CN109327961A - Pcb board based on SMA connector - Google Patents
Pcb board based on SMA connector Download PDFInfo
- Publication number
- CN109327961A CN109327961A CN201811326380.2A CN201811326380A CN109327961A CN 109327961 A CN109327961 A CN 109327961A CN 201811326380 A CN201811326380 A CN 201811326380A CN 109327961 A CN109327961 A CN 109327961A
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- metal layer
- pad
- pcb board
- layer
- sma connector
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
A kind of pcb board based on SMA connector, pcb board includes: first to be stacked to nth metal layer, first to nth metal layer, and the first metal layer includes first part and second part, first part has the first pad and microstrip line being connected with each other, and second part has the second pad；As N=2, the first clearance zone is equipped at second metal layer position corresponding with the first pad, the first pad is located in the first clearance zone in the projection of second metal layer；As N > 2, the first clearance zone is respectively equipped at the position corresponding with the first pad of every layer of metal layer of the second metal layer into nth metal layer, the projection of every layer metal layer of first pad in second metal layer into nth metal layer is respectively positioned in corresponding first clearance zone.According to the pcb board of the application, the mismatch of SMA connector, the first pad and microstrip line can be reduced.
Description
Technical field
This application involves technical field of circuit design, more particularly, to a kind of pcb board based on SMA connector.
Background technique
In the related technology, due to the width very little of microstrip line, the very thin thickness of every layer of medium, the physics ruler of SMA connector
The very little line width compared to the microstrip line is much greater, this results in the characteristic impedance of welding disking area can be very small, and SM is caused to connect
Device, the first pad and microstrip line largely mismatch, and the mismatch condition is particularly evident in 3GHz or more.
Summary of the invention
The application aims to solve at least one of the technical problems existing in the prior art.For this purpose, the application proposes a kind of base
In the pcb board of SMA connector, be conducive to the characteristic impedance for improving the first welding disking area, reduce SMA connector, the first pad with
Mismatch between microstrip line.
According to the pcb board based on SMA connector of the embodiment of the present application, the SMA connector has conductor pin and connects
Ground pin, the pcb board include: the first metal layer to nth metal layer, and the first metal layer to nth metal layer is stacked,
The first metal layer is equipped with dielectric layer, first metal between every adjacent two metal layers into nth metal layer
Layer includes the first part being separated from each other and second part, and the first part has the first pad being connected with each other and micro-strip
Line, the second part have the second pad, and first pad is suitable for being connected with the conductor pin, and second pad is suitable
It is connected in the ground pin, M metal layer is the reference ground of the microstrip line, second pad and the M metal
Layer ground connection is connected, wherein N >=2,2≤M≤N, M and N are integer；As N=2, second metal layer is corresponding with first pad
Position at be equipped with the first clearance zone, first pad is located at first clearance zone in the projection of the second metal layer
It is interior；As N > 2, every layer metal layer of the second metal layer into the nth metal layer it is corresponding with first pad
The first clearance zone, every layer metal of first pad in the second metal layer into nth metal layer are respectively equipped at position
The projection of layer is respectively positioned in corresponding first clearance zone.
According to the pcb board based on SMA connector of the embodiment of the present application, be conducive to the feature resistance for improving the first welding disking area
It is anti-, to reduce the mismatch of SMA connector, the first pad and microstrip line.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the application will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
Fig. 1 is the cooperation schematic diagram of the pcb board and SMA connector according to some embodiments of the application；
Fig. 2 is the schematic diagram of pcb board according to figure 1；
Fig. 3 is the decomposition diagram of pcb board according to Fig.2,；
Fig. 4 is the decomposition diagram according to the pcb board of the application other embodiments；
Fig. 5 is the variation range for the port standing-wave ratio for using the pcb board of the embodiment of the present application and being measured using SMA connector
Figure.
