CN109332912A - The step pitches cutting method such as laser scriber and laser applied to dicing device - Google Patents
The step pitches cutting method such as laser scriber and laser applied to dicing device Download PDFInfo
- Publication number
- CN109332912A CN109332912A CN201811148319.3A CN201811148319A CN109332912A CN 109332912 A CN109332912 A CN 109332912A CN 201811148319 A CN201811148319 A CN 201811148319A CN 109332912 A CN109332912 A CN 109332912A
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- China
- Prior art keywords
- laser
- mould group
- axis
- reflecting mirror
- axis movement
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The present invention relates to laserscribing fields, disclose the step pitches cutting method such as laser scriber and the laser applied to dicing device, including cabinet, workbench is equipped in cabinet, workbench includes lower platform, supporting block and upper mounting plate, lower platform is equipped with supporting block, supporting block is equipped with upper mounting plate, upper mounting plate is equipped with Z axis movement mould group and refracting telescope fixed plate, Z axis moves mould group and is equipped with multiple-point focusing head and laser sliver focus head, refracting telescope fixed plate is equipped with the first reflecting mirror and the second reflecting mirror, scribing laser is additionally provided on upper mounting plate, first reflection microscope group, sliver laser and the second reflection microscope group.The present invention has the advantages that scribing and sliver operation can be completed, effectively promotes processing efficiency, Improving The Quality of Products.
Description
Technical field
The present invention relates to laserscribing field, more particularly to laser scriber and swashing applied to dicing device
The step pitches cutting method such as light.
Background technique
Laser scribing means is to be radiated at workpiece surface using high energy laser beam, makes irradiated area local melting, gasification, from
And achieve the purpose that scribing.Because laser is to become a very small luminous point after dedicated optics into focus, energy density is high,
Because its processing be it is contactless, to workpiece itself without mechanical stamping press, workpiece is unlikely to deform, and heat affecting is minimum, draw precision
Height is widely used in the cutting and scribing of glass.Laser breaking machine is that the glass plate for having pulled cutting line is placed on breaking machine
On objective table, glass-cutting line to be split is moved to the underface of laser sliver focus head by objective table, passes through laser sliver
The laser that focus head is launched is come the glass that splits.After usual converted products is cut on laser scribing means, needs to be transferred to and split
Piece machine carries out sliver operation, it is therefore desirable to which the distributed operation on two machines, there are converted products transfer trouble, operating performance are numerous
Trivial, the shortcomings that processing efficiency is low, and there is also take up a large area two machines.
Laser when cutting processing workpiece, if when the upper pulse laser with fixed frequency control of control, due to
X/Y axis movement mould group is not when traveling at the uniform speed, for example X/Y axis movement mould group will cause laser in unit length in acceleration and deceleration
The time for resting on workpieces processing is closeer than generating laser point sequence under at the uniform velocity state, does not reach so as to cause the quality of converted products
Mark.
Summary of the invention
The shortcomings that present invention is directed in the prior art, provide laser scriber and the laser applied to dicing device etc.
Step pitch cutting method.
