CN109299584A - Temperature recommended method, equipment and storage medium in reflow soldering - Google Patents
Temperature recommended method, equipment and storage medium in reflow soldering Download PDFInfo
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- CN109299584A CN109299584A CN201811493654.7A CN201811493654A CN109299584A CN 109299584 A CN109299584 A CN 109299584A CN 201811493654 A CN201811493654 A CN 201811493654A CN 109299584 A CN109299584 A CN 109299584A
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- 238000005476 soldering Methods 0.000 title claims abstract description 100
- 238000000034 method Methods 0.000 title claims abstract description 77
- 238000003860 storage Methods 0.000 title claims abstract description 16
- 238000003466 welding Methods 0.000 claims abstract description 88
- 238000012360 testing method Methods 0.000 claims description 111
- 238000004422 calculation algorithm Methods 0.000 claims description 27
- 230000008569 process Effects 0.000 claims description 27
- 238000004590 computer program Methods 0.000 claims description 16
- 238000001816 cooling Methods 0.000 claims description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 14
- 238000002386 leaching Methods 0.000 claims description 10
- 230000005611 electricity Effects 0.000 claims description 9
- 238000003066 decision tree Methods 0.000 claims description 6
- 238000012417 linear regression Methods 0.000 claims description 5
- 230000035945 sensitivity Effects 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 238000012706 support-vector machine Methods 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- 241000208340 Araliaceae Species 0.000 claims description 2
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 claims description 2
- 235000003140 Panax quinquefolius Nutrition 0.000 claims description 2
- 235000008434 ginseng Nutrition 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 14
- 238000012545 processing Methods 0.000 description 9
- 230000002068 genetic effect Effects 0.000 description 8
- 230000008859 change Effects 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 238000004364 calculation method Methods 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 230000036413 temperature sense Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010353 genetic engineering Methods 0.000 description 1
- 230000008303 genetic mechanism Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/36—Circuit design at the analogue level
- G06F30/367—Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods
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Abstract
The embodiment of the present application provides temperature recommended method, equipment and the storage medium in a kind of reflow soldering.In the embodiment of the present application, according to the given temperature of each warm area and actual temperature functional relation, calculate the actual temperature that each warm area can reach at a given temperature, to again with circuit board to be welded to the sensitive parameter of temperature, estimate surface temperature of the circuit board to be welded in each warm area, and then determine the welding quality of circuit board to be welded, continue to determine welding quality by adjusting given temperature until when meeting welding quality requirement, obtain the given temperature of each warm area, the given temperature for being adapted to each warm area of the reflow soldering of different circuit boards to be welded out can quickly be recommended, and since method provided by the embodiments of the present application is applicable to the circuit board to be welded of different model, so that recommendation results science is reliable, reduce the problem of manually estimating the large error of appearance.
Description
Technical field
This application involves in electronic equipment manufacturing technical field more particularly to a kind of reflow soldering temperature recommended method,
Equipment and storage medium.
Background technique
Solder reflow techniques are not strange in electronic equipment manufacturing field, on various circuit boards used in electronic equipment
Electronic component is welded on circuit board by this technique, and this technique welding is by the heating electricity in reflow soldering
Air or nitrogen are heated to sufficiently high temperature after-blow to the circuit board for having posted electronic component by road, allow electronic component two
The solder of side bonds after melting with circuit board.The advantage of this technique is that temperature is easily controllable, and oxygen is also avoided that in welding process
Change, manufacturing cost is also easier to control.Since the temperature in reflow soldering is the key factor of influence circuit board molding, and for
Different circuit boards and different electronic components, suitable best welding temperature are also not quite similar, and need to set before welding
The temperature value of reflow soldering.
In actual industrial production, for the circuit board of different model, need veteran worker's trial-production a number of
Circuit board, observe the board quality come out of the stove to set the temperature value of reflow soldering, manually adjust the temperature of reflow soldering
Value be easy to cause biggish temperature error.
Summary of the invention
The many aspects of the application provide the temperature in a kind of reflow soldering recommend, equipment and storage medium, more fastly
Speed and the given temperature for accurately obtaining reflow soldering.
