CN109323492B - Method and device for controlling cold-heat exchange system and computer storage medium - Google Patents

Method and device for controlling cold-heat exchange system and computer storage medium Download PDF

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Publication number
CN109323492B
CN109323492B CN201811041704.8A CN201811041704A CN109323492B CN 109323492 B CN109323492 B CN 109323492B CN 201811041704 A CN201811041704 A CN 201811041704A CN 109323492 B CN109323492 B CN 109323492B
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Prior art keywords
compressor
temperature
heat exchange
exchange system
silicon valve
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CN109323492A (en
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王堃
谢军
许升
俞国新
虞朝丰
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Qingdao Haier Smart Technology R&D Co Ltd
Haier Smart Home Co Ltd
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Qingdao Haier Smart Technology R&D Co Ltd
Haier Smart Home Co Ltd
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00Arrangement or mounting of control or safety devices
    • F25B49/02Arrangement or mounting of control or safety devices for compression type machines, plants or systems
    • F25B49/022Compressor control arrangements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/07Details of compressors or related parts
    • F25B2400/077Compressor control units, e.g. terminal boxes, mounted on the compressor casing wall containing for example starter, protection switches or connector contacts
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00Control issues
    • F25B2600/02Compressor control
    • F25B2600/024Compressor control by controlling the electric parameters, e.g. current or voltage

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Air Conditioning Control Device (AREA)

Abstract

The invention discloses a method and a device for controlling a cold-heat exchange system and a computer readable storage medium, and belongs to the technical field of cold-heat exchange equipment. The heat exchange system includes: the cooling system comprises a compressor for changing the physical state of a refrigerant in the heat exchange system and a Micro Electro Mechanical System (MEMS) silicon valve for adjusting the flow of the refrigerant, wherein a temperature controller in the MEMS silicon valve is arranged in a coil of the compressor, and the method comprises the following steps: acquiring the current coil temperature of a coil in the compressor through the started temperature controller; and when the current coil temperature is higher than the set threshold temperature, the opening degree of the MEMS silicon valve is increased by a set value so as to reduce the load of the compressor. Therefore, the compressor can be subjected to overheat protection through the temperature controller, the superheat degree oscillation time is short, and the system energy-saving effect is excellent.

Description

Method and device for controlling cold-heat exchange system and computer storage medium
Technical Field
The present invention relates to the field of cooling and heating exchange equipment, and in particular, to a method and an apparatus for controlling a cooling and heating exchange system, and a computer-readable storage medium.
Background
With the increase of the daily living standard, many heat exchange system devices have been commonly used, such as: air conditioners, refrigerators, water heaters, and the like. Generally, these heat exchange systems include: the compressor is used for changing the physical state of the refrigerant in the cold-heat exchange system, and the adjusting control valve is used for adjusting the flow of the refrigerant.
Currently, the opening of these regulating control valves can be adjusted according to the temperature parameters carried in the user command, or the ambient temperature, humidity, and the operation mode of the heat exchange system, but the regulating response time is slow, for example: throttle valve parts such as a thermostatic expansion valve or a stepping motor type electronic expansion valve.
Disclosure of Invention
The embodiment of the invention provides a method and a device for controlling a cold-heat exchange system and a computer storage medium. The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview and is intended to neither identify key/critical elements nor delineate the scope of such embodiments. Its sole purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is presented later.
According to a first aspect of embodiments of the present invention, there is provided a method of controlling a heat exchange system, the heat exchange system including: the cooling system comprises a compressor for changing the physical state of a refrigerant in the heat exchange system and a Micro Electro Mechanical System (MEMS) silicon valve for adjusting the flow of the refrigerant, wherein a temperature controller in the MEMS silicon valve is arranged in a coil of the compressor, and the method comprises the following steps:
acquiring the current coil temperature of a coil in the compressor through the started temperature controller;
and when the current coil temperature is higher than the set threshold temperature, the opening degree of the MEMS silicon valve is increased by a set value so as to reduce the load of the compressor.
In an embodiment of the present invention, the method further includes:
and when the current coil temperature is less than or equal to the set threshold temperature, maintaining the opening degree of the MEMS silicon valve unchanged.
