CN109300813A - A kind of semiconductor device arrangements - Google Patents
A kind of semiconductor device arrangements Download PDFInfo
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- CN109300813A CN109300813A CN201811169037.1A CN201811169037A CN109300813A CN 109300813 A CN109300813 A CN 109300813A CN 201811169037 A CN201811169037 A CN 201811169037A CN 109300813 A CN109300813 A CN 109300813A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Abstract
The invention discloses a kind of semiconductor device arrangements, including apparatus main body, it is set to the intracorporal film sticking apparatus of described device master and is set to the intracorporal supplementary device of described device master, the film sticking apparatus includes the working chamber being set in described device main body right end, the right side inner wall of the working chamber is provided with the perforative chip entrance in left and right, the first sliding groove of opening to the right is provided in the inner left wall of the working chamber, it is provided in the first sliding groove slidably and right end extends into the first sliding block in the working chamber, rotatable first rotating shaft is provided in first sliding block, the right end of the first rotating shaft is fixedly connected with the Pneumatic clamping block being aligned with the chip entrance；The present apparatus, which can be automated, carries out pad pasting working process to semiconductor device chip, subsequent chip cutting is facilitated to process, the comfort easy to operate that personnel can be improved and use of device, the service time for reducing personnel accelerates processing efficiency, it can be recycled and long service life, cost low power consuming are few.
Description
Technical field
The present invention relates to field of semiconductor processing, specially a kind of semiconductor device arrangements.
Background technique
The development of intellectual technology is become better and better at present, partly leading thus with regard to the efficiency for needing to accelerate to produce and process, and in the past
Body production and processing apparatus structure is too simple and the manpower service time is more, just needs device that can automate to semiconductor device thus
Part chip carries out pad pasting working process, and subsequent chip cutting is facilitated to process, and personnel's use can be improved in the easy to operate of device
Comfort, the service time for reducing personnel accelerates processing efficiency, can be recycled and long service life, and cost low power consuming is few,
Therefore it is badly in need of wanting a kind of a kind of semiconductor device arrangements of multifunction.
Summary of the invention
The purpose of the present invention is to provide a kind of semiconductor device arrangements, for overcoming drawbacks described above in the prior art.
A kind of semiconductor device arrangements according to the present invention, including apparatus main body, it is set to the intracorporal patch of described device master
Film device and it is set to the intracorporal supplementary device of described device master, the film sticking apparatus includes that be set to described device main body right
Working chamber in end, the right side inner wall of the working chamber are provided with the perforative chip entrance in left and right, in the left side of the working chamber
It is provided with the first sliding groove of opening to the right on wall, is provided with slidably in the first sliding groove and right end extends into the working chamber
The first interior sliding block is provided with rotatable first rotating shaft in first sliding block, and the right end of the first rotating shaft is fixedly connected
There is the Pneumatic clamping block being aligned with the chip entrance, it is opposite that the upper and lower sides inner wall of the first sliding groove is symmetrically arranged with opening
Gear grooved, is provided with the electric gear for engaging and being cooperatively connected with the first sliding block upper and lower side in the gear grooved, and described first
The left end of shaft is provided with the spline of opening to the left, is provided with the first drive cavity, institute in the inner left wall of the first sliding groove
It states and is provided with first bevel gear in the first drive cavity, right end extension is fixedly connected at the axle center of the first bevel gear and is passed through institute
The splined shaft in first sliding groove and with spline pairing is stated, the upper end engagement of the first bevel gear is connected with second
Bevel gear is fixedly connected with the second shaft, the upper inside walls setting of first drive cavity at the axle center of the second bevel gear
Have the second sliding slot that Open Side Down, be provided in the second sliding slot can slide up and down and lower end by bearing with described second turn
Axis is rotatably assorted the second sliding block of connection, and the left and right end of second sliding block is symmetrical and is fixedly connected with directional homing device, institute
State and be provided with reseting cavity in the downside inner wall of the first drive cavity, the lower end of second shaft extend be passed through in the reseting cavity and
By bearing be rotatably assorted in can and the resetting block of interior sliding on, the lower end of the resetting block is fixedly connected with reset spring,
First gear is fixedly connected in second shaft, the right side inner wall of first drive cavity is provided with the driving of opening to the left
Slot is provided with the second gear for engaging and being cooperatively connected with the first gear, the axle center of the third gear in the driver slot
Place is fixedly connected with upper end power and is cooperatively connected in the output being fixed in the driver slot upper inside walls in first motor
Shaft is provided with film positioning device in described device main body.