The embodiment of the present application also provides the temperature recommended method in a kind of reflow soldering, comprising: initializes the Reflow Soldering
The given temperature of each warm area in furnace；It is closed according to the given temperature of the corresponding each warm area of circuit board to be welded and actual temperature function
System, calculates the actual temperature that each warm area can reach at a given temperature；It can be reached at a given temperature according to each warm area
Actual temperature and circuit board to be welded estimate surface temperature of the circuit board to be welded in each warm area to the sensitive parameter of temperature
Degree；According to surface temperature of the circuit board to be welded in each warm area, the welding quality of the circuit board to be welded is determined；If
The welding quality of the circuit board to be welded is unsatisfactory for the welding quality requirement of setting, readjusts the given temperature of each warm area,
Until the welding quality of the circuit board to be welded meets the welding quality requirement of setting, to obtain the given of each warm area
Temperature.
The embodiment of the present application provides a kind of calculating equipment, comprising: including memory and processor；The memory is used
In storage computer program；The processor, for executing the computer program, to be used for: initializing the reflow soldering
The given temperature of interior each warm area；According to the given temperature of the corresponding each warm area of circuit board to be welded and actual temperature functional relation,
Calculate the actual temperature that each warm area can reach at a given temperature；The reality that can be reached at a given temperature according to each warm area
Temperature and circuit board to be welded estimate surface temperature of the circuit board to be welded in each warm area to the sensitive parameter of temperature；
According to surface temperature of the circuit board to be welded in each warm area, the welding quality of the circuit board to be welded is determined；If institute
The welding quality for stating circuit board to be welded is unsatisfactory for the welding quality requirement of setting, readjusts the given temperature of each warm area, directly
Until the welding quality that the welding quality of the circuit board to be welded meets setting requires, to obtain the given temperature of each warm area
Degree.
The embodiment of the present application also provides a kind of computer readable storage medium for being stored with computer program, and feature exists
In causing one or more of processors to realize in reflow solderings when computer program is executed by one or more processors
Temperature recommended method in step.
In the embodiment of the present application, it according to the given temperature of each warm area and actual temperature functional relation, calculates each warm area and exists
The actual temperature that can reach under given temperature estimates electricity to be welded in conjunction with circuit board to be welded to the sensitive parameter of temperature
Surface temperature of the road plate in each warm area, and then determine the welding quality of circuit board to be welded, by adjusting given temperature continuation
Welding quality is determined until the given temperature of each warm area is obtained, so as to quickly recommend to fit out when meeting welding quality requirement
It should be in the given temperature of each warm area of the reflow soldering of different circuit boards to be welded, and due to method provided by the embodiments of the present application
It is applicable to the circuit board to be welded of different model, so that recommendation results science is reliable, reduces the larger mistake for manually estimating appearance
The problem of difference, simultaneously, additionally it is possible to substantially reduce the necessary loss generated in board production manufacture, save a large amount of economic costs.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present application, constitutes part of this application, this Shen
Illustrative embodiments and their description please are not constituted an undue limitation on the present application for explaining the application.In the accompanying drawings:
Fig. 1 is the structural schematic diagram of one exemplary temperature recommender system of the application；
Fig. 2 is the flow diagram of the temperature recommended method in the reflow soldering of the application another exemplary embodiment；
Fig. 3 is temperature of the surface temperature for the electronic component that the application another exemplary embodiment provides in reflow soldering
The schematic diagram of change curve；
Fig. 4 is the step before carrying out welding test using test circuit board that the application another exemplary embodiment provides
Schematic diagram；
Fig. 5 is the structural schematic diagram for the calculating equipment that the application another exemplary embodiment provides.
Specific embodiment
To keep the purposes, technical schemes and advantages of the application clearer, below in conjunction with the application specific embodiment and
Technical scheme is clearly and completely described in corresponding attached drawing.Obviously, described embodiment is only the application one
Section Example, instead of all the embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall in the protection scope of this application.
