CN112871829A - Integrated automatic electroplating cleaning machine for circuit board manufacturing - Google Patents
Integrated automatic electroplating cleaning machine for circuit board manufacturing Download PDFInfo
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- CN112871829A CN112871829A CN202011611377.2A CN202011611377A CN112871829A CN 112871829 A CN112871829 A CN 112871829A CN 202011611377 A CN202011611377 A CN 202011611377A CN 112871829 A CN112871829 A CN 112871829A
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- cleaning
- circuit board
- liquid
- cleaning device
- electroplating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/087—Cleaning containers, e.g. tanks by methods involving the use of tools, e.g. brushes, scrapers
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/08—Rinsing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to an integrated automatic electroplating cleaning machine for manufacturing a circuit board, which comprises an upper box body, a lower box body, an electroplating bath and a cleaning mechanism, wherein an inner cavity of the upper box body is provided with a crown block, a clamping mechanism slides on the crown block in the horizontal direction and the vertical direction through a horizontal mechanism and a vertical mechanism, the electroplated circuit board slides on the crown block in the horizontal direction, so that the electroplated circuit board slides above the cleaning mechanism and is cleaned. The cleaning mechanism comprises a first cleaning device, a second cleaning device and a third cleaning device which are sequentially arranged along the length direction of the lower box body. The liquid inlet of the first cleaning device is connected with the liquid outlet pipeline of the third cleaning device, the first cleaning device, the second cleaning device and the third cleaning device sequentially clean the electroplated circuit board, and cleaning liquid in the third cleaning device is discharged into the first cleaning device.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to an integrated automatic electroplating cleaning machine for circuit board manufacturing.
Background
The circuit board is also called a circuit board, a PCB board, an aluminum substrate, a high-frequency board, an ultrathin circuit board, a printed circuit board and the like, the circuit board mainly comprises a pad, a via hole, a mounting hole, a lead, a component, a connector, a filling part, an electrical boundary and the like, common board layer structures comprise a single-layer board, a double-layer board and a multilayer board, the circuit board enables a circuit to be miniaturized and visualized, the circuit board plays an important role in batch production of fixed circuits and optimization of electrical appliance layout, a layer of metal material needs to be electroplated on the surface of the circuit board in the production process of the circuit board, and the electroplated circuit board is cleaned so as to ensure normal.
The existing circuit board is electroplated and cleaned separately, and in the cleaning process, the problem that the electroplated circuit board is not cleaned completely due to one-time cleaning is used, and the problem that a large amount of cleaning solution is wasted due to multiple times of cleaning is solved.
Therefore, an integrated automatic electroplating cleaning machine for manufacturing circuit boards, which can clean thoroughly and does not waste cleaning liquid, is needed.
Disclosure of Invention
Technical problem to be solved
In view of the above disadvantages and shortcomings of the prior art, the present invention provides an integrated automatic electroplating cleaning machine for circuit board manufacturing, which solves the technical problems of incomplete circuit board cleaning and waste of cleaning solution.
(II) technical scheme
In order to achieve the purpose, the invention adopts the main technical scheme that:
the embodiment of the invention provides an integrated automatic electroplating cleaning machine for manufacturing a circuit board, which comprises an upper box body with an opening at the lower part and a lower box body fixed below the upper box body;
the upper box body is communicated with the lower box body to form a working area;
the interior of the lower box body is sequentially provided with a plating bath filled with electroplating solution and a cleaning mechanism, wherein the electroplating solution in the plating bath is used for electroplating the circuit board, and the cleaning mechanism is used for cleaning the circuit board;
an overhead traveling crane is arranged in an inner cavity of the upper box body, the overhead traveling crane is provided with a clamping mechanism used for hoisting a circuit board, the clamping mechanism slides horizontally and vertically on the overhead traveling crane through a horizontal mechanism and a vertical mechanism, the circuit board clamped by the clamping mechanism slides vertically and downwards on the overhead traveling crane through the vertical mechanism so as to be completely soaked in the electroplating bath, the electroplated circuit board is obtained, the vertical mechanism is reversely started again to slide vertically and upwards, the electroplated circuit board slides horizontally on the overhead traveling crane through the horizontal mechanism so as to slide the electroplated circuit board to the position above the cleaning mechanism, and the circuit board is cleaned;
the cleaning mechanism comprises a first cleaning device, a second cleaning device and a third cleaning device which are sequentially arranged along the length direction of the lower box body;
the liquid inlet of the first cleaning device is connected with the liquid outlet pipeline of the third cleaning device, the electroplated circuit board sequentially enters the first cleaning device, the second cleaning device and the third cleaning device to sequentially clean the electroplated circuit board, and the cleaning liquid in the third cleaning device is discharged into the first cleaning device.