In order to solve the above-mentioned technical problem, the present invention is addressed by following technical proposals:
Laser scriber, including cabinet, are equipped with workbench in cabinet, and workbench includes lower platform, supporting block and upper flat
Platform, lower platform are equipped with supporting block, and supporting block is equipped with upper mounting plate, and upper mounting plate is equipped with Z axis movement mould group and refracting telescope is fixed
Plate, Z axis move mould group and are equipped with multiple-point focusing head and laser sliver focus head, and refracting telescope fixed plate is equipped with the first reflecting mirror
With the second reflecting mirror, scribing laser, the first reflection microscope group, sliver laser and the second reflection microscope group are additionally provided on upper mounting plate,
First reflection microscope group is used to receive the laser of scribing laser transmitting, and the first reflecting mirror is used to receive the reflection of the first reflection microscope group
Light, the second reflection microscope group are used to receive the laser of sliver laser transmitting, and the second reflecting mirror is used to receive the second reflection microscope group
Reflected light;Lower platform is equipped with X/Y axis and moves mould group, and X/Y axis moves mould group and is equipped with objective table, and objective table is poly- positioned at multifocal
The lower section of burnt head and laser sliver focus head;X/Y axis movement mould group includes X-axis movement mould group and Y-axis movement mould group, X-axis movement
Mould group is arranged on lower platform, and X-axis moves mould group and is equipped with Y-axis movement mould group, and Y-axis moves mould group and is equipped with objective table, X-axis fortune
Dynamic model group is equipped with X-axis position sensor, and X-axis position sensor is used to monitor the displacement data of X-axis movement mould group, Y-axis movement
Mould group is equipped with Y-axis position sensor, and Y-axis position sensor is used to monitor the displacement data of Y-axis movement mould group.In same machine
Device is equipped with scribing laser and sliver laser, dicing operation is carried out to workpieces processing by multiple-point focusing head, by swashing
Light sliver focus head carries out sliver operation to workpieces processing, and scribing can be completed in same machine and sliver operates, thus not
It needs for converted products to be transferred to an other machine, reduces the operating procedure of workpieces processing transfer, and in same machine
Scribing is completed on device and sliver operates, and the processing efficiency of machine is effectively promoted, and can be reduced the occupied area of machine, is dropped
The usable floor area in low soil, to save the manufacturing cost of product.
Preferably, being additionally provided with positioning plate in Z axis movement mould group, multiple-point focusing head and the setting of laser sliver focus head exist
First through hole and the second through-hole are additionally provided on positioning plate, on positioning plate, the reflected light of the first reflecting mirror passes through quilt after first through hole
Multiple-point focusing head receives, and the reflected light of the second reflecting mirror is received after passing through the second through-hole by laser sliver focus head.
Preferably, the first reflection microscope group includes third reflecting mirror and the 4th reflecting mirror, third reflecting mirror is drawn for receiving
The laser of chip laser transmitting, the 4th reflecting mirror are used to receive the reflected light of third reflecting mirror, and the first reflecting mirror is for receiving the
The reflected light of four reflecting mirrors.
Preferably, the second reflection microscope group includes the 5th reflecting mirror and the 6th reflecting mirror, the 5th reflecting mirror is split for receiving
The laser of chip laser transmitting, the 6th reflecting mirror are used to receive the reflected light of the 5th reflecting mirror, and the second reflecting mirror is for reception the
The reflected light of six reflecting mirrors.
Preferably, workbench is equipped with steel structure rack, Steel Structure structure includes feet, lower frame, bottom plate, column and upper ledge
Frame, feet are equipped with lower frame, and lower frame is connect by column with upper frame, and upper frame is connect with workbench, is set on lower frame
There is bottom plate;Workbench is workbench made of marble, and the quantity of feet is 4, and the quantity of column is 4.
Preferably, cabinet includes case lid, upper box and lower box, case lid is hinged with upper box, and upper box is equipped with and opens
Mouthful, workbench is arranged in upper box, and upper box is connect with lower box.When machine operation, case lid is closed, when machine does not work
When, case lid is opened, to pass through the safety of case lid effective protection user.
Preferably, cabinet is equipped with smoke exhaust mechanism, smoke exhaust mechanism includes installation shell, smoke exhaust pipe, connecting tube and stretches
Pipe, installation shell both ends are equipped with the first mounting plate and the second mounting plate, and screw passes through the first mounting plate, cabinet, the second peace according to this
It is threadedly coupled after loading board with nut, installation inner walls are equipped with the first support column and the second support column, the first support column and smoke evacuation
Pipe connection, the second support column are connect with telescoping tube, and connecting tube both ends are communicated with smoke exhaust pipe, telescoping tube respectively, and flexible inside pipe wall is set
There are particulate matter sensors, smoke evacuation inside pipe wall is equipped with exhaust fan and motor, and motor is equipped with filter screen, and motor drives filter screen to turn
It is dynamic.Telescoping tube is placed near multiple-point focusing head, when multiple-point focusing head utilizes laser cut workpieces, passes through exhausting
The smog generated when processing is discharged outside cabinet machine, so that effectively the intracorporal smog of case be discharged;Particulate matter sensors pass through
Signal wire is connect with motor, and particulate matter sensors are used to detect the grain value in telescoping tube, when judging that grain value is exceeded, particle
Object sensor sends a signal to motor, and motor drives filter screen rotation, so that filter screen is located at the nozzle position of connecting tube, thus right
Particulate burning purifying in smog reduces the dust in air;When disconnected grain value is not exceeded, motor is inoperative, to reduce motor
Energy consumption, and filter screen is not at the nozzle position of connecting tube, and the speed that smog is discharged is promoted.