Further technical solution, the film positioning device include symmetrically setting on the inner wall of side before and after being set to the working chamber
It sets and the opposite guide runner that is open, electric threaded shaft is provided in the guide runner, is threadedly engaged and is connected on the electronic screw rod
Can slide up and down threaded block, and pneumatic clamps film block, the upper inside walls setting of the working chamber are fixedly connected on the threaded block
There is the third sliding slot that Open Side Down, being provided in the third sliding slot can slide up and down and lower end abuts and band with the threaded block
Have guiding resetting apparatus third sliding block, the inner left wall of the third sliding slot be provided with opening to the right and with the second sliding slot
4th sliding slot of connection, be provided in the 4th sliding slot slidably and right end and third upper end of slide block pairing and left end with
The Four-slider of the second upper end of slide block pairing, the upper and lower side of the Four-slider is symmetrical and is fixedly connected with slide guide reset dress
It sets, docking block is fixedly connected on the downside inner wall of the working chamber, is provided with determining for opening upwards on the upside of the docking block
Position slot, is provided with the second lead screw in the locating slot, is threadedly engaged on second lead screw and is connected with symmetrical film positioning
Clamping plate, is provided with the first belt chamber in the inner left wall of the locating slot, first belt is intracavitary be provided with belt with
The 4th shaft that the second lead screw power is cooperatively connected is provided with the second belt in the right side inner wall of first drive cavity
Chamber, the left end of the 4th shaft extend that be passed through second belt intracavitary and be connected with left end extension by belt power
The 5th shaft being passed through in first drive cavity, the left end of the 5th shaft are fixedly connected with third hand tap gear, and described
The 4th bevel gear being cooperatively connected can be engaged with the third hand tap gear by being fixedly connected in two shafts, be set in described device main body
It is equipped with cutter device.
Further technical solution, cutter device include that the 5th be set to the working chamber inner left wall opening to the right is slided
Slot is provided with right end in the 5th sliding slot and extends the ring slider being passed through in the working chamber, the left side of the 5th sliding slot
Inner wall is provided with and communicated with mobile cavity, and the left end of the ring slider is fixedly connected with movable block, the front and back end pair of the movable block
Claim and be fixedly connected with slide guide spring arrangement, the upper inside walls of the mobile cavity are provided with the driving groove that Open Side Down, the shifting
The second motor is installed in the upper end of motion block, the upper end of second motor is connected with the 5th cone tooth by shaft power
It takes turns, transmission device is provided in the driving groove inner left wall, it is logical that the right end power of the transmission device is connected with extension
Enter the 6th shaft in the driving groove, the right end of the 6th shaft, which is fixedly connected with to engage with the 5th bevel gear, matches
The 7th bevel gear of connection is closed, the opposite cutting groove that is open, the cutting groove are provided on the front and back side inner wall of the working chamber
It is inside provided with the third screw rod being cooperatively connected with the transmission device power, is threadedly engaged that be connected with can on the third screw rod
The operation block to horizontally slip is fixedly installed in the lower end of the operation block and is pneumatically bulldozed cutter device, and described be pneumatically bulldozed is cut
Cut device chip film can be pushed to covering chip surface after complete cut off.