Optionally, the first cleaning device comprises an outer tank body, a liquid storage chamber arranged inside the outer tank body, and a driving piece for driving the liquid storage chamber to ascend and descend inside the outer tank body;
a first liquid inlet is formed in the middle of one side of the outer groove body;
the driving piece is arranged outside the outer groove body, and one end of the driving piece penetrates through the outer groove body to be fixedly connected with the liquid storage chamber;
the liquid storage chamber is arranged below the first liquid inlet;
the liquid storage chamber is driven by the driving piece to lift in the outer groove body; when the first cleaning device is needed to clean the circuit board, the driving piece is started to enable the driving piece to drive the liquid storage chamber to ascend in the outer tank body until the circuit board is completely soaked in the liquid storage chamber filled with cleaning liquid, the work of the driving piece is stopped, and the circuit board is cleaned for the first time;
after the circuit board is stopped for a period of time, the driving piece is started again to work, so that the driving piece drives the liquid storage chamber to descend to the initial position in the outer tank body, and meanwhile, the vertical mechanism is started to drive the circuit board which finishes one-time cleaning to move upwards to return to the position right above the outer tank body;
the liquid reserve chamber includes that casing, joint are provided with weighing transducer on the impurity deposits the board in the inside impurity of casing for the monitoring impurity.
Optionally, the second cleaning device comprises a cleaning cylinder and a water inlet coil fixed at the bottom of the inner cavity of the cleaning cylinder; the water inlet branch pipe is communicated with the water inlet coil pipe; a plurality of cleaning nozzles which are arranged on the water inlet branch pipe at equal intervals and are communicated with the water inlet branch pipe; a water outlet arranged at the rear part of the bottom of the cleaning cylinder and a drain pipe used for communicating and discharging the cleaning liquid after cleaning;
the bottom of the outer side wall of the cleaning barrel is provided with racks along the circumferential direction, the racks are meshed with gears, and the gears are driven by a motor. The bottom surface of the cleaning barrel is provided with a water inlet hole communicated with the water inlet coil. And the inner wall of the water inlet hole is movably provided with a rotating ring, the inner wall of the rotating ring penetrates through a spray pipe, and the outer surface of the spray pipe is fixedly connected in the rotating ring. One end of the spray pipe is communicated with the water inlet coil pipe, and the other end of the spray pipe is communicated with external cleaning liquid;
the water inlet branch pipes are distributed in parallel to the height direction of the cleaning barrel;
motor drive gear rotates and then drives the wash bowl and rotate, and the wash bowl rotates and then drives into water coil pipe and a plurality of washing shower nozzle and rotates to make the wash bowl wash once more from each direction to the circuit board that washs.
Optionally, the third cleaning device includes a cleaning liquid cylinder, a second liquid inlet is formed in a side wall of the cleaning liquid cylinder, the second liquid inlet is communicated with external cleaning liquid through a pipeline, a main liquid discharge pipe communicated with the cleaning liquid cylinder is formed at the bottom of the cleaning liquid cylinder, a branch pipe is branched from the main liquid discharge pipe, and the branch pipe is communicated with the first liquid inlet.
Optionally, the cleaning device further comprises a cleaning chamber, the cleaning chamber is used for cleaning the electroplating bath, another branch pipe is further branched from the main liquid discharge pipe, the other branch pipe is communicated with a liquid inlet of the cleaning chamber, the other liquid inlet of the cleaning chamber is communicated with one end of the water discharge pipe, and a liquid discharge port of the cleaning chamber extends to the outside through a pipeline.
Optionally, a liquid inlet of the electroplating bath is formed in the side wall of the electroplating bath, a liquid inlet hose is communicated with the liquid inlet of the electroplating bath, a rotating shaft is fixedly connected to the middle of the side wall of the electroplating bath, one end, far away from the electroplating bath, of the rotating shaft is rotatably connected with a rotating motor, and the rotating motor drives the electroplating bath to rotate along the axial direction of the rotating motor.
Optionally, a plurality of cleaning brushes are arranged in the cleaning chamber in parallel to the bottom surface of the lower box body, a plurality of through holes are formed in one side of the cleaning chamber close to the electroplating bath and corresponding to the opening of the electroplating bath, one end of each cleaning brush is matched with the corresponding through hole and is arranged in a sealing mode, and the cleaning brushes are driven by the cleaning motors to move forward so as to enable the cleaning brushes to enter the electroplating bath rotated by 90 degrees to clean the electroplating bath.
Optionally, the cleaning brush comprises a sealing cover, a support rod and a brush which are in sealing fit with the through hole;
the sealing cover is connected with the through hole in a sealing mode, one end of the supporting rod is connected with the sealing cover, the outer side wall of the supporting rod is connected with the hairbrush, the other end of the supporting rod is connected with a driving device, and the driving device is used for driving the supporting rod to move forward along one side of the through hole and driving the supporting rod to rotate in the advancing process.
