CN109324472A - A kind of mask plate guard method - Google Patents

A kind of mask plate guard method Download PDF

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Publication number
CN109324472A
CN109324472A CN201811362886.9A CN201811362886A CN109324472A CN 109324472 A CN109324472 A CN 109324472A CN 201811362886 A CN201811362886 A CN 201811362886A CN 109324472 A CN109324472 A CN 109324472A
Authority
CN
China
Prior art keywords
mask plate
mask
aluminium foil
guard method
covered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811362886.9A
Other languages
Chinese (zh)
Inventor
李东滨
吴疆
谷义伟
王德苗
金浩
冯斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang University Kunshan Innovation Institute
Original Assignee
Zhejiang University Kunshan Innovation Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang University Kunshan Innovation Institute filed Critical Zhejiang University Kunshan Innovation Institute
Priority to CN201811362886.9A priority Critical patent/CN109324472A/en
Publication of CN109324472A publication Critical patent/CN109324472A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/48Protective coatings

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention discloses a kind of mask plate guard methods, comprising: Step 1: preparing completely new mask plate, and pre-processes to it;Step 2: depositing one layer of nano thin-film on mask plate;Step 3: by adhesive aluminium foil in mask plate outer surface;Step 4: the extra aluminium foil that removal is covered in mask hole.After protecting using mask plate guard method of the invention to traditional mask board, the recycling of mask can be realized by replacement aluminium foil, to substantially reduce mask costs.

Description

A kind of mask plate guard method
Technical field
The invention belongs to material surface modifying technology fields, and in particular to a kind of mask plate guard method.
Background technique
Mask technique is widely used in various printing technologies, physical vapour deposition (PVD) or chemical vapor deposition process, In various vapor depositions application, mask is inevitably deposited material and is polluted, when pollutant accumulation to a certain extent after, Will lead to mask can not continue to use.Since the preparation cost of mask is all very high, if service life is too short, this must So considerably increase the cost of plated film.
Summary of the invention
In view of the above-mentioned problems, the present invention proposes a kind of mask plate guard method, dropped by realizing the recycling of mask Low mask costs.
It realizes above-mentioned technical purpose, reaches above-mentioned technical effect, the invention is realized by the following technical scheme:
A kind of mask plate guard method, comprising:
Mask plate is pre-processed;
The nano thin-film that a layer thickness is 20-200nm is deposited in mask plate surfaces externally and internally;
By with a thickness of the adhesive aluminium foil of 25-250um on mask plate outer surface;
Remove the aluminium foil being covered in mask plate mask hole.
As a further improvement of the present invention, described to deposit a layer thickness receiving for 20-200nm in mask plate surfaces externally and internally Rice film, specifically:
Magnetron sputtering, evaporation or multi-arc ion coating method is used to deposit a layer thickness in mask plate surfaces externally and internally as 20- The nano thin-film of 200nm.
As a further improvement of the present invention, the material of the nano thin-film is chromium, nickel, titanium, aluminium or its alloy.
As a further improvement of the present invention, the material of the nano thin-film is diamond-like or graphite.
As a further improvement of the present invention, it is described by with a thickness of the adhesive aluminium foil of 25-250um in mask plate outer surface On, specifically include following sub-step:
(3.1) aluminium foil is covered on the outer surface of mask plate;
(3.2) using after vacuum engagement, aluminium foil is bonded in mask plate using hairbrush or ball.
It is as a further improvement of the present invention, described to remove the aluminium foil being covered in mask plate mask hole, specifically: it uses Laser engraving technique removes the aluminium foil being covered in mask plate mask hole.
Compared with prior art, beneficial effects of the present invention:
It is directly discarded different from after traditional mask board pollution, mask plate is protected using mask plate guard method of the invention It afterwards, can be by removing aluminium foil and sticking aluminium foil again reuses mask plate, to substantially reduce production cost.
Detailed description of the invention
Fig. 1 is the flow diagram of the mask plate guard method of an embodiment of the present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to embodiments, to the present invention It is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not used to Limit the present invention.
Application principle of the invention is explained in detail with reference to the accompanying drawing.
In the prior art, it is applied in various vapor depositions, mask is inevitably deposited material and is polluted, and works as pollution After object accumulation to a certain extent, will lead to mask can not be continued to use.Since the preparation cost of mask is all very high, if made With the service life it is too short if, this necessarily considerably increases the cost of plated film, for this purpose, the present invention provides a kind of mask plate protection sides Method, can be by removing aluminium foil and sticking aluminium foil again reuses mask plate, to substantially reduce production cost;Specifically Ground, as shown in Figure 1, mask plate guard method of the invention includes:
Step (1): mask plate is pre-processed;In a specific embodiment of the invention, following sub-step is specifically included It is rapid:
Prepare completely new mask plate, is put into room temperature in deionized water and is cleaned by ultrasonic 10 minutes;It is then placed in alcohol ultrasonic Cleaning 2 minutes is put into the baking oven that set temperature is 120 DEG C after the completion of cleaning and dries 30 minutes;
Step (2): the nano thin-film that a layer thickness is 20-200nm is deposited in mask plate surfaces externally and internally, covers nano thin-film Effect be that the porous oxides of mask plate surface are blocked, it is in a specific embodiment of the invention, specific to wrap Include following sub-step:
The mask plate of drying is put into the vacuum cavity of magnetron sputtering apparatus, when vacuum is evacuated to 5 × 10-3pa, is filled with argon Gas makes dynamic maintain 0.5pa air pressure, opens magnetron sputtering power supply, using metal titanium targets sputter-deposited thin films, thickness is about 50nm After take out mask plate;The material of the nano thin-film is chromium, nickel, titanium, aluminium or its alloy, can also be diamond-like or graphite;
Step (3) by with a thickness of the adhesive aluminium foil of 25-250um on mask plate outer surface, it is specific in one kind of the invention In embodiment, following sub-step is specifically included:
The mask plate for having plated film is placed on vacuum suction table, tile one layer of length-width ratio mask on the outer surface of mask plate The aluminium foil with a thickness of 100um of plate big 5% presses aluminium foil and mask plate using roll shaft, opens simultaneously vacuum suction table, utilize vacuum Aluminium foil and mask plate are attracted, is then pressed on the aluminium foil of mask plate hole locations with ball again, makes aluminium foil and mask plate Bore edges form the folding line after fitting;It why is and the market because cost is minimum using the aluminium foil of 25-250um in the present invention It is on sale;
Step (4) removes the aluminium foil being covered in mask plate mask hole;In a specific embodiment of the invention, specifically Including following sub-step:
Handled using the air-cooled end pumped laser marking machine of Shenzhen big nation laser EP-12A, centre frequency be 15~ 20kHZ is 12~13W using power, and strafing speed is 20mm/s.Mask plate is placed in laser station, laser parameter is set, Size of current is 12A, and effective vector step-length is 0.001mm, effective vector delay 30us, empty vector step-length 0.03mm, empty vector Be delayed 20us, laser ETAD expected time of arrival and departure 120us, and laser closes time 500us, jumps delay 500us, and turn round delay 5us, Q frequency 3kHZ, Q release time 8us.Aluminium foil is etched along the edge lasers in each hole of mask plate, regains mask hole.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention.The technology of the industry Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its Equivalent thereof.

