CN109300864A - 一种微小轴向安装二极管 - Google Patents

一种微小轴向安装二极管 Download PDF

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Publication number
CN109300864A
CN109300864A CN201811287671.5A CN201811287671A CN109300864A CN 109300864 A CN109300864 A CN 109300864A CN 201811287671 A CN201811287671 A CN 201811287671A CN 109300864 A CN109300864 A CN 109300864A
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CN
China
Prior art keywords
tube
tube socket
axially mounted
diode
lead
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Pending
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CN201811287671.5A
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English (en)
Inventor
彭文忠
周嵘
杜先兵
王宇
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China Zhenhua Group Wiko Electronics Co Ltd (state 873 Factory)
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China Zhenhua Group Wiko Electronics Co Ltd (state 873 Factory)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by China Zhenhua Group Wiko Electronics Co Ltd (state 873 Factory) filed Critical China Zhenhua Group Wiko Electronics Co Ltd (state 873 Factory)
Priority to CN201811287671.5A priority Critical patent/CN109300864A/zh
Publication of CN109300864A publication Critical patent/CN109300864A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861—Diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

本发明提供的一种微小轴向安装二极管，包括管座；所述管座内固接有一个管芯，管芯与管座之间通过连接线连接，管座的两端均安装有引线,引线与管座内的管芯连接。本发明用硅铝线连接管芯，减少了电极的使用，减少了产品的重量，并且通过将引线设置在二极管最底端的方式是二极管满足轴向安装的要求。

Description

一种微小轴向安装二极管
技术领域
本发明涉及一种微小轴向安装二极管。
背景技术
随着装备制造业的不断发展，为了让装备小型化、轻量化，客户对半导体器件的封装外形的小型化、重量轻的要求也越来越高，现有的一些外形已不能满足用户的使用要求，例如现有的二极管，在轴向安装时，二极管两端的引线不容易规则的曲折，在曲折过程中容易影响二极管内部结构。
发明内容
为解决上述技术问题，本发明提供了一种微小轴向安装二极管。
本发明通过以下技术方案得以实现。
本发明提供的一种微小轴向安装二极管，包括管座；所述管座内固接有管芯，管芯与管座之间通过连接线连接，管座的两端均安装有引线,引线与管座内的管芯连接。
所述管芯可根据产品要求装入所需功能芯片。
所述管座上端还设置有开口，开口通过盖板封闭。
所述引线安装在管座的下端。
所述引线的下端面与管座的下端面在同一水平面上。
所述引线为L型，短边与管座内的管芯连接后延伸至管座的最低端。
所述管芯与管壁之间具有一定间距，以保证管芯与管座之间不会出现短路现象。
所述管座为金属陶瓷材料。
所述连接线为硅铝丝。
所述管座的最低端为二极管的装配端。
本发明的有益效果在于：用硅铝线连接管芯，减少了电极的使用，减少了产品的重量，并且通过将引线设置在二极管最底端的方式是二极管满足轴向安装的要求。
附图说明
图1是本发明的结构示意图；
图中：1-管芯，2-管座，3-连接线，4-盖板，5-引线。
具体实施方式
下面进一步描述本发明的技术方案，但要求保护的范围并不局限于所述。
一种微小轴向安装二极管，包括管座2；所述管座2内固接有功能管芯，管芯与管座之间通过连接线3连接，管座2的两端均安装有引线5,引线5与管座2内的管芯连接。
所述管芯可根据产品要求装入所需功能芯片。
所述管座2上端还设置有开口，开口通过盖板4封闭。开口的大小能够让机械或工人直接将管芯装配在2内。
所述引线5安装在管座2的下端。
所述引线5的下端面与管座2的下端面在同一水平面上。
所述引线5为L型，短边与管座2内的管芯连接后延伸至管座2的最低端。
所述管芯与管壁之间具有一定间距，以保证管芯与管座之间不会出现短路现象。
所述管座2均为金属陶瓷材料。
所述连接线3为硅铝丝。
所述管座2的最低端为二极管的装配端。
本发明使用硅铝线连接管芯，减少了电极的使用，减少了产品的体积和重量，并且通过将引线设置在二极管最底端的方式是二极管满足轴向安装的要求。

Claims (10)

1.一种微小轴向安装二极管，包括管座(2)，其特征在于：所述管座(2)内固接有一个管芯，管芯与管座之间通过连接线(3)连接，管座(2)的两端均安装有引线(5),引线(5)与管座(2)内的管芯连接。
2.如权利要求1所述的一种微小轴向安装二极管，其特征在于：所述管芯可根据产品要求装入所需功能芯片。
3.如权利要求1所述的一种微小轴向安装二极管，其特征在于：所述管座(2)上端还设置有开口，开口通过盖板(4)封闭。
4.如权利要求1所述的一种微小轴向安装二极管，其特征在于：所述引线(5)安装在管座(2)的下端。
5.如权利要求1所述的一种微小轴向安装二极管，其特征在于：所述引线(5)的下端面与管座(2)的下端面在同一水平面上。
6.如权利要求1所述的一种微小轴向安装二极管，其特征在于：所述引线(5)为L型，短边与管座(2)内的管芯连接后延伸至管座(2)的最低端。
7.如权利要求1所述的一种微小轴向安装二极管，其特征在于：所述管芯与管壁之间具有一定间距，以保证管芯与管座之间不会出现短路现象。
8.如权利要求1所述的一种微小轴向安装二极管，其特征在于：所述管座(2)为金属陶瓷材料。
9.如权利要求1所述的一种微小轴向安装二极管，其特征在于：所述连接线(3)为硅铝丝。
10.如权利要求1所述的一种微小轴向安装二极管，其特征在于：所述管座(2)的最低端为二极管的装配端。
CN201811287671.5A 2018-10-31 2018-10-31 一种微小轴向安装二极管 Pending CN109300864A (zh)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101571440A (zh) * 2008-04-29 2009-11-04 北京大学 一种应用于器件级真空封装的真空度测量装置
CN104347556A (zh) * 2013-07-23 2015-02-11 中国振华集团永光电子有限公司 二极管封装结构
CN204538019U (zh) * 2015-04-28 2015-08-05 锦州辽晶电子科技有限公司 八路整流二极管阵列
CN204732388U (zh) * 2015-07-13 2015-10-28 中国电子科技集团公司第十三研究所 引线由侧面引出的陶瓷封装外壳

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101571440A (zh) * 2008-04-29 2009-11-04 北京大学 一种应用于器件级真空封装的真空度测量装置
CN104347556A (zh) * 2013-07-23 2015-02-11 中国振华集团永光电子有限公司 二极管封装结构
CN204538019U (zh) * 2015-04-28 2015-08-05 锦州辽晶电子科技有限公司 八路整流二极管阵列
CN204732388U (zh) * 2015-07-13 2015-10-28 中国电子科技集团公司第十三研究所 引线由侧面引出的陶瓷封装外壳

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Application publication date: 20190201

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