Optionally, the cleaning device further comprises a partition wall, the partition wall is arranged between the electroplating bath and the first cleaning device, a position sensor is arranged at the top of the partition wall, and the position sensor is used for detecting the time when the circuit board enters the cleaning mechanism and respectively starting the first cleaning device, the second cleaning device and the third cleaning device to work.
Optionally, the clamping mechanism comprises a clamping main body, a horizontal groove is milled in the clamping main body, the groove is used for clamping a lifting hook on the crown block, a sliding groove is formed in the lower portion of the clamping main body, a fixed clamping seat and a movable clamping seat are respectively arranged at two ends of the sliding groove, a spring is arranged in the sliding groove, one end of the spring abuts against the sliding groove, the other end of the spring abuts against the movable clamping seat, and a circuit board is clamped between the fixed clamping seat and the movable clamping seat.
(III) advantageous effects
The invention has the beneficial effects that: the integrated automatic electroplating cleaning machine for manufacturing the circuit board adopts the cleaning mechanism in the next step in the electroplating bath, and the cleaning mechanism is divided into three parts for cleaning. The third cleaning device is used for cleaning for the third time, the cleaned cleaning liquid can be reused and then is connected with the liquid inlet of the first cleaning device through the liquid outlet of the third cleaning device, so that the cleaning liquid cleaned by the third cleaning device flows into the first cleaning device through the liquid inlet of the first cleaning device, and then the first cleaning device can clean the circuit board which is electroplated and passes through the partition wall. The cleaning solution is discharged outside after cleaning, the circuit board enters the second cleaning device for cleaning again, and the circuit board is cleaned by the third cleaning device again, so that the cleaning effect of the electroplated printing plate is ensured by the hierarchical cleaning, the cleaning solution for cleaning is saved, and the waste of the cleaning solution is avoided.
Drawings
FIG. 1 is a schematic cross-sectional front view of an integrated automatic electroplating cleaning machine for manufacturing circuit boards according to the present invention;
FIG. 2 is a partial detail view of the integrated automatic plating washer cleaning mechanism for circuit board fabrication of FIG. 1;
FIG. 3 is a schematic right sectional view of a cleaning chamber of the integrated automatic electroplating cleaning machine for manufacturing circuit boards according to the present invention;
FIG. 4 is a schematic perspective view of a clamping mechanism of the integrated automatic electroplating cleaning machine for manufacturing circuit boards according to the present invention;
FIG. 5 is a schematic cross-sectional front view of the integrated automatic plating cleaning machine for manufacturing circuit boards in FIG. 4.
[ description of reference ]
10: an upper box body;
20: a lower box body;
30: an electroplating bath; 31: a liquid inlet hose; 32: a rotating shaft; 33: rotating the motor;
40: a partition wall;
50: a cleaning mechanism; 51: a first cleaning device; 511: an outer tank body; 512: a liquid storage chamber; 512-1: a housing; 512-2: an impurity precipitation plate; 513: a drive member; 514: a first liquid inlet; 52: a second cleaning device; 521: a cleaning cylinder; 522: a water inlet coil pipe; 523: a water inlet branch pipe; 524: cleaning the spray head; 525: a drain pipe; 526: a rack; 527: a gear; 528: a water spray pipe; 53: a third cleaning device; 531: a cleaning liquid cylinder; 532: a second liquid inlet; 533: a main drain pipe; 534: a first branch pipe; 535: a second branch pipe;
60: a circuit board;
70: a clamping mechanism; 71: a clamping body; 72: a groove; 73: a chute; 74: a spring; 75: fixing the clamp seat; 76: a movable clamp seat;
80: a cleaning chamber; 81: cleaning brushes; 82: a through hole; 83: a sealing cover; 84: a strut; 85: and a brush.
Detailed Description
For the purpose of better explaining the present invention and to facilitate understanding, the present invention will be described in detail by way of specific embodiments with reference to the accompanying drawings. As used herein, the terms "upper," "lower," "left," "right," and the like are used with reference to the orientation of FIG. 1.
The integrated automatic electroplating cleaning machine for manufacturing the circuit board comprises an upper box body 10 and a lower box body 20 welded below the upper box body 10, wherein the upper box body 10 is communicated with the lower box body 20 to form a working area. The plating bath 30 for containing the plating bath, the partition wall 40 and the cleaning mechanism 50 are disposed at the left end of the bottom of the inner wall of the lower box 20, and the plating bath in the plating bath 30 is used for plating the printed circuit board 60. The cleaning mechanism 50 is used to clean the circuit board 60.