Claims (6)

1. a kind of mask plate guard method characterized by comprising
Mask plate is pre-processed;
The nano thin-film that a layer thickness is 20-200nm is deposited in mask plate surfaces externally and internally;
By with a thickness of the adhesive aluminium foil of 25-250um on mask plate outer surface;
Remove the aluminium foil being covered in mask plate mask hole.
2. a kind of mask plate guard method according to claim 1, it is characterised in that: described heavy in mask plate surfaces externally and internally The nano thin-film that product a layer thickness is 20-200nm, specifically:
Magnetron sputtering, evaporation or multi-arc ion coating method is used to deposit a layer thickness in mask plate surfaces externally and internally as 20-200nm's Nano thin-film.
3. a kind of mask plate guard method according to claim 1, it is characterised in that: the nano film material be chromium, Nickel, titanium, aluminium or its alloy.
4. a kind of mask plate guard method according to claim 1, it is characterised in that: the nano film material is eka-gold Hard rock or graphite.
5. a kind of mask plate guard method according to claim 1, it is characterised in that: it is described will be with a thickness of 25-250um's Adhesive aluminium foil specifically includes following sub-step on mask plate outer surface:
(3.1) aluminium foil is covered on the outer surface of mask plate;
(3.2) using after vacuum engagement, aluminium foil is bonded in mask plate using hairbrush or ball.
6. a kind of mask plate guard method according to claim 1, it is characterised in that: the removal is covered on mask plate and covers Aluminium foil on die hole, specifically: the aluminium foil being covered in mask plate mask hole is removed using laser engraving technique.
CN201811362886.9A 2018-11-16 2018-11-16 A kind of mask plate guard method Pending CN109324472A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811362886.9A CN109324472A (en) 2018-11-16 2018-11-16 A kind of mask plate guard method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811362886.9A CN109324472A (en) 2018-11-16 2018-11-16 A kind of mask plate guard method

Publications (1)

Publication Number Publication Date
CN109324472A true CN109324472A (en) 2019-02-12

Family

ID=65257895

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811362886.9A Pending CN109324472A (en) 2018-11-16 2018-11-16 A kind of mask plate guard method

Country Status (1)

Country Link
CN (1) CN109324472A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006169573A (en) * 2004-12-14 2006-06-29 Laser Gijutsu Sogo Kenkyusho Method and device for cleaning vapor deposition mask, and method and apparatus for manufacturing organic el element
CN101065827A (en) * 2004-11-23 2007-10-31 阿德文泰克全球有限公司 Multiple shadow mask structure for deposition shadow mask protection and method of making and using same
TWI298819B (en) * 2004-12-21 2008-07-11 Ulvac Singapore Pte Ltd Mask for film-forming and mask assembling jig
CN103966545A (en) * 2013-01-29 2014-08-06 三星显示有限公司 Deposition mask
JP2014182972A (en) * 2013-03-21 2014-09-29 Panasonic Corp Recovery method of organic material, recovery device of organic material, and manufacturing method of organic el element using the same
JP2016148115A (en) * 2016-03-02 2016-08-18 大日本印刷株式会社 Method of manufacturing vapor deposition mask and method of manufacturing vapor deposition mask device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101065827A (en) * 2004-11-23 2007-10-31 阿德文泰克全球有限公司 Multiple shadow mask structure for deposition shadow mask protection and method of making and using same
JP2006169573A (en) * 2004-12-14 2006-06-29 Laser Gijutsu Sogo Kenkyusho Method and device for cleaning vapor deposition mask, and method and apparatus for manufacturing organic el element
TWI298819B (en) * 2004-12-21 2008-07-11 Ulvac Singapore Pte Ltd Mask for film-forming and mask assembling jig
CN103966545A (en) * 2013-01-29 2014-08-06 三星显示有限公司 Deposition mask
JP2014182972A (en) * 2013-03-21 2014-09-29 Panasonic Corp Recovery method of organic material, recovery device of organic material, and manufacturing method of organic el element using the same
JP2016148115A (en) * 2016-03-02 2016-08-18 大日本印刷株式会社 Method of manufacturing vapor deposition mask and method of manufacturing vapor deposition mask device

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Application publication date: 20190212