CN109299638A - Fingerprint mould group and electronic equipment equipped with the fingerprint mould group - Google Patents
Fingerprint mould group and electronic equipment equipped with the fingerprint mould group Download PDFInfo
- Publication number
- CN109299638A CN109299638A CN201710613804.2A CN201710613804A CN109299638A CN 109299638 A CN109299638 A CN 109299638A CN 201710613804 A CN201710613804 A CN 201710613804A CN 109299638 A CN109299638 A CN 109299638A
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- Prior art keywords
- fingerprint
- mould group
- substrate
- fingerprint mould
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
- G06F21/31—User authentication
- G06F21/32—User authentication using biometric data, e.g. fingerprints, iris scans or voiceprints
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2221/00—Indexing scheme relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F2221/21—Indexing scheme relating to G06F21/00 and subgroups addressing additional information or applications relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F2221/2133—Verifying human interaction, e.g., Captcha
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Security & Cryptography (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Computer Hardware Design (AREA)
- Software Systems (AREA)
- General Engineering & Computer Science (AREA)
- Image Input (AREA)
Abstract
The present invention relates to a kind of fingerprint mould group and the electronic equipment equipped with the fingerprint mould group, fingerprint mould group includes: substrate；Fingerprint chip is set on substrate；Shell, including first surface and second surface, shell offer mounting groove, and fingerprint chip is contained in mounting groove；Wherein, shell further includes the contact surface for connecting the cell wall and second surface of mounting groove, and contact surface extends to second surface from cell wall to far from the inclination of mounting groove direction；Fingerprint mould group further includes the first filling glue being connected between the periphery and substrate of fingerprint chip, and the first filling glue includes extending to supporting surface from the sidewall slope of fingerprint chip；Contact surface is held on the supporting surface of the first filling glue.Fingerprint mould group, shell is held on the contact surface of the first filling glue by contact surface, and it can avoid the angle between cell wall and second surface and the first filling glue interference, therefore it can cancel the becket around fingerprint chip to reduce the manufacturing cost of the fingerprint mould group, and effectively reduce the thickness of the fingerprint mould group.
Description
Technical field
The present invention relates to fingerprint identification device field, in particular to a kind of fingerprint mould group and the electronics equipped with the fingerprint mould group
Equipment.
Background technique
A kind of input unit of the touch screen as man-machine interactive interface, is installed on various terminal equipment, is widely applied
More and more important role is played in people's life and social development in every field.In order to realize the touch function of screen
Can, therefore touch screen is made of multilayered structure, structure is complex.Also, due in the use process of terminal device, storage
Personal information is more and more, it is therefore desirable to which device encrypts terminal device.Since the fingerprint of people is common by nature-nurture
It acts on and is formed, complexity is applied not only to identify, and also has uniqueness and invariance, therefore using fingerprint recognition as one
The cipher mode that a little terminal devices use has good security performance, and it is simple and fast to facilitate identification process, facilitates behaviour
The use of author.
As the fingerprint mould group for completing fingerprint identification function, the becket around fingerprint chip is usually provided with to avoid peace
Filling glue on shell and fingerprint chip equipped with the fingerprint mould group is interfered.And the setting of becket improves the fingerprint mould group
Cost is produced and used, while increasing the volume of fingerprint mould group and is unfavorable for the compact in size and lightening hair of fingerprint mould group
Exhibition.
Summary of the invention
Based on this, it is necessary to can increase while avoiding shell from interfering with the filling glue on fingerprint chip for fingerprint mould group
The problem of use cost and overall volume of big fingerprint mould group, provides a kind of avoidable shell and the filling glue on fingerprint chip is dry
Reduce the use cost of fingerprint mould group and the fingerprint mould group of overall volume and the electronic equipment equipped with the fingerprint mould group while relating to.
A kind of fingerprint mould group, comprising:
Substrate；
Fingerprint chip on the substrate and is electrically connected with the substrate；And
Shell, including the first surface and second surface being oppositely arranged, the shell offers the perforation first surface
With the mounting groove of the second surface, the fingerprint chip is contained in the mounting groove；
Wherein, the shell further includes the contact surface for connecting the cell wall and the second surface of the mounting groove, described to connect
Contacting surface extends to the second surface from the cell wall to far from mounting groove direction inclination；The fingerprint mould group further includes connecting
The first filling glue being connected between the periphery and the substrate of the fingerprint chip, the first filling glue includes from the fingerprint
The sidewall slope of chip extends to the supporting surface of the substrate；The contact surface is held in the described of the first filling glue and supports
On face.