The left and right ends of the upper box 10 are both provided with openings penetrating through the working area, and the openings at the two ends are used for clamping the crown block with the circuit board 60. The crown block is arranged at the top of the upper box body 10, a clamping mechanism 70 for hoisting the circuit board 60 is arranged on the crown block, and the circuit board 60 clamping mechanism 70 slides on the crown block in the horizontal direction and the vertical direction through a horizontal mechanism and a vertical mechanism. The horizontal mechanism and the vertical mechanism are both conventional technical means for technicians in the field, and the crown block can be driven to move in the horizontal direction and in the vertical direction. The circuit board 60 is vertically moved downwards on the crown block by the vertical mechanism, and the circuit board 60 is completely soaked in the electroplating solution for electroplating. The circuit board 60 is moved horizontally to the right on the overhead traveling crane by the horizontal mechanism to move the circuit board 60 to the upper side of the cleaning mechanism 50, and is moved vertically downward by the vertical mechanism to place the circuit board 60 inside the cleaning mechanism 50 for cleaning.
A first cleaning device 51, a second cleaning device 52 and a third cleaning device 53 which are sequentially arranged along the length direction of the lower box body 20 by the cleaning mechanism 50;
the liquid inlet of the first cleaning device 51 is connected with the liquid outlet of the third cleaning device 53 through a pipeline, the electroplated circuit board 60 sequentially enters the first cleaning device 51, the second cleaning device 52 and the third cleaning device 53 for cleaning, and the cleaning liquid in the third cleaning device 53 is discharged into the first cleaning device 51.
The liquid inlet of the first cleaning device 51 is connected with the liquid outlet pipeline of the third cleaning device 53, and a liquid outlet valve is arranged at the position close to the water outlet of the third cleaning device 53.
Referring to fig. 1 to 5, the present invention employs the cleaning mechanism 50 in the next step in the plating tank 30, and the cleaning mechanism 50 is divided into three-part cleaning. The third cleaning device 53 is used for cleaning for the third time, the cleaned cleaning solution can be reused, and then is connected with the liquid inlet of the first cleaning device 51 through the liquid outlet of the third cleaning device 53, so that the cleaning solution cleaned by the third cleaning device 53 flows into the first cleaning device 51 through the liquid inlet of the first cleaning device 51, and then the first cleaning device 51 can clean the circuit board 60 which passes through the partition wall 40 after being electroplated. The cleaning liquid is discharged outside after cleaning, the circuit board 60 enters the second cleaning device 52 for cleaning again, and the circuit board is cleaned by the third cleaning device 53, so that the cleaning effect of the electroplated printing plate is ensured by the step-by-step cleaning, the cleaning liquid for cleaning is saved, and the waste of the cleaning liquid is avoided.
Further, the first cleaning device 51 includes an outer tank 511, a reservoir 512 disposed inside the outer tank 511, and a driving member 513 configured to drive the reservoir 512 to ascend and descend inside the outer tank 511. Wherein the driving member 513 is an electro-hydraulic rod driving fluid reservoir 512.
The middle part of one side of the outer groove body 511 is provided with a first liquid inlet 514. Wherein the cleaning liquid of the third cleaning device 53 enters the liquid storage chamber 512 of the first cleaning device 51 through the first liquid inlet 514.
The driving member 513 is disposed outside the outer tank 511, and one end of the driving member passes through the outer tank 511 and is fixedly connected with the liquid storage chamber 512.
The liquid storage chamber 512 is disposed below the first liquid inlet 514 in an initial state, so that the liquid of the third cleaning device 53 enters the liquid storage chamber 512 through the first liquid inlet 514. The reservoir 512 is driven by the driving member 513 to move up and down inside the outer tank 511. When the first cleaning device 51 is required to clean the circuit board 60, the driving member 513 is started to enable the driving member 513 to drive the liquid storage chamber 512 to ascend in the outer tank body 511 until the printed circuit board 60 is completely soaked in the liquid storage chamber 512 filled with the cleaning liquid, the driving member 513 is stopped, and the printed circuit board 60 is cleaned for the first time. After a period of stagnation, the driving member 513 is started again to operate, so that the driving member 513 drives the liquid storage chamber 512 to descend back to the initial position in the outer slot 511. The reservoir 512 is disposed below the first inlet 514 to ensure that the cleaning solution directly enters the reservoir under the action of gravity, and the electroplated circuit board 60 is completely cleaned, so that the reservoir 512 is driven by an electric hydraulic rod to move upwards after being filled with the cleaning solution.
It should be noted that a liquid level meter is disposed at the top of the reservoir 512, and when the cleaning liquid reaches the position of the liquid level meter, the liquid level meter sends a signal to an external control system, and the control system controls the drain valve of the third cleaning device 53 to close to stop the cleaning liquid from flowing into the first cleaning device 51.
The reservoir 512 includes a housing 512-1, and the height of the housing 512-1 is greater than the height of the plating tank 30. The impurity that joint in casing 512-1 inside deposits board 512-2, is provided with weighing transducer on the impurity deposits board 512-2 for the monitoring impurity is how much, when impurity is too much, can send out the police dispatch newspaper through weighing transducer, and people regularly clear up the impurity on the impurity deposits board 512-2.
When the impurities are too much in a certain precipitation time, the gravity sensor can send an alarm to the external controller, and the controller can send an alarm to remind people of cleaning or replacing the impurity precipitation plate 512-2 regularly.
