded together; a third insulating layer is formed and covers the upper surface of the metal base material; the second circuit is formed on the third insulating layer and comprises at least one lower switch contact; the isolation layer is provided with a broken hole and is attached to the third insulation layer, and at least one lower switch contact is arranged in the broken hole; the third circuit is formed on the second lower surface of the polymer film and comprises at least one upper switch contact, wherein the polymer film is attached to the isolation layer through the second lower surface, and the at least one upper switch contact is arranged in the broken hole and aligned with the at least one lower switch contact; the elastic actuator is arranged on the polymer film and aligned with the broken hole, and the tail end of the actuating column faces to the at least one upper switch contact and the at least one lower switch contact.

In addition, the present invention provides a method for manufacturing a dual-function circuit device for a light-emitting key, the light-emitting key including an elastic actuator, the elastic actuator including an actuating pillar, at least an end of the actuating pillar being a conductive end, the method including the steps of: preparing a first insulating substrate, wherein a first circuit area is defined on the upper surface of the first insulating substrate; coating a first conductive paste layer on the first circuit region; performing a chemical plating process on the upper surface of the first insulating substrate to deposit a metal layer on the first conductive paste layer, wherein the first conductive paste layer and the metal layer form a first circuit, and the first circuit comprises at least one pair of pins; forming an insulating layer and covering the first circuit and the upper surface of the first insulating substrate, and exposing at least one pair of pins; forming a second circuit on the insulating layer, wherein the second circuit comprises at least two switch contacts; preparing a second insulating substrate, wherein the second insulating substrate is provided with a first broken hole and at least one second broken hole, and each second broken hole corresponds to one pair of pins in at least one pair of pins; attaching a second insulating substrate on the insulating layer, placing at least two switch contacts in the first broken holes, and placing each pair of pins in the corresponding second broken holes; preparing at least one light emitting diode assembly, wherein each light emitting diode assembly corresponds to one pair of pins in the at least one pair of pins and one second hole, and each light emitting diode assembly comprises a pair of pins; fixing each LED assembly in the corresponding second broken hole and respectively welding the butt pins with the corresponding butt pins; the elastic actuator is arranged on the periphery of the first broken hole, and the tail end of the actuating column faces to the at least two switch contacts.

In addition, the present invention provides a second method for manufacturing a dual-function circuit assembly for a light-emitting key, the light-emitting key including a resilient actuator, the resilient actuator including an actuating post, the method comprising the steps of: preparing an insulating substrate, wherein a first circuit area is defined on the upper surface of the insulating substrate; coating a first conductive paste layer on the first circuit region; performing a chemical plating process on the upper surface of the insulating substrate, and further depositing a metal layer on the first conductive paste layer, wherein the first conductive paste layer and the metal layer form a first circuit, and the first circuit comprises at least one pair of pins; forming an insulating layer to cover the first circuit and the upper surface of the insulating substrate and expose at least one pair of pins; forming a second circuit on the insulating layer, wherein the second circuit comprises at least one lower switch contact; preparing an isolation layer, wherein the isolation layer is provided with a first broken hole and at least one second broken hole, and each second broken hole corresponds to one pair of pins in at least one pair of pins; preparing a polymer film, wherein the polymer film is provided with at least one third hole, and each third hole corresponds to one second hole; forming a third circuit on the lower surface of the polymer film, wherein the third circuit comprises at least one upper switch contact; adhering an isolating layer between the insulating layer and the lower surface of the polymer film, and placing at least one upper switch contact and at least one lower switch contact in the first broken hole, and placing each pair of pins in the corresponding second broken holes; preparing at least one light emitting diode assembly, wherein each light emitting diode assembly corresponds to one pair of pins in the at least one pair of pins, one third hole and one second hole, and each light emitting diode assembly comprises a pair of pins; fixing each LED assembly in the corresponding third broken hole and the second broken hole and respectively welding the butt pins with the corresponding butt pins; the elastic actuator is arranged on the polymer film and is aligned with the first broken hole, and the tail end of the actuating column faces to the at least one upper switch contact and the at least one lower switch contact.

In addition, the present invention provides a third method for manufacturing a dual-function circuit assembly for a light-emitting key, the light-emitting key including an elastic actuator, the elastic actuator including an actuating rod, at least an end of the actuating rod being a conductive end, the method including the steps of: preparing a first insulating substrate, wherein a first circuit area is defined on the lower surface of the first insulating substrate; coating a first conductive paste layer on the first circuit region; performing a chemical plating process on the first insulating substrate to deposit a metal layer on the first conductive paste layer, wherein the first conductive paste layer and the metal layer form a first circuit, and the first circuit comprises at least one pair of pins; forming an insulating layer to cover the first circuit and the lower surface of the first insulating substrate and expose at least one pair of pins; forming a second circuit on the upper surface of the first insulating substrate, wherein the second circuit comprises at least two switch contacts; preparing a second insulating substrate, wherein the second insulating substrate is provided with a broken hole; attaching a second insulating substrate to the upper surface of the first insulating substrate, and placing at least two switch contacts in the broken hole; preparing at least one light emitting diode assembly, wherein each light emitting diode assembly corresponds to one pin of the at least one pair of pins and each light emitting diode assembly comprises a pair of pins; respectively welding the butt pins of each light-emitting diode assembly and the corresponding butt pins together; the elastic actuator is arranged at the periphery of the broken hole, and the tail end of the actuating column faces to the at least two switch contacts.

In addition, the present invention provides a fourth method for manufacturing a dual-function circuit assembly for a light-emitting key, the light-emitting key including a resilient actuator, the resilient actuator including an actuating post, the method comprising the steps of: preparing an insulating substrate, wherein a first circuit area is defined on a first lower surface of the insulating substrate; coating a first conductive paste layer on the first circuit region; performing a chemical plating process on the first lower surface of the insulating substrate to deposit a metal layer on the first conductive paste layer, wherein the first conductive paste layer and the metal layer form a first circuit, and the first circuit comprises at least one pair of pins; forming an insulating layer and covering the first circuit and the first lower surface of the insulating substrate, and exposing at least one pair of pins; forming a second circuit on the upper surface of the insulating substrate, wherein the second circuit comprises at least one lower switch contact; preparing an isolation layer, wherein the isolation layer is provided with a broken hole; preparing a polymer film; forming a third circuit on the second lower surface of the polymer film, wherein the third circuit comprises at least one upper switch contact; attaching an isolation layer between the upper surface of the insulating substrate and the second lower surface of the polymer film, and placing at least one upper switch contact and at least one lower switch contact in the broken hole; preparing at least one light emitting diode assembly, wherein each light emitting diode assembly corresponds to one pin of the at least one pair of pins and each light emitting diode assembly comprises a pair of pins; respectively welding the butt pins of each light-emitting diode assembly and the corresponding butt pins together; the elastic actuator is arranged on the polymer film and is aligned with the broken hole, so that the tail end of the actuating column faces to the at least one upper switch contact and the at least one lower switch contact.

In addition, the present invention provides a fifth method for manufacturing a dual-function circuit device for a light-emitting key, the light-emitting key comprising an elastic actuator, the elastic actuator comprising an actuating rod, at least an end of the actuating rod being a conductive end, the method comprising the steps of: preparing a metal substrate; forming a first insulating layer and covering the upper surface of the metal substrate, wherein a first circuit area is defined on the first insulating layer; coating a first conductive paste layer on the first circuit region; performing a chemical plating process on the first insulating layer to deposit a metal layer on the first conductive paste layer, wherein the first conductive paste layer and the metal layer form a first circuit, and the first circuit comprises at least one pair of pins; forming a second insulating layer to cover the first circuit and the first insulating layer and expose at least one pair of pins; forming a second circuit on the second insulating layer, wherein the second circuit comprises at least two switch contacts; preparing an insulating substrate, wherein the insulating substrate is provided with a first broken hole and at least one second broken hole, and each second broken hole corresponds to one pair of pins in at least one pair of pins; attaching an insulating substrate on the second insulating layer, placing at least two switch contacts in the first broken holes, and placing each pair of pins in the corresponding second broken holes; preparing at least one light emitting diode assembly, wherein each light emitting diode assembly corresponds to one pair of pins in the at least one pair of pins and one second hole, and each light emitting diode assembly comprises a pair of pins; fixing each LED assembly in the corresponding second broken hole and respectively welding the butt pins with the corresponding butt pins; the elastic actuator is arranged on the periphery of the first broken hole, and the tail end of the actuating column faces to the at least two switch contacts.

In addition, the present invention provides a sixth method for manufacturing a dual-function circuit assembly for a light-emitting key, the light-emitting key including an elastic actuator, the elastic actuator including an actuating column, the method comprising the steps of: preparing a metal substrate; forming a first insulating layer and covering the upper surface of the metal substrate, wherein a first circuit area is defined on the first insulating layer; coating a first conductive paste layer on the first circuit region; performing a chemical plating process on the first insulating layer to deposit a metal layer on the first conductive paste layer, wherein the first conductive paste layer and the metal layer form a first circuit, and the first circuit comprises at least one pair of pins; forming a second insulating layer to cover the first circuit and the first insulating layer and expose at least one pair of pins; forming a second circuit on the second insulating layer, wherein the second circuit comprises at least one lower switch contact; preparing an isolation layer, wherein the isolation layer is provided with a first broken hole and at least one second broken hole, and each second broken hole corresponds to one pair of pins in at least one pair of pins; preparing a polymer film, wherein the polymer film is provided with at least one third hole, and each third hole corresponds to one second hole; forming a third circuit on the lower surface of the polymer film, wherein the third circuit comprises at least one upper switch contact; the isolation layer is attached between the second insulation layer and the lower surface of the polymer film, at least one upper switch contact and at least one lower switch contact are arranged in the first broken hole, and each pair of pins is arranged in the corresponding second broken hole; preparing at least one light emitting diode assembly, wherein each light emitting diode assembly corresponds to one pair of pins in the at least one pair of pins, one third hole and one second hole, and each light emitting diode assembly comprises a pair of pins; fixing each LED assembly in the corresponding third broken hole and the second broken hole and respectively welding the butt pins with the corresponding butt pins; the elastic actuator is arranged on the polymer film and is aligned with the first broken hole, and the tail end of the actuating column faces to the at least one upper switch contact and the at least one lower switch contact.

In addition, the present invention provides a seventh method for manufacturing a dual-function circuit device for a light-emitting key, the light-emitting key comprising an elastic actuator, the elastic actuator comprising an actuating rod, at least an end of the actuating rod being a conductive end, the method comprising the steps of: preparing a metal substrate; forming a first insulating layer and covering the lower surface of the metal substrate, wherein a first circuit area is defined on the first insulating layer; coating a first conductive paste layer on the first circuit region; performing a chemical plating process on the first insulating layer to deposit a metal layer on the first conductive paste layer, wherein the first conductive paste layer and the metal layer form a first circuit, and the first circuit comprises at least one pair of pins; forming a second insulating layer to cover the first circuit and the first insulating layer and expose at least one pair of pins; forming a third insulating layer to cover the upper surface of the metal substrate; forming a second circuit on the third insulating layer, wherein the second circuit comprises at least two switch contacts; preparing an insulating substrate, wherein the insulating substrate is provided with a broken hole; attaching an insulating substrate to the third insulating layer, and placing at least two switch contacts in the broken holes; preparing at least one light emitting diode assembly, wherein each light emitting diode assembly corresponds to one pin of the at least one pair of pins and each light emitting diode assembly comprises a pair of pins; respectively welding the butt pins of each light-emitting diode assembly and the corresponding butt pins together; the elastic actuator is arranged at the periphery of the broken hole, and the tail end of the actuating column faces to the at least two switch contacts.

In addition, the present invention provides an eighth method for manufacturing a dual-function circuit assembly for a light-emitting key, the light-emitting key comprising an elastic actuator, the elastic actuator comprising an actuating column, the method comprising the steps of: preparing a metal substrate; forming a first insulating layer and covering the first lower surface of the metal substrate, wherein a first circuit area is defined on the first insulating layer; coating a first conductive paste layer on the first circuit region; performing a chemical plating process on the first insulating layer to deposit a metal layer on the first conductive paste layer, wherein the first conductive paste layer and the metal layer form a first circuit, and the first circuit comprises at least one pair of pins; forming a second insulating layer to cover the first circuit and the first insulating layer and expose at least one pair of pins; forming a third insulating layer to cover the upper surface of the metal substrate; forming a second circuit on the third insulating layer, wherein the second circuit comprises at least one lower switch contact; preparing an isolation layer, wherein the isolation layer is provided with a broken hole; preparing a polymer film; forming a third circuit on the second lower surface of the polymer film, wherein the third circuit comprises at least one upper switch contact; attaching the isolation layer between the third insulation layer and the second lower surface of the polymer film, and placing at least one upper switch contact and at least one lower switch contact in the broken hole; preparing at least one light emitting diode assembly, wherein each light emitting diode assembly corresponds to one pin of the at least one pair of pins and each light emitting diode assembly comprises a pair of pins; respectively welding the butt pins of each light-emitting diode assembly and the corresponding butt pins together; the elastic actuator is arranged on the polymer film and aligned with the broken hole, and the tail end of the actuating column faces to the at least one upper switch contact and the at least one lower switch contact.

Different from the prior art, the dual-function circuit assembly has the functions of a film switch and a light source circuit board. The whole thickness of the luminous keyboard comprising a plurality of luminous keys adopting the dual-function circuit component of the invention is thinner than that of the prior art thinned luminous keyboard, and even a light guide plate or a bottom plate can be omitted. By adopting the dual-function circuit assembly, the assembly procedure of the luminous keyboard can be simplified.

The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.

Drawings

Fig. 1 is an exploded view of a light-emitting key assembly and components of a dual-function circuit assembly according to a first preferred embodiment of the invention.

Fig. 2 is a cross-sectional view of the dual function circuit assembly of fig. 1 taken along line a-a.

Fig. 3 to 6 schematically show a method of manufacturing a dual-function circuit assembly according to a first preferred embodiment of the present invention in cross-sectional views.

Fig. 7 is a cross-sectional view of a dual function circuit assembly in accordance with a second preferred embodiment of the present invention.

Fig. 8 to 11 schematically show a method of manufacturing a dual function circuit assembly according to a second preferred embodiment of the present invention in cross-sectional views.

Fig. 12 is a cross-sectional view of a dual-function circuit assembly according to a third preferred embodiment of the invention.

Fig. 13 to 16 schematically illustrate in cross-sectional views a method of manufacturing a dual-function circuit assembly according to a third preferred embodiment of the present invention.

Fig. 17 is a cross-sectional view of a dual function circuit assembly in accordance with a fourth preferred embodiment of the present invention.

Fig. 18 to 21 schematically illustrate in cross-sectional views a method of manufacturing a dual-function circuit assembly according to a fourth preferred embodiment of the present invention.