The step pitches cutting method such as laser applied to dicing device, including laser scriber, further include motion control card
With the control software on industrial personal computer, control software on industrial personal computer is by the synthesis speed of predetermined acceleration, X-axis and Y-axis movement mould group
Degree, laser triggering step pitch and motion profile are arranged into the embedded software of motion control card, the embedded software of motion control card
Part moves mould by predetermined acceleration, the aggregate velocity of X-axis and Y-axis movement mould group and motion profile driving X-axis movement mould group and Y-axis
Group operation, while the displacement data Real-time Feedback of X-axis position sensor and Y-axis position sensor is to motion control card, movement control
The embedded software of fabrication obtain displacement data in real time and calculate in real time X-axis movement mould group and Y-axis movement mould group position change
Variable, when the embedded software of motion control card judges that X-axis movement mould group and the position change amount of Y-axis movement mould group reach predetermined
When laser triggering step pitch, motion control card sends instruction control scribing laser and issues a laser pulse, and scribing laser is
Pulse laser.By the cooperation of X-axis position sensor, Y-axis position sensor and motion control card, mould group and Y are moved in X-axis
Just control scribing laser issues laser when the position change amount of axis movement mould group reaches predetermined laser triggering step pitch, to process
The cutting of workpiece is all completed in the state of the step pitches such as laser, to reduce the carbonization situation of product, product quality is had
Effect improves.
The present invention has significant technical effect: being equipped with and draw on same machine due to using above technical scheme
Chip laser and sliver laser carry out dicing operation to workpieces processing by multiple-point focusing head, are focused by laser sliver
Head carries out sliver operation to workpieces processing, and scribing can be completed in same machine and sliver operates, without that will process
Transferred product reduces the operating procedure of workpieces processing transfer to an other machine, and completes to draw on same machine
Piece and sliver operate, and the processing efficiency of machine are effectively promoted, and can be reduced the occupied area of machine, reduce making for soil
With area, to save the manufacturing cost of product.The present invention has can complete scribing on a machine and sliver operates, has
Effect promotes the advantages of processing efficiency.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention.
Fig. 2 is the structural schematic diagram of box inner structure.
Fig. 3 is the partial enlarged view of A in Fig. 2.
Fig. 4 is the structural schematic diagram of positioning plate in Fig. 3.
Fig. 5 is the structural schematic diagram of X/Y axis movement mould group in Fig. 2.
Fig. 6 is the structural schematic diagram of cabinet and smoke exhaust mechanism in Fig. 1.
The toponym that each number designation is referred in the figures above is as follows: where 1-cabinet, 101-case lids, 102-
Upper box, 1021-openings, 103-lower boxes, 2-workbench, 201-upper mounting plates, 202-supporting blocks, 203-lower platforms,
3-steel structure racks, 301-upper frames, 302-columns, 303-bottom plates, 304-lower frames, 305-feets, the reflection of 4-thirds
Mirror, the 5-the four reflecting mirror, 6-the first reflection microscope group, 7-objective tables, 8-X/Y axis movement mould group, 801-X-axis movement mould group,
8011-X-axis position sensors, 802-Y-axis movement mould group, 8021-Y-axis position sensors, 9-scribing lasers, 10-are split
Chip laser, 11-refracting telescope fixed plates, 12-Z axis move mould group, the 13-the five reflecting mirror, the 14-the six reflecting mirror, 15-
It is second reflection microscope group, the 16-the first reflecting mirror, 17-positioning plates, 1701-first through hole, the 1702-the second through-hole, 18-multifocal
Point focusing head, the 19-the second reflecting mirror, 20-laser sliver focus heads, 21-smoke exhaust mechanisms, 2101-installation shells, 2102-
First support column, 2103-filter screens, 2104-smoke exhaust pipes, 2105-exhaust fans, 2106-motors, 2107-connecting tubes,
2108-telescoping tubes, 2109-particulate matter sensors, the 21010-the second support column, 21011-nuts, the 21012-the second installation
Plate, the 21013-the first mounting plate, 21014-screws.
