CN109326586A - A kind of energy supply control module and its manufacturing method - Google Patents
A kind of energy supply control module and its manufacturing method Download PDFInfo
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- CN109326586A CN109326586A CN201810972511.8A CN201810972511A CN109326586A CN 109326586 A CN109326586 A CN 109326586A CN 201810972511 A CN201810972511 A CN 201810972511A CN 109326586 A CN109326586 A CN 109326586A
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- substrate
- peripheral frame
- supply control
- energy supply
- control module
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
Abstract
The invention discloses a kind of energy supply control modules, specifically, the energy supply control module is made of first substrate, the second substrate and at least one peripheral frame, the first substrate is set to energy supply control module top, the second substrate is set to energy supply control module lower part, and the peripheral frame is set between first substrate and the second substrate；The edge of each substrate and peripheral frame is equipped with pad, is all connected by the pad between each substrate and peripheral frame；The upper and lower surface of the first substrate, the second substrate and peripheral frame is equipped with metallic circuit, and the first substrate upper surface and the second substrate upper surface are additionally provided with chip.Energy supply control module of the invention can meet current microwave components and minimize, can repair, multi-functional demand to energy supply control module.
Description
Technical field
The present invention relates to the power supply control technology field of microwave components, especially a kind of energy supply control module and its manufacturer
Method.
Background technique
Microwave components propose higher want during being increasingly miniaturized, to the miniaturization of its energy supply control module
It asks, intended volume is smaller while being also able to achieve more functions.Energy supply control module used in microwave current subassembly product
Integration mode be broadly divided into following three kinds of forms:
1) integrated based on microwave printed circuit, the pattern accuracy of which production is lower, and electronic component can only be installed on
Printing board surface, can not the discrete parts such as integrated resistor, capacitor and inductance, area occupied is larger, is unable to satisfy miniaturization
Demand；
2) integrated based on low-temperature co-fired ceramics (LTCC), which pattern accuracy is poor, inside buries chip sintering process complexity,
Cost is very high, once sintering is completed just not dismantling, inside burying chip device can not be reprocessed, and be unable to satisfy maintainable demand；
3) thin-film technique based on single layer is integrated, and the region which can be used for electrical connecting wires is few, cloth when High Density Integration
Line is difficult, and the complicated circuit more to function cannot achieve electrical interconnection, be unable to satisfy multi-functional demand.
Need a kind of miniaturization, detachably maintenance, multi-functional microwave components energy supply control module.
Summary of the invention
For solve above-mentioned existing power supply control module be unable to satisfy current microwave components to energy supply control module miniaturization, can
It repairs, the defect of multi-functional demand, the present invention provides a kind of energy supply control module and its manufacturing methods.
Technical scheme is as follows:
A kind of energy supply control module, specifically, the energy supply control module by first substrate, the second substrate and at least one
Peripheral frame composition, the first substrate are set to energy supply control module top, and the second substrate is set to energy supply control module lower part, institute
Peripheral frame is stated to be set between first substrate and the second substrate；The edge of each substrate and peripheral frame is equipped with pad, each substrate and peripheral frame
Between all connected by the pad；
The upper and lower surface of the first substrate, the second substrate and peripheral frame is equipped with metallic circuit, table on the first substrate
Face and the second substrate upper surface are additionally provided with chip.
In the above-mentioned technical solutions, the shapes and sizes of the first substrate, the second substrate and peripheral frame are unrestricted, can be with
The substrate of which kind of shape and/or size is used according to decisions such as chip size, metallic circuit complexity, installation environment, purposes
And/or peripheral frame.The quantity of the peripheral frame should determine that circuit is more complicated according to the complexity in circuits of energy supply control module, installation
When space needed for circuit is bigger, the quantity of peripheral frame is more.First substrate, peripheral frame, the second substrate stack and are connected on three-dimensional
It connects, provides enough installation spaces, and the metal of each substrate and peripheral frame upper and lower surface for integrated chip and other electronic devices
The space that circuit realizes circuit is longitudinally arranged, and significantly reduces the plane area occupied of energy supply control module, is met current
The demand that microwave components minimize energy supply control module；It is connected between each substrate or peripheral frame by pad, by being welded at pad
The melting of material, i.e., the detachable energy supply control module, meeting current microwave components removably needs energy supply control module
It asks, convenient for the maintenance of energy supply control module；All mountable chip or other electronic devices on first substrate and the second substrate are
Realize it is multi-functional provide the foundation, current microwave components can be met to the multi-functional demand of energy supply control module.
