CN109321178A - A kind of adhesive for the plate blank molding intensity improving PMDI particieboard - Google Patents

A kind of adhesive for the plate blank molding intensity improving PMDI particieboard Download PDF

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Publication number
CN109321178A
CN109321178A CN201811165171.4A CN201811165171A CN109321178A CN 109321178 A CN109321178 A CN 109321178A CN 201811165171 A CN201811165171 A CN 201811165171A CN 109321178 A CN109321178 A CN 109321178A
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CN
China
Prior art keywords
pmdi
particieboard
plate blank
blank molding
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811165171.4A
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Chinese (zh)
Inventor
邱勇
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Individual
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Individual
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Priority to CN201811165171.4A priority Critical patent/CN109321178A/en
Publication of CN109321178A publication Critical patent/CN109321178A/en
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/003Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F261/00Macromolecular compounds obtained by polymerising monomers on to polymers of oxygen-containing monomers as defined in group C08F16/00
    • C08F261/02Macromolecular compounds obtained by polymerising monomers on to polymers of oxygen-containing monomers as defined in group C08F16/00 on to polymers of unsaturated alcohols
    • C08F261/04Macromolecular compounds obtained by polymerising monomers on to polymers of oxygen-containing monomers as defined in group C08F16/00 on to polymers of unsaturated alcohols on to polymers of vinyl alcohol
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend

Abstract

The invention discloses a kind of adhesives of plate blank molding intensity for improving PMDI particieboard, by weight percentage include the water of 44%-58%, the acrylate copolymer emulsion of 40%-50%, the tributyl 2-acetylcitrate of 1.0%-3.0%, the dimethyl silicone polymer of 0.5%-1.5% and the polyoxyethylene sorbitan ester of 0.5%-1.5%;It can occur prepolymerization reaction by the NCO functional group of functional group and PMDI in the functional group, water and the particieboard natural fiber that contain in acrylate copolymer emulsion and form cross-linked network and autohesion, to realize the plate blank molding intensity for improving PMDI particieboard;Have the characteristics that the plate blank molding intensity that can effectively solve PMDI particieboard is insufficient, the plate blank molding intensity of PMDI particieboard can be improved.