Specific embodiment
Present invention is further described in detail with embodiment with reference to the accompanying drawing.
Embodiment 1
Laser scriber is equipped with workbench 2 as shown, including cabinet 1 in cabinet 1, workbench 2 includes lower platform
203, supporting block 202 and upper mounting plate 201, lower platform 203 are equipped with supporting block 202, and supporting block 202 is equipped with upper mounting plate 201, on
Platform 201 is equipped with Z axis movement mould group 12 and refracting telescope fixed plate 11, and Z axis moves mould group 12 and is equipped with multiple-point focusing head 18
With laser sliver focus head 20, refracting telescope fixed plate 11 is equipped with the first reflecting mirror 16 and the second reflecting mirror 19, on upper mounting plate 201
It is additionally provided with scribing laser 9, first and reflects microscope group 6, sliver laser 10 and the second reflection microscope group 15, the first reflection microscope group 6 is used
In the laser for receiving the transmitting of scribing laser 9, the first reflecting mirror 16 is used to receive the reflected light of the first reflection microscope group 6, and second is anti-
It penetrates microscope group 15 and is used to receive the anti-of the second reflection microscope group 15 for receiving the laser of the transmitting of sliver laser 10, the second reflecting mirror 19
Penetrate light.Lower platform 203 is equipped with X/Y axis and moves mould group 8, and X/Y axis moves mould group 8 and is equipped with objective table 7, and objective table 7 is located at more
The lower section of focal point head 18 and laser sliver focus head 20;It includes X-axis movement mould group 801 and Y-axis fortune that X/Y axis, which moves mould group 8,
Dynamic model group 802, X-axis move mould group 801 and are arranged on lower platform 203, and X-axis moves mould group 801 and is equipped with Y-axis movement mould group 802,
Y-axis moves mould group 802 and is equipped with objective table 7, and X-axis moves mould group 801 and is equipped with X-axis position sensor 8011, X-axis position sensing
Device 8011 is used to monitor the displacement data of X-axis movement mould group 801, and Y-axis moves mould group 802 and is equipped with Y-axis position sensor 8021,
Y-axis position sensor 8021 is used to monitor the displacement data of Y-axis movement mould group 802.
Positioning plate 17 is additionally provided in Z axis movement mould group 12, multiple-point focusing head 18 and the setting of laser sliver focus head 20 exist
On positioning plate 17, first through hole 1701 and the second through-hole 1702 are additionally provided on positioning plate 17, the reflected light of the first reflecting mirror 16 is worn
It is received after crossing first through hole 1701 by multiple-point focusing head 18, the reflected light of the second reflecting mirror 19 passes through quilt after the second through-hole 1702
Laser sliver focus head 20 receives.
First reflection microscope group 6 includes third reflecting mirror 4 and the 4th reflecting mirror 5, and third reflecting mirror 4 is for receiving scribing laser
The laser that device 9 emits, the 4th reflecting mirror 5 are used to receive the reflected light of third reflecting mirror 4, and the first reflecting mirror 16 is for receiving the 4th
The reflected light of reflecting mirror 5.
Second reflection microscope group 15 includes the 5th reflecting mirror 13 and the 6th reflecting mirror 14, and the 5th reflecting mirror 13 is for receiving sliver
The laser that laser 10 emits, the 6th reflecting mirror 14 are used to receive the reflected light of the 5th reflecting mirror 13, and the second reflecting mirror 19 is used for
Receive the reflected light of the 6th reflecting mirror 14.