Appended drawing reference:
Pcb board 100；
Metal layer 10；The first metal layer 10a；Second metal layer 10b；Third metal layer 10c；4th metal layer 10d；5th
Metal layer 10e；First pad 101；Uniform segment 1011；Changeover portion 1012；Microstrip line 102；Second pad 103；
Dielectric layer 20；First medium layer 20a；Second dielectric layer 20b；Third dielectric layer 20c；4th dielectric layer 20d；
First clearance zone 30；Second clearance zone 40；
SMA connector 200；Conductor pin 2001；Ground pin 2002.
Specific embodiment
Embodiments herein is described below in detail, the example of embodiment is shown in the accompanying drawings, wherein identical from beginning to end
Or similar label indicates same or similar element or element with the same or similar functions.It is retouched below with reference to attached drawing
The embodiment stated is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.
In the description of the present application, unless otherwise indicated, the meaning of " plurality " is two or more.
Below with reference to Fig. 1-Fig. 5 description according to the pcb board 100 based on SMA connector 200 of the embodiment of the present application.Wherein,
SMA connector 200 may include conductor pin 2001 and ground pin 2002.For example, conductor pin 2001 is located at SMA connector
One end of 200 main body is simultaneously coaxially disposed with main body, and ground pin 2002 is two and is located at the two of conductor pin 2001
Side.Certainly, ground pin 2002 can also be four.For SMA connector 200 specific structure by those skilled in the art
It is known, it is no longer described in detail herein.
It as Figure 1-Figure 4, may include according to the pcb board 100 based on SMA connector 200 of the embodiment of the present application
One metal layer 10a is to nth metal layer.Wherein, the integer that N is >=2.It follows that pcb board 100 is multi-layer PCB board and pcb board
100 have two layers and two layers or more of metal layer 10 (for example, every layer of metal layer 10 is copper clad layers).For example, N be 3,4,5,6,
7 or 8 equal integers.
Specifically, the first metal layer 10a is stacked to nth metal layer, and the first metal layer 10a is into nth metal layer
Dielectric layer 20 is equipped between per adjacent two metal layers 10, that is to say, that the stacking of more metal layers 10 of pcb board 100 is set
It sets and is equipped with dielectric layer 20 between adjacent two metal layers 10.For example, as Figure 3-Figure 4, pcb board 100 includes five layers of gold
Belonging to layer 10 is the first metal layer 10a, second metal layer 10b, third metal layer 10c, the 4th metal layer 10d and fifth metal layer
10e, wherein first medium layer 20a, second metal layer 10b and the are equipped between the first metal layer 10a and second metal layer 10b
It is equipped with second dielectric layer 20b between three metal layer 10c, third medium is equipped between third metal layer 10c and the 4th metal layer 10d
Layer 20c, is equipped with the 4th dielectric layer 20d between the 4th metal layer 10d and fifth metal layer 10e.
As Figure 1-Figure 4, the first metal layer 10a includes the first part being separated from each other and second part, and first
Divide with the first pad 101 and microstrip line 102 being connected with each other, second part is with the second pad 103.For example, first part
The first pad 101 and microstrip line 102 are limited, second part limits the second pad 103.
First pad 101 is suitable for being connected with conductor pin 2001, and the second pad 103 is suitable for being connected with ground pin 2002.
For example, the first pad 101 is weldingly connected with conductor pin 2001, the second pad 103 is two, two the second pad 103 difference
It is weldingly connected with two ground pins 2002.
M metal layer 10 is the reference ground of microstrip line 102, and the second pad 103 is connected with the ground connection of M metal layer 10, wherein
2≤M≤N, M are integer.For example, as shown in figure 3, second metal layer 10b is reference the ground of microstrip line 102, the second pad 103 and
Second metal layer 10b ground connection is connected.
