CN109306508B - Electroplating unit convenient to adjust liquid level of electroplating water tank - Google Patents
Electroplating unit convenient to adjust liquid level of electroplating water tank Download PDFInfo
- Publication number
- CN109306508B CN109306508B CN201811160249.3A CN201811160249A CN109306508B CN 109306508 B CN109306508 B CN 109306508B CN 201811160249 A CN201811160249 A CN 201811160249A CN 109306508 B CN109306508 B CN 109306508B
- Authority
- CN
- China
- Prior art keywords
- electroplating
- liquid level
- pipe
- water tank
- fixedly connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
- C25D17/04—External supporting frames or structures
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an electroplating unit convenient for adjusting the liquid level of an electroplating water tank, and belongs to the technical field of electroplating processing. An electroplating unit convenient for adjusting the liquid level of an electroplating water tank comprises the electroplating water tank, symmetrical support legs are fixedly connected at four corners of the bottom of the electroplating water tank, an electroplating liquid storage tank is arranged at the bottom of the electroplating water tank, a liquid level pipe is fixedly connected to the inner wall of the electroplating water tank, floating plates are slidably connected onto the liquid level pipe, a snake-shaped sleeve is fixedly connected to the outer wall of the electroplating water tank, the top end of the snake-shaped sleeve is arranged above the liquid level pipe, the bottom end of the snake-shaped sleeve extends downwards and is connected with the electroplating liquid storage tank through a fixing block, the floating plates are connected with the snake-shaped sleeve through a traction rope, and the traction rope sequentially; the electroplating solution filling device is convenient to operate, manual observation for filling the electroplating solution is abandoned, the defect of manual operation is overcome, and automatic filling of the electroplating solution is realized.
Description
Technical Field
The invention relates to the technical field of electroplating processing, in particular to an electroplating unit convenient for adjusting the liquid level of an electroplating water tank.
Background
Electroplating, which is a technology for depositing a metal coating with good adhesion but different properties and base materials on a mechanical product by utilizing the principle of an electroplating pool, wherein the electroplated layer is uniform compared with a hot-dipped layer, is generally thinner and is different from several micrometers to dozens of micrometers, and a decorative protective surface layer and various functional surface layers can be obtained on the mechanical product through electroplating, and a workpiece with abrasion and processing errors can be repaired; the purpose of electroplating is to coat a metal coating on a substrate, change the surface property or size of the substrate, and the electroplating can enhance the corrosion resistance, hardness, abrasion resistance, conductivity, smoothness, heat resistance and surface beauty of the metal.
At the in-process of constantly filling the plating solution in to electroplating water tank, the plating solution can spill over from the basin, for containing appropriate amount of plating solution in guaranteeing the plating bath, therefore need in time to filling the plating solution in the plating bath at electroplating process to the realization is adjusted the liquid level of plating solution, the filling to the plating solution among the prior art is many through artifical observation, and then operates, and manual operation often has delay and error, therefore can't realize carrying out timely filling to the plating solution.
Disclosure of Invention
The invention aims to solve the problems in the background technology, and provides a plating unit which is convenient for adjusting the liquid level of a plating water tank.
In order to achieve the purpose, the invention adopts the following technical scheme:
an electroplating unit convenient for adjusting the liquid level of an electroplating water tank comprises the electroplating water tank, supporting legs which are symmetrically fixedly connected at four corners of the bottom of the electroplating water tank, an electroplating liquid storage tank is arranged at the bottom of the electroplating water tank, a liquid level pipe is fixedly connected to the inner wall of the electroplating water tank, floating plates are slidably connected onto the liquid level pipe, snake-shaped sleeves are fixedly connected to the outer wall of the electroplating water tank, the top ends of the snake-shaped sleeves are arranged above the liquid level pipe, the bottom ends of the snake-shaped sleeves extend downwards and are connected with the electroplating liquid storage tank through fixing blocks, the floating plates are connected with the snake-shaped sleeves through traction ropes, the traction ropes sequentially pass through the snake-shaped sleeves and the fixing blocks and extend to the inside of the electroplating liquid storage tank, one end of the traction ropes, which is arranged in the electroplating, one end of the filling pipe, which is far away from the electroplating liquid storage tank, extends upwards and is arranged above the liquid level pipe.