Further, the second cleaning device 52 includes a cleaning cylinder 521, a water inlet coil 522 fixed at the bottom of the inner cavity of the cleaning cylinder 521, a water inlet branch pipe 523 communicated with the water inlet coil 522, a plurality of cleaning nozzles 524 arranged at equal intervals on the water inlet branch pipe 523 and a water outlet arranged at the rear of the bottom of the cleaning cylinder 521, and is used for communicating one end of a water drain pipe 525 for draining the cleaned cleaning liquid, and the other end of the water drain pipe 525 is communicated with the cleaning chamber 80.
The bottom of the outer side wall of the cleaning barrel 521 is distributed with a rack 526 along the circumferential direction, the rack 526 is meshed with a gear 527, and the gear 527 is driven by a motor. The bottom surface of the cleaning barrel 521 is provided with a water inlet hole communicated with the water inlet coil 522. And the inner wall of the water inlet hole is movably provided with a rotating ring, the inner wall of the rotating ring penetrates through the water spraying pipe 528, and the outer surface of the water spraying pipe 528 is fixedly connected in the rotating ring. A spray pipe 528 is in communication with the intake coil 522, the spray pipe 528 being for the inflow of clean external wash water.
The water inlet branch pipes 523 are distributed in parallel to the height direction of the cleaning cylinder 521.
The motor driving gear 527 rotates to drive the cleaning barrel 521 to rotate, and the cleaning barrel 521 rotates to drive the water inlet coil 522 and the plurality of cleaning nozzles 524 to rotate. So that the cleaning cylinder 521 can perform cleaning and flushing on the printed circuit board 60 from all directions.
The working principle of the second cleaning device 52 is as follows: the starter motor is rotatory, the motor rotates and then drives gear 527 and rotate, gear 527 rotate with rack 526 on the wash bowl 521 meshes mutually, thereby drive the wash bowl 521 and rotate, because the setting of swivel becket so that spray pipe 528 can not rotate along with the wash bowl 521, wash pipe 528 can be to supplying outside washing liquid in the water inlet coil pipe 522 in the wash bowl 521, water inlet coil pipe 522 just can flow into the washing shower nozzle 524 through water inlet branch pipe 523 with the washing liquid, wash the shower nozzle and can wash from circuit board 60 all directions at wash bowl 521 pivoted in-process, thereby make the washing of circuit board 60 more thorough.
Further, the third cleaning device 53 includes a cleaning liquid cylinder 531, a second liquid inlet 532 is provided on a side wall of the cleaning liquid cylinder 531, and the second liquid inlet 532 is used for flowing in of an external clean cleaning liquid. The bottom of the cleaning liquid cylinder 531 is provided with a main liquid discharge pipe 533 communicated with the cleaning liquid cylinder 531. A first branch pipe 534 branches from the main drain pipe 533, and the first branch pipe 534 communicates with the first inlet port 514.
Further, the cleaning chamber 80 is further included, the cleaning chamber 80 is used for cleaning the electroplating bath 30, a second branch pipe 535 is further branched from the main liquid discharge pipe 533, the second branch pipe 535 is communicated with a liquid inlet of the cleaning chamber 80, another liquid inlet of the cleaning chamber 80 is communicated with one end of a water discharge pipe 525, and a liquid discharge port of the cleaning chamber 80 extends to the outside through a pipeline. Since the plating vessel 30 is cleaned by the cleaning chamber 80, the plating vessel 30 is periodically cleaned by the cleaning chamber 80, since the plating solution is prevented from being used for a long time and from causing a certain corrosiveness to the plating vessel 30.
It should be noted that when the cleaning liquid in the liquid storage chamber 512 of the first cleaning device 51 reaches the height of the liquid level meter, the valve on the first branch pipe 534 of the first liquid inlet 514 is closed, the valve on the second branch pipe 535 is opened, and the liquid in the cleaning liquid cylinder 531 flows into the cleaning chamber 80 for use in the cleaning chamber 80.
Furthermore, a liquid inlet of the electroplating bath is arranged on the side wall of the electroplating bath 30, and the liquid inlet of the electroplating bath is communicated with a liquid inlet hose 31. The middle part of the side wall of the electroplating bath 30 is fixedly connected with a rotating shaft 32, one end of the rotating shaft 32, which is far away from the electroplating bath 30, is rotatably connected with a rotating motor 33, and the rotating motor 33 drives the electroplating bath 30 to rotate for 90 degrees. The rotation of plating cell 30 along rotation axis 32 aligns the opening of plating cell 30 with cleaning chamber 80, further facilitating the cleaning of plating cell 30 by cleaning chamber 80.