As N=2, at the position corresponding with the first pad 101 second metal layer 10b be equipped with the first clearance zone 30, first
Projection of the pad 101 in second metal layer 10b is located in the first clearance zone 30, that is to say, that the first pad 101 is in the second metal
The projection of layer 10b is positioned at the outside of the first clearance zone 30 of second metal layer 10b, i.e., the outer profile of the first pad 101 is the
The projection of two metal layer 10b and the profile of the first clearance zone 30 of this layer of metal layer 10 are completely coincident, and can also be located at this layer of gold
In the profile for belonging to the first clearance zone 30 of layer 10.
As N > 2, every layer metal layer 10 of the second metal layer 10b into nth metal layer it is corresponding with the first pad 101
Position at be respectively equipped with the first clearance zone 30.Every layer gold of first pad 101 in second metal layer 10b into nth metal layer
The projection for belonging to layer 10 is respectively positioned in corresponding first clearance zone 30, that is to say, that other other than the first metal layer 10a
In metal layer 10, the first clearance zone 30 and the first weldering are equipped at the position corresponding with the first pad 101 of every layer of metal layer 10
Disk 101 does not weld in the projection of corresponding metal layer 10 positioned at the outside of the first clearance zone 30 of this layer of metal layer 10, i.e., first
The projection of every layer metal layer 10 of the outer profile of disk 101 in other metal layers 10 other than the first metal layer 10a can be with
It is completely coincident with the profile of the first clearance zone 30 of this layer of metal layer, the first clearance zone 30 of this layer of metal layer 10 can also be located at
Profile in.Be conducive to improve the characteristic impedance at the first pad 101 as a result, to reduce SMA connector 200, the first pad
101 and microstrip line 102 mismatch.
According to the pcb board 100 based on SMA connector 200 of the embodiment of the present application, by the first clearance zone 30 of setting and make
The projection for obtaining the first pad 101 is located in the first clearance zone 30, to be conducive to improve the feature resistance in 101 region of the first pad
It is anti-, to reduce the mismatch of SMA connector 200, the first pad 101 and microstrip line 102.
In some embodiments of the present application, as M=3, at the position corresponding with microstrip line 102 second metal layer 10b
Equipped with the second clearance zone 40, as M > 3, every layer metal layer 10 and micro-strip of the second metal layer 10b into (M-1) metal layer
Line 102 is equipped with the second clearance zone 40 at corresponding position.Consequently facilitating realizing reference of the M metal layer as microstrip line 102
Ground, while avoiding the interference generated due to being not provided with the second clearance zone 40 to the ground connection of microstrip line 102.
For example, as shown in figure 4, third metal layer 10c is reference of microstrip line 102, second metal layer be 10b's and micro-strip
The second clearance zone 40 is equipped at the corresponding position of line 102.
Specifically, in the plane for being parallel to pcb board 100, the projection of microstrip line 102 is located in the second clearance zone 40.From
And be easy to implement M metal layer 10 as microstrip line 102 reference ground, while avoid it is right due to being not provided with the second clearance zone 40
The interference that the ground connection of microstrip line 102 generates.
In some embodiments of the present application, the second pad 103 passes through metallic vias (not shown) phase with M metal layer
Even, to be grounded the ground connection of pin 2002 and the second pad 103.Specifically, for example, when second metal layer 10b is reference
When ground, the first medium layer 20a between the second pad 103, the first metal layer 10a and second metal layer 10b is respectively equipped with via hole,
The inner wall of via hole is equipped with the coat of metal (such as copper plate) to realize the company between the second pad 103 and second metal layer 10b
It connects.About the specific set-up mode of metallic vias, by as it is known to those skilled in the art that be no longer described in detail herein.
In some embodiments of the present application, from the double layer of metal of second metal layer 10b arbitrary neighborhood into nth metal layer
The area and shape of first clearance zone 30 of layer 10 are all the same.To facilitate the processing and manufacturing to pcb board 100, be conducive to drop
Low cost.Certainly, in other optional embodiments, from the first metal layer 10a to nth metal layer on 10 direction, more
Metal layer 10 far from the first metal layer 10a, the area of the first clearance zone 30 is bigger, thus preferably optimized PCB 100
Structure is conducive to the characteristic impedance for further increasing the first pad 101.