Preferably, the electroplating solution storage tank is fixedly connected with the supporting leg through a supporting rod.
Preferably, a water pump is arranged in the filling pipe, a water outlet end of the water pump is connected with a water pipe, and one end, far away from the water pump, of the water pipe extends to the top end of the filling pipe.
Preferably, one side of the liquid level pipe, which is far away from the electroplating water tank, is provided with a liquid inlet hole, the side wall of the liquid level pipe is provided with symmetrical sliding holes, and the floating plate is connected in the sliding holes in a sliding manner.
Preferably, the floating plate comprises floating blocks, floating balls, floating plates and floating rods, the inner wall of each sliding hole is connected with the symmetrical floating blocks in a sliding mode, each floating block is fixedly connected with a floating connecting shaft, one side of each floating connecting shaft, which is arranged outside the liquid level pipe, is fixedly connected with the floating balls through connecting rods, one side of each floating connecting shaft, which is arranged inside the liquid level pipe, is fixedly connected with the floating rods, and the floating plates are symmetrically connected to the floating rods.
Preferably, snakelike sheathed tube inside seted up with haulage rope assorted trepanning, actuating mechanism is including touching the clamp plate, it passes through slide bar sliding connection at the inner wall of plating solution bin to touch the clamp plate, it touches the pressure head to touch to be equipped with on the clamp plate, the inner wall fixedly connected with and the touch pressure head assorted of plating solution bin touch the pressure switch.
Preferably, the slide bar is sleeved with a spring, and two ends of the spring are respectively fixedly connected with the inner walls of the touch plate and the electroplating liquid storage box.
Preferably, an installation groove is formed in the inner wall of the top end of the electroplating solution storage tank, a driving motor is arranged in the installation groove and electrically connected with the touch switch, and the output end of the driving motor is fixedly connected with a driving gear through a rotating shaft; one end of the filling pipe, which is arranged in the electroplating liquid storage tank, is fixedly connected with an end cover, and the end cover is connected to the filling pipe in a rotating and sealing manner.
Preferably, the side wall of the end cover is fixedly sleeved with a gear ring meshed with the driving gear, the side wall of the end cover is provided with a plurality of first liquid inlet holes, one side of the filling pipe close to the end cover is fixedly connected with a baffle plate, and the baffle plate is provided with a second liquid inlet hole matched with the first liquid inlet hole.
Preferably, the first liquid inlet hole and the second liquid inlet hole are arranged in a crossed manner along the axial direction of the filling pipe.
Compared with the prior art, the invention provides an electroplating unit convenient for adjusting the liquid level of an electroplating water tank, which has the following beneficial effects:
1. according to the electroplating unit convenient for adjusting the liquid level of the electroplating water tank, the liquid level pipe is fixedly connected to the inner wall of the electroplating water tank, the floating plate is connected in the liquid level pipe in a sliding mode, the floating plate moves in the liquid level pipe along with the liquid level, when the liquid level descends, the floating plate moves downwards along the liquid level pipe and drives the driving mechanism to work through the traction rope, and the driving mechanism further drives the filling pipe to fill electroplating liquid.
2. This electroplating unit convenient to adjust electroplating water tank liquid level passes through branch and landing leg fixed linking to each other through the plating solution bin, and the existence of branch is favorable to carrying out effectual support to the plating solution bin.
3. This electroplate unit convenient to adjust electroplating water tank liquid level through being equipped with the water pump in the filling pipe, the play water end of water pump is connected with the water pipe, and the one end that the water pump was kept away from to the water pipe extends to the top of filling pipe, and the existence of water pump is favorable to absorbing the plating solution that will enter into in the filling pipe in the water pipe to in the liquid level pipe is arranged to the water pipe, thereby realize the filling to the plating solution.