A cleaning brush 81 is arranged in the cleaning chamber 80, the cleaning brush 81 is driven by a cleaning motor to move forward, so that the cleaning brush 81 enters the electroplating tank 30 rotated by 90 degrees to clean the electroplating tank 30, the cleaning brush 81 returns to the cleaning chamber 80 after cleaning, a liquid inlet switch of the cleaning chamber 80 is started through an external controller, cleaning water of the second cleaning device 52 enters the cleaning chamber 80 through a water outlet pipe 525, cleaning liquid of the third cleaning device 53 enters the cleaning chamber 80 through a second branch pipe 535, the cleaning brush 81 is cleaned, and finally a water outlet valve is opened to discharge liquid in the cleaning chamber 80 after cleaning the brush 81 to the outside. Or the liquid in the cleaning chamber 80 is discharged to the outside before the plating tank 30 is cleaned again.
Further, a plurality of washing brushes are provided in the washing chamber 80 in parallel to the bottom surface of the lower case 20, a plurality of through holes 82 are provided in the side of the washing chamber 80 close to the plating tank 30 in correspondence to the opening of the plating tank 30, one ends of the washing brushes are fitted and sealed in the through holes 82, and the washing brushes are driven by the washing motor to move forward so as to be brought into the plating tank 30 after being rotated by 90 degrees (in a state of a dotted line of the plating tank 30 in fig. 3) to wash the plating tank 30. The plating tank 30 is periodically cleaned by a cleaning brush.
Further, the washing brush includes a sealing cover 83 sealingly engaged with the through hole 82, a support rod 84, and a brush 81;
the sealing cover 83 is connected with the through hole 82 in a sealing mode, one end of the supporting rod 84 is connected with the sealing cover 83, the outer side wall of the supporting rod 84 is connected with the brush 81, and the other end of the supporting rod 84 is connected with a driving device which is used for driving the supporting rod 84 to advance along one side of the through hole 82 and driving the supporting rod 84 to rotate in the advancing process.
It should be noted that, during cleaning, the cleaning solution in the cleaning chamber is discharged to the outside, the driving device is started to drive the support rod to rotate and advance, the driving device has a working principle similar to that of a spiral advancing rod, the support rod is driven to rotate while advancing, the brush 81 enters the electroplating bath 30 to clean the electroplating bath, the cleaning is completed, the driving device is reversely started to drive the support rod to reversely rotate and return to the initial state, namely the state in fig. 3, so that the sealing cover 83 is tightly attached to the through hole 82, the cleaning solution can be put into the liquid storage chamber 80 again to soak and clean the brush 81, and finally the cleaning solution is discharged to the outside and can clean the electroplating bath 30 again.
Further, the device comprises a partition wall 40, wherein the partition wall 40 is arranged between the electroplating bath 30 and the first cleaning device 51, a position sensor is arranged on the top of the partition wall 40, and the position sensor is used for detecting the time when the circuit board 60 enters the cleaning mechanism 50 and respectively starting the first cleaning device 51, the second cleaning device 52 and the third cleaning device 53. Facilitating more accurate starting of the cleaning mechanism 50.
Further, the clamping mechanism 70 includes a clamping main body 71, a horizontal groove 72 is milled on the clamping main body 71, the groove 72 is used for clamping a lifting hook on the overhead traveling crane, a sliding groove 73 is formed below the clamping main body 71, a fixed clamping seat 75 and a movable clamping seat 76 are respectively arranged at two ends of the sliding groove 73, a spring 74 is arranged in the sliding groove 73, one end of the spring 74 abuts against the sliding groove 73, the other end of the spring 74 abuts against the movable clamping seat 76, and the circuit board 60 is clamped between the fixed clamping seat 75 and the movable clamping seat 76. The distance between the fixed holder 75 and the movable holder 76 can be adjusted within a certain range by the spring 74, so as to be adapted to the width of the circuit board 60. The circuit board 60 is clamped by the elastic force of the fixed clamp holder 75, the movable clamp holder 76 and the circuit board 60.
In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium; either as communication within the two elements or as an interactive relationship of the two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, a first feature may be "on" or "under" a second feature, and the first and second features may be in direct contact, or the first and second features may be in indirect contact via an intermediate. Also, a first feature "on," "above," and "over" a second feature may be directly or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lower level than the second feature.
In the description herein, the description of the terms "one embodiment," "some embodiments," "an embodiment," "an example," "a specific example" or "some examples" or the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described above, it should be understood that the above embodiments are illustrative and not restrictive, and that those skilled in the art may make changes, modifications, substitutions and alterations to the above embodiments without departing from the scope of the present invention.