Description

A kind of adhesive for the plate blank molding intensity improving PMDI particieboard
Technical field
The invention belongs to adhesive technology fields, and in particular to a kind of plate blank molding intensity that PMDI particieboard can be improved Adhesive.
Background technique
PMDI is free of formaldehyde, and waterproof performance is outstanding, and mechanical strength is high, is the ideal adhesive for substituting UF or MUF, has wide Wealthy market prospects.But other special gluings are not added since PMDI is without just gluing ability, when if producing particieboard with PMDI Agent, the intensity of slab can be insufficient, slab will appear can not be successfully by gap between conveyer belt or conveyer belt and press steel belt it Between gap, press closure will cause when squeezing slab be broken, arch upward, turned-down edge, the defects of falling off.
Summary of the invention
In view of the deficiencies of the prior art, the present invention is intended to provide a kind of plate blank molding that can effectively solve PMDI particieboard is strong Spend the adhesive of plate blank molding intensity insufficient, that PMDI particieboard can be improved.
To achieve the above object, the present invention adopts the following technical scheme:
A kind of adhesive for the plate blank molding intensity improving PMDI particieboard, by weight percentage including 44%-58% Water, the acrylate copolymer emulsion of 40%-50%, the tributyl 2-acetylcitrate of 1.0%-3.0%, 0.5%-1.5% it is poly- The polyoxyethylene sorbitan ester of dimethyl siloxane and 0.5%-1.5%.
Further, the acrylate copolymer emulsion is by weight percentage by the vinylacetate of 10%-25%, 3%- 8% polyvinyl alcohol, the butyl acrylate of 5%-15%, the acrylic acid of 10%-20%, the styrene of 5%-15%, appropriate first Base methyl acrylate, appropriate methacrylic acid, the tackifying resin of 10%-15%, the auxiliary agent of 1%-5% and 45%-50% water Synthesis is made.
Further, the synthesis process of the acrylate copolymer emulsion includes S1, protecting colloid preparation, in reaction kettle The water of the middle polyvinyl alcohol that 3%-8% is added and 45%-50%, and stir and be warming up to 90 DEG C -95 DEG C, it is completely molten to polyvinyl alcohol 60 DEG C are cooled to after solution;
S2, semi-continuous process polymerization are used using the acrylic acid of 10%-20% as seed emulsion on the basis of step S1 The acrylic acid fourth of the vinylacetate of 10%-25%, the styrene of 5%-15% and 5%-15% is added dropwise in semicontinuous stage feeding polymerization Ester mix monomer, control reaction temperature are 70 DEG C -80 DEG C and stir, vinylacetate, styrene, butyl acrylate 3-4 hours It is added dropwise, then is warming up to 85 DEG C, and keep the temperature 0.5 hour, be then cooled to 40 DEG C;
S3, removal free monomer, after being cooled to 40 DEG C in step s 2, vacuumize the free monomer removed in reaction kettle;
S4, discharging is neutralized, on the basis of step S3, appropriate methyl methacrylate, appropriate first is added into reaction kettle Base acrylic acid, the tackifying resin of 10%-15%, 1%-5% auxiliary agent, and be cooled to room temperature, neutralize discharging.
Preferably, the auxiliary agent is one or more of OP-10, dodecyl sodium sulfate, potassium peroxydisulfate, organosilicon.
The invention has the following beneficial effects:
A kind of adhesive for the plate blank molding intensity for improving PMDI particieboard of the present invention, can pass through acrylic ester copolymer cream Prepolymerization reaction shape occurs for the NCO functional group of functional group, water and the functional group and PMDI in particieboard natural fiber contained in liquid Cross-linked structure and autohesion are reticulated, to realize the plate blank molding intensity for improving PMDI particieboard;With can effectively solve The plate blank molding intensity of PMDI particieboard is insufficient, the characteristics of plate blank molding intensity of PMDI particieboard can be improved.
Specific embodiment
Combined with specific embodiments below, the invention will be further described, in order to be more clearly understood that the present invention wants Seek the technical idea of protection.
A kind of adhesive for the plate blank molding intensity for improving PMDI particieboard of the present invention, includes 44%- by weight percentage 58% water, the acrylate copolymer emulsion of 40%-50%, the tributyl 2-acetylcitrate of 1.0%-3.0%, 0.5%- 1.5% dimethyl silicone polymer and the polyoxyethylene sorbitan ester of 0.5%-1.5%.
Wherein, acrylate copolymer emulsion by weight percentage by the vinylacetate of 10%-25%, 3%-8% it is poly- Vinyl alcohol, the butyl acrylate of 5%-15%, the acrylic acid of 10%-20%, the styrene of 5%-15%, appropriate methacrylic acid The hydration of methyl esters, appropriate methacrylic acid, the tackifying resin of 10%-15%, the auxiliary agent of 1%-5% and 45%-50% is at being made.
The synthesis process of acrylate copolymer emulsion includes that 3%-8% is added in S1, protecting colloid preparation in a kettle Polyvinyl alcohol and 45%-50% water, and stir be warming up to 90 DEG C -95 DEG C, be cooled to 60 after polyvinyl alcohol is completely dissolved ℃;
S2, semi-continuous process polymerization are used using the acrylic acid of 10%-20% as seed emulsion on the basis of step S1 The acrylic acid fourth of the vinylacetate of 10%-25%, the styrene of 5%-15% and 5%-15% is added dropwise in semicontinuous stage feeding polymerization Ester mix monomer, control reaction temperature are 70 DEG C -80 DEG C and stir, vinylacetate, styrene, butyl acrylate 3-4 hours It is added dropwise, then is warming up to 85 DEG C, and keep the temperature 0.5 hour, be then cooled to 40 DEG C;
S3, removal free monomer, after being cooled to 40 DEG C in step s 2, vacuumize the free monomer removed in reaction kettle;
S4, discharging is neutralized, on the basis of step S3, appropriate methyl methacrylate, appropriate first is added into reaction kettle Base acrylic acid, the tackifying resin of 10%-15%, 1%-5% auxiliary agent, and be cooled to room temperature, neutralize discharging.
Specifically, auxiliary agent is one or more of OP-10, dodecyl sodium sulfate, potassium peroxydisulfate, organosilicon.
The insufficient principle of plate blank molding intensity of present invention solution PMDI particieboard are as follows: it passes through acrylate copolymer emulsion In the NCO functional group of functional group, water and functional group and PMDI in particieboard natural fiber contained prepolymerization reaction occur formed Cross-linked network and autohesion, to realize the plate blank molding intensity for improving PMDI particieboard;With can effectively solve PMDI The plate blank molding intensity of particieboard is insufficient, the characteristics of plate blank molding intensity of PMDI particieboard can be improved.
For those skilled in the art, it can make other each according to the above description of the technical scheme and ideas Kind is corresponding to be changed and deforms, and all these change and deform the protection model that all should belong to the claims in the present invention Within enclosing.