In an embodiment of the present invention, the method further includes:
and adjusting the opening degree of the MEMS silicon valve according to at least one parameter of the temperature parameter, the environment temperature and humidity parameter and the working mode parameter carried in the received user instruction.
In an embodiment of the present invention, the method further includes:
and when the compressor is determined to stop working, closing the temperature controller.
According to a second aspect of embodiments of the present invention, there is provided an apparatus for controlling a heat exchange system, the heat exchange system including: the device comprises a compressor for changing the physical state of a refrigerant in the heat exchange system and a Micro Electro Mechanical System (MEMS) silicon valve for adjusting the flow of the refrigerant, wherein a temperature controller in the MEMS silicon valve is arranged in a coil of the compressor, and the device comprises:
the acquisition unit is used for acquiring the current coil temperature of a coil in the compressor through the started temperature controller;
and the first adjusting unit is used for adjusting the opening degree of the MEMS silicon valve to be larger than a set value when the current coil temperature is larger than a set threshold temperature so as to reduce the load of the compressor.
In an embodiment of the present invention, the apparatus further includes:
and the second adjusting unit is used for maintaining the opening degree of the MEMS silicon valve unchanged when the current coil temperature is less than or equal to the set threshold temperature.
In an embodiment of the present invention, the apparatus further includes:
and the third adjusting unit is used for adjusting the opening degree of the MEMS silicon valve according to at least one parameter of the temperature parameter, the environment temperature and humidity parameter and the working mode parameter carried in the received user instruction.
In an embodiment of the present invention, the apparatus further includes:
and the closing unit is used for closing the temperature controller when the compressor stops working.
According to a third aspect of the embodiments of the present invention, there is provided a device for controlling a cooling-heating exchange system, used in a cooling-heating exchange system apparatus, the cooling-heating exchange system including: the device comprises a compressor for changing the physical state of a refrigerant in the heat exchange system and a Micro Electro Mechanical System (MEMS) silicon valve for adjusting the flow of the refrigerant, wherein a temperature controller in the MEMS silicon valve is arranged in a coil of the compressor, and the device comprises:
a processor;
a memory for storing processor-executable instructions;
wherein the processor is configured to:
acquiring the current coil temperature of a coil in the compressor through the started temperature controller;
and when the current coil temperature is higher than the set threshold temperature, the opening degree of the MEMS silicon valve is increased by a set value so as to reduce the load of the compressor.
According to a fourth aspect of embodiments of the present invention, there is provided a computer readable storage medium having stored thereon computer instructions which, when executed by a processor, implement the steps of the above-described method.
The technical scheme provided by the embodiment of the invention has the following beneficial effects:
in the embodiment of the invention, the MEMS silicon valve is adopted in the cold-heat exchange system equipment to adjust the flow of the refrigerant, the MEMS silicon valve not only has the advantage of high valve opening and closing speed, but also can perform overheat protection on the compressor through the temperature controller, and has short superheat degree oscillation time and excellent system energy-saving effect.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a flow chart illustrating a method of controlling a heat exchange system according to an exemplary embodiment;
FIG. 2 is a flow chart illustrating a method of controlling a heat exchange system according to an exemplary embodiment;
FIG. 3 is a block diagram illustrating a control device of a heat exchange system according to an exemplary embodiment;
fig. 4 is a block diagram illustrating a control device of a heat exchange system according to an exemplary embodiment.
Detailed Description
The following description and the drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of embodiments of the invention encompasses the full ambit of the claims, as well as all available equivalents of the claims. Embodiments may be referred to herein, individually or collectively, by the term "invention" merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is in fact disclosed. Herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed. The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. For the structures, products and the like disclosed by the embodiments, the description is relatively simple because the structures, the products and the like correspond to the parts disclosed by the embodiments, and the relevant parts can be just described by referring to the method part.