Further technical solution, the supplementary device include being set to the 5th bevel gear right end engagement to be cooperatively connected
The 6th bevel gear, be fixedly connected with connecting shaft at the axle center of the 6th bevel gear, the right end of the connecting shaft extends and dynamic
Force-fitting is connected with attachment device, is provided with runner chamber in the upper end of described device main body, and the runner is intracavitary to be provided with and institute
The first runner of attachment device power mating connection is stated, the inner left wall of the runner chamber is provided with the pad pasting slot of opening upwards,
It is rotatably assorted at the upper end opening of the pad pasting slot and is connected with sealing plate block, the upper end of the sealing plate block is provided with spring slide dress
It sets, the upper end of described device main body is fixedly connected with transfer, in addition the upper end of the spring slide device is fixedly connected with
One end extended the fixed first lead being set around on first runner, the sealing plate block and the dress after the transfer
It sets and is fixedly connected with the first spring between main body upper end, raw material membrane cylinder device, the raw material film are provided in the pad pasting slot
Chip film one end extends and is passed through in the working chamber on drum apparatus, and described device main body upper end is provided with the raw material of opening upwards
Slot, chip film can be supplemented by being placed with raw material membrane cylinder in the raw material tank.
The beneficial effects of the present invention are: the configuration of the present invention is simple, easy to operate, device is needed to carry out semiconductor chip surface
When pad pasting cuts work, semiconductor chip is placed into working chamber by personnel by chip entrance, and Pneumatic clamping block is opened will be partly
Conductor chip clamps rear electric gear unlatching and first rotating shaft is driven to move to left, and semiconductor chip is moved to the working chamber leftmost side, this
When first motor open drive third gear rotation first gear is driven, make the second shaft rotation second bevel gear is driven after
Splined shaft is driven by first bevel gear, since splined shaft has cooperated at this time with spline, so driving first rotating shaft rotation
Overturn semiconductor chip to horizontal plane, electronic screw rod is opened rotation drive pneumatic clamps film block and moved down after the completion, while driving core
Piece film is moved up into down between film positioning splint, moves to right Four-slider and the second sliding block simultaneously since third sliding block moves down at this time
It moves up, second bevel gear is disengaged from first bevel gear, and the 4th bevel gear engages with third hand tap gear, and first motor is opened at this time
Unblank crosses the 4th bevel gear and drives third hand tap gear rotation, to drive the rotation of the second lead screw by the 5th shaft and the 4th shaft
Make the clamping chip film positioning close to each other of film positioning splint, while threaded block returns to original state, at this time due to ring slider quilt
Pushing to move to left moves to left movable block to engage the 5th bevel gear with the 7th bevel gear, and the second motor, which is opened, at this time will pass through transmission dress
It sets and drives the rotation of third screw rod, while being pneumatically bulldozed cutter device work and being displaced downwardly at semiconductor chip upper side position, operation block
It is driven the process moved to left and is pneumatically bulldozed cutter device and chip film is labelled to when semiconductor core on piece is completed and cut off, work at the same time
Block makes first rotating shaft rotate overturning semiconductor chip again to reverse side when returning to original state, repeat step and carry out pad pasting, complete
When semiconductor chip is moved to outside chip entrance, the 5th bevel gear engages with the 6th bevel gear at this time, when needing replacing raw material
The second motor, which is opened, when film drives the rotation of the first runner by attachment device, so that sealing plate block is carried out overturning and opens pad pasting slot, personnel
Raw material of taking out of raw material tank carries out supplement replacement, and the present apparatus, which can automate, carries out at pad pasting processing semiconductor device chip
Reason, facilitates subsequent chip cutting to process, and the comfort easy to operate that personnel can be improved and use of device reduces the fortune of personnel
It seeks the time and accelerates processing efficiency, can be recycled and long service life, cost low power consuming are few.
Detailed description of the invention
Fig. 1 is overall structure diagram inside a kind of semiconductor device arrangements of the invention；
Fig. 2 is the top view in direction " A-A " in Fig. 1 of the present invention；
Fig. 3 is the enlarged diagram of " B " in Fig. 1 of the present invention；
Fig. 4 is the enlarged diagram of " C " in Fig. 1 of the present invention.
Specific embodiment
Below with reference to Fig. 1-4, the present invention is described in detail.