4. This electroplating unit convenient to adjust electroplating water tank liquid level, one side through keeping away from electroplating water tank at the liquid level pipe has seted up the feed liquor hole, the slide hole of symmetry has been seted up to the lateral wall of liquid level pipe, it is downthehole to float plate sliding connection at the slide, the existence in feed liquor hole is favorable to electroplating the interior plating solution of basin to enter into the liquid level intraductal, in order to do benefit to the realization and survey electroplating water tank's liquid level, the existence in slide hole is when the plating solution goes on to the liquid level pipe, it slides along with the inner wall of liquid level pipe to be convenient for.
5. This electroplate unit convenient to adjust electroplating bath liquid level, through being equipped with showy plate, showy plate is including floating the piece, float the ball, float the board, float the pole, float a sliding connection at the inner wall that slides the hole, and float between the piece fixedly connected with float even axle, float even axle and pass through the connecting rod and float the ball fixed linking to each other, float even axle and float the pole fixed linking to each other, float board symmetric connection on floating the pole, utilize and float the piece, float the ball, float board and float the pole along with the liquid level removal in the liquid level pipe, the realization is to the drive of haulage rope, thereby realize driving actuating mechanism work.
6. The electroplating unit convenient for adjusting the liquid level of the electroplating water tank is characterized in that a trepan boring matched with a traction rope is formed in the snake-shaped sleeve, the traction rope can move in the snake-shaped sleeve due to the trepan boring, a driving mechanism is arranged and comprises a touch pressing plate, the touch pressing plate is driven by the traction rope to slide on the outer wall of a sliding rod along with the liquid level in the electroplating water tank, the touch pressing plate compresses a spring in the process of approaching an electroplating solution storage tank and is contacted with a touch pressing switch through the touch pressing head, so that the driving motor is driven to work through the touch pressing switch, the driving motor drives a driving gear to rotate in the rotating process, the driving gear further drives an end cover to rotate on a filling pipe through a gear ring, when a first liquid inlet hole is driven to correspond to a second liquid inlet hole, electroplating solution in the electroplating solution storage tank enters the filling pipe under the action, and enters the liquid level pipe through the water pipe, thereby realizing the filling of the electroplating liquid.
7. This electroplate unit convenient to adjust electroplating water tank liquid level through cup jointed the spring on the slide bar, the both ends of spring link to each other with the inner wall that touches clamp plate and plating solution bin is fixed respectively, and the existence of spring is convenient for realize touching the reseing of clamp plate.
8. This electroplating unit convenient to adjust electroplating basin liquid level, first feed liquor hole and second feed liquor hole are along the axial cross arrangement of filler pipe, and the end cover of being convenient for is at the pivoted in-process for when first feed liquor hole corresponds with second feed liquor hole position, the plating solution that realizes in the plating solution storage tank enters into in the filler pipe.
The device has the advantages that the operation is convenient, the filling of the electroplating solution by manual observation is abandoned, the defect of manual operation is overcome, and the automatic filling of the electroplating solution is realized.
Drawings
FIG. 1 is a schematic perspective view of an electroplating unit for conveniently adjusting a liquid level of an electroplating bath according to the present invention;
FIG. 2 is a second schematic perspective view of an electroplating unit for conveniently adjusting a liquid level of an electroplating bath according to the present invention;
FIG. 3 is a schematic structural diagram of a floating plate of an electroplating unit for conveniently adjusting the liquid level of an electroplating water tank according to the present invention;
FIG. 4 is a schematic structural view of a connection between a snake-shaped sleeve and a pulling rope of an electroplating unit for conveniently adjusting the liquid level of an electroplating water tank according to the present invention;
FIG. 5 is a schematic structural view of the connection between the serpentine casing and the filler tube of the electroplating unit and the electroplating solution storage tank for conveniently adjusting the liquid level of the electroplating bath according to the present invention;
FIG. 6 is a schematic structural view of a connection between an end cover and a filling pipe of an electroplating unit for conveniently adjusting the liquid level of an electroplating water tank according to the present invention;
FIG. 7 is a schematic structural view of the connection between the end cover of the electroplating unit and the gear ring, which is convenient for adjusting the liquid level of the electroplating water tank, according to the present invention;
FIG. 8 is a schematic structural diagram of a connection between a filling pipe and a baffle of an electroplating unit for conveniently adjusting the liquid level of an electroplating water tank according to the present invention.