In some embodiments of the present application, on the direction towards microstrip line 102, the width of the first pad 101 gradually subtracts
It is small.Since the width of microstrip line 102 is smaller, on the direction towards microstrip line 102, by the way that the width of the first pad 101 is set
It is set to and is gradually reduced, consequently facilitating the first pad 101 is preferably matched with the width of microstrip line 102, to further increase
The characteristic impedance in one pad, 101 region further decreases the mismatch journey of SMA connector 200, the first pad 101 and microstrip line 102
Degree, keeps the Insertion Loss measured value of cabling more accurate, while can also reduce the influence of strap ladder line bring.
Specifically, as shown in Fig. 2, the first pad 101 include uniform segment 1011 and changeover portion 1012, uniform segment 1011 with connect
Ground pin 2002 is connected, and the width of uniform segment 1011 is constant, and one end of changeover portion 1012 is connected with uniform segment 1011, changeover portion
1012 other end is connected with microstrip line 102, and the width of changeover portion 1012 gradually subtracts on the direction towards close microstrip line 102
It is small.So as to further facilitate the first pad 101 neighbouring microstrip line 102 one end and microstrip line 102 matching, thus more into
One step improves the characteristic impedance in 101 region of the first pad, reduces the mistake of SMA connector 200, the first pad 101 and microstrip line 102
With degree, while it can be also further reduced the influence of strap ladder line bring, while also assure the first pad 101 and conductor pin
The reliability of connection between 2001.
Optionally, the width of width with uniform segment 1011 of one end of changeover portion 1012 is equal.The first weldering can be facilitated as a result,
The setting of disk 101.
Optionally, the width of the other end of changeover portion 1012 is not less than the width of microstrip line 102.Specifically, changeover portion
The width of 1012 other end is equal with the width of microstrip line 102.The neighbouring micro- of the first pad 101 can greatly be facilitated as a result,
The matching of one end with line 102 and microstrip line 102 effectively improves the characteristic impedance in 101 region of the first pad, reduces SMA and connects
The mismatch of device 200, the first pad 101 and microstrip line 102 is connect, while can also be further reduced strap ladder line bring shadow
It rings.It is, of course, understood that the width of the other end of changeover portion 1012 can also be slightly larger than the line width of microstrip line 102, example
Such as, the width of the other end of changeover portion 1012 is d1, and the width of microstrip line 102 is d2,1.001d2≤d1≤1.1d2.
Optionally, as shown in Fig. 2, the both ends of the width direction of changeover portion 1012 extend straight.It is facilitated as a result, to
The processing of one pad 101, and be conducive to improve the matching between SMA connector 200 and the first pad 101 and microstrip line 102
Degree.Certainly, the application is without being limited thereto, and in other optional embodiments, the both ends of the width direction of changeover portion 1012 are in
Curve extends.For example, the both ends of the width direction of changeover portion 1012 extend in camber line, be conducive to optimized PCB 100 as a result,
Structure.
Optionally, the line width of microstrip line is no more than 0.03mm, to ensure that the impedance of microstrip line.
The structure of the pcb board 100 based on SMA connector 200 of the embodiment of the present application is carried out with reference to the accompanying drawing detailed
Explanation.
Embodiment 1
It as shown in Figure 1-Figure 3, may include according to the pcb board 100 based on SMA connector 200 of the embodiment of the present application
One metal layer 10a to fifth metal layer 10e.Every layer of metal layer 10 is copper clad layers.
The first metal layer 10a to fifth metal layer 10e is stacked, between the first metal layer 10a and second metal layer 10b
Equipped with first medium layer 20a, second dielectric layer 20b, third metal are equipped between second metal layer 10b and third metal layer 10c
It is equipped with third dielectric layer 20c between layer 10c and the 4th metal layer 10d, is set between the 4th metal layer 10d and fifth metal layer 10e
There is the 4th dielectric layer 20d.