Preferably, the material of the first substrate, the second substrate and peripheral frame is all ceramics.
Preferably, the peripheral frame is " returning " word ring structure of intermediate hollow out.
" returning " word ring structure of intermediate hollow out, can in the second substrate chip and other electronic devices provide enough
Installation space.
Preferably, the pad is equipped with plated-through hole, and the plated-through hole connection upper surface metallic circuit is under
Surface metal circuit.
By plated-through hole, so that the metallic circuit in each substrate and peripheral frame is formed an entirety, meet power supply of the present invention
The demand that control module three-dimensional is longitudinally routed.
Preferably, the shape of the first substrate, the second substrate and peripheral frame is identical, in the same size.
Preferably, the pad is vertical interconnection pad, and each pad is in the first substrate, the second substrate and peripheral frame
Position is arranged to correspond to each other.
The corresponding position of each substrate and peripheral frame is arranged in each pad, can be big convenient for the design and production of each substrate and peripheral frame
The big assembling process for simplifying energy supply control module of the present invention.
The present invention also provides the manufacturing methods of above-mentioned energy supply control module, include the following steps:
1) it designs and makes first substrate, the second substrate and peripheral frame, and make pad respectively；
2) in the second substrate upper surface chip；
3) according to from bottom to up be respectively the second substrate, peripheral frame, each substrate of sequential connection of first substrate or peripheral frame；
4) on the first substrate surface mount chip to get the energy supply control module.
Design of the step 1) to each substrate and peripheral frame refers to the shape to each substrate and peripheral frame, size, surface metal circuit
With the design of welding disk pattern etc., wherein surface metal circuit and welding disk pattern can be completed the process by thin-film technique.
Preferably, step 1) further include: on the pad be arranged through-hole go forward side by side row metalization filling.
Preferably, the method that step 3) connects each substrate or peripheral frame are as follows: make solder bump on pad, then weld.
The present invention also provides the method for maintaining of above-mentioned energy supply control module: being heated to solder to module weld and melts
Change, separates each substrate or peripheral frame, debugging or replacement inner equipment, then repeat above-mentioned manufacturing method.
The invention has the following beneficial effects:
1) energy supply control module of the invention, first substrate, peripheral frame, the second substrate are stacked and are connected on three-dimensional,
Enough installation spaces, and the metallic circuit of each substrate and peripheral frame upper and lower surface are provided for integrated chip and other electronic devices
The space for realizing circuit is longitudinally arranged, and significantly reduces the area occupied of energy supply control module, meets current microwave components
Demand to energy supply control module miniaturization.
2) energy supply control module of the invention is connected by pad between each substrate or peripheral frame, passes through solder at pad
Melting, i.e., the detachable energy supply control module, meets dismountable demand, convenient for the maintenance of energy supply control module, meets
Current microwave components are to the maintainable demand of energy supply control module.
3) all mountable chip or other electronics devices in energy supply control module of the invention, first substrate and the second substrate
Part provides the foundation for realization is multi-functional, can meet current microwave components to the multi-functional demand of energy supply control module.
Detailed description of the invention
Examples of the present invention will be described by way of reference to the accompanying drawings, in which:
Fig. 1 is energy supply control module scale diagrams in the embodiment of the present invention.
Fig. 2 is energy supply control module structural schematic diagram in the embodiment of the present invention.
Fig. 3 is first substrate integrated circuit view in the embodiment of the present invention.
Fig. 4 is the first peripheral frame, the second peripheral frame integrated circuit view in the embodiment of the present invention.
Fig. 5 is the second substrate integrated circuit view in the embodiment of the present invention.
Description of symbols:
1, first substrate；2, the first peripheral frame；3, the second peripheral frame；4, the second substrate；10, first substrate upper surface metal electricity
Road；11, first substrate lower surface metal circuit；12, first substrate plated-through hole；13, first substrate chip；20, first encloses
Frame upper surface metallic circuit；21, the first peripheral frame lower surface metal circuit；22, the first peripheral frame plated-through hole；30, the second peripheral frame
Upper surface metallic circuit；31, the second peripheral frame lower surface metal circuit；32, the second peripheral frame plated-through hole；40, in the second substrate
Surface metal circuit；41, the second substrate lower surface metal circuit；42, the second substrate plated-through hole；43, the second substrate chip；
101, tube core is driven；102, the first metal-oxide-semiconductor core；103, the second metal-oxide-semiconductor core；104, triode；105, zener diode；106, thin
Film integrated resistor；107, thin-film integration resistance group；108, chip capacity；401, thin-film integration resistance group；102, analog switch core
Piece；103, thin-film integration resistance.