Referring to Fig.1-4, a kind of semiconductor device arrangements of embodiment according to the present invention, including apparatus main body 10, setting
In the film sticking apparatus in described device main body 10 and the supplementary device being set in described device main body 10, the film sticking apparatus
Including the working chamber 11 being set in 10 right end of described device main body, the right side inner wall of the working chamber 11, which is provided with left and right, to be run through
Chip entrance 12, the first sliding groove 13 of opening to the right, the first sliding groove are provided in the inner left wall of the working chamber 11
It is provided in 13 slidably and right end extends into the first sliding block 14 in the working chamber 11, be provided in first sliding block 14
Rotatable first rotating shaft 15, the right end of the first rotating shaft 15 are fixedly connected with the pneumatic clamps being aligned with the chip entrance 12
Take block 16, the upper and lower sides inner wall of the first sliding groove 13 is symmetrically arranged with the opposite gear grooved 17 that is open, in the gear grooved 17
It is provided with the electric gear 18 for engaging and being cooperatively connected with 14 upper and lower side of the first sliding block, the left end setting of the first rotating shaft 15
There is the spline 19 of opening to the left, the first drive cavity 20 is provided in the inner left wall of the first sliding groove 13, described first passes
Be provided with first bevel gear 21 in dynamic chamber 20, be fixedly connected at the axle center of the first bevel gear 21 right end extension be passed through it is described
Splined shaft 22 in first sliding groove 13 and with the spline 19 pairing, the upper end of the first bevel gear 21, which is engaged, to be cooperatively connected
There is second bevel gear 23, the second shaft 24, first drive cavity 20 are fixedly connected at the axle center of the second bevel gear 23
Upper inside walls be provided with the second sliding slot 25 that Open Side Down, being provided in the second sliding slot 25 can slide up and down and lower end is logical
It crosses bearing and second shaft 24 is rotatably assorted the second sliding block 26 of connection, the left and right end of second sliding block 26 is symmetrical and solid
Surely it is connected with directional homing device 27, is provided with reseting cavity 28 in the downside inner wall of first drive cavity 20, described second turn
The lower end of axis 24 extend be passed through in the reseting cavity 28 and by bearing be rotatably assorted in can and the resetting block 29 of interior sliding on,
The lower end of the resetting block 29 is fixedly connected with reset spring 30, is fixedly connected with first gear 31 in second shaft 24,
The right side inner wall of first drive cavity 20 is provided with opening driver slot 32 to the left, be provided in the driver slot 32 with it is described
First gear 31 engages the second gear 33 being cooperatively connected, and is fixedly connected with upper end power at the axle center of the third gear 33 and matches
Conjunction is connected to the output revolving shaft 35 being fixed in 32 upper inside walls of driver slot in first motor 34, described device main body
Film positioning device is provided in 10.
Valuably or illustratively, the film positioning device includes being set on the 11 front and back side inner wall of working chamber symmetrically
The guide runner 36 for being arranged and being open opposite is provided with electric threaded shaft 37, screw thread on the electronic screw rod 37 in the guide runner 36
It is connected with the threaded block 38 that can slide up and down, pneumatic clamps film block 39, the work are fixedly connected on the threaded block 38
The upper inside walls of chamber 11 are provided with the third sliding slot 40 that Open Side Down, be provided in the third sliding slot 40 can slide up and down and under
The third sliding block 41 abutted with the threaded block 38 and with guiding resetting apparatus is held, the inner left wall of the third sliding slot 40 is set
Be equipped with the 4th sliding slot 42 that opening is connected to the right and with the second sliding slot 25, be provided in the 4th sliding slot 42 slidably and
The Four-slider 43 of right end and 41 upper end of third sliding block pairing and left end and 26 upper end of the second sliding block pairing, described the
The upper and lower side of Four-slider 43 is symmetrical and is fixedly connected with slide guide resetting apparatus 44, fixed on the downside inner wall of the working chamber 11 to connect
It is connected to docking block 45, the upside of the docking block 45 is provided with the locating slot 46 of opening upwards, is provided in the locating slot 46
Second lead screw 47 is threadedly engaged on second lead screw 47 and is connected with symmetrical film positioning splint 48, the locating slot 46
Inner left wall in be provided with the first belt chamber 49, be provided with belt and second lead screw in the first belt chamber 49
The 4th shaft 50 that 47 power are cooperatively connected is provided with the second belt chamber 51, institute in the right side inner wall of first drive cavity 20
The left end for stating the 4th shaft 50 extends to be passed through in the second belt chamber 51 and be connected with left end by belt power and extend
The left end of the 5th shaft 52 being passed through in first drive cavity 20, the 5th shaft 52 is fixedly connected with third hand tap gear
53, the 4th bevel gear 54 being cooperatively connected can be engaged with the third hand tap gear 53 by being fixedly connected in second shaft 24,
Cutter device is provided in described device main body 10.