In the figure: 1. an electroplating water tank; 2. a support leg; 3. an electroplating liquid storage tank; 4. a liquid level tube; 5. a floating plate; 501. a floating block; 502. floating the ball; 503. a floating plate; 504. a floating rod; 6. a serpentine shaped cannula; 7. a fixed block; 8. a hauling rope; 9. a filling pipe; 10. a strut; 11. a water pump; 12. a water pipe; 13. a liquid inlet hole; 14. a slide hole; 15. a floating connecting shaft; 16. a connecting rod; 17. a pressure plate is contacted; 18. a slide bar; 19. a touch switch; 20. a spring; 21. mounting grooves; 22. a drive motor; 23. a drive gear; 24. an end cap; 25. a gear ring; 26. a first liquid inlet hole; 27. a baffle plate; 28. a second liquid inlet hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Example 1:
referring to fig. 1, 2 and 4, an electroplating unit convenient for adjusting the liquid level of an electroplating water tank comprises an electroplating water tank 1, wherein four corners at the bottom of the electroplating water tank 1 are fixedly connected with symmetrical support legs 2, the bottom of the electroplating water tank 1 is provided with an electroplating solution storage tank 3, the inner wall of the electroplating water tank 1 is fixedly connected with a liquid level pipe 4, the liquid level pipe 4 is slidably connected with a floating plate 5, the outer wall of the electroplating water tank 1 is fixedly connected with a snake-shaped sleeve 6, the top end of the snake-shaped sleeve 6 is arranged above the liquid level pipe 4, the bottom end of the snake-shaped sleeve 6 extends downwards and is connected with the electroplating solution storage tank 3 through a fixing block 7, the floating plate 5 is connected with the snake-shaped sleeve 6 through a traction rope 8, the traction rope 8 sequentially passes through the snake-shaped sleeve 6 and the fixing block 7 and extends to the, the outer wall of the top end of the electroplating solution storage tank 3 is connected with a filling pipe 9, and one end, far away from the electroplating solution storage tank 3, of the filling pipe 9 extends upwards and is arranged above the liquid level pipe 4; the liquid level pipe 4 is fixedly connected to the inner wall of the electroplating water tank 1, the floating plate 5 is connected to the liquid level pipe 4 in a sliding mode, the floating plate 5 moves in the liquid level pipe 4 along with the liquid level, when the liquid level descends, the floating plate 5 moves downwards along the liquid level pipe 4, the driving mechanism is driven to work through the traction rope 8, and the driving mechanism further drives the filling pipe 9 to fill the electroplating solution.
Plating solution storage tank 3 passes through branch 10 and is fixed continuous with landing leg 2, and the existence of branch 10 is favorable to carrying out effectual support to plating solution storage tank 3.
Example 2:
referring to fig. 1, 2, 4 and 5, an electroplating unit convenient for adjusting the liquid level of an electroplating tank is substantially the same as that in embodiment 1, further, a water pump 11 is arranged in a filling pipe 9, a water outlet end of the water pump 11 is connected with a water pipe 12, one end of the water pipe 12 far away from the water pump 11 extends to the top end of the filling pipe 9, and the presence of the water pump 11 is beneficial to absorbing electroplating solution entering the filling pipe 9 into the water pipe 12 and discharging the electroplating solution into a liquid level pipe 4 through the water pipe 12, so as to realize filling of the electroplating solution.
