CN109304818A - 一种用于晶圆流片制造的切段装置 - Google Patents
一种用于晶圆流片制造的切段装置 Download PDFInfo
- Publication number
- CN109304818A CN109304818A CN201811208663.7A CN201811208663A CN109304818A CN 109304818 A CN109304818 A CN 109304818A CN 201811208663 A CN201811208663 A CN 201811208663A CN 109304818 A CN109304818 A CN 109304818A
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- Prior art keywords
- groups
- threaded rod
- plate
- respectively arranged
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 238000003825 pressing Methods 0.000 claims abstract description 28
- 230000005540 biological transmission Effects 0.000 claims abstract description 14
- 238000005086 pumping Methods 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 33
- 239000013078 crystal Substances 0.000 abstract description 33
- 229910052710 silicon Inorganic materials 0.000 abstract description 33
- 239000010703 silicon Substances 0.000 abstract description 33
- 238000005520 cutting process Methods 0.000 abstract description 9
- 229910021421 monocrystalline silicon Inorganic materials 0.000 abstract description 8
- 230000000694 effects Effects 0.000 description 5
- 238000002224 dissection Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 230000004224 protection Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811208663.7A CN109304818B (zh) | 2018-10-17 | 一种用于晶圆流片制造的切段装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811208663.7A CN109304818B (zh) | 2018-10-17 | 一种用于晶圆流片制造的切段装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109304818A true CN109304818A (zh) | 2019-02-05 |
CN109304818B CN109304818B (zh) | 2024-10-22 |
Family
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0535296A1 (en) * | 1991-09-30 | 1993-04-07 | Mitsubishi Materials Corporation | Slicing machine |
CN101499409A (zh) * | 2008-10-17 | 2009-08-05 | 秦拓微电子技术(上海)有限公司 | 智能型晶圆贴膜机 |
CN101974833A (zh) * | 2010-10-29 | 2011-02-16 | 张丁元 | 电脑晶片绣花机横向切片装置 |
US20140311471A1 (en) * | 2013-04-18 | 2014-10-23 | Disco Corporation | Cutting apparatus having blade cover |
CN107756655A (zh) * | 2017-09-28 | 2018-03-06 | 倪雨阳 | 一种石墨垫片自动切割、加工成型流水线设备 |
CN207386726U (zh) * | 2017-11-06 | 2018-05-22 | 常州市明锐工具有限公司 | 一种沉孔成型刀 |
CN108544542A (zh) * | 2018-05-17 | 2018-09-18 | 江苏聚泰科技有限公司 | 一种lcm背光源切割装置 |
CN209492015U (zh) * | 2018-10-17 | 2019-10-15 | 江苏英锐半导体有限公司 | 一种用于晶圆流片制造的切段装置 |
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0535296A1 (en) * | 1991-09-30 | 1993-04-07 | Mitsubishi Materials Corporation | Slicing machine |
CN101499409A (zh) * | 2008-10-17 | 2009-08-05 | 秦拓微电子技术(上海)有限公司 | 智能型晶圆贴膜机 |
CN101974833A (zh) * | 2010-10-29 | 2011-02-16 | 张丁元 | 电脑晶片绣花机横向切片装置 |
US20140311471A1 (en) * | 2013-04-18 | 2014-10-23 | Disco Corporation | Cutting apparatus having blade cover |
CN107756655A (zh) * | 2017-09-28 | 2018-03-06 | 倪雨阳 | 一种石墨垫片自动切割、加工成型流水线设备 |
CN207386726U (zh) * | 2017-11-06 | 2018-05-22 | 常州市明锐工具有限公司 | 一种沉孔成型刀 |
CN108544542A (zh) * | 2018-05-17 | 2018-09-18 | 江苏聚泰科技有限公司 | 一种lcm背光源切割装置 |
CN209492015U (zh) * | 2018-10-17 | 2019-10-15 | 江苏英锐半导体有限公司 | 一种用于晶圆流片制造的切段装置 |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20240922 Address after: 3 / F (d), Yancheng high tech Pioneer Park Service Center, No.9, huaruizhong Road, Yanlong street, Yandu District, Yancheng City, Jiangsu Province, 224000 Applicant after: Yancheng sugaoqirui Technology Co.,Ltd. Country or region after: China Address before: 224000 standard workshop 3, No. 1, middle New York Road, comprehensive free trade zone, Yancheng Economic and Technological Development Zone, Yancheng City, Jiangsu Province Applicant before: JIANGSU YINGRUI SEMICONDUCTOR Co.,Ltd. Country or region before: China |
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GR01 | Patent grant |