Specific embodiment
All features disclosed in this specification or disclosed all methods or in the process the step of, in addition to mutually exclusive
Feature and/or step other than, can combine in any way.
Any feature disclosed in this specification unless specifically stated can be equivalent or with similar purpose by other
Alternative features are replaced.That is, unless specifically stated, each feature is an example in a series of equivalent or similar characteristics
?.
The defect of the prior art: existing power supply control module is unable to satisfy miniaturization, can repair, multi-functional demand.
The technical problem to be solved in the present invention: provide it is a kind of have three-dimensional longitudinal wiring, it is detachable, can a large amount of chip
And the energy supply control module of other electronic devices.
Basic embodiment:
As depicted in figs. 1 and 2, a kind of energy supply control module, specifically, the energy supply control module by first substrate (1),
The second substrate (4) and at least one peripheral frame composition, the first substrate (1) are set to energy supply control module top, second base
Plate (4) is set to energy supply control module lower part, and the peripheral frame is set between first substrate (1) and the second substrate (4)；It each substrate and encloses
The edge of frame is equipped with pad, is all connected by the pad between each substrate and peripheral frame；
The upper and lower surface of the first substrate (1), the second substrate (4) and peripheral frame is equipped with metallic circuit, first base
Plate (1) upper surface and the second substrate (4) upper surface are additionally provided with chip.
In the above-mentioned technical solutions, the shapes and sizes of the first substrate (1), the second substrate (4) and peripheral frame are unrestricted
System which kind of shape and/or size can be used according to decisions such as chip size, metallic circuit complexity, installation environment, purposes
Substrate and/or peripheral frame.Illustratively, the first substrate (1), peripheral frame, the second substrate (4) can for round, polygon or
Other irregular shapes, it is preferable that the first substrate (1), peripheral frame, the second substrate (4) are the square that side length is 6.3mm.
The quantity of the peripheral frame should determine that circuit is more complicated according to the complexity in circuits of energy supply control module, installation electricity
When space needed for road is bigger, the quantity of peripheral frame is more.Illustratively, the quantity of the peripheral frame can be 1,2,3,5.
First substrate (1), peripheral frame, the second substrate (4) are stacked and are connected on three-dimensional, are integrated chip and other electricity
Sub- device provides enough installation spaces, and each substrate and the metallic circuit of peripheral frame upper and lower surface realize circuit space it is vertical
To arrangement, the area occupied of energy supply control module is significantly reduced, is conducive to the volume for reducing energy supply control module, meets and work as
The demand that preceding microwave components minimize energy supply control module；It is connected between each substrate or peripheral frame by pad, at pad
The melting of solder, i.e., the detachable energy supply control module, it is dismountable to energy supply control module to meet current microwave components
Demand, convenient for the maintenance of energy supply control module；All mountable chip or other electricity on first substrate (1) and the second substrate (4)
Sub- device provides the foundation for realization is multi-functional, can meet current microwave components to the multi-functional demand of energy supply control module.
Preferably, the material of the first substrate (1), the second substrate (4) and peripheral frame is all ceramics.
Preferably, the peripheral frame is " returning " word ring structure of intermediate hollow out.
" returning " word ring structure of intermediate hollow out, can on the second substrate (4) chip and other electronic devices provide
Enough installation spaces.
Preferably, the pad is equipped with plated-through hole, and the plated-through hole connection upper surface metallic circuit is under
Surface metal circuit.
By plated-through hole, so that the metallic circuit in each substrate and peripheral frame is formed an entirety, meet power supply of the present invention
The demand that control module three-dimensional is longitudinally routed.
Preferably, the first substrate (1), the second substrate (4) are identical with the shape of peripheral frame, in the same size.
Preferably, the pad is vertical interconnection pad, and each pad is in the first substrate (1), the second substrate (4) and encloses
Setting position on frame corresponds to each other.
The corresponding position of each substrate and peripheral frame is arranged in each pad, can be big convenient for the design and production of each substrate and peripheral frame
The big assembling process for simplifying energy supply control module of the present invention.
The present invention also provides the manufacturing methods of above-mentioned energy supply control module, include the following steps:
1) it designs and makes first substrate, the second substrate and peripheral frame, and make pad respectively；
2) in the second substrate upper surface chip；
3) according to from bottom to up be respectively the second substrate, peripheral frame, each substrate of sequential connection of first substrate or peripheral frame；
4) on the first substrate surface mount chip to get the energy supply control module.