Micro-Electro-Mechanical System (MEMS) silicon valve can be used as a throttle valve product, and the operating mode of a main valve is driven by a pilot valve. The pilot valve adopts a silQflo silicon flow control chip based on MEMS technology and electric heating driving, and can realize linear and proportional adjustment of the expansion valve on the flow of the refrigerant by utilizing PWM signals. In the embodiment of the invention, the MEMS silicon valve is adopted in the cold-heat exchange system equipment to adjust the flow of the refrigerant, the MEMS silicon valve not only has the advantage of high valve opening and closing speed, but also can perform overheat protection on the compressor through the temperature controller, and has short superheat degree oscillation time and excellent system energy-saving effect.
The MEMS silicon valve mainly comprises a pilot valve and a main valve, wherein the pilot valve is an electrically driven, linear and silicon micro-electromechanical system. The pilot valve receives an electrical signal and transmits a linear actuation pressure to the spool of the main valve, plus a spring force to balance the actuation pressure so that the spool moves with the pilot valve. In addition, in the embodiment of the invention, an intelligent feedback mechanism is provided, and the feedback mechanism can perform intelligent algorithm processing according to the sensor signal and adjust the valve to perform accurate control, so that the functions of accurately controlling the actuating mechanism and quickly adjusting the valve are achieved. Wherein the MEMS silicon valve reaction time is below 200 milliseconds from full on to full off.
The corresponding equipment of the cold and heat exchange system can comprise: air conditioner, refrigerator, water heater, etc., and these heat exchange systems include: a compressor for changing the physical state of the refrigerant in the cold-heat exchange system, and an adjusting control valve for adjusting the flow of the refrigerant. In the embodiment of the invention, the refrigerant regulating control valve is an MEMS silicon valve, and the original refrigerant regulating control valve in the equipment corresponding to the cold-heat exchange system is replaced by the MEMS silicon valve. For example: the thermal expansion valve in the air conditioner is replaced by an MEMS silicon valve.
In the embodiment of the invention, the MEMS silicon valve not only comprises a valve with adjustable opening degree, but also comprises a temperature controller, and the MEMS silicon valve can be subjected to prediction control in a single-path PWM mode according to the temperature detected by the temperature controller.
FIG. 1 is a flow chart illustrating a method of controlling a heat exchange system according to an exemplary embodiment. Of course, the heat exchange system includes: the cooling system comprises a compressor for changing the physical state of a refrigerant in the cold-heat exchange system and an MEMS (micro electro mechanical systems) silicon valve for adjusting the flow of the refrigerant, wherein a temperature controller in the MEMS silicon valve is arranged in a coil of the compressor. As shown in fig. 1, the process of controlling the heat exchange system includes:
step 101: and acquiring the current coil temperature of the coil in the compressor through the started temperature controller.
In the embodiment of the invention, the cold-heat exchange system comprises the compressor, and when the compressor works, the compressor is easy to generate heat, and if the heat is not discharged and removed, the service life and the performance of the compressor are reduced. The MEMS silicon valve comprises the temperature controller, so the temperature controller can be arranged in the coil of the compressor, and after the temperature controller is started, the current coil temperature of the coil in the compressor can be obtained through the started temperature controller. Preferably, the current temperature parameter of the coil in the compressor can be obtained through a temperature sensor in the temperature controller, and thus, the processing module in the temperature sensor can obtain the current coil temperature of the coil in the compressor according to the obtained current temperature parameter.
Step 102: and when the current coil temperature is higher than the set threshold temperature, the opening degree of the MEMS silicon valve is increased by a set value so as to reduce the load of the compressor.
Because the heat of the compressor can cause the life reduction and the performance reduction of the compressor if the heat is not removed, a threshold temperature can be preset, when the coil temperature of the compressor exceeds the threshold temperature, the heat of the compressor can be determined, protective measures need to be taken, at the moment, the opening degree of the MEMS silicon valve can be adjusted to be large, the flow rate of a refrigerant is increased, the power of the compressor can be reduced, and the load of the compressor is reduced.
The opening degree of the MEMS silicon valve can be adjusted to be larger than a set value according to the specific model of the MEMS silicon valve, for example: the MEMS silicon valve may be adjustable from off to on, or may be adjustable from a first opening value to a second opening value of the MEMS silicon valve, the first opening value and the second opening value differing by one, two, or more setting values. Because the response time of the MEMS silicon valve is less than 200 milliseconds from full opening to full closing, the process of adjusting the MEMS silicon valve is very quick and less than 200 milliseconds, the valve adjusting time in a cold-heat exchange system is prolonged, and the efficiency of changing the load of the compressor is improved.