As shown in Figure 1-Figure 3, the first metal layer 10a includes the first part being separated from each other and second part, and first
Divide and limit the first pad 101 and microstrip line 102, the first pad 101 is connected with microstrip line 102, and second part limits two
Second pad 103.
First pad 101 is weldingly connected with conductor pin 2001, and the second pad 103 is suitable for welding phase with ground pin 2002
Even.
The position corresponding with the first pad 101 of every layer metal layer 10 of the second metal layer 10b into fifth metal layer 10e
Place is respectively equipped with the first clearance zone 30, every layer metal of first pad 101 in second metal layer 10b into fifth metal layer 10e
The projection of layer 10 is respectively positioned in corresponding first clearance zone 30, and the shape of the first pad 101 and the first clearance zone 30, area are homogeneous
Together.
Second metal layer 10b is the reference ground of microstrip line 102, and the second pad 103 and second metal layer 10b passes through metal mistake
Hole is connected.
Specifically, as shown in Fig. 2, the first pad 101 include uniform segment 1011 and changeover portion 1012, uniform segment 1011 with connect
Ground pin 2002 is connected, and the width of uniform segment 1011 is constant, and one end of changeover portion 1012 is connected with uniform segment 1011, changeover portion
The width of 1012 one end is equal with the width of uniform segment 1011, and the other end of changeover portion 1012 is connected with microstrip line 102, transition
1012 width of section are gradually reduced on the direction towards close microstrip line 102, the width and micro-strip of the other end of changeover portion 1012
The width of line 102 is equal, and the both ends of the width direction of changeover portion 1012 extend straight.
Inventor is used the pcb board 100 in the present embodiment and has been carried out the survey of port standing-wave ratio using SMA connector 200
Examination, as a result as shown in figure 5, port standing wave ratio is between 1-1.1, thus specification SMA connector 200, the first pad 101
It is good with the matching degree of microstrip line 102.
Embodiment 2
The present embodiment is substantially the same with embodiment 1, and something in common uses identical label, the difference is that: third gold
Belong to the reference ground that layer 10c is microstrip line 102, is equipped with the second clearance zone at the position of the correspondence microstrip line 102 of second metal layer 10b
40, the second pad 103 is connected with third metal layer 10c by metallic vias.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means specific features described in conjunction with this embodiment or example, knot
Structure, material or feature are contained at least one embodiment or example of the application.In the present specification, to above-mentioned term
Schematic representation may not refer to the same embodiment or example.Moreover, specific features, structure, material or the spy of description
Point can be combined in any suitable manner in any one or more of the embodiments or examples.
While there has been shown and described that embodiments herein, it will be understood by those skilled in the art that: not
A variety of change, modification, replacement and modification can be carried out to these embodiments in the case where being detached from the principle and objective of the application, this
The range of application is defined by the claims and their equivalents.
Claims (11)
1. a kind of pcb board based on SMA connector, which is characterized in that the SMA connector has conductor pin and ground pipe
Foot, the pcb board include:
The first metal layer to nth metal layer, the first metal layer to nth metal layer is stacked, and the first metal layer is extremely
Dielectric layer is equipped between every adjacent two metal layers in nth metal layer, the first metal layer includes being separated from each other
First part and second part, the first part there is the first pad and microstrip line that are connected with each other, the second part
With the second pad, first pad is suitable for being connected with the conductor pin, and second pad is suitable for and the ground pipe
Foot is connected, and M metal layer is the reference ground of the microstrip line, and second pad is connected with M metal layer ground connection,
In, N >=2,2≤M≤N, M and N are integer；
As N=2, the first clearance zone, first pad are equipped at second metal layer position corresponding with first pad
It is located in first clearance zone in the projection of the second metal layer；As N > 2, the second metal layer to the N gold
Belong to and is respectively equipped with the first clearance zone, first pad at the position corresponding with first pad of every layer of metal layer in layer
It is respectively positioned in corresponding first clearance zone in the projection of every layer metal layer of the second metal layer into nth metal layer.