Workbench 2 is equipped with steel structure rack 3, and Steel Structure structure includes feet 305, lower frame 304, bottom plate 303, column 302
With upper frame 301, feet 305 is equipped with lower frame 304, and lower frame 304 is connect by column 302 with upper frame 301, upper frame
301 connect with workbench 2, and lower frame 304 is equipped with bottom plate 303;Workbench 2 is workbench 2 made of marble, feet 305
Quantity be 4, the quantity of column 302 is 4.
Cabinet 1 includes case lid 101, upper box 102 and lower box 103, and case lid 101 and upper box 102 are hinged, upper box
102 are equipped with opening 1021, and workbench 2 is arranged in upper box 102, and upper box 102 is connect with lower box 103.
Cabinet 1 is equipped with smoke exhaust mechanism 21, and smoke exhaust mechanism 21 includes installation shell 2101, smoke exhaust pipe 2104, connecting tube
2107 and telescoping tube 2108, installation 2101 both ends of shell are equipped with the first mounting plate 21013 and the second mounting plate 21012, screw
21014 are threadedly coupled after the first mounting plate 21013, cabinet 1, the second mounting plate 21012 with nut 21011 according to this, install
2101 inner wall of shell is equipped with the first support column 2102 and the second support column 21010, and the first support column 2102 connects with smoke exhaust pipe 2104
Connect, the second support column 21010 is connect with telescoping tube 2108,2107 both ends of connecting tube respectively with smoke exhaust pipe 2104, telescoping tube 2108
It communicates, 2108 inner wall of telescoping tube is equipped with particulate matter sensors 2109, and 2104 inner wall of smoke exhaust pipe is equipped with exhaust fan 2105 and motor
2106, motor 2106 is equipped with filter screen 2103, and motor 2106 drives filter screen 2103 to rotate.
The step pitches cutting method such as laser applied to dicing device, including laser scriber, further include motion control card
With the control software on industrial personal computer, control software on industrial personal computer is by the synthesis speed of predetermined acceleration, X-axis and Y-axis movement mould group
Degree, laser triggering step pitch and motion profile are arranged into the embedded software of motion control card, the embedded software of motion control card
Part is transported by predetermined acceleration, the aggregate velocity of X-axis and Y-axis movement mould group and motion profile driving X-axis movement mould group 801 and Y-axis
Dynamic model group 802 is run, while the displacement data Real-time Feedback of X-axis position sensor 8011 and Y-axis position sensor 8012 is to fortune
Dynamic control card, the embedded software of motion control card obtain displacement data in real time and calculate X-axis movement mould group 801 and Y in real time
Axis moves the position change amount of mould group 802, when the embedded software of motion control card judges X-axis movement mould group 801 and Y-axis movement
When the position change amount of mould group 802 reaches predetermined laser triggering step pitch, motion control card sends instruction control scribing laser 9 and sends out
A laser pulse out, to reach the step pitches such as laser cutting purpose, scribing laser 9 is pulse laser.
In short, the foregoing is merely presently preferred embodiments of the present invention, it is all according to equalization made by scope of the present invention patent
Variation and modification, shall all be covered by the patent of the invention.