Fig. 22 is a cross-sectional view of a dual function circuit assembly in accordance with a fifth preferred embodiment of the present invention.

Fig. 23 to 26 schematically illustrate in cross-sectional views a method of manufacturing a dual-function circuit assembly according to a fifth preferred embodiment of the present invention.

Fig. 27 is a cross-sectional view of a dual function circuit assembly in accordance with a sixth preferred embodiment of the present invention.

Fig. 28 to 31 schematically illustrate in cross-sectional views a method of manufacturing a dual function circuit assembly according to a sixth preferred embodiment of the present invention.

Fig. 32 is a cross-sectional view of a dual function circuit assembly in accordance with a seventh preferred embodiment of the present invention.

Fig. 33 to 36 schematically illustrate in cross-sectional views a method of manufacturing a dual-function circuit assembly according to a seventh preferred embodiment of the present invention.

Fig. 37 is a cross-sectional view of a dual-function circuit assembly in accordance with an eighth preferred embodiment of the present invention.

Fig. 38 to 41 schematically illustrate in cross-sectional views a method of manufacturing a dual-function circuit assembly according to an eighth preferred embodiment of the present invention.

Detailed Description

Referring to fig. 1 and 2, a dual function circuit assembly 2 according to a first preferred embodiment of the present invention is schematically depicted. Fig. 1 schematically shows a light-emitting key 1 using a dual-function circuit assembly 2 according to a first preferred embodiment of the present invention in an assembly and component development view. Fig. 2 is a cross-sectional view of the dual function circuit assembly 2 of fig. 1 taken along line a-a. For convenience of illustration, fig. 2 is a cross-sectional view of the dual-function circuit assembly 2 and the elastic actuator 12.

As shown in fig. 1, the light-emitting key 1 using the dual-function circuit assembly 2 according to the first preferred embodiment of the present invention includes a base plate 10, the dual-function circuit assembly 2, a resilient actuator 12, a key cap 14, and a lifting mechanism 16.

The lifting mechanism 16 is disposed between the base plate 10 and the key cap 14. The elevating mechanism 16 restricts the movement of the key cap 14 between the non-depressed position and the depressed position.

As shown in fig. 1 and 2, the elastic actuator 12 includes an elastic dome 122 and an actuating column 124. The dome 122 has an opening 1222 and a top 1224. The actuating post 124 is formed within the dome body 122 and extends toward the opening 1222 of the dome body 122. The elastic actuator 12 is disposed on the dual function circuit assembly 2.

The lifting mechanism 16 may be a scissor-type supporting device, a butterfly-type supporting device, or other conventional lifting mechanisms. The elevator mechanism 16 shown in fig. 1 is a scissor-type elevator mechanism 16 formed by an inner arm member 162 and an outer arm member 164. Inner arm member 162 is rotatably coupled to lower surface 142 of keycap 14 and base plate 10, respectively. The outer arm member 164 is rotatably coupled to the lower surface 142 of the key cap 14 and the base 10, respectively. For example, as shown in FIG. 1, two pairs of receiving portions 146 are integrally formed with keycap 14 on lower surface 142. Two receiving channels 102 are integrally formed in the base plate 10. Wherein a pair of receiving portions 146 and a pair of receiving channels 102 are used to connect the inner arm members 162. Another pair of receiving portions 146 and another pair of receiving channels 102 are used to connect the outer arm members 164.

The elastic actuator 12 is coupled to the lower surface 142 of the keycap 14. For example, as shown in FIG. 1, keycap 14 also has posts 144, posts 144 being formed on lower surface 142 of keycap 14. The protruding pillar 144 is embedded in the groove 1226 at the top 1224 of the dome body 122 of the elastic actuator 12, that is, one end of the protruding pillar 144 is connected to the lower surface 142 of the key cap 14, and the other end of the protruding pillar 144 is embedded in the groove 1226, so as to realize the coupling connection between the elastic actuator 12 and the key cap 14.

As shown in fig. 2, in the light-emitting key 1 of the dual-function circuit assembly 2 according to the first preferred embodiment of the present invention, at least the end 1242 of the actuating rod 124 is a conductive end. In one embodiment, a plurality of graphite particles or a plurality of metal particles are coated on the end 1242 of the post 124.

As shown in fig. 2, the dual-function circuit assembly 2 of the first preferred embodiment of the present invention includes a first insulating substrate 20, a first circuit 21, an insulating layer 22, a second circuit 23, a second insulating substrate 25 and at least one light emitting diode assembly 26. In the example shown in fig. 1 and 2, only one led device 26 is shown as a representative. In one embodiment, the LED element 26 may be a packaged LED element or a bare die type LED element.

In one embodiment, the first insulating substrate 20 and the second insulating substrate 25 may be phenolic cotton paper-based substrates, glass cloth-based substrates, ceramic substrates (e.g., aluminum nitride, aluminum oxide, silicon carbide, etc.), polymer films, etc. If the first insulating substrate 20 and the second insulating substrate 25 are polymer films, they can be polymer films formed by polyethylene terephthalate, polyimide, polymethyl methacrylate, or other similar commercial polymer materials. If the first insulating substrate 20 is a ceramic substrate, it can assist in dissipating heat generated during the operation of the led assembly 26.

The first circuit 21 is formed on the upper surface 202 of the first insulating substrate 20. The first circuit 21 includes at least one pair of pins 212. The insulating layer 22 is formed to cover the first circuit 21 and the upper surface 202 of the first insulating substrate 20 while exposing at least one pair of leads 212.

As also shown in fig. 2, in one embodiment, a first circuit region 204 is defined on the upper surface 202 of the first insulating substrate 20. The first circuit 21 may include a first conductive paste layer 214 and a metal layer 216. A first conductive paste layer 214 is coated on the first circuit region 204. The metal layer 216 may be deposited on the first conductive paste layer 214 by an electroless plating process. The first conductive paste layer 214 may include conductive particles formed of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and combinations thereof. The first conductive paste layer 214 may be coated on the first circuit region 204 by a screen printing process (not limited thereto).

In one embodiment, the metal layer 216 may have a single Cu layer, a multi-Ag/Au layer/multi-Ag/Au/Sn/Ni layer/single Cu layer, a single Sn layer/single Cu layer, a single Ag layer/single Cu layer, a single Au layer/single Cu layer, a single Ag layer/single Ni layer/single Cu layer, a single Au layer/single Ni layer/single Cu layer, a single Sn layer/single Au layer/single Ag layer/single Ni layer/single Cu layer, or the like.

In one embodiment, the insulating layer 22 may be formed by coating an ultraviolet curing resin on the first circuit 21 and the upper surface 202 of the first insulating substrate 20 and then irradiating ultraviolet light to cure the resin.

The second circuit 23 is formed on the insulating layer 22. The second circuit 23 includes at least two switch contacts 232.

In one embodiment, the second circuit region 222 is defined on the insulating layer 22. The second circuit 23 may include a second conductive paste layer 234. A second conductive paste layer 234 is coated on the second wiring region 222. The second conductive paste layer 234 may include conductive particles formed of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and combinations thereof. The second conductive paste layer 234 may be coated on the second circuit region 222 by a screen printing process (not limited thereto).

The second insulating substrate 25 has a first hole 252 and at least one second hole 254. Each second hole 254 corresponds to one of the at least one pair of leads 212. In fig. 1 and 2, only one second hole 254 is shown as a representative.

The second insulating substrate 25 is attached to the insulating layer 22, such that at least two of the switch contacts 232 are disposed in the first holes 252 of the second insulating substrate 25, and each pair of the leads 212 is disposed in the corresponding second hole 254.

In one embodiment, the adhesive layer 24 is coated on the second circuit 23 and the insulating layer 22, and exposes the at least one pair of leads 212 and the at least two switch contacts 232. The second insulating substrate 25 is attached to the insulating layer 22 via the adhesive layer 24. The adhesive layer 24 may be formed by coating a water gel, but is not limited thereto.

Each led assembly 26 corresponds to one of the at least one pair of leads 212 and one of the second holes 254, and each led assembly 26 correspondingly includes a pair of leads 262. Each led module 26 is fixed in the corresponding second hole 254, and the pair of pins 262 are soldered to the corresponding pair of pins 212.

Further, the transparent encapsulant 27 at least covers the at least one second hole 254 and the at least one led assembly 26. At least one light emitting diode assembly 26 is driven to emit light and shine towards the key cap 14.

The elastic actuator 12 is disposed at the periphery of the first hole 252, such that the end 1242 of the actuating post 124 faces the at least two switch contacts 232. When the key cap 14 moves to the pressing position, the dome body 122 of the elastic actuator 12 deforms, so that the conductive end 1242 of the actuating column 124 contacts the at least two switch contacts 232 to make the at least two switch contacts 232 conduct with each other, thereby triggering the light-emitting key 1 of the present invention to be switched to the conducting state. When the key cap 14 is released and moved to the non-depressed position, the dome body 122 of the elastic actuator 12 returns to its original shape to separate the conductive end 1242 of the actuating cylinder 124 from the at least two switch contacts 232.

The dual-function circuit assembly 2 of the first preferred embodiment of the present invention has the functions of a membrane switch and a light source circuit board, and the thickness thereof can be reduced to 270 μm to 350 μm. The light-emitting key 1 using the dual-function circuit assembly 2 according to the first preferred embodiment of the present invention can eliminate the light guide plate.

Referring to fig. 3 to 6, a method of manufacturing the dual function circuit assembly 2 of the first preferred embodiment shown in fig. 2 according to the present invention is schematically illustrated in cross-sectional views. The cross-sectional lines of the cross-sections shown in FIGS. 3-6 are defined as the lines A-A in FIG. 1.

First, as shown in fig. 3, the method of the present invention first prepares a first insulating substrate 20.

In one embodiment, the first insulating substrate 20 may be a phenolic cotton paper-based substrate, a glass cloth-based substrate, a ceramic substrate (e.g., aluminum nitride, aluminum oxide, silicon carbide, etc.), a polymer film, or the like. If the first insulating substrate 20 is a polymer film, it can be an insulating substrate formed by polyethylene terephthalate, polyimide, polymethyl methacrylate, or other similar commercial polymer materials. If the first insulating substrate 20 is a ceramic substrate, it can assist in dissipating heat generated during the operation of the led assembly 26.

Next, as also shown in fig. 3, a first circuit 21 is formed on the upper surface 202 of the first insulating substrate 20. The first circuit 21 includes at least one pair of pins 212.

In one embodiment, a first circuit region 204 is defined on the upper surface 202 of the first insulating substrate 20. The first circuit 21 is formed by the steps of: first conductive paste layer 214 is coated on first circuit region 204. Next, an electroless plating process is performed on the upper surface 202 of the first insulating substrate 20, and a metal layer 216 is deposited on the first conductive paste layer 214. The first conductive paste layer 214 and the metal layer 216 constitute a first circuit 21. The first conductive paste layer 214 may include conductive particles formed of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and combinations thereof. The first conductive paste layer 214 may be coated on the first circuit region 204 by a screen printing process (not limited thereto).

Next, as shown in fig. 4, the insulating layer 22 is formed to cover the first circuit 21 and the upper surface 202 of the first insulating substrate 20, and expose at least one pair of leads 212.

Next, as shown in fig. 4, a second circuit 23 is formed on the insulating layer 22. The second circuit 23 includes at least two switch contacts 232.

Next, as shown in fig. 5, the second circuit 23 and the insulating layer 22 are covered by the adhesive layer 24, and the at least one pair of leads 212 and the at least two switch contacts 232 are exposed.

In one embodiment, the adhesive layer 24 is formed by coating a water gel, but not limited thereto.

Next, as also shown in fig. 5, a second insulating substrate 25 is prepared. The second insulating substrate 25 has a first hole 252 and at least one second hole 254. Each second hole 254 corresponds to one of the at least one pair of leads 212.

In one embodiment, the second insulating substrate 25 may be a phenolic cotton paper-based substrate, a glass cloth-based substrate, a ceramic substrate (e.g., aluminum nitride, aluminum oxide, silicon carbide, etc.), a polymer film, or the like. If the insulating substrate 25 is a polymer film, it may be an insulating substrate formed of polyethylene terephthalate, polyimide, polymethyl methacrylate, or other similar commercially available polymer materials.

Next, as also shown in fig. 5, the second insulating substrate 25 is attached to the insulating layer 22 by the adhesive layer 24 (not limited thereto), and at least two switch contacts 232 are disposed in the first holes 252, and each pair of pins 212 is disposed in the corresponding second hole 254.

Next, as shown in fig. 6, at least one light emitting diode assembly 26 is prepared. Each led assembly 26 corresponds to one of the at least one pair of leads 212 and one of the second holes 254, and each led assembly 26 includes a pair of leads 262.

Finally, as also shown in fig. 6, each led assembly 26 is fixed in its corresponding second hole 254, and the pair of pins 262 thereof and the corresponding pair of pins 212 are respectively soldered together.

Further, as also shown in fig. 6, at least one second hole 254 and at least one led assembly 26 are covered by a transparent encapsulant 27, so as to complete the dual-function circuit assembly 2 shown in fig. 2. The elastic actuator 12 is disposed at the periphery of the first hole 252 of the second insulating substrate 25, such that the conductive end 1242 of the actuating column 124 faces at least two switch contacts 232.

Referring to fig. 7, a dual function circuit assembly 3 according to a second preferred embodiment of the present invention is schematically depicted. Fig. 7 is a cross-sectional view of a dual-function circuit assembly 3 according to a second preferred embodiment of the present invention. The cross-section of FIG. 7 has the cross-sectional line defined as line A-A in FIG. 1. The dual-function circuit component 3 of the second preferred embodiment of the present invention can replace the dual-function circuit component 2 of the first preferred embodiment of the present invention and be mounted to the light-emitting key 1 shown in fig. 1. At this point, the end 1242 of the actuator post 124 need not be electrically conductive. For convenience of illustration, fig. 7 is a cross-sectional view of the dual-function circuit assembly 3 and the elastic actuator 12.

As shown in fig. 7, the dual-function circuit device 3 according to the second preferred embodiment of the present invention includes an insulating substrate 30, a first circuit 31, an insulating layer 32, a second circuit 33, an isolation layer 35, a polymer film 36, a third circuit 37, and at least one light emitting diode device 38. In the example of FIG. 7, only one LED element 38 is shown as representative. In one embodiment, the LED element 38 may be a packaged LED element or a bare die type LED element.

In one embodiment, the insulating substrate 30 may be a phenolic cotton paper-based substrate, a glass cloth-based substrate, a ceramic substrate (e.g., aluminum nitride, aluminum oxide, silicon carbide, etc.), a polymer film, or the like. If the insulating substrate 30 is a polymer film, the insulating substrate 30 and the polymer film 36 may be made of polyethylene terephthalate, polyimide, polymethyl methacrylate, or other similar commercially available polymer materials. If the insulating substrate 30 is a ceramic substrate, it can assist in dissipating heat generated during the operation of the led assembly 38.