Above-mentioned fingerprint mould group, shell are held on the contact surface of the first filling glue by contact surface, and can avoid cell wall with
Angle between second surface is interfered with the first filling glue, therefore can cancel the becket around fingerprint chip to reduce this
The manufacturing cost of fingerprint mould group, and the yields of fingerprint mould group is improved, and effectively reduce the thickness of the fingerprint mould group, to have
Conducive to the lightening of the electronic equipment for being equipped with the fingerprint mould group.
The contact surface is far from the relatively described contact surface in the substrate side close to the base in one of the embodiments,
The vertical range of plate side is 0.1~0.3mm, and the contact surface is far from the relatively described contact surface of fingerprint chip-side close to described
The horizontal distance of fingerprint chip-side is 0.1~0.3mm.In this way, contact surface has biggish area to be held in the first filling
Glue avoids the corner at the mounting groove both ends on shell from forming interference with the first filling glue and leads to mistake at a distance from shell and substrate
Greatly, and fingerprint chip can not accurately cooperate with shell.
Supporting surface described in the first filling glue is from the side wall of the fingerprint chip to separate in one of the embodiments,
The inclination of fingerprint chip direction extends and is gradually reduced at a distance from the substrate.In this way, the first filling glue forms longitudinal section
Roughly triangular shape, the gap between outer rim, fingerprint chip and shell to seal fingerprint chip and substrate avoid outer
The liquid on boundary enters in fingerprint chip between fingerprint chip and substrate, fingerprint chip and shell, extends making for the fingerprint mould group
With the service life, the job stability of the fingerprint mould group is improved.
The fingerprint chip is covered with the second filling close to the end face of the substrate side in one of the embodiments,
Glue, the second filling glue are wholely set with the first filling glue.In this way, can by substrate sticking on fingerprint chip with secured
Ground fixed substrate.
The fingerprint chip circumferentially offers receiving close to one end margin of substrate in one of the embodiments,
Slot, part the first filling glue are filled in the holding tank.In this way, the first excessive filling glue can be in overflow to holding tank
And the excessive height of the first filling glue is avoided, without the dosage of accurate control points glue, reduce production difficulty.
Rectangular in cross-section of the holding tank in the plane of the vertical substrate in one of the embodiments,.In this way,
With lower difficulty of processing, and have biggish accommodation space to accommodate the first filling glue, avoids the height of the first filling glue
It is excessively high.
The fingerprint mould group further includes key in one of the embodiments, and the key is located at the substrate far from institute
State fingerprint recognition chip-side.In this way, operator's pressable fingerprint chip, to drive key works, therefore the fingerprint mould group
It can be by carrying out other operations, to have more multi-functional while with fingerprint identification function.
The substrate is flexible circuit board or Rigid Flex in one of the embodiments,.In this way, having Distribution density
The feature high, light-weight, thickness is thin, bending is good etc..
The fingerprint mould group further includes stiffening plate in one of the embodiments, and it is remote that the stiffening plate is set to the substrate
From the fingerprint chip-side.In this way, the structural strength of substrate can be improved.
A kind of electronic equipment, including above-mentioned fingerprint mould group.
Above-mentioned electronic equipment, since the thickness of fingerprint mould group is smaller, electronic equipment can reserve lesser space to set
The fingerprint mould group is set, to be conducive to the lightening of electronic equipment.
Detailed description of the invention
Fig. 1 is the cross-sectional view of the fingerprint mould group of an embodiment；
Fig. 2 is the partial enlarged view of fingerprint mould group shown in FIG. 1；
Fig. 3 is the explosive view of fingerprint mould group shown in FIG. 1；
Fig. 4 is the cross-sectional view of the fingerprint mould group of another embodiment.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
As shown in FIG. 1 to 3, a kind of fingerprint mould group 100 of this preferred embodiment, including substrate 10 and fingerprint chip 20.
Wherein, fingerprint chip 20 is set on substrate 10 and is electrically connected with substrate 10, and shell 30 includes first be oppositely arranged
Surface 31 and second surface 32, shell 30 offer the mounting groove 33 of perforation first surface 31 and second surface 32, fingerprint chip
20 are contained in mounting groove 33.Shell 30 further includes the contact surface 35 for connecting the cell wall 34 and second surface 32 of mounting groove 33, is connect
Contacting surface 35 extends to second surface 32 from cell wall 34 to far from the inclination of 33 direction of mounting groove, and fingerprint mould group 100 further includes being connected to
The first filling glue 40 between the periphery and substrate 10 of fingerprint chip 20, the first filling glue 40 include the side wall from fingerprint chip 20
Inclination extends to the supporting surface 42 of substrate 10, and contact surface 35 is held on the supporting surface 42 of the first filling glue 40.