Therefore, in the cold-heat exchange system equipment, the MEMS silicon valve is adopted to adjust the flow of the refrigerant, the MEMS silicon valve not only has the advantage of high valve opening and closing speed, but also can perform overheat protection on the compressor through the temperature controller, and the superheat degree oscillation time is short, and the system energy-saving effect is excellent.
In addition, the service life of the MEMS silicon valve can exceed 100 ten thousand times, and the MEMS silicon valve has extremely quick response time (less than or equal to 0.2S time), so that a cold-heat exchange system adopting the MMEMS valve silicon can save more than 30 percent of energy compared with a common electronic expansion valve.
Meanwhile, the MEMS silicon valve can be upgraded through remote monitoring, the temperature algorithm of a temperature controller in the MEMS silicon valve is updated in time, or other MEMS silicon valve control software is updated, so that the reaction speed of the MEMS silicon valve is guaranteed, the upgrading and updating of products are realized remotely, and the consumption of hardware is reduced.
Of course, in the embodiment of the present invention, when the current coil temperature is less than or equal to the set threshold temperature, the opening degree of the MEMS silicon valve is maintained. Thus, stable operation of the heat exchange system is maintained.
Because the MEMS silicon valve replaces the existing electronic valve for adjusting the refrigerant flow in the cold-heat exchange system, the MEMS silicon valve has the functions of adjusting the opening degree of the MEMS silicon valve according to at least one parameter of the temperature parameter, the environment temperature and humidity parameter and the working mode parameter carried in the received user instruction. Like this, guaranteed cold and heat exchange system's current function to, because MEMS silicon valve has the fast advantage of ooff valve, further improved cold and heat exchange system's reaction time, thereby also promoted cold and heat exchange system's efficiency, also improved user's experience.
Since the temperature controller in the MEMS silicon valve is used for overheat protection of the compressor, the temperature controller is turned off when it is determined that the compressor stops operating, and thus, the consumption of resources can be saved.
The following operational flows are grouped into specific embodiments to illustrate the methods provided by the embodiments of the present disclosure.
In this embodiment, the heat exchange system may be a heat pump system including a compressor, and a MEMS silicon valve may be used instead of the existing thermal expansion valve, and the temperature controller in the MEMS silicon valve is provided in the coil of the compressor.
Fig. 2 is a flowchart illustrating a control method of a heat exchange system according to an exemplary embodiment, where as shown in fig. 2, a process of the heat exchange system control includes:
step 201: the compressor of the heat pump system is started to operate.
Step 202: the temperature controller provided in the coil of the compressor starts to operate.
Step 203: and acquiring the current coil temperature of the coil in the compressor through the started temperature controller.
Here, the current coil temperature of the coil in the compressor may be periodically acquired to reduce the load.
Step 204: is it determined whether the current coil temperature is greater than the set threshold temperature? If so, go to step 205, otherwise, go to step 206.
Step 205: the opening of the MEMS silicon valve is adjusted by a set value and step 207 is performed.
If the MEMS silicon valve is closed, this step may open the MEMS silicon valve. If the opening degree of the MEMS silicon valve is smaller, the opening degree of the MEMS silicon valve can be adjusted to be larger, so that the flow of the refrigerant passing through the compressor is larger, the load of the compressor can be reduced, the temperature of the compressor is reduced, and the overheat protection of the compressor is realized.
Step 206: the opening of the MEMS silicon valve is maintained and the process returns to step 207.
If the MEMS silicon valve is still closed, if the MEMS silicon valve is at the first opening, the first opening is considered, and so on.
Step 207: is the compressor stopped? If yes, go to step 208, otherwise, go back to step 203.
Step 208: the temperature controller is turned off.