Example 3:
referring to fig. 1-8, an electroplating unit convenient for adjusting the liquid level of an electroplating water tank comprises an electroplating water tank 1, the four corners at the bottom of the electroplating water tank 1 are fixedly connected with symmetrical support legs 2, the bottom of the electroplating water tank 1 is provided with an electroplating solution storage tank 3, the inner wall of the electroplating water tank 1 is fixedly connected with a liquid level pipe 4, the liquid level pipe 4 is slidably connected with a floating plate 5, the outer wall of the electroplating water tank 1 is fixedly connected with a snake-shaped sleeve 6, the top end of the snake-shaped sleeve 6 is arranged above the liquid level pipe 4, the bottom end of the snake-shaped sleeve 6 extends downwards and is connected with the electroplating solution storage tank 3 through a fixing block 7, the floating plate 5 is connected with the snake-shaped sleeve 6 through a traction rope 8, the traction rope 8 sequentially passes through the snake-shaped sleeve 6 and the fixing block 7 and extends, the outer wall of the top end of the electroplating solution storage tank 3 is connected with a filling pipe 9, and one end, far away from the electroplating solution storage tank 3, of the filling pipe 9 extends upwards and is arranged above the liquid level pipe 4; the liquid level pipe 4 is fixedly connected to the inner wall of the electroplating water tank 1, the floating plate 5 is connected to the liquid level pipe 4 in a sliding mode, the floating plate 5 moves in the liquid level pipe 4 along with the liquid level, when the liquid level descends, the floating plate 5 moves downwards along the liquid level pipe 4, the driving mechanism is driven to work through the traction rope 8, and the driving mechanism further drives the filling pipe 9 to fill the electroplating solution.
Liquid level pipe 4 keeps away from one side of electroplating basin 1 and has seted up feed liquor hole 13, the slide hole 14 of symmetry is seted up to the lateral wall of liquid level pipe 4, float 5 sliding connection of plate in slide hole 14, the existence in feed liquor hole 13 is favorable to the plating solution in the electroplating basin 1 to enter into liquid level pipe 4, in order to do benefit to the realization and to observe the liquid level of electroplating basin 1, the existence of slide hole 14 is when the plating solution of being convenient for carries out liquid level pipe 4, it slides at the inner wall of liquid level pipe 4 along with the liquid level to realize floating plate 5.
The floating plate 5 comprises floating blocks 501, floating balls 502, floating plates 503, floating rods 504, the inner walls of the sliding holes 14 are slidably connected with the symmetrical floating blocks 501, a floating connecting shaft 15 is fixedly connected between the floating blocks 501, the floating connecting shaft 15 is arranged on one side outside the liquid level pipe 4 and is fixedly connected with the floating balls 502 through a connecting rod 16, the floating connecting shaft 15 is arranged on one side inside the liquid level pipe 4 and is fixedly connected with the floating rods 504, the floating plates 503 are symmetrically connected on the floating rods 504, the floating blocks 501, the floating balls 502, the floating plates 503 and the floating rods 504 move in the liquid level pipe 4 along with the liquid level, the traction ropes 8 are driven, and therefore the driving mechanism is driven to work.
A trepan boring matched with the traction rope 8 is formed in the snake-shaped sleeve 6, the driving mechanism comprises a touch pressing plate 17, the touch pressing plate 17 is connected to the inner wall of the electroplating solution storage tank 3 in a sliding mode through a sliding rod 18, a touch pressing head is arranged on the touch pressing plate 17, and a touch pressing switch 19 matched with the touch pressing head is fixedly connected to the inner wall of the electroplating solution storage tank 3;
the sliding rod 18 is sleeved with a spring 20, two ends of the spring 20 are respectively and fixedly connected with the touch pressure plate 17 and the inner wall of the electroplating liquid storage tank 3, and the touch pressure plate 17 is convenient to reset due to the spring 20;
an installation groove 21 is formed in the inner wall of the top end of the electroplating solution storage tank 3, a driving motor 22 is arranged in the installation groove 21, the driving motor 22 is electrically connected with the touch switch 19, and the output end of the driving motor 22 is fixedly connected with a driving gear 23 through a rotating shaft; one end of the filling pipe 9, which is arranged in the plating solution storage tank 3, is fixedly connected with an end cover 24, and the end cover 24 is connected to the filling pipe 9 in a rotating and sealing manner;