Claims (10)
1. The utility model provides an integration automatic electroplating cleaning machine for circuit board preparation which characterized in that: comprises an upper box body (10) with an opening at the lower part and a lower box body (20) fixed below the upper box body (10);
the upper box body (10) is communicated with the lower box body (20) to form a working area;
an electroplating bath (30) filled with electroplating solution and a cleaning mechanism (50) are sequentially arranged in the lower box body (20), wherein the electroplating solution in the electroplating bath (30) is used for electroplating the circuit board (60), and the cleaning mechanism (50) is used for cleaning the circuit board (60);
an inner cavity of the upper box body (10) is provided with a crown block, the crown block is provided with a clamping mechanism (70) used for hoisting a circuit board (60), the clamping mechanism (70) slides on the crown block in the horizontal and vertical directions through a horizontal mechanism and a vertical mechanism, the circuit board (60) clamped by the clamping mechanism (70) slides on the crown block vertically and downwards through the vertical mechanism so that the circuit board (60) is completely soaked in the electroplating bath (30) to obtain the electroplated circuit board (60), the vertical mechanism is reversely started again to slide vertically and upwards, and the electroplated circuit board (60) slides on the crown block horizontally through the horizontal mechanism so that the electroplated circuit board (60) slides above the cleaning mechanism (50) and is cleaned;
the cleaning mechanism (50) comprises a first cleaning device (51), a second cleaning device (52) and a third cleaning device (53) which are sequentially arranged along the length direction of the lower box body (20);
the liquid inlet of the first cleaning device (51) is connected with the liquid outlet pipeline of the third cleaning device (53), the electroplated circuit board (60) sequentially enters the first cleaning device (51), the second cleaning device (52) and the third cleaning device (53) to be cleaned, and the cleaning liquid in the third cleaning device (53) is discharged into the first cleaning device (51).
2. The integrated automatic electroplating cleaning machine for manufacturing the circuit board according to claim 1, wherein: the first cleaning device (51) comprises an outer tank body (511), a liquid storage chamber (512) arranged in the outer tank body (511) and a driving piece (513) used for driving the liquid storage chamber (512) to ascend and descend in the outer tank body (511);
a first liquid inlet (514) is formed in the middle of one side of the outer tank body (511);
the driving piece (513) is arranged outside the outer tank body (511), and one end of the driving piece penetrates through the outer tank body (511) and is fixedly connected with the liquid storage chamber (512);
the liquid storage chamber (512) is arranged below the first liquid inlet (514), and the first liquid inlet (514) is connected with the third cleaning device (53) through a pipeline;
the liquid storage chamber (512) is driven to lift in the outer groove body (511) by the driving piece (513); when the first cleaning device (51) is required to clean the circuit board (60), the driving piece (513) is started to enable the driving piece (513) to drive the liquid storage chamber (512) to ascend in the outer groove body (511) until the circuit board (60) is completely soaked in the liquid storage chamber (512) filled with cleaning liquid, the driving piece (513) stops working, and the circuit board (60) finishes first cleaning;
after the circuit board is stopped for a period of time, the driving piece (513) is started to work again, so that the driving piece (513) drives the liquid storage chamber (512) to descend to the initial position in the outer tank body (511), and meanwhile, a vertical mechanism is started to drive the circuit board (60) which finishes one-time cleaning to move upwards and return to the position right above the outer tank body (511);
the liquid storage chamber (512) comprises a shell (512-1) and an impurity precipitation plate (512-2) clamped inside the shell (512-1), wherein a weight sensor is arranged on the impurity precipitation plate (512-2) and used for monitoring impurities.
3. The integrated automatic electroplating cleaning machine for manufacturing the circuit board according to claim 1, wherein: the second cleaning device (52) comprises a cleaning cylinder (521) and a water inlet coil pipe (522) fixed at the bottom of the inner cavity of the cleaning cylinder (521); a water inlet branch pipe (523) communicated with the water inlet coil pipe (522); a plurality of cleaning nozzles (524) which are arranged on the water inlet branch pipe (523) at equal intervals and are communicated with the water inlet branch pipe (523); a water outlet arranged at the rear part of the bottom of the cleaning cylinder (521) and a water outlet pipe (525) used for communicating and discharging cleaning liquid after cleaning;
the cleaning device is characterized in that racks (526) are distributed at the bottom of the outer side wall of the cleaning barrel (521) along the circumferential direction of the cleaning barrel, the racks (526) are meshed with gears (527), and the gears (527) are driven by a motor. The bottom surface of the cleaning barrel (521) is provided with a water inlet hole communicated with the water inlet coil pipe (522). And the inner wall of the water inlet hole is movably provided with a rotating ring, the inner wall of the rotating ring penetrates through a water spray pipe (528), and the outer surface of the water spray pipe (528) is fixedly connected in the rotating ring. One end of the spray pipe (528) is communicated with the water inlet coil pipe (522), and the other end of the spray pipe (528) is communicated with external cleaning liquid;
the water inlet branch pipes (523) are distributed in parallel to the height direction of the cleaning cylinder (521);
the motor drives the gear (527) to rotate so as to drive the cleaning barrel (521) to rotate, the cleaning barrel (521) rotates so as to drive the water inlet coil pipe (522) and the plurality of cleaning nozzles (524) to rotate, so that the cleaning barrel (521) can clean and flush the circuit board (60) which is cleaned once again from all directions.