Therefore, in the embodiment, the MEMS silicon valve is adopted in the heat pump system to adjust the flow rate of the refrigerant, and the MEMS silicon valve not only has the advantage of high valve opening and closing speed, but also can perform overheat protection on the compressor through the temperature controller, and has short superheat oscillation time and excellent system energy saving effect.
The following are embodiments of the disclosed apparatus that may be used to perform embodiments of the disclosed methods.
According to the process of food material freezing control in the refrigeration equipment, a device for food material freezing control in the refrigeration equipment can be constructed.
Fig. 3 is a block diagram illustrating a control device of a heat exchange system according to an exemplary embodiment. The heat exchange system includes: a compressor for changing the physical state of the refrigerant in the heat exchange system, and a MEMS silicon valve for adjusting the flow rate of the refrigerant, wherein a temperature controller in the MEMS silicon valve is disposed in a coil of the compressor, as shown in fig. 3, the apparatus includes: an acquisition unit 100 and a first adjustment unit 200, wherein,
an obtaining unit 100, configured to obtain, through the started temperature controller, a current coil temperature of a coil in the compressor.
The first adjusting unit 200 is configured to adjust the opening of the MEMS silicon valve to a set value when the current coil temperature is greater than the set threshold temperature, so as to reduce the load of the compressor.
In an embodiment of the present invention, the apparatus further includes: and the second adjusting unit is used for maintaining the opening degree of the MEMS silicon valve unchanged when the current coil temperature is less than or equal to the set threshold temperature.
In an embodiment of the present invention, the apparatus further includes: and the third adjusting unit is used for adjusting the opening degree of the MEMS silicon valve according to at least one parameter of the temperature parameter, the environment temperature and humidity parameter and the working mode parameter carried in the received user instruction.
In an embodiment of the present invention, the apparatus further includes: and a closing unit for closing the temperature controller when it is determined that the compressor stops operating.
Embodiments of the disclosed apparatus are described below in conjunction with specific embodiments.
In this embodiment, the heat exchange system may be an air conditioning system including a compressor, and the MEMS silicon valve may be used to replace an existing electronic expansion valve, and the temperature controller in the MEMS silicon valve is disposed in a coil of the compressor.
Fig. 4 is a block diagram illustrating a control device of a heat exchange system according to an exemplary embodiment. As shown in fig. 4, the apparatus includes: an acquiring unit 100, a first adjusting unit 200, a second adjusting unit 300, a third adjusting unit 400, and a closing unit 500.
The obtaining unit 100 may obtain a current coil temperature of a coil in the compressor through the started temperature controller. In this way, when the current coil temperature is greater than the set threshold temperature, the first adjusting unit 200 may adjust the opening degree of the MEMS silicon valve to be greater than the set value for reducing the load of the compressor. When the current coil temperature is less than or equal to the set threshold temperature, the second adjusting unit 300 may maintain the opening of the MEMS silicon valve.
Of course, since the MEMS silicon valve replaces the existing electronic expansion valve, the third adjusting unit 400 may adjust the opening degree of the MEMS silicon valve according to at least one of the temperature parameter, the environmental temperature and humidity parameter, and the working mode parameter carried in the received user instruction. Therefore, the existing functions of the air conditioner are guaranteed, and the MEMS silicon valve has the advantage of high valve opening and closing speed, so that the reaction time of the air conditioning system is further prolonged, the effect of the air conditioning system is improved, and the user experience is also improved.
Of course, after the compressor of the air conditioning system stops working, the closing unit 500 may be closed by the temperature controller in the MEMS silicon valve, further saving energy consumption.
Therefore, in the embodiment, the MEMS silicon valve is adopted in the air conditioning system to adjust the flow rate of the refrigerant, and the MEMS silicon valve not only has the advantage of high valve opening and closing speed, but also can perform overheat protection on the compressor through the temperature controller, and has short superheat oscillation time and excellent system energy saving effect.