The first circuit 31 is formed on the upper surface 302 of the insulating substrate 30. The first circuit 31 includes at least one pair of pins 312. The insulating layer 32 is formed to cover the first circuit 31 and the upper surface 302 of the insulating substrate 30, and to expose at least one pair of leads 312.

As also shown in fig. 7, in one embodiment, a first circuit region 304 is defined on the upper surface 302 of the insulating substrate 30. The first circuit 31 may include a first conductive paste layer 314 and a metal layer 316. A first conductive paste layer 314 is coated on the first wiring region 304. A metal layer 316 may be deposited on the first conductive paste layer 314 by an electroless plating process. The first conductive paste layer 314 may include conductive particles formed of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and combinations thereof. The first conductive paste layer 314 may be coated on the first circuit region 304 by a screen printing process (not limited thereto).

In one embodiment, the metal layer 316 may be a single Cu layer, a multi-Ag/Au layer/a multi-Ag/Au/Sn/Ni layer/a single Cu layer, a single Sn layer/a single Cu layer, a single Ag layer/a single Cu layer, a single Au layer/a single Cu layer, a single Ag layer/a single Ni layer/a single Cu layer, a single Au layer/a single Ni layer/a single Cu layer, a single Sn layer/a single Au layer/a single Ag layer/a single Ni layer/a single Cu layer, or the like.

In one embodiment, the insulating layer 32 may be formed by coating an ultraviolet curable resin on the first circuit 31 and the upper surface 302 of the insulating substrate 30 and then irradiating ultraviolet light to cure the resin.

The second circuit 33 is formed on the insulating layer 32. The second circuit 33 comprises at least one lower switching contact 332. The first adhesive layer 34a covers the second circuit 33 and the insulating layer 32, and exposes the at least one pair of leads 312 and the at least one lower switch contact 332.

In one embodiment, the insulating layer 32 has a second circuit region 322 defined thereon. The second circuit 33 may include a second conductive paste layer 334. A second conductive paste layer 334 is coated on the second circuit region 322. The second conductive paste layer 334 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The second conductive paste layer 334 may be coated on the second circuit region 322 by a screen printing process (not limited thereto).

The isolation layer 35 has a first hole 352 and at least one second hole 354. Each second hole 354 corresponds to one of the at least one pair of pins 312. The isolation layer 35 is attached to the insulating layer 32 by a first adhesive layer 34a (not limited thereto), such that at least one lower switch contact 332 is disposed in the first hole 352 and each pair of pins 312 is disposed in the corresponding second hole 354. The second adhesive layer 34b covers the isolation layer 35 and does not cover the first hole 352 and the at least one second hole 354. In fig. 7, only one second hole 354 is shown as a representative.

The polymer film 36 has at least one third hole 364. Each third hole 364 corresponds to one second hole 354. The third circuit 37 is formed on the lower surface 362 of the polymer film 36. The third circuit 37 includes at least one upper switch contact 372. The polymer film 36 is attached to the isolation layer 35 by the second adhesive layer 34b (not limited thereto) at the lower surface 362, and at least one upper switch contact 372 is disposed in the first through hole and aligned with at least one lower switch contact 332, and each third through hole 364 is aligned with its corresponding second through hole 354. In fig. 7, only one third hole 364 is shown as a representative.

In one embodiment, the first adhesive layer 34a and the second adhesive layer 34b are formed by coating a water gel, but not limited thereto.

In one embodiment, the polymer film 36 has a third circuit region 366 defined on the lower surface 362. The third circuit 37 may include a third conductive paste layer 374. A third conductive paste layer 374 is coated on the third line region 366. The third conductive paste layer 374 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. A third conductive paste layer 374 may be coated on the third circuit region 366 by a screen printing process (not limited thereto). In practical applications, the second circuit 33 and the third circuit 37 may have a jumper design.

Each led assembly 38 corresponds to one of the at least one pair of leads 312, a third hole 364 and a second hole 354, and each led assembly 38 includes a pair of leads 382. Each led assembly 38 is fixed in the corresponding third hole 364 and the corresponding second hole 354, and the pair of pins 382 and the corresponding pair of pins 312 are respectively soldered together.

Further, the transparent encapsulant 39 covers at least the at least one third hole 364 and the at least one led assembly 38. At least one light emitting diode assembly 26 is driven to emit light and shine towards the key cap 14.

The elastic actuator 12 is disposed on the polymer film 36 and aligned with the first hole 352, and the end 1242 of the actuating rod 124 faces the at least one upper switch contact 372 and the at least one lower switch contact 332. When the key cap 14 moves to the pressed position, the dome body 122 of the elastic actuator 12 deforms to cause the end 1242 of the actuating pillar 124 to press down, so that the at least one upper switch contact 372 contacts the at least one lower switch contact 332 to conduct with each other, thereby triggering the light-emitting key 1 of the present invention to be switched to the conducting state. When the key cap 14 is released to move to the non-depressed position, the dome body 122 of the resilient actuator 12 returns to its original shape to separate the at least one lower switch contact 332 from the at least one upper switch contact 372. The components in fig. 7 having the same reference numerals as those in fig. 2 have the same or similar structures and functions, and are not repeated herein.

The dual-function circuit assembly 3 of the second preferred embodiment of the present invention has the functions of a membrane switch and a light source circuit board, and the thickness thereof can be reduced to 270 μm to 350 μm. The light-emitting key 1 of the dual-function circuit assembly 3 according to the second preferred embodiment of the present invention can be used without a light guide plate.

Referring to fig. 8 to 11, a method for manufacturing a dual-function circuit device 3 according to a second preferred embodiment of the present invention as shown in fig. 7 is schematically illustrated in cross-sectional views. The cross-sections shown in FIGS. 8-11 have cross-sectional lines defined as line A-A in FIG. 1.

As shown in fig. 8, in the manufacturing method of the present invention, first, an insulating base material 30 is prepared.

In one embodiment, the insulating substrate 30 may be a phenolic cotton paper-based substrate, a glass cloth-based substrate, a ceramic substrate (e.g., aluminum nitride, aluminum oxide, silicon carbide, etc.), a polymer film, or the like. If the insulating substrate 30 is a polymer film, it can be a polymer film formed by polyethylene terephthalate, polyimide, polymethyl methacrylate, or other similar commercial polymer materials. If the insulating substrate 30 is a ceramic substrate, it can assist in dissipating heat generated during the operation of the led assembly 38.

Next, as also shown in fig. 8, the first circuit 31 is formed on the upper surface 302 of the insulating substrate 30. The first circuit 31 includes at least one pair of pins 312.

As also shown in fig. 8, in one embodiment, a first circuit region 304 is defined on the top surface 302 of the insulating substrate 30. The first circuit 31 may include a first conductive paste layer 314 and a metal layer 316. A first conductive paste layer 314 is coated on the first wiring region 304. A metal layer 316 may be deposited on the first conductive paste layer 314 by an electroless plating process. The first conductive paste layer 314 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The first conductive paste layer 314 may be coated on the first circuit region 304 by a screen printing process (not limited thereto).

Next, as shown in fig. 9, an insulating layer 32 is formed to cover the first circuit 31 and the upper surface 302 of the insulating substrate 30 and expose at least one pair of leads 312.

Next, as also shown in fig. 9, a second circuit 33 is formed on the insulating layer 32. The second circuit 33 comprises at least one lower switching contact 332.

Next, as shown in fig. 10, the second circuit 33 and the insulating layer 32 are covered with a first adhesive layer 34a, and the at least one pair of leads 312 and the at least one lower switch contact 332 are exposed.

Next, as also shown in fig. 10, an isolation layer 35 is prepared. The isolation layer 35 has a first hole 352 and at least one second hole 354. Each second hole 354 corresponds to one of the at least one pair of pins 312.

Next, as also shown in fig. 10, a polymer film 36 is prepared. The polymer film 36 has at least one third hole 364. Each third hole 364 corresponds to one second hole 354.

In one embodiment, the polymer film 36 may be a polymer film formed of polyethylene terephthalate, polyimide, polymethyl methacrylate, or other similar commercially available polymer materials.

Next, as shown in fig. 10, a third circuit 37 is formed on the lower surface 362 of the polymer film 36. The third circuit 37 includes at least one upper switch contact 372.

Next, as also shown in fig. 10, the second adhesive layer 34b is coated on the lower surface 362 of the polymer film 36, and at least one upper switch contact 372 is exposed.

In one embodiment, the first adhesive layer 34a and the second adhesive layer 34b can be formed by coating a water gel, but not limited thereto.

Next, as also shown in fig. 10, the isolation layer 35 is attached between the insulating layer 32 and the lower surface 362 of the polymer film 36 by the first adhesive layer 34a and the second adhesive layer 34b (not limited thereto), and the at least one upper switch contact 372 and the at least one lower switch contact 332 are disposed in the first hole 352, and each pair of pins 312 is disposed in the corresponding second hole 354.

Next, as shown in fig. 11, at least one light emitting diode assembly 38 is prepared. Each led assembly 38 corresponds to one of the at least one pair of leads 312, a third hole 364 and a second hole 354, and each led stem assembly 38 includes a pair of leads 382.

Finally, as also shown in fig. 11, each led module 38 is fixed in the corresponding third hole 364 and the corresponding second hole 354, and the pair of pins 382 and the corresponding pair of pins 312 are soldered together.

Further, as also shown in fig. 11, at least one third hole 364 and at least one led element 38 are covered by a transparent encapsulant 39, so as to complete the dual-function circuit element 3 shown in fig. 7. The elastic actuator 12 is disposed on the polymer film 36 and aligned with the first hole 352, and the end 1242 of the actuating rod 124 faces the at least one upper switch contact 372 and the at least one lower switch contact 332.

Referring to fig. 12, a dual function circuit assembly 4 according to a third preferred embodiment of the present invention is schematically illustrated. Fig. 12 is a cross-sectional view of a dual-function circuit assembly 4 according to a third preferred embodiment of the present invention. The cross-section of FIG. 12 is defined by the section line A-A in FIG. 1. The dual-function circuit component 4 of the third preferred embodiment of the present invention can replace the dual-function circuit component 2 of the first preferred embodiment of the present invention and be mounted to the light-emitting key 1 shown in fig. 1. At this point, at least the end 1242 of the actuating post 124 is conductive. For convenience of illustration, only the dual function circuit element 4 and the elastic actuator 12 are shown in a cross-sectional view in fig. 12.

As shown in fig. 12, the dual-function circuit assembly 4 of the third preferred embodiment of the present invention includes a first insulating substrate 40, a first circuit 41, an insulating layer 42, a second circuit 43, a second insulating substrate 45 and at least one light emitting diode assembly 46. In the example shown in fig. 12, only one led element 46 is shown as a representative. In one embodiment, the LED element 46 may be a packaged LED element or a bare die type LED element.

In one embodiment, the first insulating substrate 40 and the second insulating substrate 45 may be a phenolic cotton paper-based substrate, a glass cloth-based substrate, a ceramic substrate (e.g., aluminum nitride, aluminum oxide, silicon carbide, etc.), a polymer film, etc. If the first insulating substrate 40 and the second insulating substrate 45 are polymer films, they may be polymer films formed of polyethylene terephthalate, polyimide, polymethyl methacrylate, or other similar commercially available polymer materials. If the first insulating substrate 40 is a ceramic substrate, it can assist in dissipating heat generated during the operation of the led assembly 46.

The first circuit 41 is formed on the lower surface 402 of the first insulating substrate 40. The first circuit 41 includes at least one pair of pins 412. The insulating layer 42 is formed to cover the first circuit 41 and the lower surface 402 of the first insulating substrate 40, and expose at least one pair of leads 412.

As also shown in fig. 12, in one embodiment, the lower surface 402 of the first insulating substrate 40 defines a first circuit region 404. The first circuit 41 may include a first conductive paste layer 414 and a metal layer 416. A first conductive paste layer 414 is coated on the first circuit region 404. A metal layer 416 may be deposited on the first conductive paste layer 414 by an electroless plating process. The first conductive paste layer 414 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The first conductive paste layer 414 may be coated on the first circuit region 404 by a screen printing process (not limited thereto).

In one embodiment, the metal layer 416 may have a single Cu layer, multiple Ag/Au layers/multiple Ag/Au/Sn/Ni layers/single Cu layer, single Sn layer/single Cu layer, single Ag layer/single Cu layer, single Au layer/single Cu layer, single Ag layer/single Ni layer/single Cu layer, single Au layer/single Ni layer/single Cu layer, single Sn layer/single Au layer/single Ag layer/single Ni layer/single Cu layer, etc.

In one embodiment, the insulating layer 42 may be formed by coating an ultraviolet curing resin on the first circuit 41 and the lower surface 402 of the first insulating substrate 40 and then irradiating ultraviolet light to cure the resin.

The second circuit 43 is formed on the upper surface 406 of the first insulating substrate 40. The second circuit 43 includes at least two switch contacts 432.

In one embodiment, the second circuit region 408 is defined on the upper surface 406 of the first insulating substrate 40. The second circuit 43 may include a second conductive paste layer 434. A second conductive paste layer 434 is coated on the second circuit region 408. The second conductive paste layer 434 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. A second conductive paste layer 434 may be coated on the second circuit region 408 by a screen printing process (not limited thereto).

The adhesive layer 44 covers the second circuit 43 and the upper surface 406 of the first insulating substrate 40, and exposes at least two switch contacts 432.

In one embodiment, the adhesive layer 44 is formed by coating a water gel, but not limited thereto.

The second insulating substrate 45 has a broken hole 452. The second insulating substrate 45 is attached to the upper surface 406 of the first insulating substrate 40 by an adhesive layer 44 (not limited thereto), and at least two switch contacts 432 are disposed in the holes 452 of the second insulating substrate 45.

Each led assembly 46 corresponds to one of the at least one pair of leads 412, and each led assembly 46 includes a pair of leads 462. The pair of pins 462 of each led assembly 46 and the corresponding pair of pins 412 are soldered together.

Further, a transparent encapsulant 47 covers at least one of the led elements 46. In practical applications, each LED element 46 may be a side-emitting LED element. The light-emitting key 1 of the dual-function circuit assembly 4 according to the third preferred embodiment of the present invention can further be provided with a light guide plate for guiding the light emitted from the at least one led assembly 46 to illuminate the key cap 14.

The elastic actuator 12 is disposed at the periphery of the through hole 452 of the second insulating substrate 45, such that the end 1242 of the actuating column 124 faces at least two switch contacts 432. When the key cap 14 moves to the pressing position, the dome body 122 of the elastic actuator 12 deforms, so that the conductive end 1242 of the actuating column 124 contacts at least two switch contacts 432, and the at least two switch contacts 432 are conducted with each other, thereby triggering the light-emitting key 1 of the present invention to be converted into the conducting state. When the key cap 14 is released and moved to the non-depressed position, the dome 122 of the elastic actuator 12 returns to its original shape to separate the conductive end 1242 of the actuating post 124 from the at least two switch contacts 432. The components in fig. 12 having the same reference numerals as those in fig. 2 have the same or similar structures and functions, and are not repeated herein.