Valuably or illustratively, cutter device include be set to 11 inner left wall of working chamber opening to the right the 5th
Sliding slot 55 is provided with right end in the 5th sliding slot 55 and extends the ring slider 56 being passed through in the working chamber 11, and the described 5th
The inner left wall of sliding slot 55 is provided with and communicated with mobile cavity 57, and the left end of the ring slider 56 is fixedly connected with movable block 58, institute
It states the front and back end of movable block 58 symmetrically and is fixedly connected with slide guide spring arrangement 59, the upper inside walls of the mobile cavity 57 are provided with
The driving groove 60 that Open Side Down is installed with the second motor 61, the upper end of second motor 61 in the upper end of the movable block 58
It is connected with the 5th bevel gear 62 by shaft power, is provided with transmission device 70, institute in 60 inner left wall of driving groove
The right end power for stating transmission device 70, which is connected with, extends the 6th shaft 71 that is passed through in the driving groove 60, and described 6th turn
The right end of axis 71 is fixedly connected with can engage the 7th bevel gear 72 being cooperatively connected, the working chamber with the 5th bevel gear 62
It is provided with the opposite cutting groove 66 that is open on 11 front and back side inner wall, is provided with and the transmission device 70 in the cutting groove 66
The third screw rod 67 that power is cooperatively connected is threadedly engaged the operation block 68 that is connected with and can horizontally slip on the third screw rod 67,
It is fixedly installed in the lower end of the operation block 68 and is pneumatically bulldozed cutter device 69, the cutter device 69 that is pneumatically bulldozed can incite somebody to action
Chip film is completed to be cut off after being pushed to covering chip surface.
Valuably or illustratively, the supplementary device includes being set to 62 right end of the 5th bevel gear engagement cooperation to connect
The 6th bevel gear 63 connect is fixedly connected with connecting shaft 64, the right side of the connecting shaft 64 at the axle center of the 6th bevel gear 63
End extends and power is connected with attachment device 65, is provided with runner chamber 73 in the upper end of described device main body 10, and described turn
The first runner 74 being cooperatively connected with 65 power of attachment device, the inner left wall of the runner chamber 73 are provided in wheel chamber 73
It is provided with the pad pasting slot 75 of opening upwards, is rotatably assorted at the upper end opening of the pad pasting slot 75 and is connected with sealing plate block 76, it is described
The upper end of sealing plate block 76 is provided with spring slide device 77, and the upper end of described device main body 10 is fixedly connected with transfer 78,
The upper end of the spring slide device 77 is fixedly connected with fixation after other end extended the transfer 78 and is set around institute
The first lead 79 on the first runner 74 is stated, the sealing plate block 76 and described device main body are fixedly connected with first between 10 upper end
Spring 80 is provided with raw material membrane cylinder device 81, chip film one end on the raw material membrane cylinder device 81 in the pad pasting slot 75
Extension is passed through in the working chamber 11, and 10 upper end of described device main body is provided with the raw material tank 82 of opening upwards, the raw material tank
Raw material membrane cylinder is placed in 82 can supplement chip film.