2. the pcb board according to claim 1 based on SMA connector, which is characterized in that
As M=3, the second clearance zone is equipped at second metal layer position corresponding with the microstrip line；
As M > 3, every layer metal layer with the microstrip line corresponding position of the second metal layer into (M-1) metal layer
The place of setting is equipped with second clearance zone.
3. the pcb board according to claim 1 based on SMA connector, which is characterized in that second pad and described the
M metal layer is connected by metallic vias.
4. the pcb board according to claim 1 based on SMA connector, which is characterized in that from the second metal layer to institute
Nth metal layer is stated, the area and shape of first clearance zone of the metal layer of two layers of arbitrary neighborhood are all the same.
5. the pcb board according to claim 1 based on SMA connector, which is characterized in that towards close to the microstrip line
Direction on, the width of first pad is gradually reduced.
6. the pcb board according to claim 5 based on SMA connector, which is characterized in that first pad includes uniform
Section and changeover portion, the uniform segment are connected with the ground pin, and one end of the changeover portion is connected with uniform segment, the transition
The other end of section is connected with the microstrip line, gradually subtracts in the width towards the changeover portion on the direction close to the microstrip line
It is small.
7. the pcb board of SMA connector according to claim 6, which is characterized in that the width of the other end of the changeover portion
It is equal with the width of the microstrip line.
8. the pcb board of SMA connector according to claim 6, which is characterized in that the two of the width direction of the changeover portion
End extends straight.
9. the pcb board of SMA connector according to claim 6, which is characterized in that the two of the width direction of the changeover portion
Hold curved extension.
10. the pcb board of SMA connector according to claim 9, which is characterized in that the width direction of the changeover portion
Both ends extend in camber line.
11. the pcb board according to claim 1 to 10 based on SMA connector, which is characterized in that described first
Any one layer metal layer of the metal layer into the nth metal layer is copper clad layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811326380.2A CN109327961A (en) | 2018-11-08 | 2018-11-08 | Pcb board based on SMA connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811326380.2A CN109327961A (en) | 2018-11-08 | 2018-11-08 | Pcb board based on SMA connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109327961A true CN109327961A (en) | 2019-02-12 |
Family
ID=65260736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811326380.2A Pending CN109327961A (en) | 2018-11-08 | 2018-11-08 | Pcb board based on SMA connector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109327961A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111627328A (en) * | 2020-05-07 | 2020-09-04 | Oppo广东移动通信有限公司 | Electronic device and flexible display panel assembly thereof |
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| CN106981745A (en) * | 2016-01-15 | 2017-07-25 | 上海新微技术研发中心有限公司 | Board edge connecting structure of SMA connector |
| CN206921989U (en) * | 2017-06-30 | 2018-01-23 | 成都玖信科技有限公司 | A kind of transition connector of glass insulator and microstrip line |
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|---|---|---|---|---|
| CN2805300Y (en) * | 2005-05-18 | 2006-08-09 | 威盛电子股份有限公司 | Assembly structure of connector |
| CN1972558A (en) * | 2005-10-31 | 2007-05-30 | 索尼株式会社 | Flexible printed circuit board and module and device having same |
| CN101542849A (en) * | 2006-11-24 | 2009-09-23 | 菲尼克斯电气公司 | Manufactured round plug connector for the ethernet |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111627328A (en) * | 2020-05-07 | 2020-09-04 | Oppo广东移动通信有限公司 | Electronic device and flexible display panel assembly thereof |
| CN111627328B (en) * | 2020-05-07 | 2022-10-21 | Oppo广东移动通信有限公司 | Electronic device and flexible display panel assembly thereof |
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Application publication date: 20190212 |
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| RJ01 | Rejection of invention patent application after publication |