The dual-function circuit assembly 4 according to the third preferred embodiment of the present invention has the functions of a membrane switch and a light source circuit board, and the thickness thereof can be reduced to 270 μm to 350 μm.

Referring to fig. 13 to 16, a method for manufacturing the dual-function circuit device 4 of the third preferred embodiment shown in fig. 12 is schematically illustrated in cross-sectional views. The cross-sectional lines of the cross-sections shown in FIGS. 13-16 are defined as the lines A-A in FIG. 1.

As shown in fig. 13, in the manufacturing method of the present invention, first, a first insulating substrate 40 is prepared.

In one embodiment, the first insulating substrate 40 may be a phenolic cotton paper-based substrate, a glass cloth-based substrate, a ceramic substrate (e.g., aluminum nitride, aluminum oxide, silicon carbide, etc.), a polymer film, or the like. If the first insulating substrate 40 is a polymer film, it can be formed by polyethylene terephthalate, polyimide, polymethyl methacrylate or other similar commercial polymer materials. If the first insulating substrate 40 is a ceramic substrate, it can assist in dissipating heat generated during the operation of the led assembly 46.

Next, as also shown in fig. 13, the first circuit 41 is formed on the lower surface 402 of the first insulating substrate 40. The first circuit 41 includes at least one pair of pins 412.

As also shown in fig. 13, in one embodiment, a first circuit region 404 is defined on the lower surface 402 of the first insulating substrate 40. The first circuit 41 may include a first conductive paste layer 414 and a metal layer 416. A first conductive paste layer 414 is coated on the first circuit region 404. A metal layer 416 may be deposited on the first conductive paste layer 414 by an electroless plating process. The first conductive paste layer 414 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The first conductive paste layer 414 may be coated on the first circuit region 404 by a screen printing process (not limited thereto).

Next, as also shown in fig. 13, an insulating layer 42 is formed to cover the first circuit 41 and the lower surface 402 of the first insulating substrate 40, and to expose at least one pair of leads 412.

In one embodiment, the insulating layer 42 may be formed by coating an ultraviolet curing resin on the first circuit 41 and the upper surface 302 of the first insulating substrate 40, and then irradiating ultraviolet light to cure the resin.

Next, as shown in fig. 14, a second circuit 43 is formed on the upper surface 406 of the first insulating substrate 40. The second circuit 43 includes at least two switch contacts 432.

Next, as shown in fig. 15, the second circuit 43 and the upper surface 406 of the first insulating substrate 40 are covered by the adhesive layer 44, and at least two switch contacts 432 are exposed.

In one embodiment, the adhesive layer 44 may be formed by coating a water gel, but not limited thereto.

Next, as also shown in fig. 15, a second insulating substrate 45 is prepared. The second insulating substrate 45 has a broken hole 452.

In one embodiment, the second insulating substrate 45 may be a phenolic cotton paper-based substrate, a glass cloth-based substrate, a ceramic substrate (e.g., aluminum nitride, aluminum oxide, silicon carbide, etc.), a polymer film, or the like. If the second insulating substrate 45 is a polymer film, it can be a polymer film formed by polyethylene terephthalate, polyimide, polymethyl methacrylate, or other similar commercial polymer materials.

Next, as also shown in fig. 15, the second insulating substrate 45 is attached to the upper surface 406 of the first insulating substrate 40 by an adhesive layer 44 (not limited thereto), and at least two switch contacts 432 are disposed in the holes 452.

Next, as shown in fig. 16, at least one light emitting diode unit 46 is prepared. Each led element 46 corresponds to one of the at least one pair of leads 412, and each led element 46 includes a pair of leads 462.

Finally, as also shown in fig. 16, the pair of leads 462 of each led assembly 46 and the corresponding pair of leads 412 are soldered together.

Further, as also shown in fig. 16, at least one led element 46 is covered by a transparent encapsulant 47, so as to complete the dual-function circuit element 4 shown in fig. 12. The elastic actuator 12 is disposed at the periphery of the through hole 452 of the second insulating substrate 45, and the conductive end 1242 of the actuating column 124 faces at least two switch contacts 432.

Referring to fig. 17, a dual function circuit assembly 5 according to a fourth preferred embodiment of the present invention is schematically illustrated. Fig. 17 is a cross-sectional view of a dual-function circuit assembly 5 according to a fourth preferred embodiment of the present invention. The cross-section of FIG. 17 has the cross-sectional line defined as line A-A in FIG. 1. The dual-function circuit module 5 of the fourth preferred embodiment of the present invention can replace the dual-function circuit module 2 of the first preferred embodiment of the present invention and be mounted to the light-emitting key 1 shown in fig. 1. At this point, the end 1242 of the actuator post 124 need not be conductive. For convenience of illustration, fig. 17 is a cross-sectional view of the dual-function circuit device 5 and the elastic actuator 12.

As shown in fig. 17, the dual-function circuit device 5 of the fourth preferred embodiment of the present invention includes an insulating substrate 50, a first circuit 51, an insulating layer 52, a second circuit 53, an isolation layer 55, a polymer film 56, a third circuit 57, and at least one light emitting diode device 58. In the example shown in fig. 17, only one led device 58 is shown as a representative. In one embodiment, the LED assembly 58 may be a packaged LED assembly or a bare die type LED assembly.

In one embodiment, the insulating substrate 50 may be a phenolic cotton paper-based substrate, a glass cloth-based substrate, a ceramic substrate (e.g., aluminum nitride, aluminum oxide, silicon carbide, etc.), a polymer film, or the like. If the insulating substrate 50 is a polymer film, the insulating substrate 50 and the polymer film 56 can be polymer films formed of polyethylene terephthalate, polyimide, polymethyl methacrylate, or other similar commercially available polymer materials. If the insulating substrate 50 is a ceramic substrate, it can assist in dissipating heat generated during the operation of the led assembly 58.

The first circuit 51 is formed on the first lower surface 502 of the insulating substrate 50. The first circuit 51 includes at least one pair of pins 512. The insulating layer 52 is formed to cover the first circuit 51 and the first lower surface 502 of the insulating substrate 50, and expose at least one pair of leads 512.

As also shown in fig. 17, in one embodiment, a first circuit region 504 is defined on the first lower surface 502 of the insulating substrate 50. The first circuit 51 may include a first conductive paste layer 514 and a metal layer 516. A first conductive paste layer 514 is coated on the first wiring region 504. A metal layer 516 may be deposited on the first conductive paste layer 514 by an electroless plating process. The first conductive paste layer 514 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The first conductive paste layer 514 may be coated on the first circuit region 504 by a screen printing process (not limited thereto).

In one embodiment, the metal layer 516 may be a single Cu layer, a multi-Ag/Au layer/multi-Ag/Au/Sn/Ni layer/single Cu layer, a single Sn layer/single Cu layer, a single Ag layer/single Cu layer, a single Au layer/single Cu layer, a single Ag layer/single Ni layer/single Cu layer, a single Au layer/single Ni layer/single Cu layer, a single Sn layer/single Au layer/single Ag layer/single Ni layer/single Cu layer, or the like.

In one embodiment, the insulating layer 52 can be formed by coating the first circuit 51 and the first lower surface 502 of the insulating substrate 50 with an ultraviolet curing resin and then irradiating ultraviolet light to cure the resin.

The second circuit 53 is formed on the upper surface 506 of the insulating substrate 50. The second circuit 53 comprises at least one lower switching contact 532. The first adhesive layer 54a is coated on the second circuit 53 and the upper surface 506 of the insulating substrate 50, and exposes at least one lower switch contact 532.

In one embodiment, the insulating substrate 50 has a second circuit area 508 defined on the upper surface 506. The second circuit 53 may include a second conductive paste layer 534. The second conductive paste layer 534 is coated on the second circuit region 508. The second conductive paste layer 534 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The second conductive paste layer 534 can be coated on the second circuit region 508 by a screen printing process (not limited thereto).

The isolation layer 55 has a via 552. The isolation layer 55 is attached to the upper surface 506 of the insulating substrate 50 by a first adhesive layer 54a (not limited thereto), and the at least one lower switch contact 532 is disposed in the via 552 of the isolation layer 55. The second adhesive layer 54b covers the isolation layer 55 and does not cover the broken hole 552 of the isolation layer 55.

In one embodiment, the first adhesive layer 54a and the second adhesive layer 54b are formed by coating a water gel, but not limited thereto.

The third circuit 57 is formed on the second lower surface 562 of the polymer film 56. The third circuit 57 includes at least one upper switch contact 572. The polymer film 56 is attached to the isolation layer 55 through the second adhesive layer 54b (not limited thereto) and the second lower surface 562, such that the at least one upper switch contact 572 is disposed in the hole 552 of the isolation layer 55 and aligned with the at least one lower switch contact 532.

In one embodiment, the second bottom surface 562 of the polymer film 56 defines a third circuit region 564. The third circuit 57 may include a third conductive paste layer 574. A third conductive paste layer 574 is coated on the third wiring region 564. The third conductive paste layer 574 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The third conductive paste layer 574 may be coated on the third circuit region 564 by a screen printing process (not limited thereto). In practical applications, the second circuit 53 and the third circuit 57 may have a jumper design.

Each led assembly 58 corresponds to one of the at least one pair of leads 512, and each led assembly 58 includes a pair of leads 582. The pair of pins 582 of each led module 58 and the corresponding pair of pins 512 are soldered together.

Further, a transparent encapsulant 59 covers at least one of the led assemblies 58. In practical applications, each LED element 56 is a side-emitting LED element. The light-emitting key 1 of the dual-function circuit assembly 5 according to the fourth preferred embodiment of the present invention can further be provided with a light guide plate for guiding the light emitted from the at least light-emitting diode assembly 56 to illuminate the key cap 14.

The elastic actuator 12 is disposed on the polymer film 56 and aligned with the hole 552 of the isolation layer 55, and the end 1242 of the actuating rod 124 faces the at least one upper switch contact 572 and the at least one lower switch contact 532. When the key cap 14 moves to the pressed position, the dome body 122 of the elastic actuator 12 deforms to cause the end 1242 of the actuating pillar 124 to press down, so that the at least one upper switch contact 572 contacts the at least one lower switch contact 532 to conduct with each other, thereby triggering the light-emitting key 1 of the present invention to be switched to the conducting state. When the key cap 14 is released to move to the non-depressed position, the dome body 122 of the elastic actuator 12 returns to its original shape to separate the end 1242 of the actuating post 124 from the at least one upper switch contact 572, so that the at least one upper switch contact 572 and the at least one lower switch contact 532, which are originally in contact with each other, are separated. The components in fig. 17 having the same reference numerals as those in fig. 2 have the same or similar structures and functions, and are not repeated herein.

The dual-function circuit assembly 5 of the fourth preferred embodiment of the present invention has the functions of a membrane switch and a light source circuit board, and the thickness thereof can be reduced to 270 μm to 350 μm.

Referring to fig. 18 to 21, a method for manufacturing the dual-function circuit device 5 of the fourth preferred embodiment shown in fig. 17 is schematically illustrated in cross-sectional views. The cross-sectional lines of the cross-sections shown in FIGS. 18-21 are defined as the lines A-A in FIG. 1.

As shown in fig. 18, in the manufacturing method of the present invention, first, an insulating base material 50 is prepared.

In one embodiment, the insulating substrate 50 may be a phenolic cotton paper-based substrate, a glass cloth-based substrate, a ceramic substrate (e.g., aluminum nitride, aluminum oxide, silicon carbide, etc.), a polymer film, or the like. If the insulating substrate 50 is a polymer film, it can be a polymer film formed by polyethylene terephthalate, polyimide, polymethyl methacrylate, or other similar commercial polymer materials. If the insulating substrate 50 is a ceramic substrate, it can assist in dissipating heat generated during the operation of the led assembly 58.

Next, as also shown in fig. 18, the first circuit 51 is formed on the first lower surface 502 of the insulating substrate 50. The first circuit 51 includes at least one pair of pins 512.

As also shown in fig. 18, in one embodiment, a first circuit region 504 is defined on the first lower surface 502 of the insulating substrate 50. The first circuit 51 may include a first conductive paste layer 514 and a metal layer 516. A first conductive paste layer 514 is coated on the first wiring region 504. A metal layer 516 may be deposited on the first conductive paste layer 514 by an electroless plating process. The first conductive paste layer 514 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The first conductive paste layer 514 may be coated on the first circuit region 504 by a screen printing process (not limited thereto).

Next, as also shown in fig. 18, an insulating layer 52 is formed to cover the first circuit 51 and the first lower surface 502 of the insulating substrate 50 and expose at least one pair of leads 512.

Next, as shown in fig. 19, a second circuit 53 is formed on the upper surface 506 of the insulating base material 50. The second circuit 53 comprises at least one lower switching contact 532.

Next, as shown in fig. 20, the second circuit 53 and the upper surface 506 of the insulating substrate 50 are covered with a first adhesive layer 54a, and at least one lower switch contact 532 is exposed.

Next, as also shown in fig. 20, a spacer layer 55 is prepared. The isolation layer 55 has a via 552.

Next, as shown in fig. 20, a polymer film 56 is prepared.

In one embodiment, the polymer film 56 may be a polymer film formed of polyethylene terephthalate, polyimide, polymethyl methacrylate, or other similar commercially available polymer materials.

Next, as also shown in fig. 20, a third circuit 57 is formed on the second lower surface 562 of the polymer film 56. The third circuit 57 includes at least one upper switch contact 572.

Next, as also shown in fig. 20, a second adhesive layer 54b is coated on the second bottom surface 562 of the polymer film 56, and at least one upper switch contact 572 is exposed.

In one embodiment, the first adhesive layer 54a and the second adhesive layer 54b can be formed by coating a water gel, but not limited thereto.

Next, as also shown in fig. 20, the isolation layer 55 is attached between the upper surface 506 of the insulating substrate 50 and the second lower surface 562 of the polymer film 56 by the first adhesion layer 54a and the second adhesion layer 54b (not limited thereto), and the at least one upper switch contact 572 and the at least one lower switch contact 532 are disposed in the via 552.

Next, as shown in fig. 21, at least one light emitting diode assembly 58 is prepared. Each led assembly 58 corresponds to one of the at least one pair of leads 512, and each led assembly 58 includes a pair of leads 582.

Finally, as also shown in fig. 21, the pair of pins 582 of each led assembly 58 and the corresponding pair of pins 512 are soldered together.

Further, as also shown in fig. 21, at least one light emitting diode assembly 58 is covered by a transparent encapsulant 59, thereby completing the dual-function circuit assembly 5 shown in fig. 17. The elastic actuator 12 is disposed on the polymer film 56 and aligned with the hole 552, and the end 1242 of the actuating rod 124 faces the at least one upper switch contact 572 and the at least one lower switch contact 532.