4. The integrated automatic plating cleaning machine for manufacturing the circuit board according to claim 3, wherein: the third cleaning device (53) comprises a cleaning liquid barrel body (531), a second liquid inlet (532) is formed in the side wall of the cleaning liquid barrel body (531), the second liquid inlet (532) is communicated with external cleaning liquid through a pipeline, a main liquid discharge pipe (533) communicated with the cleaning liquid barrel body (531) is formed in the bottom of the cleaning liquid barrel body (531), a first branch pipe (534) is branched from the main liquid discharge pipe (533), and the first branch pipe (534) is communicated with the first liquid inlet (514).
5. The integrated automatic electroplating cleaning machine for manufacturing the circuit board according to claim 4, wherein: the cleaning device is characterized by further comprising a cleaning chamber (80), wherein the cleaning chamber (80) is used for cleaning the electroplating bath (30), a second branch pipe (535) is further branched from the main liquid discharge pipe (533), the second branch pipe (535) is communicated with a liquid inlet of the cleaning chamber (80), another liquid inlet of the cleaning chamber (80) is communicated with one end of the water discharge pipe (525), and a liquid discharge port of the cleaning chamber (80) extends to the outside through a pipeline.
6. The integrated automatic plating cleaning machine for manufacturing the circuit board according to claim 5, wherein: the electroplating bath device is characterized in that an electroplating bath liquid inlet is formed in the side wall of the electroplating bath (30), a liquid inlet hose (31) is communicated with the electroplating bath liquid inlet, a rotating shaft (32) is fixedly connected to the middle of the side wall of the electroplating bath (30), one end, far away from the electroplating bath (30), of the rotating shaft (32) is rotatably connected with a rotating motor (33), and the rotating motor (33) drives the electroplating bath (30) to rotate 90 degrees along the axial direction of the rotating motor (33).
7. The integrated automatic electroplating cleaning machine for manufacturing the circuit board according to claim 6, wherein: be on a parallel with in purge chamber (80) the bottom surface of lower box (20) is provided with a plurality of cleaning brushes, purge chamber (80) are close to plating bath (30) one side with a plurality of through-holes (82) have been seted up correspondingly to plating bath (30) opening, the one end of cleaning brush with through-hole (82) cooperate sealed setting, the cleaning brush moves forward under the drive of cleaning motor, so that the cleaning brush gets into and rotates behind the 90 degrees right in plating bath (30) are washd.
8. The integrated automatic plating cleaning machine for manufacturing the circuit board according to claim 7, wherein: the cleaning brush comprises a sealing cover (83) in sealing fit with the through hole (82), a support rod (84) and a brush (81);
sealed lid (83) with through-hole (82) sealing connection, the one end of branch (84) with sealed lid (83) link to each other, the lateral wall of branch (84) with brush (81) link to each other, the other end of branch (84) is connected with drive arrangement, drive arrangement is used for the drive branch (84) are followed through-hole (82) one side is advanced, and drives in the process of advancing branch (84) rotate.
9. The integrated automatic electroplating cleaning machine for manufacturing the circuit board according to claim 1, wherein: the cleaning device is characterized by further comprising a partition wall (40), wherein the partition wall (40) is arranged between the electroplating tank (30) and the first cleaning device (51), a position sensor is arranged at the top of the partition wall (40) and used for detecting the time when the circuit board (60) enters the cleaning mechanism (50) and respectively starting the first cleaning device (51), the second cleaning device (52) and the third cleaning device (53) to work.
10. The integrated automatic electroplating cleaning machine for manufacturing the circuit board according to claim 1, wherein: fixture (70) include centre gripping main part (71) mill horizontal recess (72) on centre gripping main part (71), recess (72) are used for the overhead traveling crane to go up the centre gripping of drawing, spout (73) have been seted up to the below of centre gripping main part (71), the both ends of spout (73) are provided with fixed holder (75) and activity holder (76) respectively, be provided with spring (74) in spout (73), the one end of spring (74) with spout (73) offset, the other end of spring (74) with activity holder (76) offset, fixed holder (75) with circuit board (60) have been held in the centre gripping between activity holder (76).
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| CN113634547A (en) * | 2021-08-26 | 2021-11-12 | 南京屹正网络科技有限公司 | Circuit board cleaning equipment and cleaning method |
| CN114132704A (en) * | 2021-12-14 | 2022-03-04 | 华芯(嘉兴)智能装备有限公司 | Two-way telescoping device of small rail car |
| CN114798676A (en) * | 2022-06-28 | 2022-07-29 | 徐州阳森建设科技有限公司 | Solar cell panel's backplate recovery unit |
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| CN117641754A (en) * | 2024-01-25 | 2024-03-01 | 梅州鼎泰电路板有限公司 | Electroplating cleaning machine for circuit board production |
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