Design of the step 1) to each substrate and peripheral frame refers to the shape to each substrate and peripheral frame, size, surface metal circuit
With the design of welding disk pattern etc., wherein surface metal circuit and welding disk pattern can be completed the process by thin-film technique.
Preferably, step 1) further include: on the pad be arranged through-hole go forward side by side row metalization filling.
Preferably, the method that step 3) connects each substrate or peripheral frame are as follows: make solder bump on pad, then weld.
The present invention also provides the method for maintaining of above-mentioned energy supply control module: being heated to solder to module weld and melts
Change, separates each substrate or peripheral frame, debugging or replacement inner equipment, then repeat above-mentioned manufacturing method.
Embodiment:
A kind of energy supply control module is made of first substrate, the second substrate and two layers of peripheral frame, specific as follows:
As shown in Fig. 2, the energy supply control module includes the first ceramic substrate (1) stacked gradually from top to bottom, first
Ceramic peripheral frame (2), the second ceramic peripheral frame (3), the second ceramic substrate (4), as shown in Figure 1, each layer be all side behavior 6.3mm just
It is rectangular；
First ceramic substrate (1) includes first substrate upper surface metallic circuit (10), first substrate lower surface metal
Circuit (11), first substrate plated-through hole (12), first substrate chip (13), the first substrate chip (13) are located at first
The top of upper surface of base plate metallic circuit (10), the first substrate plated-through hole (12) connect first substrate upper surface metal
Circuit (10) and first substrate lower surface metal circuit (11)；
Described first ceramic peripheral frame (2) includes: the first peripheral frame upper surface metallic circuit (20), the first peripheral frame lower surface metal
Circuit (21), the first peripheral frame plated-through hole (22), the first peripheral frame plated-through hole (22) connect the first peripheral frame upper surface
Metallic circuit (20) and the first peripheral frame lower surface metal circuit (21)；
Described second ceramic peripheral frame (3) includes: the second peripheral frame upper surface metallic circuit (30), the second peripheral frame lower surface metal
Circuit (31), the second peripheral frame plated-through hole (32), the second peripheral frame plated-through hole (32) connect the second peripheral frame upper surface
Metallic circuit (30) and the second peripheral frame lower surface metal circuit (31)；
Second ceramic substrate (4) includes: the second substrate upper surface metallic circuit (40), the second substrate lower surface metal
Circuit (41), the second substrate plated-through hole (42), the second substrate chip (43), the second substrate chip (43) are located at second
The top of upper surface of base plate metallic circuit (40), the second substrate plated-through hole (42) connect the second substrate upper surface metal
Circuit (40) and the second substrate lower surface metal circuit (41).
As shown in figure 3, first substrate upper surface metallic circuit (10), first substrate lower surface metal circuit (11) are common complete
At the function of electrical connection；Driving tube core (101) and the first metal-oxide-semiconductor core (102) are completed to can control positive piezoelectricity by being electrically connected
The function of source on-off；Second metal-oxide-semiconductor core (103), triode (104), thin-film integration resistance (106) and zener diode (105)
Electrifying timing sequence defencive function is completed by electrical connection；Thin-film integration resistance group (107) is with chip capacity (108) by electrically connecting
It connects and completes voltage swing regulatory function.
As shown in figure 4, the described second ceramic peripheral frame (2) and third ceramics peripheral frame (3), on circuit pattern and shape completely
Unanimously；Middle section hollow out provides installation space to lower layer's integrated chip；First peripheral frame upper surface metallic circuit (20) and second
Peripheral frame upper surface metallic circuit (30) is consistent, the first peripheral frame lower surface metal circuit (21) and the second peripheral frame lower surface metal circuit
(31) consistent, the first peripheral frame plated-through hole (22) and the second peripheral frame plated-through hole (32) are consistent.
As shown in figure 5, the second substrate upper surface metallic pattern (40) plays electrical connection function, the second substrate lower surface
Metallic pattern (41) plays ground connection, thin-film integration resistance group (401), analog switch chip (402) and thin-film integration resistance
(403) realize that negative electricity voltage can switch the function of output between two different voltage values by electrical connection.