a gear ring 25 meshed with the driving gear 23 is fixedly sleeved on the side wall of the end cover 24, a plurality of first liquid inlet holes 26 are formed in the side wall of the end cover 24, a baffle plate 27 is fixedly connected to one side, close to the end cover 24, of the filling pipe 9, and a second liquid inlet hole 28 matched with the first liquid inlet holes 26 is formed in the baffle plate 27; by arranging a trepan boring matched with the hauling rope 8 in the snake-shaped sleeve 6, the hauling rope 8 can move in the snake-shaped sleeve 6 conveniently due to the trepan boring, and by arranging a driving mechanism which comprises a touch pressing plate 17, along with the liquid level in the electroplating water tank 1 descending, the floating plate 5 drives the touch pressing plate 17 to slide on the outer wall of a sliding rod 18 through the hauling rope 8, the touch pressing plate 17 compresses a spring 20 in the process of approaching the electroplating solution storage tank 3 and is contacted with a touch pressing switch 19 through the touch pressing head, so that the driving motor 22 is driven to work through the touch pressing switch 19, the driving motor 22 drives a driving gear 23 to rotate in the rotating process, the driving gear 23 further drives an end cover 24 to rotate on the filling pipe 9 through a gear ring 25, and drives a first liquid inlet 26 to correspond to a second liquid inlet 28, the electroplating solution in the electroplating solution storage tank 3 enters the filling pipe 9 under the action of a water pump 11, and enters the liquid level pipe 4 through the water pipe 12, thereby realizing the filling of the electroplating liquid.
Example 4:
referring to fig. 1-8, an electroplating unit for conveniently adjusting the liquid level of an electroplating water tank is substantially the same as that of embodiment 3, and further, a first liquid inlet hole 26 and a second liquid inlet hole 28 are arranged in a crossed manner along the axial direction of a filling pipe 9, so that the electroplating solution in an electroplating solution storage tank 3 can enter the filling pipe 9 when the first liquid inlet hole 26 corresponds to the second liquid inlet hole 28 in the rotating process of an end cover 24.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
1. The utility model provides an electroplate unit convenient to adjust electroplating water tank liquid level, includes electroplating water tank (1), its characterized in that: the bottom four corners department fixedly connected with landing leg (2) of symmetry of electroplating basin (1), the bottom of electroplating basin (1) is equipped with plating solution bin (3), electroplating basin (1) inner wall fixedly connected with liquid level pipe (4), sliding connection has showy plate (5) on liquid level pipe (4), the outer wall fixedly connected with snakelike sleeve pipe (6) of electroplating basin (1), the top of liquid level pipe (4) is arranged in to the top of snakelike sleeve pipe (6), the bottom downwardly extending of snakelike sleeve pipe (6) links to each other with plating solution bin (3) through fixed block (7), it links to each other with snakelike sleeve pipe (6) through haulage rope (8) to float plate (5), just haulage rope (8) pass snakelike sleeve pipe (6) and fixed block (7) in proper order and extend to the inside of plating solution bin (3), one end of the traction rope (8) arranged in the electroplating solution storage tank (3) is fixedly connected with a driving mechanism, the outer wall of the top end of the electroplating solution storage tank (3) is connected with a filling pipe (9), and one end, far away from the electroplating solution storage tank (3), of the filling pipe (9) extends upwards and is arranged above the liquid level pipe (4);
a liquid inlet hole (13) is formed in one side, away from the electroplating water tank (1), of the liquid level pipe (4), symmetrical sliding holes (14) are formed in the side wall of the liquid level pipe (4), and the floating plate (5) is connected in the sliding holes (14) in a sliding mode;
float plate spare (5) including floating piece (501), floating ball (502), floating plate (503), showy pole (504), the inner wall sliding connection of slide hole (14) has the floating piece (501) of symmetry, fixedly connected with floats even axle (15) between floating piece (501), float even axle (15) and arrange in the outer one side of liquid level pipe (4) and pass through connecting rod (16) and float ball (502) fixed linking to each other, float even axle (15) and arrange one side in liquid level pipe (4) and float pole (504) fixed linking to each other, float plate (503) symmetric connection on floating pole (504).