Above-mentioned fingerprint mould group 100, shell 30 is held on the contact surface of the first filling glue 40 by contact surface 35, and can be kept away
The angle exempted between cell wall 34 and second surface 32 is interfered with the first filling glue 40, therefore can be cancelled around fingerprint chip 20
Becket to reduce the manufacturing cost of the fingerprint mould group 100, and improve the yields of fingerprint mould group 100, and effectively reduce
The thickness of the fingerprint mould group 100, to be conducive to the lightening of the electronic equipment equipped with the fingerprint mould group 100.
In the present embodiment, shell 30 is made of metal material, therefore is convenient to processing contact surface 35 without influencing
The structural strength of shell 30.
Please continue to refer to FIG. 1 to FIG. 3, in one embodiment, contact surface 35 is leaned on far from 10 side relative contact 35 of substrate
The vertical range of nearly 10 side of substrate is 0.1~0.3mm, and contact surface 35 is close far from 20 side relative contact 35 of fingerprint chip
The horizontal distance of 20 side of fingerprint chip is 0.1~0.3mm, therefore the contact surface 35 has biggish area to be held in first
Glue 40 is filled, the angle between the cell wall 34 on shell 30 and second surface 32 is avoided to form interference with the first filling glue 40 and lead
Cause shell 30 excessive at a distance from substrate 10, and fingerprint chip 20 can not accurately cooperate with shell 30.It is appreciated that contact surface
35 size is without being limited thereto, can be set as needed.Preferably, contact surface 35 is close far from 10 side relative contact 35 of substrate
The vertical range of 10 side of substrate is 0.2mm, and contact surface 35 is far from 20 side relative contact 35 of fingerprint chip close to fingerprint core
The horizontal distance of 20 side of piece is 0.2mm.
Further, the corner of cell wall 34 of the mounting groove 33 far from 10 one end of substrate and first surface 31 is equipped with chamfering
36, the size of the chamfering 36 is much smaller than the area of contact surface 35.Specifically in the present embodiment, the size of chamfering 36 is 0.05mm,
To avoid the side wall of mounting groove 33 from being damaged.It is appreciated that the size of chamfering 36 is without being limited thereto, can be set as needed.
The supporting surface 42 of first filling glue 40 extends from the side wall of fingerprint chip 20 to far from the inclination of 20 direction of fingerprint chip
And be gradually reduced at a distance from substrate 10, to form the roughly triangular shape in longitudinal section, with seal fingerprint chip 20 with
Gap between the outer rim of substrate 10, fingerprint chip 20 and shell 30, avoid extraneous liquid from fingerprint chip 20 and substrate 10,
Enter in fingerprint chip 20 between fingerprint chip 20 and shell 30, extends the service life of the fingerprint mould group 100, improve the fingerprint
The job stability of mould group 100.In the present embodiment, the inclination of the tilt angle of supporting surface 42 and the contact surface 35 on shell 30
Angle is roughly the same, to have biggish contact range with contact surface 35 and avoid interfering.
Further, fingerprint chip 20 is covered with second close to the end face (i.e. the bottom surface of fingerprint chip 20) of 10 side of substrate
Fill glue 50, second filling glue 50 with first fill glue 40 is wholely set, thus by substrate 10 be pasted on fingerprint chip 20 with
Firmly fix substrate 10.
As shown in figure 4, in one embodiment, fingerprint chip 20 circumferentially offers holding tank close to 10 1 end margin of substrate
22, part first is filled glue 40 and is filled in holding tank 22.The holding tank 22 is used to control the height of the first filling glue 40, therefore
Excessive first filling glue 40 can avoid the excessive height of the first filling glue 40 in overflow to holding tank 22, without accurately controlling
Dosage for dispensing glue is made, production difficulty is reduced.
Further, rectangular in cross-section of the holding tank 22 in the plane of vertical substrate 10, to have lower processing
Difficulty, and have biggish accommodation space to accommodate the first filling glue 40, avoid the excessive height of the first filling glue 40.
Please refering to fig. 1~Fig. 3, fingerprint mould group 100 further include key 70 again, and key 70 is located at substrate 10 far from fingerprint core
20 side of piece.Operator's pressable fingerprint chip 20, to drive key 70 to work, therefore the fingerprint mould group 100 has finger
It can be by carrying out other operations, to have more multi-functional while line identification function.
In one embodiment, substrate 10 is flexible circuit board, therefore with Distribution density is high, light-weight, thickness is thin, bending
Property well equal feature.It is appreciated that in other embodiments, substrate 10 can also be Rigid Flex.
Further, when substrate 10 is flexible circuit board, fingerprint mould group 100 further includes stiffening plate 60, and stiffening plate 60 is set
In substrate 10 far from 20 side of fingerprint chip, to improve the structural strength of substrate 10.