Claims (8)
1. laser scriber, it is characterised in that: including cabinet (1), be equipped with workbench (2) in cabinet (1), workbench (2) packet
Lower platform (203), supporting block (202) and upper mounting plate (201) are included, lower platform (203) is equipped with supporting block (202), supporting block
(202) upper mounting plate (201) are equipped with, upper mounting plate (201) is equipped with Z axis movement mould group (12) and refracting telescope fixed plate (11), Z axis
It moves mould group (12) and is equipped with multiple-point focusing head (18) and laser sliver focus head (20), refracting telescope fixed plate (11) is equipped with
First reflecting mirror (16) and the second reflecting mirror (19) are additionally provided with scribing laser (9), the first reflection microscope group on upper mounting plate (201)
(6), sliver laser (10) and the second reflection microscope group (15), the first reflection microscope group (6) is for receiving scribing laser (9) transmitting
Laser, the first reflecting mirror (16) be used for receives first reflection microscope group (6) reflected light, second reflection microscope group (15) is used for receive
The laser of sliver laser (10) transmitting, the second reflecting mirror (19) are used to receive the reflected light of the second reflection microscope group (15);It is lower flat
Platform (203) is equipped with X/Y axis movement mould group (8), and X/Y axis moves mould group (8) and is equipped with objective table (7), and objective table (7) is located at more
The lower section of focal point head (18) and laser sliver focus head (20);X/Y axis movement mould group (8) includes X-axis movement mould group (801)
Mould group (802) are moved with Y-axis, X-axis moves mould group (801) and is arranged on lower platform (203), and X-axis movement mould group (801) is equipped with
Y-axis moves mould group (802), and Y-axis moves mould group (802) and is equipped with objective table (7), and X-axis moves mould group (801) and is equipped with X-axis position
It sets sensor (8011), X-axis position sensor (8011) is used to monitor the displacement data of X-axis movement mould group (801), Y-axis movement
Mould group (802) is equipped with Y-axis position sensor (8021), and Y-axis position sensor (8021) is for monitoring Y-axis movement mould group
(802) displacement data.
2. laser scriber according to claim 1, it is characterised in that: be additionally provided with positioning in Z axis movement mould group (12)
Plate (17), multiple-point focusing head (18) and laser sliver focus head (20) are arranged on positioning plate (17), on positioning plate (17) also
Equipped with first through hole (1701) and the second through-hole (1702), after the reflected light of the first reflecting mirror (16) passes through first through hole (1701)
It is received by multiple-point focusing head (18), the reflected light of the second reflecting mirror (19) is gathered after passing through the second through-hole (1702) by laser sliver
Burnt head (20) receives.
3. laser scriber according to claim 1, it is characterised in that: the first reflection microscope group (6) includes third reflection
Mirror (4) and the 4th reflecting mirror (5), third reflecting mirror (4) are used to receive the laser of scribing laser (9) transmitting, the 4th reflecting mirror
(5) for receiving the reflected light of third reflecting mirror (4), the first reflecting mirror (16) is used to receive the reflected light of the 4th reflecting mirror (5).
4. laser scriber according to claim 1, it is characterised in that: the second reflection microscope group (15) includes the 5th reflection
Mirror (13) and the 6th reflecting mirror (14), the 5th reflecting mirror (13) are used to receive the laser of sliver laser (10) transmitting, and the 6th is anti-
Mirror (14) are penetrated for receiving the reflected light of the 5th reflecting mirror (13), the second reflecting mirror (19) is for receiving the 6th reflecting mirror (14)
Reflected light.
5. laser scriber according to claim 1, it is characterised in that: workbench (2) is equipped with steel structure rack (3),
Steel Structure structure includes feet (305), lower frame (304), bottom plate (303), column (302) and upper frame (301), feet (305)
It is equipped with lower frame (304), lower frame (304) is connect by column (302) with upper frame (301), upper frame (301) and work
Platform (2) connection, lower frame (304) are equipped with bottom plate (303);Workbench (2) is workbench (2) made of marble, feet
(305) quantity is 4, and the quantity of column (302) is 4.
6. laser scriber according to claim 1, it is characterised in that: cabinet (1) includes case lid (101), upper box
(102) and lower box (103), hingedly, upper box (102) is equipped with opening (1021), work for case lid (101) and upper box (102)
Make platform (2) setting in upper box (102), upper box (102) is connect with lower box (103).
7. laser scriber according to claim 1, it is characterised in that: cabinet (1) is equipped with smoke exhaust mechanism (21), row
Smoke machine structure (21) includes installation shell (2101), smoke exhaust pipe (2104), connecting tube (2107) and telescoping tube (2108), installs shell
(2101) both ends are equipped with the first mounting plate (21013) and the second mounting plate (21012), and screw (21014) passes through the first peace according to this
Loading board (21013), cabinet (1), the second mounting plate (21012) are threadedly coupled with nut (21011) afterwards, in installation shell (2101)
Wall is equipped with the first support column (2102) and the second support column (21010), and the first support column (2102) is connect with smoke exhaust pipe (2104),
Second support column (21010) is connect with telescoping tube (2108), connecting tube (2107) both ends respectively with smoke exhaust pipe (2104), telescoping tube
(2108) it communicates, telescoping tube (2108) inner wall is equipped with particulate matter sensors (2109), and smoke exhaust pipe (2104) inner wall is equipped with exhausting
Machine (2105) and motor (2106), motor (2106) are equipped with filter screen (2103), and motor (2106) drives filter screen (2103)
Rotation.