2. The electroplating unit for facilitating the adjustment of the liquid level of an electroplating water tank as claimed in claim 1, wherein the electroplating solution storage tank (3) is fixedly connected with the support leg (2) through a support rod (10).
3. The electroplating unit convenient for adjusting the liquid level of the electroplating water tank as claimed in claim 1, wherein a water pump (11) is arranged in the filling pipe (9), a water outlet end of the water pump (11) is connected with a water pipe (12), and one end of the water pipe (12) far away from the water pump (11) extends to the top end of the filling pipe (9).
4. The electroplating unit convenient for adjusting the liquid level of an electroplating water tank as claimed in claim 1, wherein a trepan matched with the traction rope (8) is formed inside the serpentine sleeve (6), the driving mechanism comprises a touch plate (17), the touch plate (17) is slidably connected to the inner wall of the electroplating solution storage tank (3) through a sliding rod (18), a touch head is arranged on the touch plate (17), and a touch switch (19) matched with the touch head is fixedly connected to the inner wall of the electroplating solution storage tank (3).
5. The electroplating unit convenient for adjusting the liquid level of the electroplating water tank as claimed in claim 4, wherein the slide rod (18) is sleeved with a spring (20), and two ends of the spring (20) are respectively fixedly connected with the touch pressure plate (17) and the inner wall of the electroplating solution storage tank (3).
6. The electroplating unit convenient for adjusting the liquid level of an electroplating water tank as claimed in claim 1, wherein an installation groove (21) is formed in the inner wall of the top end of the electroplating liquid storage tank (3), a driving motor (22) is arranged in the installation groove (21), the driving motor (22) is electrically connected with a touch switch (19), and the output end of the driving motor (22) is fixedly connected with a driving gear (23) through a rotating shaft; one end of the filling pipe (9) arranged in the electroplating liquid storage tank (3) is fixedly connected with an end cover (24), and the end cover (24) is connected to the filling pipe (9) in a rotating and sealing mode.
7. The electroplating unit convenient for adjusting the liquid level of the electroplating water tank as claimed in claim 6, wherein a gear ring (25) engaged with the driving gear (23) is fixedly sleeved on the side wall of the end cover (24), a plurality of first liquid inlet holes (26) are formed in the side wall of the end cover (24), a baffle plate (27) is fixedly connected to one side of the filling pipe (9) close to the end cover (24), and a second liquid inlet hole (28) matched with the first liquid inlet hole (26) is formed in the baffle plate (27).
8. An electroplating unit for facilitating adjustment of the liquid level of an electroplating bath according to claim 7, characterized in that the first liquid inlet hole (26) and the second liquid inlet hole (28) are arranged crosswise along the axial direction of the filler pipe (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811160249.3A CN109306508B (en) | 2018-09-30 | 2018-09-30 | Electroplating unit convenient to adjust liquid level of electroplating water tank |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811160249.3A CN109306508B (en) | 2018-09-30 | 2018-09-30 | Electroplating unit convenient to adjust liquid level of electroplating water tank |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109306508A CN109306508A (en) | 2019-02-05 |
| CN109306508B true CN109306508B (en) | 2020-05-05 |
Family
ID=65225261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811160249.3A Active CN109306508B (en) | 2018-09-30 | 2018-09-30 | Electroplating unit convenient to adjust liquid level of electroplating water tank |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109306508B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112609226A (en) * | 2020-12-08 | 2021-04-06 | 冯小彬 | Diode electroplating supporting device for detecting electroplating liquid level by utilizing buoyancy |