In one embodiment, fingerprint chip 20 is also covered with covering far from 10 side of substrate (i.e. the top surface of fingerprint chip 20)
Layer 80, fingerprint chip 20 is completely covered to provide protection for fingerprint chip 20 in coating 80, avoids fingerprint chip 20 from being exposed to outer
It is damaged in boundary's environment.In the present embodiment, coating 80 is contained in the mounting groove 33 on shell 30.
Above-mentioned fingerprint mould group 100, shell 30 offer mounting groove 33 to accommodate fingerprint chip 20, since shell 30 is equipped with
Contact surface 35 avoids shell 30 and first from filling the contact surface of glue 40 to contact the first filling glue 40 around fingerprint chip 20
Too small and interfere, there is no need to be arranged around fingerprint chip 20 to avoid the becket interfered, to reduce finger
The production cost for reducing fingerprint mould group 100 of the thickness of line mould group 100.
As shown in Figures 1 and 3, a kind of electronic equipment of this preferred embodiment, including above-mentioned fingerprint mould group 100, fingerprint mould
The shell 30 of group 100 is a part of the outer housing of electronic equipment, in this way, the electronic equipment is referred to by the realization of fingerprint mould group 100
Line identification function.
Above-mentioned electronic equipment, since the thickness of fingerprint mould group 100 is smaller, electronic equipment can reserve lesser space with
The fingerprint mould group 100 is set, to be conducive to the lightening of electronic equipment.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of fingerprint mould group characterized by comprising
Substrate；
Fingerprint chip on the substrate and is electrically connected with the substrate；And
Shell, including the first surface and second surface being oppositely arranged, the shell offers the perforation first surface and institute
The mounting groove of second surface is stated, the fingerprint chip is contained in the mounting groove；
Wherein, the shell further includes the contact surface for connecting the cell wall and the second surface of the mounting groove, the contact surface
The second surface is extended to from the cell wall to far from mounting groove direction inclination；The fingerprint mould group further includes being connected to
The first filling glue between the periphery and the substrate of the fingerprint chip, the first filling glue includes from the fingerprint chip
Sidewall slope extend to the supporting surface of the substrate；The contact surface is held in the supporting surface of the first filling glue
On.
2. fingerprint mould group according to claim 1, which is characterized in that the contact surface is far from the substrate side with respect to institute
Stating vertical range of the contact surface close to the substrate side is 0.1~0.3mm, and the contact surface is opposite far from fingerprint chip-side
The contact surface is 0.1~0.3mm close to the horizontal distance of the fingerprint chip-side.
3. fingerprint mould group according to claim 1, which is characterized in that the supporting surface of the first filling glue is described in
The side wall of fingerprint chip extends to separate fingerprint chip direction inclination and is gradually reduced at a distance from the substrate.
4. fingerprint mould group according to claim 1, which is characterized in that end of the fingerprint chip close to the substrate side
Face is covered with the second filling glue, and the second filling glue is wholely set with the first filling glue.
5. fingerprint mould group according to claim 1, which is characterized in that the fingerprint chip is close to one end margin of substrate
Holding tank is circumferentially offered, part the first filling glue is filled in the holding tank.
6. fingerprint mould group according to claim 5, which is characterized in that the holding tank is in the plane of the vertical substrate
Rectangular in cross-section.
7. fingerprint mould group according to claim 1, which is characterized in that the fingerprint mould group further includes key, the key
Positioned at the substrate far from the fingerprint recognition chip-side.
8. fingerprint mould group according to claim 1, which is characterized in that the substrate is flexible circuit board or soft or hard combination
Plate.
9. fingerprint mould group according to claim 1, which is characterized in that the fingerprint mould group further includes stiffening plate, the benefit
Strong plate is set to the substrate far from the fingerprint chip-side.
10. a kind of electronic equipment, which is characterized in that including fingerprint mould group as claimed in any one of claims 1 to 9 wherein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710613804.2A CN109299638A (en) | 2017-07-25 | 2017-07-25 | Fingerprint mould group and electronic equipment equipped with the fingerprint mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710613804.2A CN109299638A (en) | 2017-07-25 | 2017-07-25 | Fingerprint mould group and electronic equipment equipped with the fingerprint mould group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109299638A true CN109299638A (en) | 2019-02-01 |
Family
ID=65167367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710613804.2A Withdrawn CN109299638A (en) | 2017-07-25 | 2017-07-25 | Fingerprint mould group and electronic equipment equipped with the fingerprint mould group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109299638A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110417963A (en) * | 2019-07-18 | 2019-11-05 | 维沃移动通信有限公司 | Terminal device |
-
2017
- 2017-07-25 CN CN201710613804.2A patent/CN109299638A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110417963A (en) * | 2019-07-18 | 2019-11-05 | 维沃移动通信有限公司 | Terminal device |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant before: OFilm Microelectronics Technology Co.,Ltd. |
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| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190201 |