Advantages of the present invention is numerous.Different aspect, embodiment or embodiments can produce one in following advantages
Or multiple advantages.It is one advantage of the present invention that: energy supply control module of the invention, first substrate, peripheral frame, the second substrate are three
Dimension is stacked and is connected on direction, provides enough installation spaces for integrated chip and other electronic devices, and each substrate with enclose
The space that the metallic circuit of frame upper and lower surface realizes circuit is longitudinally arranged, and significantly reduces the occupancy face of energy supply control module
Product is conducive to the volume for reducing energy supply control module, meets the demand that current microwave components minimize energy supply control module.
Yet another advantage of the present invention is that: energy supply control module of the invention is connected by pad between each substrate or peripheral frame, passes through weldering
The melting of solder at disk, i.e., the detachable energy supply control module, it is removable to energy supply control module to meet current microwave components
The demand unloaded, convenient for the maintenance of energy supply control module.It is a further advantage of the present invention to: energy supply control module of the invention, the
All mountable chip or other electronic devices on one substrate and the second substrate provide the foundation for realization is multi-functional, can meet
Current microwave components are to the multi-functional demand of energy supply control module.
The invention is not limited to specific embodiments above-mentioned.The present invention, which expands to, any in the present specification to be disclosed
New feature or any new combination, and disclose any new method or process the step of or any new combination.
Claims (10)
1. a kind of energy supply control module, which is characterized in that the energy supply control module is by first substrate, the second substrate and at least one
A peripheral frame composition, the first substrate are set to energy supply control module top, and the second substrate is set to energy supply control module lower part,
The peripheral frame is set between first substrate and the second substrate；The edge of each substrate and peripheral frame is equipped with pad, each substrate and encloses
It is all connected by the pad between frame；
The upper and lower surface of the first substrate, the second substrate and peripheral frame is equipped with metallic circuit, the first substrate upper surface with
The second substrate upper surface is additionally provided with chip.
2. energy supply control module according to claim 1, which is characterized in that the first substrate, the second substrate and peripheral frame
Material be all ceramics.
3. energy supply control module according to claim 1, which is characterized in that the peripheral frame is " returning " word ring of intermediate hollow out
Shape structure.
4. energy supply control module according to claim 1, which is characterized in that the pad is equipped with plated-through hole, institute
State plated-through hole connection upper surface metallic circuit and lower surface metal circuit.
5. energy supply control module according to claim 1, which is characterized in that the first substrate, the second substrate and peripheral frame
Shape it is identical, it is in the same size.
6. energy supply control module according to claim 1, which is characterized in that the pad is vertical interconnection pad, each to weld
Setting position of the disk in the first substrate, the second substrate and peripheral frame corresponds to each other.
7. a kind of manufacturing method of the described in any item energy supply control modules of claim 1~6, which is characterized in that including as follows
Step:
1) it designs and makes first substrate, the second substrate and peripheral frame, and make pad respectively；
2) in the second substrate upper surface chip；
3) according to from bottom to up be respectively the second substrate, peripheral frame, each substrate of sequential connection of first substrate or peripheral frame；
4) on the first substrate surface mount chip to get the energy supply control module.
8. manufacturing method according to claim 7, which is characterized in that step 1) further include: be arranged on the pad logical
Hole go forward side by side row metalization filling.
9. manufacturing method according to claim 7, which is characterized in that the method that step 3) connects each substrate or peripheral frame are as follows:
Solder bump is made on pad, is then welded.
10. a kind of method for maintaining of the described in any item energy supply control modules of claim 1~6, which is characterized in that welded to module
The place of connecing is heated to solder thawing, separates each substrate or peripheral frame, debugging or replacement inner equipment, then repeatedly claim 7~9 times
Manufacturing method described in one.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810972511.8A CN109326586A (en) | 2018-08-24 | 2018-08-24 | A kind of energy supply control module and its manufacturing method |
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| CN201810972511.8A CN109326586A (en) | 2018-08-24 | 2018-08-24 | A kind of energy supply control module and its manufacturing method |
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| CN109326586A true CN109326586A (en) | 2019-02-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111128679A (en) * | 2019-12-18 | 2020-05-08 | 北京无线电测量研究所 | Power division microwave substrate and manufacturing method thereof |
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| EP0562629A2 (en) * | 1992-03-26 | 1993-09-29 | Sumitomo Electric Industries, Limited | Semiconductor device comprising a package |
| US20010054758A1 (en) * | 2000-06-21 | 2001-12-27 | Isaak Harlan R. | Three-dimensional memory stacking using anisotropic epoxy interconnections |
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| CN111128679A (en) * | 2019-12-18 | 2020-05-08 | 北京无线电测量研究所 | Power division microwave substrate and manufacturing method thereof |
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