Referring to fig. 22, a dual function circuit assembly 6 according to a fifth preferred embodiment of the present invention is schematically illustrated. Fig. 22 is a cross-sectional view of a dual-function circuit assembly 6 according to a fifth preferred embodiment of the present invention. The section line of FIG. 22 is defined as the line A-A in FIG. 1. The dual-function circuit assembly 6 of the fifth preferred embodiment of the present invention can replace the dual-function circuit assembly 2 of the first preferred embodiment of the present invention and be mounted to the light-emitting key 1 shown in fig. 1. At this point, at least the end 1242 of the actuating post 124 is conductive. For convenience of illustration, only a cross-sectional view of the dual-function circuit assembly 6 and the elastic actuator 12 is shown in fig. 22.

As shown in fig. 22, the dual-function circuit assembly 6 according to the fifth preferred embodiment of the present invention includes a metal substrate 60, a first insulating layer 61a, a first circuit 62, a second insulating layer 61b, a second circuit 63, an insulating substrate 65 and at least one light emitting diode assembly 66. In the example shown in FIG. 22, only one LED element 66 is shown as a representative. In one embodiment, the LED assembly 66 may be a packaged LED assembly or a bare die type LED assembly.

In one embodiment, the metal substrate 60 may be a stainless steel sheet, an aluminum sheet, or the like. The metal substrate 60 serves as a bottom plate of the prior art light-emitting key.

In one embodiment, the insulating substrate 65 may be a phenolic cotton paper-based substrate, a glass cloth-based substrate, a ceramic substrate (e.g., aluminum nitride, aluminum oxide, silicon carbide, etc.), a polymer film, or the like. If the insulating substrate 65 is a polymer film, it may be a polymer film formed of polyethylene terephthalate, polyimide, polymethyl methacrylate, or other similar commercially available polymer materials.

The first insulating layer 61a is formed to cover the upper surface 602 of the metal base 60. The first circuit 62 is formed on the first insulating layer 61 a. The first circuit 62 includes at least a pair of pins 622.

In one embodiment, the first insulating layer 61a may be formed by performing an electrical insulating process on the upper surface 602 of the metal substrate 60, or may be formed by coating an ultraviolet curable resin on the upper surface 602 of the metal substrate 60 and then irradiating ultraviolet light to cure the resin.

As also shown in fig. 22, in one embodiment, a first circuit region 61a2 is defined on the first insulating layer 61 a. The first circuit 62 may include a first conductive paste layer 624 and a metal layer 626. The first conductive paste layer 624 is coated on the first wiring region 61a 2. A metal layer 626 may be deposited on the first conductive paste layer 624 by an electroless plating process. The first conductive paste layer 624 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The first conductive paste layer 624 may be coated on the first circuit region 61a2 by a screen printing process (not limited thereto).

In one embodiment, the metal layer 626 may have a single Cu layer, a multi-Ag/Au layer/multi-Ag/Au/Sn/Ni layer/single Cu layer, a single Sn layer/single Cu layer, a single Ag layer/single Cu layer, a single Au layer/single Cu layer, a single Ag layer/single Ni layer/single Cu layer, a single Au layer/single Ni layer/single Cu layer, a single Sn layer/single Au layer/single Ag layer/single Ni layer/single Cu layer, or the like.

The second insulating layer 61b is formed to cover the first circuit 62 and the first insulating layer 61a and expose at least one pair of leads 622. The second circuit 63 is formed on the second insulating layer 61 b. The second circuit 63 includes at least two switch contacts 632.

In one embodiment, the second insulating layer 61b can be formed by coating an ultraviolet curing resin on the first circuit 62 and the first insulating layer 61a and then irradiating ultraviolet light to cure the resin.

In one embodiment, the second insulating layer 61b has a second circuit region 61b2 defined thereon. The second circuit 63 may include a second conductive paste layer 634. The second conductive paste layer 634 is coated on the second line region 61b 2. The second conductive paste layer 634 may contain conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The second conductive paste layer 634 may be coated on the second circuit region 61b2 by a screen printing process (not limited thereto).

The adhesive layer 64 covers the second circuit 63 and the second insulating layer 61b, and exposes the at least one pair of leads 622 and the at least two switch contacts 632.

In one embodiment, the adhesive layer 64 may be formed by coating a water gel, but not limited thereto.

The insulating substrate 65 has a first break 652 and at least one second break 654. Each second hole corresponds to one of the leads 622 in the at least one pair of leads 622. In fig. 22, only one second hole 654 is shown as a representative.

The insulating substrate 65 is attached to the second insulating layer 61b by an adhesive layer 64 (not limited thereto), and at least two switch contacts 632 are disposed in the first holes 652 of the insulating substrate 65, and each pair of leads 622 is disposed in the corresponding second hole 654. Each led assembly 66 corresponds to one of the leads 622 and the second hole 654, and each led assembly 66 includes a pair of leads 662. Each led module 66 is fixed in the corresponding second hole 654, and the pair of pins 662 are respectively soldered to the pair of pins 622.

Further, the transparent encapsulant 67 at least covers the at least one second hole 654 and the at least one led module 66. At least one light emitting diode assembly 66 is driven to emit light and shine toward the keycap 14.

The elastic actuator 12 is disposed at the periphery of the first hole 652 of the insulating substrate 65, and the conductive end 1242 of the actuating column 124 faces at least two switch contacts 632. When the key cap 14 moves to the pressing position, the dome body 122 of the elastic actuator 12 deforms, so that the conductive end 1242 of the actuating column 124 contacts at least two switch contacts 632 to make the at least two switch contacts 632 conduct with each other, thereby triggering the light-emitting key 1 of the present invention to be switched to the conducting state. When the key cap 14 is released and moved to the non-depressed position, the dome 122 of the elastic actuator 12 returns to its original shape to separate the conductive end 1242 of the actuating post 124 from the at least two switch contacts 632. In fig. 22, components having the same numbers as those in fig. 2 have the same or similar structures and functions, and are not described herein again.

The dual-function circuit assembly 6 of the fifth preferred embodiment of the present invention has the functions of a membrane switch and a light source circuit board, and the thickness thereof can be reduced to 270 μm to 350 μm. The light-emitting key 1 of the dual-function circuit assembly 6 according to the fifth preferred embodiment of the present invention can be used without a light guide plate.

Referring to fig. 23 to 26, a method for manufacturing the dual-function circuit device 6 of the fifth preferred embodiment shown in fig. 22 according to the present invention is schematically illustrated in cross-sectional views. The cross-sectional lines of the cross-sections shown in FIGS. 23-26 are defined as the lines A-A in FIG. 1.

As shown in fig. 23, in the manufacturing method of the present invention, first, a metal base material 60 is prepared.

Next, as also shown in fig. 23, a first insulating layer 61a is formed to cover the upper surface 602 of the metal base 60.

Next, as shown in fig. 23, a first circuit 62 is formed over the first insulating layer 61 a. The first circuit 62 includes at least a pair of pins 622.

As also shown in fig. 23, in one embodiment, a first circuit region 61a2 is defined on the first insulating layer 61 a. The first circuit 62 may include a first conductive paste layer 624 and a metal layer 626. The first conductive paste layer 624 is coated on the first wiring region 61a 2. A metal layer 626 may be deposited on the first conductive paste layer 624 by an electroless plating process. The first conductive paste layer 624 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The first conductive paste layer 624 may be coated on the first circuit region 61a2 by a screen printing process (not limited thereto).

Next, as shown in fig. 24, a second insulating layer 61b is formed to cover the first circuit 62 and the first insulating layer 61a, and to expose at least one pair of leads 622.

Next, as shown in fig. 24, a second circuit 63 is formed over the second insulating layer 61 b. The second circuit 63 includes at least two switch contacts 632.

As also shown in fig. 24, in one embodiment, a second circuit region 61b2 is defined on the second insulating layer 61 b. The second circuit 63 may include a second conductive paste layer 634. The second conductive paste layer 634 is coated on the second line region 61b 2. The second conductive paste layer 634 may contain conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The second conductive paste layer 634 may be coated on the second circuit region 61b2 by a screen printing process (not limited thereto).

Next, as shown in fig. 25, the second circuit 63 and the second insulating layer 61b are covered by the adhesive layer 64, and the at least one pair of leads 622 and the at least two switch contacts 632 are exposed.

Next, as also shown in fig. 25, an insulating base material 65 is prepared. The insulating substrate 65 has a first break 652 and at least one second break 654. Each second hole 654 corresponds to one of the leads 622.

Next, as also shown in fig. 25, the insulating substrate 65 is attached to the second insulating layer 61b by the adhesive layer 64 (not limited thereto), and at least two switch contacts 632 are disposed in the first holes 652, and each pair of leads 622 is disposed in the corresponding second hole 654.

Next, as shown in fig. 26, at least one light emitting diode assembly 66 is prepared. Each led assembly 66 corresponds to one of the leads 622 and the second hole 654, and each led assembly 66 includes a pair of leads 662.

Finally, as also shown in fig. 26, each led assembly 66 is fixed in its corresponding second hole 654, and its pair of pins 662 and its corresponding pair of pins 622 are soldered together, respectively.

Further, as also shown in fig. 26, at least one second hole 654 and at least one led assembly 66 are covered by a transparent encapsulant 67. The elastic actuator 12 is disposed at the periphery of the first hole 652 of the polymer film 65, and makes the conductive end 1242 of the actuating column 124 face the at least two switch contacts 632.

Referring to fig. 27, a dual function circuit assembly 7 according to a sixth preferred embodiment of the present invention is schematically illustrated. Fig. 27 is a cross-sectional view of a dual-function circuit assembly 7 according to a sixth preferred embodiment of the present invention. The cross-section of FIG. 27 has the cross-sectional line defined as line A-A in FIG. 1. The dual-function circuit component 7 of the sixth preferred embodiment of the present invention can replace the dual-function circuit component 2 of the first preferred embodiment of the present invention and be mounted to the light-emitting key 1 shown in fig. 1. At this point, the end 1242 of the actuator post 124 need not be conductive. For convenience of illustration, fig. 27 is a cross-sectional view of the dual-function circuit assembly 7 and the elastic actuator 12.

As shown in fig. 27, the dual-function circuit device 7 of the sixth preferred embodiment of the invention includes a metal substrate 70, a first insulating layer 71a, a first circuit 72, a second insulating layer 71b, a second circuit 73, an isolation layer 75, a polymer film 76, a third circuit 77, and at least one light emitting diode device 78. In the example shown in fig. 24, only one led device 78 is shown as a representative. In one embodiment, the LED device 78 may be a packaged LED device 78 or a bare die type LED device 78.

In one embodiment, the metal substrate 70 may be a stainless steel sheet, an aluminum sheet, or the like. The metal substrate 70 serves as a bottom plate of the prior art light-emitting key.

In one embodiment, the polymer film 76 may be a polymer film formed of polyethylene terephthalate, polyimide, polymethyl methacrylate, or other similar commercially available polymer materials.

The first insulating layer 71a is formed to cover the upper surface 702 of the metal substrate 70. The first circuit 72 is formed on the first insulating layer 71 a. The first circuit 72 includes at least a pair of pins 722.

In one embodiment, the first insulating layer 71a may be formed by performing an electrical insulating process on the upper surface 702 of the metal substrate 70, or may be formed by coating an ultraviolet curable resin on the upper surface 702 of the metal substrate 70 and then irradiating ultraviolet light to cure the resin.

As also shown in fig. 27, in one embodiment, a first line region 71a2 is defined on the first insulating layer 71 a. The first circuit 72 may include a first conductive paste layer 724 and a metal layer 726. The first conductive paste layer 724 is coated on the first wiring region 71a 2. A metal layer 726 may be deposited on the first conductive paste layer 724 by an electroless plating process. The first conductive paste layer 724 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The first conductive paste layer 724 may be coated on the first circuit region 71a2 by a screen printing process (not limited thereto).

In one embodiment, the metal layer 726 may have a single Cu layer, multiple Ag/Au layers, multiple Ag/Au/Sn/Ni layers, single Cu layer, single Sn layer, single Cu layer, single Ag layer, single Cu layer, single Au layer, single Cu layer, single Ag layer, single Ni layer, single Cu layer, single Au layer, single Ni layer, single Cu layer, single Sn layer, single Au layer, single Ag layer, single Ni layer, single Cu layer, etc.

The second insulating layer 71b is formed to cover the first circuit 72 and the first insulating layer 71a and to expose at least one pair of leads 722. The second circuit 73 is formed on the second insulating layer 71 b. The second circuit 73 includes at least one lower switch contact 732. The first adhesive layer 74a covers the second circuit 73 and the second insulating layer 71b, and exposes the at least one pair of leads 722 and the at least one lower switch contact 732.

In one embodiment, the second insulating layer 71b can be formed by first coating an ultraviolet curing resin on the first circuit 72 and the first insulating layer 71a and then irradiating ultraviolet light to cure the resin.

As also shown in fig. 27, in one embodiment, a second line region 71b2 is defined on the second insulating layer 71 b. The second circuit 73 may include a second conductive paste layer 734. A second conductive paste layer 734 is coated on the second line region 71b 2. The second conductive paste layer 734 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The second conductive paste layer 734 may be coated on the second circuit region 71b2 by a screen printing process (not limited thereto).

The isolation layer 75 has a first break 752 and at least one second break 754. Each second hole 754 corresponds to one of the pins 722 in the at least one pair of pins 722. The isolation layer 75 is attached to the second insulating layer 71b by a first adhesive layer 74 (not limited thereto), such that at least one lower switch contact 732 is disposed in the first hole 752 of the isolation layer 75, and each pair of leads 722 is disposed in the corresponding second hole 754. The second adhesive layer 74b covers the isolation layer 75 and does not cover the first hole 752 and the at least one second hole 754. In fig. 27, only one second hole 754 is shown as a representative.

The polymer film 76 has at least one third perforation 764. Each third perforation 764 corresponds to one second perforation 754. Third circuit 77 is formed on lower surface 762 of polymer film 76. The third circuit includes at least one upper switch contact 772. The polymer film 76 is attached to the isolation layer 75 by the second adhesive layer 74b (not limited thereto) with a lower surface 762, and at least one upper switch contact 772 is disposed in the first hole 752 of the isolation layer 75 and aligned with at least one lower switch contact 732, and each third hole 764 is aligned with its corresponding second hole 754. In fig. 27, only one third hole 764 is shown as a representative.

In one embodiment, the first adhesive layer 74a and the second adhesive layer 74b are formed by coating a water gel, but not limited thereto.

In one embodiment, third circuit region 766 is defined on lower surface 762 of polymer film 76. The third circuit 77 may include a third conductive paste layer 774. A third conductive paste layer 774 is coated on the third wiring region 766. The third conductive paste layer 774 may contain conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The third conductive paste layer 774 may be coated on the third circuit region 766 by a screen printing process (not limited thereto). In practical applications, the second circuit 33 and the third circuit 77 may have a jumper design.