Claims (4)

1. a kind of adhesive for the plate blank molding intensity for improving PMDI particieboard, it is characterised in that: include by weight percentage The water of 44%-58%, the acrylate copolymer emulsion of 40%-50%, 1.0%-3.0% tributyl 2-acetylcitrate, The dimethyl silicone polymer of 0.5%-1.5% and the polyoxyethylene sorbitan ester of 0.5%-1.5%.
2. a kind of adhesive of plate blank molding intensity for improving PMDI particieboard as described in claim 1, it is characterised in that: institute Acrylate copolymer emulsion is stated by weight percentage by the vinylacetate of 10%-25%, the polyvinyl alcohol of 3%-8%, 5%- 15% butyl acrylate, the acrylic acid of 10%-20%, the styrene of 5%-15%, appropriate methyl methacrylate, appropriate first The hydration of base acrylic acid, the tackifying resin of 10%-15%, the auxiliary agent of 1%-5% and 45%-50% is at being made.
3. a kind of adhesive of plate blank molding intensity for improving PMDI particieboard as claimed in claim 2, it is characterised in that: institute The synthesis process for stating acrylate copolymer emulsion includes,
S1, protecting colloid preparation, are added the polyvinyl alcohol of 3%-8% and the water of 45%-50%, and stir heating in a kettle To 90 DEG C -95 DEG C, 60 DEG C are cooled to after polyvinyl alcohol is completely dissolved;
S2, semi-continuous process polymerization, using the acrylic acid of 10%-20% as seed emulsion on the basis of step S1, using partly connecting Continuous stage feeding polymerization, the butyl acrylate that the vinylacetate of 10%-25%, the styrene of 5%-15% and 5%-15% is added dropwise are mixed Monomer is closed, control reaction temperature is 70 DEG C -80 DEG C and stirs, and vinylacetate, is added dropwise styrene for butyl acrylate 3-4 hours It finishes, then is warming up to 85 DEG C, and keep the temperature 0.5 hour, be then cooled to 40 DEG C;
S3, removal free monomer, after being cooled to 40 DEG C in step s 2, vacuumize the free monomer removed in reaction kettle;
S4, discharging is neutralized, on the basis of step S3, appropriate methyl methacrylate, appropriate methyl-prop is added into reaction kettle Olefin(e) acid, the tackifying resin of 10%-15%, 1%-5% auxiliary agent, and be cooled to room temperature, neutralize discharging.
4. a kind of adhesive for the plate blank molding intensity for improving PMDI particieboard, feature exist as claimed in claim 2 or claim 3 In: the auxiliary agent is one or more of OP-10, dodecyl sodium sulfate, potassium peroxydisulfate, organosilicon.
CN201811165171.4A 2018-09-30 2018-09-30 A kind of adhesive for the plate blank molding intensity improving PMDI particieboard Pending CN109321178A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811165171.4A CN109321178A (en) 2018-09-30 2018-09-30 A kind of adhesive for the plate blank molding intensity improving PMDI particieboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811165171.4A CN109321178A (en) 2018-09-30 2018-09-30 A kind of adhesive for the plate blank molding intensity improving PMDI particieboard

Publications (1)

Publication Number Publication Date
CN109321178A true CN109321178A (en) 2019-02-12

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1498936A (en) * 2002-11-06 2004-05-26 中国科学院成都有机化学研究所 Method for synthesizing and preparing avirulent adhesion agent
WO2005028523A1 (en) * 2003-09-20 2005-03-31 Celanese Ventures Gmbh Novel polyvinyl alcohols and novel polyvinyl alcohol copolymers
CN101225271A (en) * 2008-02-04 2008-07-23 唐浩 Water-based all-purpose adhesive and method for preparing same
CN102994016A (en) * 2012-11-02 2013-03-27 广东巴德士化工有限公司 Multipolymer type waterproof sealant for construction
CN106995676A (en) * 2017-04-10 2017-08-01 孙小力 A kind of zero formaldehyde wood adhesive and preparation method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1498936A (en) * 2002-11-06 2004-05-26 中国科学院成都有机化学研究所 Method for synthesizing and preparing avirulent adhesion agent
WO2005028523A1 (en) * 2003-09-20 2005-03-31 Celanese Ventures Gmbh Novel polyvinyl alcohols and novel polyvinyl alcohol copolymers
CN101225271A (en) * 2008-02-04 2008-07-23 唐浩 Water-based all-purpose adhesive and method for preparing same
CN102994016A (en) * 2012-11-02 2013-03-27 广东巴德士化工有限公司 Multipolymer type waterproof sealant for construction
CN106995676A (en) * 2017-04-10 2017-08-01 孙小力 A kind of zero formaldehyde wood adhesive and preparation method thereof

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