8. being applied to the step pitches cutting methods such as the laser of dicing device, it is characterised in that: including laser scribing described in claim 1
Sheet devices further include the control software on motion control card and industrial personal computer, and the control software on industrial personal computer is by predetermined acceleration, X
The embedded software of the aggregate velocity of axis and Y-axis movement mould group, laser triggering step pitch and motion profile setting to motion control card
In, the embedded software of motion control card is driven by predetermined acceleration, the aggregate velocity of X-axis and Y-axis movement mould group and motion profile
Dynamic X-axis movement mould group (801) and Y-axis movement mould group (802) operation, while X-axis position sensor (8011) and Y-axis position sensing
The displacement data Real-time Feedback of device (8012) obtains displacement data to motion control card, the embedded software of motion control card in real time
And the position change amount of X-axis movement mould group (801) and Y-axis movement mould group (802) is calculated in real time, when the insertion of motion control card
Formula software judges that X-axis movement mould group (801) and the position change amount of Y-axis movement mould group (802) reach predetermined laser triggering step pitch
When, motion control card sends instruction control scribing laser (9) and issues a laser pulse, and scribing laser (9) swashs for pulse
Light device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811148319.3A CN109332912A (en) | 2018-09-29 | 2018-09-29 | The step pitches cutting method such as laser scriber and laser applied to dicing device |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0532428A (en) * | 1991-07-30 | 1993-02-09 | Hoya Corp | Method for working glass and its apparatus |
US20040089644A1 (en) * | 2002-11-12 | 2004-05-13 | Kazuma Sekiya | Laser machining method and laser machining apparatus |
CN201353688Y (en) * | 2008-12-30 | 2009-12-02 | 武汉楚天激光(集团)股份有限公司 | High-precision two-dimensional movement work platform control system for laser film engraving |
JP2010212478A (en) * | 2009-03-11 | 2010-09-24 | Panasonic Corp | Laser processing method, and laser processing device |
CN203509351U (en) * | 2013-09-27 | 2014-04-02 | 东莞市盛雄激光设备有限公司 | Multi-head laser etching machine |
CN104972226A (en) * | 2014-04-10 | 2015-10-14 | 大族激光科技产业集团股份有限公司 | Double-head laser machining device and machining method |
CN206153763U (en) * | 2016-09-30 | 2017-05-10 | 广东正业科技股份有限公司 | Carbon dioxide laser processing equipment |
-
2018
- 2018-09-29 CN CN201811148319.3A patent/CN109332912A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0532428A (en) * | 1991-07-30 | 1993-02-09 | Hoya Corp | Method for working glass and its apparatus |
US20040089644A1 (en) * | 2002-11-12 | 2004-05-13 | Kazuma Sekiya | Laser machining method and laser machining apparatus |
CN201353688Y (en) * | 2008-12-30 | 2009-12-02 | 武汉楚天激光(集团)股份有限公司 | High-precision two-dimensional movement work platform control system for laser film engraving |
JP2010212478A (en) * | 2009-03-11 | 2010-09-24 | Panasonic Corp | Laser processing method, and laser processing device |
CN203509351U (en) * | 2013-09-27 | 2014-04-02 | 东莞市盛雄激光设备有限公司 | Multi-head laser etching machine |
CN104972226A (en) * | 2014-04-10 | 2015-10-14 | 大族激光科技产业集团股份有限公司 | Double-head laser machining device and machining method |
CN206153763U (en) * | 2016-09-30 | 2017-05-10 | 广东正业科技股份有限公司 | Carbon dioxide laser processing equipment |
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Application publication date: 20190215 |