When needing device to carry out the cutting work of semiconductor chip surface pad pasting, personnel enter semiconductor chip by chip
Mouth 12 is placed into working chamber 11, and Pneumatic clamping block 16, which is opened, clamps the rear unlatching of electric gear 18 drive first for semiconductor chip
Shaft 15 moves to left, and semiconductor chip is moved to 11 leftmost side of working chamber, and first motor 34, which is opened, at this time drives third gear 33
Rotation drives first gear 31, is driven after driving the rotation of the second shaft 24 by second bevel gear 23 by first bevel gear 21
Splined shaft 22, since splined shaft 22 and spline 19 have cooperated at this time, so the rotation of first rotating shaft 15 is driven to make semiconductor core
Piece is overturn to horizontal plane, and electronic screw rod 37 is opened rotation drive pneumatic clamps film block 39 and moved down after the completion, while driving chip film past
Under move up between film positioning splint 48, move to right Four-slider 43 and the second sliding block simultaneously since third sliding block 41 moves down at this time
26 move up, and second bevel gear 23 is disengaged from first bevel gear 21, and the 4th bevel gear 54 engages with third hand tap gear 53, at this time
First motor 34 is opened drives third hand tap gear 53 to rotate by the 4th bevel gear 54, to pass through the 5th shaft 52 and the 4th turn
Axis 50 drives the rotation of the second lead screw 47 to position the clamping chip film close to each other of film positioning splint 48, while threaded block 38 returns to just
Beginning state moves to left movable block 58 by the 5th bevel gear 62 and the 7th bevel gear 72 since ring slider 56 is pushed to move to left at this time
Engagement, the second motor 61, which will be opened, at this time to drive third screw rod 67 to rotate by transmission device 70, while pneumatically be bulldozed cutting dress
It sets 69 work to be displaced downwardly at semiconductor chip upper side position, operation block 68 is driven the process moved to left and is pneumatically bulldozed cutter device 69
Chip film is labelled to when semiconductor core on piece is completed and is cut off, working at the same time when block 68 returns to original state makes first rotating shaft 15 again
Secondary rotation overturns semiconductor chip to reverse side, repeats step and carries out pad pasting, and semiconductor chip is moved to chip entrance when completion
Outside 12, the 5th bevel gear 62 engages with the 6th bevel gear 63 at this time, and when needing replacing raw material film, the unlatching of the second motor 61 passes through
Attachment device 65 drives the rotation of the first runner 74, so that sealing plate block 76 is carried out overturning and opens pad pasting slot 75, personnel are out of raw material tank 82
Raw material of taking carries out supplement replacement.
The beneficial effects of the present invention are: the configuration of the present invention is simple, easy to operate, device is needed to carry out semiconductor chip surface
When pad pasting cuts work, semiconductor chip is placed into working chamber by personnel by chip entrance, and Pneumatic clamping block is opened will be partly
Conductor chip clamps rear electric gear unlatching and first rotating shaft is driven to move to left, and semiconductor chip is moved to the working chamber leftmost side, this
When first motor open drive third gear rotation first gear is driven, make the second shaft rotation second bevel gear is driven after
Splined shaft is driven by first bevel gear, since splined shaft has cooperated at this time with spline, so driving first rotating shaft rotation
Overturn semiconductor chip to horizontal plane, electronic screw rod is opened rotation drive pneumatic clamps film block and moved down after the completion, while driving core
Piece film is moved up into down between film positioning splint, moves to right Four-slider and the second sliding block simultaneously since third sliding block moves down at this time
It moves up, second bevel gear is disengaged from first bevel gear, and the 4th bevel gear engages with third hand tap gear, and first motor is opened at this time
Unblank crosses the 4th bevel gear and drives third hand tap gear rotation, to drive the rotation of the second lead screw by the 5th shaft and the 4th shaft
Make the clamping chip film positioning close to each other of film positioning splint, while threaded block returns to original state, at this time due to ring slider quilt
Pushing to move to left moves to left movable block to engage the 5th bevel gear with the 7th bevel gear, and the second motor, which is opened, at this time will pass through transmission dress
It sets and drives the rotation of third screw rod, while being pneumatically bulldozed cutter device work and being displaced downwardly at semiconductor chip upper side position, operation block
It is driven the process moved to left and is pneumatically bulldozed cutter device and chip film is labelled to when semiconductor core on piece is completed and cut off, work at the same time
Block makes first rotating shaft rotate overturning semiconductor chip again to reverse side when returning to original state, repeat step and carry out pad pasting, complete
When semiconductor chip is moved to outside chip entrance, the 5th bevel gear engages with the 6th bevel gear at this time, when needing replacing raw material
The second motor, which is opened, when film drives the rotation of the first runner by attachment device, so that sealing plate block is carried out overturning and opens pad pasting slot, personnel
Raw material of taking out of raw material tank carries out supplement replacement, and the present apparatus, which can automate, carries out at pad pasting processing semiconductor device chip
Reason, facilitates subsequent chip cutting to process, and the comfort easy to operate that personnel can be improved and use of device reduces the fortune of personnel
It seeks the time and accelerates processing efficiency, can be recycled and long service life, cost low power consuming are few.
Those skilled in the art can define, can in the case of not departing from overall spirit of the invention and design
To make the various modifications for above embodiments.It falls within the scope of protection of the present invention.Protection scheme of the invention
It is subject to claims appended hereto.
Claims (4)
1. a kind of semiconductor device arrangements, including apparatus main body, it is set to the intracorporal film sticking apparatus of described device master and setting
In the intracorporal supplementary device of described device master, the film sticking apparatus includes the working chamber being set in described device main body right end,
The right side inner wall of the working chamber is provided with the perforative chip entrance in left and right, is provided with opening in the inner left wall of the working chamber
First sliding groove to the right is provided in the first sliding groove slidably and right end extends into the first sliding block in the working chamber,
Rotatable first rotating shaft is provided in first sliding block, the right end of the first rotating shaft is fixedly connected with to be entered with the chip
The Pneumatic clamping block of mouth alignment, the upper and lower sides inner wall of the first sliding groove are symmetrically arranged with the opposite gear grooved that is open, the tooth
The electric gear for engaging and being cooperatively connected with the first sliding block upper and lower side, the left end setting of the first rotating shaft are provided in race
There is opening spline to the left, be provided with the first drive cavity in the inner left wall of the first sliding groove, in first drive cavity
Be provided with first bevel gear, be fixedly connected at the axle center of the first bevel gear right end extension be passed through in the first sliding groove and
Upper end engagement with the splined shaft of spline pairing, the first bevel gear is connected with second bevel gear, and described the
The second shaft is fixedly connected at the axle center of two bevel gears, the upper inside walls of first drive cavity are provided with that Open Side Down
Two sliding slots, being provided in the second sliding slot can slide up and down and lower end is rotatably assorted with second shaft by bearing and is connect
The second sliding block, the left and right end of second sliding block is symmetrical and is fixedly connected with directional homing device, first drive cavity
Reseting cavity is provided in the inner wall of downside, the lower end of second shaft, which extends, to be passed through in the reseting cavity and match by bearing rotation
Together in can and the resetting block of interior sliding on, the lower end of the resetting block is fixedly connected with reset spring, in second shaft
It is fixedly connected with first gear, the right side inner wall of first drive cavity is provided with the driver slot of opening to the left, the driver slot
It is inside provided with the second gear for engaging and being cooperatively connected with the first gear, is fixedly connected at the axle center of the third gear
Power is held to be cooperatively connected in the output revolving shaft being fixed in the driver slot upper inside walls in first motor, described device master
It is provided with film positioning device in vivo.
2. a kind of semiconductor device arrangements according to claim 1, it is characterised in that: the film positioning device includes setting
The arranged symmetrically and opposite guide runner that is open on the inner wall of side, is provided with electronic silk before and after the working chamber in the guide runner
Thick stick is threadedly engaged on the electronic screw rod and is connected with the threaded block that can slide up and down, and is fixedly connected on the threaded block pneumatic
Press from both sides film block, the upper inside walls of the working chamber are provided with the third sliding slot that Open Side Down, be provided in the third sliding slot can on
Lower slider and lower end abut with the threaded block and have the third sliding block of guiding resetting apparatus, in the left side of the third sliding slot
Wall is provided with the 4th sliding slot that opening is connected to the right and with the second sliding slot, is provided in the 4th sliding slot slidably and right
The Four-slider at end and third upper end of slide block pairing and left end and second upper end of slide block pairing, the Four-slider
Upper and lower side is symmetrical and is fixedly connected with slide guide resetting apparatus, and docking block, institute are fixedly connected on the downside inner wall of the working chamber
The locating slot for being provided with opening upwards on the upside of docking block is stated, is provided with the second lead screw, second lead screw in the locating slot
On be threadedly engaged and be connected with symmetrical film positioning splint, the first belt chamber is provided in the inner left wall of the locating slot,
Intracavitary the 4th shaft for being provided with belt and the second lead screw power and being cooperatively connected of first belt, described first passes
Be provided with the second belt chamber in the right side inner wall of dynamic chamber, the left end of the 4th shaft extend be passed through second belt it is intracavitary and
Left end, which is connected with, by belt power extends the 5th shaft being passed through in first drive cavity, a left side for the 5th shaft
End is fixedly connected with third hand tap gear, and mating connection can be engaged with the third hand tap gear by being fixedly connected in second shaft
The 4th bevel gear, be provided with cutter device in described device main body.
3. a kind of semiconductor device arrangements according to claim 1, it is characterised in that: cutter device is described including being set to
Working chamber inner left wall opening the 5th sliding slot to the right is provided with right end extension in the 5th sliding slot and is passed through in the working chamber
Ring slider, the inner left wall of the 5th sliding slot is provided with and communicated with mobile cavity, and the left end of the ring slider is fixedly connected
There is movable block, the front and back end of the movable block is symmetrical and is fixedly connected with slide guide spring arrangement, the upper inside walls of the mobile cavity
It is provided with the driving groove that Open Side Down, the second motor is installed in the upper end of the movable block, the upper end of second motor is logical
It crosses shaft power and is connected with the 5th bevel gear, transmission device, the transmission dress are provided in the driving groove inner left wall
The right end power set is connected with the 6th shaft for extending and being passed through in the driving groove, and the right end of the 6th shaft is fixed to be connected
The 7th bevel gear being cooperatively connected can be engaged with the 5th bevel gear by being connected to, and be provided on the front and back side inner wall of the working chamber
Be open opposite cutting groove, and the third screw rod being cooperatively connected with the transmission device power is provided in the cutting groove, described
It is threadedly engaged the operation block that is connected with and can horizontally slip on third screw rod, is fixedly installed in the lower end of the operation block and pneumatically pushes away
Flat cutter device, it is described pneumatically be bulldozed cutter device chip film can be pushed to covering chip surface after complete cut
It is disconnected.
4. a kind of semiconductor device arrangements according to claim 1, it is characterised in that: the supplementary device includes being set to
The 5th bevel gear right end engages the 6th bevel gear being cooperatively connected, the company of being fixedly connected at the axle center of the 6th bevel gear
The right end of spindle, the connecting shaft extends and power is connected with attachment device, is provided in the upper end of described device main body
Runner chamber, the runner is intracavitary to be provided with the first runner being cooperatively connected with the attachment device power, a left side for the runner chamber
Side inner wall is provided with the pad pasting slot of opening upwards, is rotatably assorted at the upper end opening of the pad pasting slot and is connected with sealing plate block, described
The upper end of sealing plate block is provided with spring slide device, and the upper end of described device main body is fixedly connected with transfer, the spring
The upper end of carriage is fixedly connected with fixation after other end extended the transfer and is set around on first runner
First lead, the first spring is fixedly connected between the sealing plate block and described device main body upper end, is set in the pad pasting slot
It is equipped with raw material membrane cylinder device, chip film one end extends and is passed through in the working chamber on the raw material membrane cylinder device, the dress
The raw material tank that main body upper end is provided with opening upwards is set, chip film can be supplemented by being placed with raw material membrane cylinder in the raw material tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811169037.1A CN109300813A (en) | 2018-10-08 | 2018-10-08 | A kind of semiconductor device arrangements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811169037.1A CN109300813A (en) | 2018-10-08 | 2018-10-08 | A kind of semiconductor device arrangements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109300813A true CN109300813A (en) | 2019-02-01 |
Family
ID=65161796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811169037.1A Withdrawn CN109300813A (en) | 2018-10-08 | 2018-10-08 | A kind of semiconductor device arrangements |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109300813A (en) |
-
2018
- 2018-10-08 CN CN201811169037.1A patent/CN109300813A/en not_active Withdrawn
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Application publication date: 20190201 |