Each led assembly 78 corresponds to one of the pair of leads 722, the third hole 764 and the second hole 754, and each led assembly 78 includes a pair of pins 782, each led assembly 78 is fixed in the corresponding third hole 764 and the corresponding second hole 754, and the pair of pins 782 and the corresponding pair of leads 722 are respectively soldered together.

Further, the transparent encapsulant 79 at least covers the at least one third hole 764 and the at least one led assembly 78. At least one light emitting diode assembly 76 is driven to emit light and shine toward the keycap 14.

The elastic actuator 12 is disposed on the polymer film 76 and aligned with the first hole 752 of the isolation layer 75, and the end 1242 of the actuating rod 124 faces the at least one upper switch contact 772 and the at least one lower switch contact 732. When the key cap 14 moves to the pressed position, the dome body 122 of the elastic actuator 12 deforms to press down the end 1242 of the actuating column 124, so that at least one upper switch contact 772 contacts at least one lower switch contact 732 to conduct with each other, thereby triggering the light-emitting key 1 of the present invention to be switched to the conducting state. When the key cap 14 is released to move to the non-depressed position, the dome body 122 of the elastic actuator 12 returns to its original shape to separate the end 1242 of the actuating post 124 from the at least one upper switch contact 772, thereby separating the at least one upper switch contact 772 and the at least one lower switch contact 732 that are originally in contact with each other. In fig. 27, components having the same reference numerals as those in fig. 2 have the same or similar structures and functions, and are not described herein again.

The dual-function circuit assembly 7 of the sixth preferred embodiment of the present invention has the functions of a membrane switch and a light source circuit board, and the thickness thereof can be reduced to 270 μm to 350 μm. The light-emitting key 1 of the dual-function circuit assembly 7 according to the sixth preferred embodiment of the present invention can be free of a light guide plate.

Referring to fig. 28 to 31, a method for manufacturing the dual-function circuit device 7 of the sixth preferred embodiment shown in fig. 27 according to the present invention is schematically illustrated in cross-sectional views. The cross-sectional lines of the cross-sections shown in FIGS. 28-31 are defined as the lines A-A in FIG. 1.

As shown in fig. 28, in the manufacturing method of the present invention, first, a metal base material 70 is prepared.

Next, as also shown in fig. 28, a first insulating layer 71a is formed to cover the upper surface 702 of the metal substrate 70.

Next, as shown in fig. 28, a first circuit 72 is formed over the first insulating layer 71 a. The first circuit 72 includes at least a pair of pins 722.

As also shown in fig. 28, in one embodiment, a first line region 71a2 is defined on the first insulating layer 71 a. The first circuit 72 may include a first conductive paste layer 724 and a metal layer 726. The first conductive paste layer 724 is coated on the first wiring region 71a 2. A metal layer 726 may be deposited on the first conductive paste layer 724 by an electroless plating process. The first conductive paste layer 724 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The first conductive paste layer 724 may be coated on the first circuit region 71a2 by a screen printing process (not limited thereto).

Next, as shown in fig. 29, a second insulating layer 71b is formed to cover the first circuit 72 and the first insulating layer 71a and to expose at least one pair of leads 722.

Next, as shown in fig. 29, a second circuit 73 is formed over the second insulating layer 71 b. The second circuit 73 includes at least one lower switch contact 732.

As also shown in fig. 29, in one embodiment, a second line region 71b2 is defined on the second insulating layer 71 b. The second circuit 73 may include a second conductive paste layer 734. A second conductive paste layer 734 is coated on the second line region 71b 2. The second conductive paste layer 734 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The second conductive paste layer 734 may be coated on the second circuit region 71b2 by a screen printing process (not limited thereto).

Next, as shown in fig. 30, the second circuit 73 and the second insulating layer 71b are covered with a first adhesive layer 74a, and the at least one pair of leads 722 and the at least one lower switch contact 732 are exposed.

Next, as also shown in fig. 30, a separation layer 75 is prepared. The isolation layer 75 has a first break 752 and at least one second break 754. Each second hole 754 corresponds to one of the pins 722 in the at least one pair of pins 722.

Next, as also shown in fig. 30, a polymer film 76 is prepared. The polymer film 76 has at least one third perforation 764. Each third perforation 764 corresponds to one second perforation 754.

Next, as also shown in fig. 30, a third circuit 77 is formed on the lower surface 762 of the polymer film 76. The third circuit 77 includes at least one upper switch contact 772.

In one embodiment, third circuit region 766 is defined on lower surface 762 of polymer film 76. The third circuit 77 may include a third conductive paste layer 774. A third conductive paste layer 774 is coated on the third wiring region 766. The third conductive paste layer 774 may contain conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The third conductive paste layer 774 may be coated on the third circuit region 766 by a screen printing process (not limited thereto). In practical applications, the second circuit 73 and the third circuit 77 may have a jumper design.

Next, as also shown in fig. 30, a second adhesive layer 74b is coated on the lower surface 762 of the polymer film 76, and at least one upper switch contact 772 is exposed.

In one embodiment, the first adhesive layer 74a and the second adhesive layer 74b can be formed by coating a water gel, but not limited thereto.

Next, as also shown in fig. 30, the isolation layer 75 is attached between the second insulating layer 71b and the lower surface 762 of the polymer film 76 by the first adhesive layer 74a and the second adhesive layer 74b (not limited thereto), and the at least one upper switch contact 772 and the at least one lower switch contact 732 are disposed in the first via 752, and each pair of leads 722 is disposed in the corresponding second via 754.

Next, as shown in fig. 31, at least one light emitting diode assembly 78 is prepared. Each led assembly 78 corresponds to one of the pair of leads 722, the third via 764 and the second via 754, and each led assembly 78 includes a pair of leads 782.

Finally, as also shown in fig. 31, each led assembly 78 is fixed in the corresponding third hole 764 and the corresponding second hole 754, and the pair of pins 782 thereof and the pair of pins 722 thereof are respectively soldered together.

Further, as also shown in fig. 31, at least one third hole 764 and at least one led assembly 78 are covered by a transparent encapsulant 79, so as to complete the dual-function circuit assembly 7 shown in fig. 27. The elastic actuator 12 is disposed on the polymer film 76 and aligned with the first hole 752, and the end 1242 of the actuating rod 124 faces the at least one upper switch contact 772 and the at least one lower switch contact 732.

Referring to fig. 32, a dual function circuit assembly 8 according to a seventh preferred embodiment of the present invention is schematically illustrated. Fig. 32 is a cross-sectional view of a dual-function circuit assembly 8 according to a seventh preferred embodiment of the present invention. The cross-section shown in FIG. 32 has the cross-sectional line defined as line A-A in FIG. 1. The dual-function circuit module 8 of the seventh preferred embodiment of the present invention can replace the dual-function circuit module 2 of the first preferred embodiment of the present invention and be mounted to the light-emitting key 1 shown in fig. 1. At this point, at least the end 1242 of the actuating post 124 is conductive. For convenience of illustration, only the dual function circuit element 8 and the elastic actuator 12 are shown in cross-sectional view in fig. 32.

As shown in fig. 32, the dual-function circuit device 8 according to the seventh preferred embodiment of the present invention includes a metal substrate 80, a first insulating layer 81a, a first circuit 82, a second insulating layer 81b, a third insulating layer 81c, a second circuit 83, an insulating substrate 85, and at least one light emitting diode device 86. In the example shown in fig. 28, only one led device 86 is shown as a representative. In one embodiment, the led element 86 may be a packaged led element 86 or a bare die type led element 86.

In one embodiment, the metal substrate 80 may be a stainless steel sheet, an aluminum sheet, or the like. The metal substrate 80 serves as a bottom plate of the prior art light-emitting key.

In one embodiment, the insulating substrate 85 may be a phenolic cotton paper-based substrate, a glass cloth-based substrate, a ceramic substrate (e.g., aluminum nitride, aluminum oxide, silicon carbide, etc.), a polymer film, or the like. If the insulating substrate 85 is a polymer film, it can be a polymer film formed by polyethylene terephthalate, polyimide, polymethyl methacrylate, or other similar commercial polymer materials.

The first insulating layer 81a is formed to cover the lower surface 802 of the metal base 80. The first circuit 82 is formed on the first insulating layer 81 a. The first circuit 82 includes at least one pair of pins 822.

In one embodiment, the first insulating layer 81a may be formed by performing an electrical insulation process on the lower surface 802 of the metal substrate 80, or may be formed by coating an ultraviolet curable resin on the lower surface 802 of the metal substrate 80 and then irradiating ultraviolet light to cure the resin.

As also shown in fig. 32, in one embodiment, a first circuit region 81a2 is defined on the first insulating layer 81 a. The first circuit 82 may include a first conductive paste layer 824 and a metal layer 826. The first conductive paste layer 824 is coated on the first wiring region 81a 2. A metal layer 826 may be deposited on the first conductive paste layer 824 by an electroless plating process. The first conductive paste layer 824 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The first conductive paste layer 824 may be coated on the first circuit region 81a2 by a screen printing process (not limited thereto).

In one embodiment, the metal layer 826 can be a single Cu layer, a multi-Ag/Au layer/multi-Ag/Au/Sn/Ni layer/single Cu layer, a single Sn layer/single Cu layer, a single Ag layer/single Cu layer, a single Au layer/single Cu layer, a single Ag layer/single Ni layer/single Cu layer, a single Au layer/single Ni layer/single Cu layer, a single Sn layer/single Au layer/single Ag layer/single Ni layer/single Cu layer, or the like.

The second insulating layer 81b is formed to cover the first circuit 82 and the first insulating layer 81a and expose at least one pair of leads 822.

In one embodiment, the second insulating layer 81b can be formed by first coating an ultraviolet curing resin on the first circuit 82 and the first insulating layer 81a and then irradiating ultraviolet light to cure the resin.

The third insulating layer 81c is formed to cover the upper surface 804 of the metal base 80. The second circuit 83 is formed on the third insulating layer 81 c. The second circuit 83 includes at least two switch contacts 832.

In one embodiment, the third insulating layer 81c may be formed by performing an electrical insulation process on the upper surface 804 of the metal substrate 80, or may be formed by coating an ultraviolet curable resin on the upper surface 804 of the metal substrate 80 and then irradiating ultraviolet light to cure the resin.

In one embodiment, the third insulating layer 81c has a second circuit region defined thereon, the third insulating layer 81c 2. The second circuit 83 may include a second conductive paste layer 834. The second conductive paste layer 834 is coated on the second line region third insulating layer 81c 2. The second conductive paste layer 834 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The second conductive paste layer 834 may be coated on the second circuit region 81c2 by a screen printing process (not limited thereto).

The adhesive layer 84 covers the second circuit 83 and the third insulating layer 81c, and exposes at least two switch contacts 832.

In one embodiment, the adhesive layer 84 may be formed by coating a water gel, but not limited thereto.

The insulating substrate 85 has a break 852. The insulating substrate 85 is attached to the third insulating layer 81c by an adhesive layer 84 (not limited thereto), and the at least two switch contacts 832 are disposed in the through holes 852 of the insulating substrate 85. Each led assembly 86 corresponds to one of the at least one pair of leads 822, and each led assembly 86 includes a pair of leads 862. The pair of pins 862 of each led assembly 86 and the corresponding pair of pins 822 are soldered together.

Further, a transparent encapsulant 87 covers at least one of the led assemblies 86. In practical applications, each led element 86 is a side-emitting led element. The light-emitting key 1 of the dual-function circuit assembly 8 according to the seventh preferred embodiment of the present invention can further be provided with a light guide plate for guiding at least the light emitted from the light-emitting diode assembly 86 to illuminate the key cap 14.

The elastic actuator 12 is disposed at the periphery of the through hole 852 of the insulating substrate 85, and the end 1242 of the actuating rod 124 faces at least two switch contacts 832. When the key cap 14 moves to the pressing position, the dome body 122 of the elastic actuator 12 deforms, so that the conductive end 1242 of the actuating pillar 124 contacts the at least two switch contacts 832 to make the at least two switch contacts 832 conduct with each other, thereby triggering the light-emitting key 1 of the present invention to be switched to the conducting state. When the key cap 14 is released and moved to the non-depressed position, the dome body 122 of the elastic actuator 12 returns to its original shape to separate the conductive end 1242 of the actuating cylinder 124 from the at least two switch contacts 832. The components in fig. 32 having the same reference numerals as those in fig. 2 have the same or similar structures and functions, and are not repeated herein.

The dual-function circuit assembly 8 of the seventh preferred embodiment of the present invention has the functions of a membrane switch and a light source circuit board, and the thickness thereof can be reduced to 270 μm to 350 μm.

Referring to fig. 33 to 36, a method for manufacturing the dual-function circuit device 8 of the seventh preferred embodiment shown in fig. 32 is schematically illustrated in cross-sectional view. The cross-sections shown in FIGS. 33-36 have cross-sectional lines defined as line A-A in FIG. 1.

As shown in fig. 33, in the manufacturing method of the present invention, first, a metal base 80 is prepared.

Next, as also shown in fig. 33, a first insulating layer 81a is formed to cover the lower surface 802 of the metal base 80.

Next, as shown in fig. 33, the first circuit 82 is formed over the first insulating layer 81 a. The first circuit 82 includes at least one pair of pins 822.

As also shown in fig. 33, in one embodiment, a first circuit region 81a2 is defined on the first insulating layer 81 a. The first circuit 82 may include a first conductive paste layer 824 and a metal layer 826. The first conductive paste layer 824 is coated on the first wiring region 81a 2. A metal layer 826 may be deposited on the first conductive paste layer 824 by an electroless plating process. The first conductive paste layer 824 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The first conductive paste layer 824 may be coated on the first circuit region 81a2 by a screen printing process (not limited thereto).

Next, as also shown in fig. 33, a second insulating layer 81b is formed to cover the first circuit 82 and the first insulating layer 81a and to expose at least one pair of leads 822.

Next, as shown in fig. 34, a third insulating layer 81c is formed to cover the upper surface 804 of the metal base 80.

Next, as also shown in fig. 34, a second circuit 83 is formed over the third insulating layer 81 c. The second circuit 83 includes at least two switch contacts 832.

As also shown in fig. 34, in one embodiment, a second circuit region 81c2 is defined on the third insulating layer 81 c. The second circuit 83 may include a second conductive paste layer 834. A second conductive paste layer 834 is coated on the second line region 81c 2. The second conductive paste layer 834 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The second conductive paste layer 834 may be coated on the second circuit region 81c2 by a screen printing process (not limited thereto).

Next, as shown in fig. 35, the second circuit 83 and the third insulating layer 81c are covered by the adhesive layer 84, and at least two switch contacts 832 are exposed.

Next, as also shown in fig. 35, an insulating base material 85 is prepared. The insulating substrate 85 has a break 852.

Next, as also shown in fig. 35, the insulating substrate 85 is attached to the third insulating layer 81c by the adhesive layer 84 (not limited thereto), and the at least two switch contacts 832 are disposed in the holes 852.

Next, as shown in fig. 36, at least one light emitting diode assembly 86 is prepared. Each led assembly 86 corresponds to one of the at least one pair of leads 822, and each led assembly includes a pair of leads 862.

Finally, as also shown in fig. 36, the pair of pins 862 of each led assembly 86 and the corresponding pair of pins 822 are soldered together.

Further, as also shown in fig. 36, at least one light emitting diode assembly 86 is covered by a transparent encapsulant 87, thereby completing the dual-function circuit assembly 8 shown in fig. 32. The elastic actuator 12 is disposed at the periphery of the through hole 852 of the insulating substrate 85, and the end 1242 of the actuating rod 124 faces at least two switch contacts 832.

Referring to fig. 37, a dual function circuit assembly 9 according to an eighth preferred embodiment of the present invention is schematically illustrated. Fig. 37 is a cross-sectional view of a dual-function circuit assembly 9 according to an eighth preferred embodiment of the present invention. The cross-section shown in FIG. 37 has the cross-sectional line defined as line A-A in FIG. 1. The dual-function circuit assembly 9 of the eighth preferred embodiment of the present invention can replace the dual-function circuit assembly 2 of the first preferred embodiment of the present invention and be mounted to the light-emitting key 1 shown in fig. 1. At this point, the end 1242 of the actuator post 124 need not be conductive. For convenience of illustration, fig. 37 is a cross-sectional view of the dual-function circuit assembly 9 and the elastic actuator 12.

As shown in fig. 37, the dual-function circuit device 9 of the eighth preferred embodiment of the invention includes a metal substrate 90, a first insulating layer 91a, a first circuit 92, a second insulating layer 91b, a third insulating layer 91c, a second circuit 93, an isolation layer 95, a polymer film 96, a third circuit 97, and at least one light emitting diode device 98. In the example shown in fig. 37, only one led device 98 is shown as a representative. In one embodiment, the LED element 98 may be a packaged LED element or a bare die type LED element.

In one embodiment, the metal substrate 90 may be a stainless steel sheet, an aluminum sheet, or the like. The metal substrate 90 serves as a bottom plate of the prior art light-emitting key.

In one embodiment, the polymer film 96 may be a polymer film formed of polyethylene terephthalate, polyimide, polymethyl methacrylate, or other similar commercially available polymer materials.

The first insulating layer 91a is formed to cover the first lower surface 902 of the metal substrate 90. The first circuit 92 is formed on the first insulating layer 91 a. The first circuit 92 includes at least a pair of pins 922.

In one embodiment, the first insulating layer 91a may be formed by performing an electrical insulating process on the first lower surface 902 of the metal substrate 90, or may be formed by coating an ultraviolet curable resin on the first lower surface 902 of the metal substrate 90 and then irradiating ultraviolet light to cure the resin.

As also shown in fig. 37, in one embodiment, a first circuit region 91a2 is defined on the first insulating layer 91 a. The first circuit 92 may include a first conductive paste layer 924 and a metal layer 926. The first conductive paste layer 924 is coated on the first wiring region 91a 2. A metal layer 926 may be deposited on the first conductive paste layer 924 by an electroless plating process. The first conductive paste layer 924 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The first conductive paste layer 924 may be coated on the first circuit region 91a2 by a screen printing process (not limited thereto).

In one embodiment, the metal layer 926 may have a structure of a single Cu layer, a plurality of Ag/Au layers/a plurality of Ag/Au/Sn/Ni layers/a single Cu layer, a single Sn layer/a single Cu layer, a single Ag layer/a single Cu layer, a single Au layer/a single Cu layer, a single Ag layer/a single Ni layer/a single Cu layer, a single Au layer/a single Ni layer/a single Cu layer, a single Sn layer/a single Au layer/a single Ag layer/a single Ni layer/a single Cu layer, or the like.

The second insulating layer 91b is formed to cover the first circuit 92 and the first insulating layer 91a and expose at least one pair of leads 922.

In one embodiment, the second insulating layer 91b may be formed by first coating an ultraviolet curing resin on the first circuit 92 and the first insulating layer 91a and then irradiating ultraviolet light to cure the resin.

The third insulating layer 91c is formed to cover the upper surface 904 of the metal base material 90. The second circuit 93 is formed on the third insulating layer 91 c. The second circuit 93 includes at least one lower switch contact 932. The first adhesive layer 94a covers the second circuit 93 and the third insulating layer 91c, and exposes the at least one lower switch contact 932.

In one embodiment, the third insulating layer 91c may be formed by performing an electrical insulation process on the upper surface 904 of the metal substrate 90, or by coating an ultraviolet curable resin on the upper surface 904 of the metal substrate 90 and then irradiating ultraviolet light to cure the resin.

In one embodiment, the third insulating layer 91c has a second circuit region 91c2 defined thereon. The second circuit 93 may include a second conductive paste layer 934. A second conductive paste layer 934 is coated on the second line region 91c 2. The second conductive paste layer 934 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The second conductive paste layer 934 may be coated on the second circuit region 91c2 by a screen printing process (not limited thereto).

The isolation layer 95 has a perforation 952. The isolation layer 95 is attached to the third insulation layer 91c by a first adhesive layer 94a (not limited thereto), and at least one lower switch 932 is disposed in the hole 952 of the isolation layer 95. The second adhesive layer 94b covers the isolation layer 95 and does not cover the broken hole 952 of the isolation layer 95.

The third circuit 97 is formed on the second lower surface 962 of the polymer film 96. The third circuit 97 includes at least one upper switch contact 972. The polymer film 96 is attached to the isolation layer 95 by the second lower surface 962 through the second adhesive layer 94b (not limited thereto), and the at least one upper switch contact 972 is disposed in the hole 952 of the isolation layer 95 and aligned with the at least one lower switch contact 932.

In one embodiment, the first adhesive layer 94a and the second adhesive layer 94b are formed by coating a water gel, but not limited thereto.

In one embodiment, the second bottom surface 962 of the polymer film 96 defines a third circuit region 964. The third circuit 97 may include a third conductive paste layer 974. A third conductive paste layer 974 is coated on the third circuit region 964. The third conductive paste layer 974 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The third conductive paste layer 974 may be coated on the third circuit region 964 by a screen printing process (not limited thereto). In practical applications, the second circuit 93 and the third circuit 97 may have a jumper design.

Each led assembly 98 corresponds to one of the at least one pair of leads 922, and each led assembly 98 includes a pair of leads 982. The pair of pins 982 of each led module 98 and the corresponding pair of pins 922 are soldered together.

Further, a transparent encapsulant 99 covers at least one of the led modules 98. In practice, each LED element 98 is a side-emitting LED element. The light-emitting key 1 using the dual-function circuit assembly 9 of the seventh preferred embodiment of the present invention can further be provided with a light guide plate for guiding the light emitted by the at least one light-emitting diode assembly 98 to illuminate the key cap 14.

The elastic actuator 12 is disposed on the polymer film 96 and aligned with the broken hole 952 of the isolation layer 95, and the end 1242 of the actuating rod 124 faces the at least one upper switch contact 972 and the at least one lower switch contact 932. When the key cap 14 moves to the pressed position, the dome body 122 of the elastic actuator 12 deforms to press down the end 1242 of the actuating pillar 124, so that the at least one upper switch contact 972 contacts the at least one lower switch contact 932 to be conducted with each other, thereby triggering the light-emitting key 1 of the present invention to be converted into the conducting state. When the key cap 14 is released and moved to the non-depressed position, the dome body 122 of the elastic actuator 12 returns to the original shape to separate the end 1242 of the actuating post 124 from the at least one upper switch contact 972, thereby separating the at least one upper switch contact 972 from the at least one lower switch contact 932, which are originally in contact with each other. The components in fig. 37 having the same reference numerals as those in fig. 2 have the same or similar structures and functions, and are not repeated herein.

The dual-function circuit assembly 9 of the eighth preferred embodiment of the present invention has the functions of a membrane switch and a light source circuit board, and the thickness thereof can be reduced to 270 μm to 350 μm.

Referring to fig. 38 to 41, a method for manufacturing the dual-function circuit device 9 of the eighth preferred embodiment shown in fig. 37 is schematically illustrated in cross-sectional views. The cross-sectional lines of the cross-sections shown in FIGS. 38-41 are defined as the lines A-A in FIG. 1.

As shown in fig. 38, in the manufacturing method of the present invention, first, a metal base material 90 is prepared.

Next, as also shown in fig. 38, a first insulating layer 91a is formed to cover the first lower surface 902 of the metal substrate 90.

Next, as shown in fig. 38, a first circuit 92 is formed over the first insulating layer 91 a. The first circuit 92 includes at least a pair of pins 922.

As also shown in fig. 38, in one embodiment, a first circuit region 91a2 is defined on the first insulating layer 91 a. The first circuit 92 may include a first conductive paste layer 924 and a metal layer 926. The first conductive paste layer 924 is coated on the first wiring region 91a 2. A metal layer 926 may be deposited on the first conductive paste layer 924 by an electroless plating process. The first conductive paste layer 924 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The first conductive paste layer 924 may be coated on the first circuit region 91a2 by a screen printing process (not limited thereto).

Next, as also shown in fig. 38, a second insulating layer 91b is formed to cover the first circuit 92 and the first insulating layer 91a and to expose at least one pair of leads 922.

Next, as shown in fig. 39, a third insulating layer 91c is formed to cover the upper surface 904 of the metal base 90.

Next, as also shown in fig. 39, a second circuit 93 is formed over the third insulating layer 91 c. The second circuit 93 includes at least one lower switch contact 932.

As also shown in fig. 39, in one embodiment, a second circuit region 91c2 is defined on the third insulating layer 91 c. The second circuit 93 may include a second conductive paste layer 934. A second conductive paste layer 934 is coated on the second line region 91c 2. The second conductive paste layer 934 may include conductive particles formed of any one of silver, copper, gold, aluminum, graphite, carbon nanotubes, graphene, and/or any combination thereof. The second conductive paste layer 934 may be coated on the second circuit region 91c2 by a screen printing process (not limited thereto).

Next, as shown in fig. 40, the second circuit 93 and the third insulating layer 91c are covered with a first adhesive layer 94a, and at least one lower switch contact 932 is exposed.

Next, as also shown in fig. 40, an isolation layer 95 is prepared. The isolation layer 95 has a perforation 952.

Next, as shown in fig. 40, a polymer film 96 is prepared.

Next, as shown in fig. 40, third circuits 97 are formed on the second lower surface 962 of the polymer film 96. The third circuit 97 includes at least one upper switch contact 972.

Next, as also shown in fig. 40, a second adhesive layer 94b is coated on the second lower surface 962 of the polymer film 96, and at least one upper switch contact 972 is exposed.

In one embodiment, the first adhesive layer 94a and the second adhesive layer 94b can be formed by coating a water gel, but not limited thereto.

Next, as also shown in fig. 40, the isolation layer 95 is attached between the third insulating layer 91c and the second lower surface 962 of the polymer film 96 by the first adhesive layer 94a and the second adhesive layer 94b (not limited thereto), and the at least one upper switch contact 972 and the at least one lower switch contact 932 are disposed in the hole 952.

Next, as shown in fig. 41, at least one light emitting diode assembly 98 is prepared. Each led assembly 98 corresponds to one of the at least one pair of leads 922, and each led assembly 98 includes a pair of leads 982.

Finally, as also shown in fig. 41, the pair of pins 982 of each led module 98 and the corresponding pair of pins 922 are soldered together.

Further, as also shown in fig. 41, at least one led module 98 is covered by a transparent encapsulant 99, so as to complete the dual-function circuit module 9 shown in fig. 37. The elastic actuator 12 is disposed on the polymer film 96 and aligned with the broken hole 952, and the end 1242 of the actuating rod 124 faces the at least one upper switch contact 972 and the at least one lower switch contact 932.

From the above detailed description of the present invention, it can be clearly understood that the dual-function circuit assembly of the present invention has the functions of the membrane switch and the light source circuit board. The whole thickness of the luminous keyboard comprising a plurality of luminous keys adopting the dual-function circuit component of the invention is thinner than that of the prior art thinned luminous keyboard, and even a light guide plate or a bottom plate can be omitted. By adopting the dual-function circuit assembly, the assembly procedure of the luminous keyboard can be simplified.

The above detailed description of the preferred embodiments is intended to more clearly illustrate the features and spirit of the present invention, and is not intended to limit the scope of the present invention by the preferred embodiments disclosed above. On the contrary, it is intended to cover various modifications and equivalent arrangements included within the scope of the appended claims. The scope of the invention is therefore to be accorded the broadest interpretation so as to encompass all such modifications and equivalent arrangements as is within the scope of the appended claims.

Claims

1. A dual function circuit assembly for a light emitting key, the light emitting key comprising a resilient actuator, the resilient actuator comprising an actuating post, at least an end of the actuating post being a conductive end, the dual function circuit assembly comprising:

a first insulating substrate;

a first circuit formed on the upper surface of the first insulating substrate, the first circuit including at least one pair of pins, wherein a first circuit area is defined on the upper surface of the first insulating substrate, the first circuit including a first conductive paste layer and a metal layer, the first conductive paste layer being coated on the first circuit area, the metal layer being deposited on the first conductive paste layer by a chemical plating process;

an insulating layer formed to cover the first circuit and the upper surface of the first insulating substrate and to expose the at least one pair of leads;

a second circuit formed on the insulating layer, the second circuit including at least two switch contacts;

the second insulating substrate is attached to the insulating layer, the at least two switch contacts are arranged in the first broken holes, and each pair of pins is arranged in the corresponding second broken hole; and

each LED component corresponds to one pair of pins in the at least one pair of pins and one second broken hole and comprises a pair of pins, each LED component is fixed in the corresponding second broken hole, and the pair of pins of each LED component and the corresponding pair of pins are respectively welded together; the elastic actuator is arranged at the periphery of the first broken hole, and the tail end of the actuating column faces the at least two switch contacts.

2. A dual function circuit assembly for a light emitting key, the light emitting key comprising a resilient actuator, the resilient actuator comprising an actuating post, the dual function circuit assembly comprising:

an insulating base material;

a first circuit formed on the upper surface of the insulating substrate, the first circuit including at least one pair of pins, wherein a first circuit area is defined on the upper surface of the insulating substrate, the first circuit including a first conductive paste layer and a metal layer, the first conductive paste layer being coated on the first circuit area, the metal layer being deposited on the first conductive paste layer by a chemical plating process;

an insulating layer formed to cover the first circuit and the upper surface of the insulating substrate and to expose the at least one pair of leads;

a second circuit formed on the insulating layer, the second circuit including at least one lower switch contact;

the isolating layer is attached to the insulating layer, the at least one lower switch contact is arranged in the first broken hole, and each pair of pins is arranged in the corresponding second broken hole;

the polymer film is provided with at least one third hole, and each third hole corresponds to one second hole;

a third circuit formed on the lower surface of the polymer film, the third circuit comprising at least one upper switch contact, wherein the lower surface of the polymer film is attached to the isolation layer, the at least one upper switch contact is arranged in the first through hole and aligned with the at least one lower switch contact, and each third through hole is aligned with the corresponding second through hole; and

each LED component corresponds to one pair of pins in the at least one pair of pins, one third broken hole and one second broken hole, each LED component comprises a pair of pins, each LED component is fixed in the corresponding third broken hole and the corresponding second broken hole, and the pair of pins and the corresponding pair of pins are respectively welded together;

the elastic actuator is arranged on the polymer film and aligned with the first broken hole, and the tail end of the actuating column faces to the at least one upper switch contact and the at least one lower switch contact.

3. A dual function circuit assembly for a light emitting key, the light emitting key comprising a resilient actuator, the resilient actuator comprising an actuating post, at least an end of the actuating post being a conductive end, the dual function circuit assembly comprising:

a first insulating substrate;

a first circuit formed on a lower surface of the first insulating substrate, the first circuit including at least one pair of leads, wherein a first circuit area is defined on the lower surface of the first insulating substrate, the first circuit including a first conductive paste layer and a metal layer, the first conductive paste layer being coated on the first circuit area, the metal layer being deposited on the first conductive paste layer by a chemical plating process;

an insulating layer formed to cover the first circuit and the lower surface of the first insulating substrate and to expose the at least one pair of leads;

each LED component corresponds to one pair of pins in the at least one pair of pins and comprises a pair of pins, and the pair of pins of each LED component and the corresponding pair of pins are respectively welded together;

a second circuit formed on the upper surface of the first insulating substrate, the second circuit including at least two switch contacts; and

the second insulating substrate is provided with a broken hole, is attached to the upper surface of the first insulating substrate and enables the at least two switch contacts to be arranged in the broken hole;

the elastic actuator is arranged at the periphery of the broken hole, and the tail end of the actuating column faces to the at least two switch contacts.

4. A dual function circuit assembly for a light emitting key, the light emitting key comprising a resilient actuator, the resilient actuator comprising an actuating post, the dual function circuit assembly comprising:

an insulating base material;

a first circuit formed on a first lower surface of the insulating substrate, the first circuit including at least one pair of pins, wherein a first circuit area is defined on the first lower surface of the insulating substrate, the first circuit including a first conductive paste layer and a metal layer, the first conductive paste layer being coated on the first circuit area, the metal layer being deposited on the first conductive paste layer by a chemical plating process;

an insulating layer formed to cover the first circuit and the first lower surface of the insulating substrate and to expose the at least one pair of leads;

a second circuit formed on the upper surface of the insulating substrate, the second circuit comprising at least one lower switch contact;

an isolation layer having a hole, the isolation layer being attached to the upper surface of the insulating substrate and having the at least one lower switch contact disposed in the hole;

a polymer film; and

a third circuit formed on the second lower surface of the polymer film, the third circuit including at least one upper switch contact, wherein the polymer film is attached to the isolation layer with the second lower surface, and the at least one upper switch contact is disposed in the hole and aligned with the at least one lower switch contact;

the elastic actuator is arranged on the polymer film and aligned with the broken hole, and the tail end of the actuating column faces to the at least one upper switch contact and the at least one lower switch contact.

5. A dual function circuit assembly for a light emitting key, the light emitting key comprising a resilient actuator, the resilient actuator comprising an actuating post, at least an end of the actuating post being a conductive end, the dual function circuit assembly comprising:

a metal substrate;

a first insulating layer formed and covering the upper surface of the metal substrate;

a first circuit formed on the first insulating layer, the first circuit including at least one pair of pins, wherein a first circuit region is defined on the first insulating layer, the first circuit including a first conductive paste layer and a metal layer, the first conductive paste layer being coated on the first circuit region, the metal layer being deposited on the first conductive paste layer by a chemical plating process;

a second insulating layer formed to cover the first circuit and the first insulating layer and to expose the at least one pair of leads;

a second circuit formed on the second insulating layer, the second circuit including at least two switch contacts;

the insulating substrate is attached to the second insulating layer, the at least two switch contacts are arranged in the first broken holes, and each pair of pins is arranged in the corresponding second broken hole; and

each LED component corresponds to one pair of pins in the at least one pair of pins and one second broken hole and comprises a pair of pins, each LED component is fixed in the corresponding second broken hole, and the pair of pins and the corresponding pair of pins are respectively welded together;

the elastic actuator is arranged at the periphery of the first broken hole, and the tail end of the actuating column faces the at least two switch contacts.

6. A dual function circuit assembly for a light emitting key, the light emitting key comprising a resilient actuator, the resilient actuator comprising an actuating post, the dual function circuit assembly comprising:

a metal substrate;

a second circuit formed on the second insulating layer, the second circuit comprising at least one lower switch contact;

the isolating layer is attached to the second insulating layer, the at least one lower switch contact is arranged in the first broken hole, and each pair of pins is arranged in the corresponding second broken hole;

7. A dual function circuit assembly for a light emitting key, the light emitting key comprising a resilient actuator, the resilient actuator comprising an actuating post, at least an end of the actuating post being a conductive end, the dual function circuit assembly comprising:

a metal substrate;

a first insulating layer formed and covering the lower surface of the metal substrate;

a third insulating layer formed to cover the upper surface of the metal base material;

a second circuit formed on the third insulating layer, the second circuit including at least two switch contacts; and

the insulating substrate is provided with a broken hole, is attached to the third insulating layer and enables the at least two switch contacts to be arranged in the broken hole;

8. A dual function circuit assembly for a light emitting key, the light emitting key comprising a resilient actuator, the resilient actuator comprising an actuating post, the dual function circuit assembly comprising:

a metal substrate;

a first insulating layer formed and covering the first lower surface of the metal substrate;

a second circuit formed on the third insulating layer, the second circuit including at least one lower switch contact;

the isolation layer is provided with a broken hole, is attached to the third insulation layer and enables the at least one lower switch contact to be arranged in the broken hole;

a polymer film; and

9. A method of manufacturing a dual function circuit assembly for use in a light emitting key, the light emitting key comprising a resilient actuator, the resilient actuator comprising an actuating post, at least the end of the actuating post being a conductive end, the method comprising the steps of:

preparing a first insulating substrate, wherein a first circuit area is defined on the upper surface of the first insulating substrate;

coating a first conductive paste layer on the first circuit region;

performing a chemical plating process on the upper surface of the first insulating substrate to deposit a metal layer on the first conductive paste layer, wherein the first conductive paste layer and the metal layer form a first circuit, and the first circuit comprises at least one pair of pins;

forming an insulating layer to cover the first circuit and the upper surface of the first insulating substrate and expose the at least one pair of pins;

forming a second circuit on the insulating layer, wherein the second circuit comprises at least two switch contacts;

preparing a second insulating substrate, wherein the second insulating substrate is provided with a first broken hole and at least one second broken hole, and each second broken hole corresponds to one pair of pins in the at least one pair of pins;

bonding the second insulating substrate on the insulating layer, placing the at least two switch contacts in the first broken holes, and placing each pair of pins in the corresponding second broken holes;

preparing at least one light emitting diode assembly, wherein each light emitting diode assembly corresponds to one pair of pins in the at least one pair of pins and one second hole, and each light emitting diode assembly comprises a pair of pins; and

fixing each LED assembly in the corresponding second broken hole and respectively welding the pair of pins with the corresponding pair of pins;

10. A method of manufacturing a dual function circuit assembly for use with a light emitting key, the light emitting key comprising a resilient actuator, the resilient actuator comprising an actuating post, the method comprising the steps of:

preparing an insulating substrate, wherein a first circuit area is defined on the upper surface of the insulating substrate;

coating a first conductive paste layer on the first circuit region;

performing a chemical plating process on the upper surface of the insulating substrate to deposit a metal layer on the first conductive paste layer, wherein the first conductive paste layer and the metal layer form a first circuit, and the first circuit comprises at least one pair of pins;

forming an insulating layer to cover the first circuit and the upper surface of the insulating substrate and expose the at least one pair of pins;

forming a second circuit on the insulating layer, wherein the second circuit comprises at least one lower switch contact;

preparing an isolation layer, wherein the isolation layer is provided with a first broken hole and at least one second broken hole, and each second broken hole corresponds to one pair of pins in the at least one pair of pins;

preparing a polymer film, wherein the polymer film is provided with at least one third hole, and each third hole corresponds to one second hole;

forming a third circuit on the lower surface of the polymer film, wherein the third circuit comprises at least one upper switch contact;

attaching the isolation layer between the insulation layer and the lower surface of the polymer film, and placing the at least one upper switch contact and the at least one lower switch contact in the first broken hole, and placing each pair of pins in the corresponding second broken holes;

preparing at least one light emitting diode assembly, wherein each light emitting diode assembly corresponds to one pair of pins in the at least one pair of pins, one third hole and one second hole, and each light emitting diode assembly comprises a pair of pins; and

fixing each LED assembly in the corresponding third broken hole and the second broken hole and respectively welding the pair of pins with the corresponding pair of pins;

11. A method of manufacturing a dual function circuit assembly for use in a light emitting key, the light emitting key comprising a resilient actuator, the resilient actuator comprising an actuating post, at least the end of the actuating post being a conductive end, the method comprising the steps of:

preparing a first insulating substrate, wherein a first circuit area is defined on the lower surface of the first insulating substrate;

coating a first conductive paste layer on the first circuit region;

performing a chemical plating process on the first insulating substrate to deposit a metal layer on the first conductive paste layer, wherein the first conductive paste layer and the metal layer form a first circuit, and the first circuit comprises at least one pair of pins;

forming an insulating layer to cover the first circuit and the lower surface of the first insulating substrate and expose the at least one pair of pins;

forming a second circuit on the upper surface of the first insulating substrate, wherein the second circuit comprises at least two switch contacts;

preparing a second insulating substrate, wherein the second insulating substrate is provided with a broken hole;

bonding the second insulating substrate on the upper surface of the first insulating substrate, and placing the at least two switch contacts in the broken hole;

preparing at least one light emitting diode assembly, wherein each light emitting diode assembly corresponds to one pair of pins in the at least one pair of pins and each light emitting diode assembly comprises a pair of pins; and

respectively welding the pair of pins of each light emitting diode assembly with the corresponding pair of pins;

12. A method of manufacturing a dual function circuit assembly for use with a light emitting key, the light emitting key comprising a resilient actuator, the resilient actuator comprising an actuating post, the method comprising the steps of:

preparing an insulating substrate, wherein a first circuit area is defined on a first lower surface of the insulating substrate;

coating a first conductive paste layer on the first circuit region;

performing a chemical plating process on the first lower surface of the insulating substrate to deposit a metal layer on the first conductive paste layer, wherein the first conductive paste layer and the metal layer form a first circuit, and the first circuit comprises at least one pair of pins;

forming an insulating layer to cover the first circuit and the first lower surface of the insulating substrate and expose the at least one pair of pins;

forming a second circuit on the upper surface of the insulating substrate, wherein the second circuit comprises at least one lower switch contact;

preparing an isolation layer, wherein the isolation layer is provided with a broken hole;

preparing a polymer film;

forming a third circuit on the second lower surface of the polymer film, wherein the third circuit comprises at least one upper switch contact;

attaching the isolation layer between the upper surface of the insulating substrate and the second lower surface of the polymer film, and placing the at least one upper switch contact and the at least one lower switch contact in the hole;

the elastic actuator is arranged on the polymer film and is aligned with the broken hole, so that the tail end of the actuating column faces to the at least one upper switch contact and the at least one lower switch contact.

13. A method of manufacturing a dual function circuit assembly for use in a light emitting key, the light emitting key comprising a resilient actuator, the resilient actuator comprising an actuating post, at least the end of the actuating post being a conductive end, the method comprising the steps of:

preparing a metal substrate;

forming a first insulating layer and covering the upper surface of the metal substrate, wherein a first circuit area is defined on the first insulating layer;

coating a first conductive paste layer on the first circuit region;

performing a chemical plating process on the first insulating layer to deposit a metal layer on the first conductive paste layer, wherein the first conductive paste layer and the metal layer form a first circuit, and the first circuit comprises at least one pair of pins;

forming a second insulating layer to cover the first circuit and the first insulating layer and expose the at least one pair of pins;

forming a second circuit on the second insulating layer, wherein the second circuit comprises at least two switch contacts;

preparing an insulating substrate, wherein the insulating substrate is provided with a first broken hole and at least one second broken hole, and each second broken hole corresponds to one pair of pins in the at least one pair of pins;

attaching the insulating substrate to the second insulating layer, placing the at least two switch contacts in the first broken holes, and placing each pair of pins in the corresponding second broken holes;

14. A method of manufacturing a dual function circuit assembly for use with a light emitting key, the light emitting key comprising a resilient actuator, the resilient actuator comprising an actuating post, the method comprising the steps of:

preparing a metal substrate;

coating a first conductive paste layer on the first circuit region;

forming a second circuit on the second insulating layer, wherein the second circuit comprises at least one lower switch contact;

attaching the isolation layer between the second insulation layer and the lower surface of the polymer film, placing the at least one upper switch contact and the at least one lower switch contact in the first broken hole, and placing each pair of pins in the second broken hole corresponding to the pins;

15. A method of manufacturing a dual function circuit assembly for use in a light emitting key, the light emitting key comprising a resilient actuator, the resilient actuator comprising an actuating post, at least the end of the actuating post being a conductive end, the method comprising the steps of:

preparing a metal substrate;

forming a first insulating layer and covering the lower surface of the metal substrate, wherein a first circuit area is defined on the first insulating layer;

coating a first conductive paste layer on the first circuit region;

forming a third insulating layer to cover the upper surface of the metal substrate;

forming a second circuit on the third insulating layer, wherein the second circuit comprises at least two switch contacts;

preparing an insulating substrate, wherein the insulating substrate is provided with a broken hole;

attaching the insulating substrate to the third insulating layer, and placing the at least two switch contacts in the broken hole;

16. A method of manufacturing a dual function circuit assembly for use with a light emitting key, the light emitting key comprising a resilient actuator, the resilient actuator comprising an actuating post, the method comprising the steps of:

preparing a metal substrate;

forming a first insulating layer and covering the first lower surface of the metal substrate, wherein a first circuit area is defined on the first insulating layer;

coating a first conductive paste layer on the first circuit region;

forming a second circuit on the third insulating layer, wherein the second circuit comprises at least one lower switch contact;

preparing a polymer film;

bonding the isolation layer between the third insulation layer and the second lower surface of the polymer film, and placing the at least one upper switch contact and the at least one lower switch contact in the hole;