| CN114351200B (en) * | 2021-11-29 | 2024-04-09 | 昆山市鼎尔兴机械设备有限公司 | High-speed steel belt annular continuous hanging plating line |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1793434A (en) * | 2005-12-06 | 2006-06-28 | 钢铁研究总院 | Apparatus for continuous electrodepositing of metallic film and process thereof |
| CN201109803Y (en) * | 2007-10-24 | 2008-09-03 | 重庆华丰印刷材料有限公司 | Electrolysis liquid-storing case having automatic fluid infusion apparatus |
| CN205270416U (en) * | 2015-12-24 | 2016-06-01 | 德阳东钢钢绳有限公司 | Liquid level control mechanism and water tank wire drawing machine thereof |
| CN206545053U (en) * | 2017-01-22 | 2017-10-10 | 深圳市永利电镀制品有限公司 | It is easy to the electroplating unit of regulation plating tank liquid level |
-
2018
- 2018-09-30 CN CN201811160249.3A patent/CN109306508B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1793434A (en) * | 2005-12-06 | 2006-06-28 | 钢铁研究总院 | Apparatus for continuous electrodepositing of metallic film and process thereof |
| CN201109803Y (en) * | 2007-10-24 | 2008-09-03 | 重庆华丰印刷材料有限公司 | Electrolysis liquid-storing case having automatic fluid infusion apparatus |
| CN205270416U (en) * | 2015-12-24 | 2016-06-01 | 德阳东钢钢绳有限公司 | Liquid level control mechanism and water tank wire drawing machine thereof |
| CN206545053U (en) * | 2017-01-22 | 2017-10-10 | 深圳市永利电镀制品有限公司 | It is easy to the electroplating unit of regulation plating tank liquid level |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109306508A (en) | 2019-02-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109306508B (en) | Electroplating unit convenient to adjust liquid level of electroplating water tank | |
| CN205171009U (en) | Medicine water circle device and have device's heavy copper system, electroplating system | |
| CN112871829A (en) | Integrated automatic electroplating cleaning machine for circuit board manufacturing | |
| CN112899667A (en) | Chemical silver plating device for plastic products | |
| CN205391817U (en) | Weir left -falling stroke liquid ware floats | |
| CN211713222U (en) | Plating bath with inner wall easy to clean | |
| CN111571437A (en) | Metal cleaning device capable of being fixed and automatically turned over based on air pressure | |
| CN211170943U (en) | Liquid receiving device for electroplating travelling crane | |
| CN112899763A (en) | Intelligent device with multi-material simultaneous plating | |
| CN111519237B (en) | Cleaning device based on plating solution in plating bath | |
| CN111076070A (en) | Lubricating grease filling device with positioning structure for bearing machining | |
| CN214271075U (en) | General type auto parts hinders system of plating | |
| CN217267198U (en) | Curing means is used in bridge construction | |
| CN211853475U (en) | Lubricating grease filling device with positioning structure for bearing machining | |
| CN202479162U (en) | Ultrasonic plastic pipe cleaning device | |
| CN113604854A (en) | Electrophoresis application device | |
| CN113548771A (en) | Oil discharge device based on catering wastewater oil removal equipment | |
| CN206428335U (en) | A kind of selective electroplating bar plates mould | |
| CN220999918U (en) | Electroplating equipment with uniform electroplating | |
| CN217839191U (en) | Liquid level buoy device of electroplating liquid medicine tank | |
| CN203602745U (en) | Stirring device applied to electrolyte bath | |
| CN220485880U (en) | Automatic electroplating system | |
| CN114534929B (en) | Nonferrous metal mine flotation equipment | |
| CN211660618U (en) | Ultrasonic cleaning device for galvanizing precision mechanical parts | |
| CN212388141U (en) | Liquid supplementing device for electroplating of automobile parts |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 313000 shaijiadou village, Zhili Town, Wuxing District, Huzhou City, Zhejiang Province Patentee after: Huzhou Jinye Surface Technology Co.,Ltd. Address before: 313000 shaijiadou village, Zhili Town, Wuxing District, Huzhou City, Zhejiang Province Patentee before: HUZHOU JINYE ELECTROPLATING Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: An electroplating unit convenient for adjusting the liquid level of the electroplating tank Effective date of registration: 20221229 Granted publication date: 20200505 Pledgee: Huzhou Wuxing Rural Commercial Bank Co.,Ltd. high tech Zone Green sub branch Pledgor: Huzhou Jinye Surface Technology Co.,Ltd. Registration number: Y2022980028485 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |