CN109340375A - A kind of circuit feedthrough and its installation sealing structure - Google Patents
A kind of circuit feedthrough and its installation sealing structure Download PDFInfo
- Publication number
- CN109340375A CN109340375A CN201811445796.6A CN201811445796A CN109340375A CN 109340375 A CN109340375 A CN 109340375A CN 201811445796 A CN201811445796 A CN 201811445796A CN 109340375 A CN109340375 A CN 109340375A
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- Prior art keywords
- glue
- metal sleeve
- sealing structure
- installation
- circuit
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- 238000007789 sealing Methods 0.000 title claims abstract description 74
- 238000009434 installation Methods 0.000 title claims abstract description 39
- 239000003292 glue Substances 0.000 claims abstract description 96
- 239000002184 metal Substances 0.000 claims abstract description 41
- 230000010412 perfusion Effects 0.000 claims abstract description 10
- 239000011148 porous material Substances 0.000 claims abstract description 3
- 239000011810 insulating material Substances 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 6
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 238000001514 detection method Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000003850 cellular structure Anatomy 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/10—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Measurement Of Radiation (AREA)
Abstract
The present invention relates to a kind of circuit feedthrough and its installation sealing structures, belong to electronic component sealing structure technical field.Metal sleeve inside and fill insulant between electrode, are followed successively by low, medium and high temperature glue by metal sleeve center outward；The installation duct for installing circuit feedthrough is a different duct of upper and lower pore size, the small channel diameter in aperture matches with metal sleeve outer diameter, the big channel section in aperture is located at and atmosphere contact jaw, diameter is greater than metal sleeve outer diameter, gap is formed between metal sleeve, gap location perfusion filling sealing element, sealing element are followed successively by low, medium and high temperature glue from inside to outside, and high-temp glue is and atmosphere contact jaw.The present invention is in guaranteeing electronic component under the premise of the vacuum or sealing effect of vacuum or sealing structure, realize the circuit feedthrough of vacuum or sealing structure in ordinary temperature and the electronic component of size, and the circuit feedthrough in the wide temperature range of low temperature to high temperature and the vacuum or sealing structure of miniature electric component.
Description
Technical field
The present invention relates to a kind of circuit feedthrough and its installation sealing structures, specifically, being related in a kind of electronic component
The circuit feedthrough of vacuum or sealing structure and its installation sealing structure belong to electronic component sealing structure technical field.
Background technique
Existing circuit feedthrough (feedthrough), also known as vacuum electrode, vacuum feedthroughs, vacuum pottery envelope electrode,
Vacuum feedthrough, vacuum electric feedthrough or thermocouple sealing element have structure shown in FIG. 1, i.e., are placed with electricity in metal sleeve
Pole, electrode both ends are pierced by metal sleeve both ends, inside metal sleeve between electrode fill insulant, such as insulating cement, then
Metal sleeve, insulating materials and electrode solidified with cured method it is integral, then by metal sleeve insertion and vacuum or close
In seal structure in the installation duct A of connection installation circuit feedthrough, installation duct A structure is as shown in Figures 2 and 3, is one
Aperture through-hole unanimous between the higher and lower levels, can by by metal sleeve contact atmosphere one end end setting to the left and right protrusion and diameter be greater than
Circuit feedthrough is fixed on the mounting hole by the week edge with fixing piece, such as screw by all edges in the installation aperture duct A
In the road end A, and by placing sealing element, such as sealing rubber ring between all edges and the duct, or use metal rigidity
Sealing such as welding mode be sealed, realization electric current or electric signal from the side feedthrough of vacuum or sealing structure to the other side,
As shown in Figure 4.
The circuit feedthrough and its installation sealing structure are widely used in true in conventional structure electronic component under room temperature
Empty or sealing structure circuit is introduced or is drawn, its main feature is that not only can guarantee that electric current or electric signal transmitted undampedly, but also can be protected
Demonstrate,prove the vacuum degree or sealing effect of vacuum or sealing structure.But the vacuum of the electronic component for working at low temperature or sealing
Structure, due to the reason of material heat expansion, low-temperature condition leak hole be will increase, therefore circuit feedthrough described in the prior art and its peace
Dress sealing structure not necessarily can guarantee the vacuum degree or sealing effect of vacuum device；On the other hand, for miniature electric component
For, since its vacuum or sealing structure limit, the sealing that the place duct A is installed in circuit feedthrough can not use rubber sealing or
Metal rigidity sealing.
Summary of the invention
To overcome defect of the existing technology, the purpose of the present invention is to provide a kind of circuit feedthrough and its installation sealings
Structure, the structure guarantee electronic component in the vacuum or sealing effect of vacuum or sealing structure under the premise of, it can be achieved that
The circuit feedthrough of vacuum or sealing structure in prior art ordinary temperature and the electronic component of size, and be furthermore achieved
Low temperature (77K) to high temperature (473K) wide temperature range and miniature electric component vacuum or sealing structure in, circuit feedback
Logical application.
To achieve the purpose of the present invention, following technical scheme is provided.
A kind of circuit feedthrough and its installation sealing structure, the circuit feedthrough is mainly by metal sleeve, electrode and insulation material
Material composition；Electrode is placed in metal sleeve, electrode both ends are pierced by metal sleeve both ends, fill out between electrode inside metal sleeve
Insulating materials is filled, the insulating materials is followed successively by low temperature glue, medium temperature glue and high-temp glue by metal sleeve center outward.
In the installation sealing structure, the installation duct B of electronic component vacuum or sealing structure installation circuit feedthrough is
The outer diameter of the metal sleeve of a upper and lower different duct of pore size, the small channel section diameter in aperture and circuit feed through structures
Match, play the role of being inserted into and circuit feedthrough and support and fix, the big channel section in aperture be located at it is big
Gas contacts one end, and diameter is greater than the outer diameter of metal sleeve, and gap is formed between metal sleeve outer wall, and gap location perfusion filling is close
Sealing, the sealing element are followed successively by low temperature glue, medium temperature glue and high-temp glue from inside to outside, and high-temp glue is and atmosphere contact jaw.
Wherein, the low temperature glue is polyurethane modified epoxy resin, and bondline thickness is more than or equal to 0.5mm；
The medium temperature glue is bisphenol A type epoxy resin, and bondline thickness is more than or equal to 0.5mm；
The high-temp glue is amino four-functional group epoxy resin, and bondline thickness is more than or equal to 0.5mm.
The perfusion fill method of low temperature glue, medium temperature glue and high-temp glue in the insulating materials and sealing element are as follows: be first perfused
Fill low temperature glue, solidification；Then perfusion filling medium temperature glue, solidification；Filled high-temperature glue, solidification is finally perfused.
Beneficial effect
1. the present invention provides a kind of circuit feedthrough and its installation sealing structure, wherein the insulation material in the circuit feedthrough
Material is followed successively by low temperature glue, medium temperature glue and high-temp glue by metal sleeve center outward and constitutes, and wherein low temperature glue is known as high performance low temperature
Structure glue, it is ensured that sealing, which is in down to 77K temperature, still good leakproofness and insulating properties；It is solid that medium temperature glue is also known as medium temperature
Change structure glue, the transition zone between low temperature glue and high-temp glue plays close at middle-temperature section (being higher than 77K, be lower than 473K) sealing
The effect of envelope and insulation；High-temp glue is also known as thermal structure glue, it is ensured that sealing be in up to 473K temperature still have it is good
Sealing and insulating properties；
2. the present invention provides a kind of circuit feedthrough and its installation sealing structure, wherein the installation sealing structure pass through by
Installation circuit feedthrough installation duct A structure be improved to installation duct B, and using layering successively be perfused and solidify low temperature glue, in
Three kinds of glue of warm glue and high-temp glue are sealed, and are substantially increased vacuum-packed reliability, are applicable not only to room temperature stock size
Electronic component, and be suitable for the wide temperature range of low temperature (77K) to high temperature (473K), and rubber sealing can not be used
Or in the miniature dimensions electronics member device of metal rigidity sealing；
3. the structure is simple the present invention provides a kind of circuit feedthrough and its installation sealing structure, it is easy to implement.
Detailed description of the invention
Fig. 1 is the schematic diagram of prior art circuits feed through structures.
Fig. 2 is the main view for installing the installation duct A of circuit feedthrough in vacuum or sealing structure in the prior art.
Fig. 3 is the top view for installing the installation duct A of circuit feedthrough in vacuum or sealing structure in the prior art.
Fig. 4 is the structural schematic diagram for installing circuit feedthrough in vacuum or sealing structure in the prior art.
Fig. 5 is circuit feed through structures schematic diagram in embodiment 1.
Fig. 6 is the main view that vacuum or sealing structure install duct B in embodiment 1.
Fig. 7 is the top view that vacuum or sealing structure install duct B in embodiment 1.
Fig. 8 is the structural schematic diagram for installing circuit feedthrough in embodiment 1 in vacuum or sealing structure.
Wherein, 1-metal sleeve, 2-electrodes, 3-insulating materials, 4-sealing elements, 5-low temperature glues, 6-medium temperature glue,
7-high-temp glues, 8-installation duct A, 9-installation duct B
Specific embodiment
To keep the purpose of the present invention, content and advantage clearer, with reference to the accompanying drawings and examples, to of the invention
Specific embodiment is described in further detail.
Embodiment 1
A kind of circuit feedthrough and its installation sealing structure, the circuit feedthrough are mainly stainless steel 304 by material, size:
0.8 × 50mm of Φ, wall thickness are that the metal sleeve 1 of 0.15mm, the electrode 2 of Φ 0.07mm enameled wire and insulating materials 3 form；
Electrode 2 is placed in metal sleeve 1,2 both ends of electrode are pierced by 1 both ends of metal sleeve, fill out between 1 inside of metal sleeve and electrode 2
Insulating materials 3 is filled, it is total that the insulating materials 3 is followed successively by the low temperature glue 5 of 15mm thickness, two layers of glue-line by 1 center of metal sleeve outward
The high-temp glue 7 for being 20mm with a thickness of the medium temperature glue 6 of 15mm and two layers of glue-line overall thickness is constituted, as shown in Figure 5.
In the installation sealing structure, with two kinds of cellular structures totally six matching VS MD30 type leak detector leak detection tool equipment
Production, the material of leak detection tool equipment are stainless steel 304, and the installation duct B 9 that circuit feedthrough is installed on leak detection tool equipment is upper and lower aperture
Duct of different sizes, the big channel diameter in aperture are Φ 3mm, Φ 1.8mm, and hole depth 1.5mm, the small channel diameter in aperture is
0.8 ± 0.02mm of Φ, hole depth 3mm, the outer diameter phase of the small channel section in aperture and the metal sleeve 1 of circuit feed through structures
Match, to play insertion circuit feedthrough and support and fixed function, the big channel section in aperture is located at and atmosphere
Contact forms gap between one end, and the outer wall of metal sleeve 1, gap location perfusion filling sealing element 4, and the sealing element 4 is by interior
It is followed successively by the high-temp glue 7 of the low temperature glue 5 of 0.5mm thickness, the medium temperature glue 6 of 0.5mm thickness and 0.5mm thickness outward, high-temp glue 7 is and atmosphere
Contact jaw, as shown in Figure 6 to 8.
Wherein, the low temperature glue 5 is polyurethane modified epoxy resin；
The medium temperature glue 6 is bisphenol A type epoxy resin；
The high-temp glue 7 is amino four-functional group epoxy resin.
The perfusion fill method of low temperature glue 5, medium temperature glue 6 and high-temp glue 7 in the insulating materials 3 and sealing element 4 are as follows: first
5,100 DEG C of low temperature glue of perfusion filling solidifies 2 hours；Then solidify 1 hour for 6,80 DEG C of medium temperature glue of perfusion filling；Finally perfusion filling
Solidify 1~2 hour at 7,130 DEG C~150 DEG C of high-temp glue.
The circuit feedthrough being prepared and its installation sealing structure are tested as follows:
With between the digital multimeter measurement circuit feed through structures enamel-cover wire core being cured and the barrel of metal sleeve 1
Resistance, transformation gear are tested；
The leak detection tool equipment being cured is matched on VS MD30 type leak detector, implements leak detection test with vacuum test method.
Experiment shows: the electricity in the circuit feed through structures between 2 enamel-cover wire core of electrode and the barrel of metal sleeve 1
Resistance is infinity；Its leak rate of the leak detection tool equipment of the installation sealing structure is less than 1.0 × 10-12Pa·m3/s。
Embodiment 2
A kind of circuit feedthrough and its installation sealing structure, the low temperature glue 5, medium temperature glue 6, high-temp glue 7 use Φ respectively
The die casting of 50mm is at Φ 50mm, low temperature glue film, medium temperature glue film and the high temperature glue film of thickness 0.5mm, respectively in embodiment 1
The condition of cure of the low temperature glue 5, medium temperature glue 6 and high-temp glue 7 is solidified；The existing low temperature glue 5, medium temperature glue can also be used
6 and film of the thickness more than or equal to 0.5mm of high-temp glue 7 be cut into the low temperature glue film, medium temperature glue film and high temperature glue film of Φ 50mm；
A matching VS MD30 type leak detector and Φ 50mm low temperature glue film, medium temperature glue film and high temperature glue film are made with stainless steel material 304
Leak detection tool equipment, for examine low temperature glue 5, medium temperature glue 6 and high-temp glue 7 in the solid state receiving pressure performance.
Experiment shows: the thickness of each glue film after solidifying of low temperature glue 5, medium temperature glue 6 and high-temp glue 7 reaches 0.5mm, leads to
It crosses leak detector to hunt leak, leak hunting method is the same as embodiment 1.The leak rate of each solidified glue film is respectively less than 1.0 × 10-12Pa·m3/
Thus s can determine whether that it is able to bear the pressure of a standard atmospheric pressure.It further illustrates: low temperature glue 5, medium temperature glue 6 and high-temp glue
The tensile shear strength minimum value of 7 three kinds of glue is 17MPa, is able to satisfy conventional vacuum in low temperature (77K) to high temperature (473K) range
The pouring of device is able to achieve the seal request of vacuum in low temperature (77K) to high temperature (473K) range (or sealing) device.
Claims (3)
1. a kind of circuit feedthrough and its installation sealing structure, it is characterised in that: the circuit feedthrough mainly by metal sleeve (1),
Electrode (2) and insulating materials (3) composition；It is placed with electrode (2) in metal sleeve (1), electrode (2) both ends are pierced by metal sleeve
(1) both ends, the internal fill insulant (3) between electrode (2) of metal sleeve (1), the insulating materials (3) is by metal sleeve
(1) center is followed successively by low temperature glue (5), medium temperature glue (6) and high-temp glue (7) outward；
Low temperature glue (5) is polyurethane modified epoxy resin；Medium temperature glue (6) is bisphenol A type epoxy resin；High-temp glue (7) is amino
Four-functional group epoxy resin.
2. a kind of circuit feedthrough according to claim 1 and its installation sealing structure, it is characterised in that: the installation sealing
In structure, the installation duct B (9) of electronic component vacuum or sealing structure installation circuit feedthrough is that upper and lower pore size is different
One duct, the small channel section diameter in aperture and the outer diameter of the metal sleeve (1) of circuit feed through structures match, and aperture is big
Channel section, which is located at, contacts one end with atmosphere, and diameter is greater than the outer diameter of metal sleeve (1), between the outer wall of metal sleeve (1)
Formed gap, gap location perfusion filling sealing element (4), sealing element (4) be followed successively by from inside to outside low temperature glue (5), medium temperature glue (6) and
High-temp glue (7), high-temp glue (7) are and atmosphere contact jaw.
3. a kind of circuit feedthrough according to claim 1 or 2 and its installation sealing structure, it is characterised in that: low temperature glue (5)
Bondline thickness be more than or equal to 0.5mm；The bondline thickness of medium temperature glue (6) is more than or equal to 0.5mm；The bondline thickness of high-temp glue (7)
More than or equal to 0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811445796.6A CN109340375A (en) | 2018-11-29 | 2018-11-29 | A kind of circuit feedthrough and its installation sealing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811445796.6A CN109340375A (en) | 2018-11-29 | 2018-11-29 | A kind of circuit feedthrough and its installation sealing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109340375A true CN109340375A (en) | 2019-02-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811445796.6A Pending CN109340375A (en) | 2018-11-29 | 2018-11-29 | A kind of circuit feedthrough and its installation sealing structure |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2358556Y (en) * | 1998-12-23 | 2000-01-12 | 中国科学院上海光学精密机械研究所 | Pulse discharge lamp with sandwich insulating layer lamp holder |
| CN101565184A (en) * | 2009-05-22 | 2009-10-28 | 宜昌南玻硅材料有限公司 | Electrode sealing method in hydrogen furnace device for polysilicon production and device thereof |
| WO2010150591A1 (en) * | 2009-06-25 | 2010-12-29 | Nok株式会社 | Seal structure |
| CN104158088A (en) * | 2014-08-27 | 2014-11-19 | 中国工程物理研究院流体物理研究所 | Cable transmission and multi-module current collection strong pulse current device |
| US20150276460A1 (en) * | 2014-03-28 | 2015-10-01 | Honeywell International Inc. | Feed-through for gwr measurements in tanks |
| CN105992610A (en) * | 2013-12-12 | 2016-10-05 | 贺利氏德国有限两合公司 | Direct integration of feedthrough to implantable medical device housing using a gold alloy |
| CN209294389U (en) * | 2018-11-29 | 2019-08-23 | 云南北方昆物光电科技发展有限公司 | A kind of circuit feedthrough and its installation sealing structure |
-
2018
- 2018-11-29 CN CN201811445796.6A patent/CN109340375A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2358556Y (en) * | 1998-12-23 | 2000-01-12 | 中国科学院上海光学精密机械研究所 | Pulse discharge lamp with sandwich insulating layer lamp holder |
| CN101565184A (en) * | 2009-05-22 | 2009-10-28 | 宜昌南玻硅材料有限公司 | Electrode sealing method in hydrogen furnace device for polysilicon production and device thereof |
| WO2010150591A1 (en) * | 2009-06-25 | 2010-12-29 | Nok株式会社 | Seal structure |
| CN105992610A (en) * | 2013-12-12 | 2016-10-05 | 贺利氏德国有限两合公司 | Direct integration of feedthrough to implantable medical device housing using a gold alloy |
| US20150276460A1 (en) * | 2014-03-28 | 2015-10-01 | Honeywell International Inc. | Feed-through for gwr measurements in tanks |
| CN104158088A (en) * | 2014-08-27 | 2014-11-19 | 中国工程物理研究院流体物理研究所 | Cable transmission and multi-module current collection strong pulse current device |
| CN209294389U (en) * | 2018-11-29 | 2019-08-23 | 云南北方昆物光电科技发展有限公司 | A kind of circuit feedthrough and its installation sealing structure |
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