In an embodiment of the present invention, there is provided a device for controlling a cooling and heating system, which is used in a cooling and heating system apparatus, the cooling and heating system including: the device comprises a compressor for changing the physical state of a refrigerant in the heat exchange system and an MEMS silicon valve for adjusting the flow of the refrigerant, wherein a temperature controller in the MEMS silicon valve is arranged in a coil of the compressor, and the device comprises:
a processor;
a memory for storing processor-executable instructions;
wherein the processor is configured to:
acquiring the current coil temperature of a coil in the compressor through the started temperature controller;
and when the current coil temperature is higher than the set threshold temperature, the opening degree of the MEMS silicon valve is increased by a set value so as to reduce the load of the compressor.
In one embodiment of the present invention, a computer-readable storage medium is provided, having stored thereon computer instructions, which when executed by a processor, implement the steps of the above-described method.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, optical storage, and the like) having computer-usable program code embodied therein.
The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
It is to be understood that the present invention is not limited to the procedures and structures described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.

Claims (10)

1. A method of controlling a heat exchange system, the heat exchange system comprising: the cooling system comprises a compressor for changing the physical state of a refrigerant in the heat exchange system and a Micro Electro Mechanical System (MEMS) silicon valve for adjusting the flow of the refrigerant, wherein a temperature controller in the MEMS silicon valve is arranged in a coil of the compressor, and the method comprises the following steps:
acquiring the current coil temperature of a coil in the compressor through the started temperature controller;
and when the current coil temperature is higher than the set threshold temperature, the opening degree of the MEMS silicon valve is increased by a set value so as to reduce the load of the compressor.
2. The method of claim 1, wherein the method further comprises:
and when the current coil temperature is less than or equal to the set threshold temperature, maintaining the opening degree of the MEMS silicon valve unchanged.
3. The method of claim 1 or 2, wherein the method further comprises:
and adjusting the opening degree of the MEMS silicon valve according to at least one parameter of the temperature parameter, the environment temperature and humidity parameter and the working mode parameter carried in the received user instruction.
4. The method of claim 1, wherein the method further comprises:
and when the compressor is determined to stop working, closing the temperature controller.
5. A device controlled by a heat exchange system, the heat exchange system comprising: the device comprises a compressor for changing the physical state of a refrigerant in the heat exchange system and a Micro Electro Mechanical System (MEMS) silicon valve for adjusting the flow of the refrigerant, wherein a temperature controller in the MEMS silicon valve is arranged in a coil of the compressor, and the device comprises:
the acquisition unit is used for acquiring the current coil temperature of a coil in the compressor through the started temperature controller;
and the first adjusting unit is used for adjusting the opening degree of the MEMS silicon valve to be larger than a set value when the current coil temperature is larger than a set threshold temperature so as to reduce the load of the compressor.
6. The apparatus of claim 5, wherein the apparatus further comprises:
and the second adjusting unit is used for maintaining the opening degree of the MEMS silicon valve unchanged when the current coil temperature is less than or equal to the set threshold temperature.
7. The apparatus of claim 5 or 6, wherein the apparatus further comprises:
and the third adjusting unit is used for adjusting the opening degree of the MEMS silicon valve according to at least one parameter of the temperature parameter, the environment temperature and humidity parameter and the working mode parameter carried in the received user instruction.
8. The apparatus of claim 5, wherein the apparatus further comprises:
and the closing unit is used for closing the temperature controller when the compressor stops working.
9. A device for controlling a heat exchange system, the device being used in a heat exchange system apparatus, the heat exchange system comprising: the device comprises a compressor for changing the physical state of a refrigerant in the heat exchange system and a Micro Electro Mechanical System (MEMS) silicon valve for adjusting the flow of the refrigerant, wherein a temperature controller in the MEMS silicon valve is arranged in a coil of the compressor, and the device comprises:
a processor;
a memory for storing processor-executable instructions;
wherein the processor is configured to:
acquiring the current coil temperature of a coil in the compressor through the started temperature controller;
and when the current coil temperature is higher than the set threshold temperature, the opening degree of the MEMS silicon valve is increased by a set value so as to reduce the load of the compressor.
10. A computer-readable storage medium having stored thereon computer instructions, which, when executed by a processor, carry out the steps of the method according to any one of claims 1 to 4.
CN201811041704.8A 2018-09-07 2018-09-07 Method and device for controlling cold-heat exchange system and computer storage medium Active CN109323492B (en)

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