In traditional solder reflow process, it is generally divided into four-stage, each stage is known as " area (Zone) ", each
Area is owned by respective temperature curve, according to the difference of temperature curve can substantially be divided into " preheating ", " leaching heat ", " reflux " and
" cooling " four welding processes.Circuit board to be welded enters from one of reflow soldering, then comes out from the other end of reflow soldering,
Different warm areas can successively be passed through, these warm areas realize the welding process in aforementioned four stage, the warm area length one of reflow soldering
As be 45cm~50cm, the quantity of warm area can have 3,4,5,6,7,8,9,10,12,15 even more warm areas.And reflow soldering
Interior actual temperature is to influence the key factor of circuit board molding, different circuit boards since it is with different electronic components,
Suitable temperature curve is also not quite similar, and needs before welding to circuit board, sets each warm area in reflow soldering
Given temperature.
But in reflow soldering each warm area of the given temperature of each warm area and the inside of reflow soldering actual temperature it
Between and it is unequal.Because heat has the process of a conduction in object and air, wherein the partial heat in reflow soldering
It can distribute, form thermal losses, cause the actual temperature of the gas blown on circuit board to be welded that can be lower than given temperature.
The heat of loss is related to the quantity of electronic component on the material of circuit board to be welded and circuit board, due to directly quantifying this
A thermal losses is relatively difficult, thus blow to the temperature of gas on circuit board to be welded just can not accurate quantification come out, and temperature
Excessively high directly to burn out circuit board to be welded, the too low tin cream that cannot just melt of temperature causes not weld on circuit board to be welded
Electronic component causes the loss of circuit board to be welded.
And whether the actual temperature gone out in reflow soldering by manual type subjective judgement has reached optimum efficiency, there are two
A problem, one is can generate the indefinite waste product of quantity in trial-manufacturing process, usually at 10 pieces or more, production will necessarily be made every time
At certain loss；The second is the subjective judgement of manual type can depend critically upon the knowhow of worker, different workers for
The view of product quality may be different, then the plank quantity for needing to waste is also different, influence certainly maximum or final
The given temperature value of reflow soldering is not optimum value.
In some embodiments of the application, according to the given temperature of each warm area and actual temperature functional relation, each temperature is calculated
The actual temperature that area can reach at a given temperature is estimated to be welded in conjunction with circuit board to be welded to the sensitive parameter of temperature
Surface temperature of the circuit board in each warm area is connect, and then determines the welding quality of circuit board to be welded, by adjusting given temperature
Continue to determine welding quality until the given temperature of each warm area is obtained, so as to quickly recommend when meeting welding quality requirement
It is adapted to the given temperature of each warm area of the reflow soldering of different circuit boards to be welded out, and due to the method for the embodiment of the present application
It is applicable to the circuit board to be welded of different model, so that recommendation results science is reliable, reduces the larger mistake for manually estimating appearance
The problem of difference, simultaneously, additionally it is possible to substantially reduce the necessary loss generated in board production manufacture, save a large amount of economic costs.
Below in conjunction with attached drawing, the technical scheme provided by various embodiments of the present application will be described in detail.
Fig. 1 is a kind of structural schematic diagram for temperature recommender system that one exemplary embodiment of the application provides.Such as Fig. 1 institute
Show, which includes: terminal 101 and reflow soldering 102.
Wherein, terminal 101 can be any equipment with certain computing capability, such as can be working machine, plate electricity
Brain, PC etc..The basic structure of terminal 101 includes: at least one processing unit and at least one processor.Processing is single
Member and the quantity of memory depend on the configuration and type of terminal 101.Memory may include the memory of volatibility, such as
RAM, also may include non-volatile memory, such as read-only memory (Read-Only Memory, ROM), flash memory etc., or
Person can also include two types simultaneously.Operating system (Operating System, OS), one are typically stored in memory
Or multiple application programs, it also can store program data etc..Other than processing unit and memory, terminal 101 further includes
Some basic configuration, such as network card chip, IO bus, audio-video component etc..Optionally, terminal 101 can also include some outer
Peripheral equipment, such as keyboard, mouse, input pen etc..Other peripheral equipments are well known in the art, and are not done herein superfluous
It states.
Reflow soldering 102 refers to for by the electronic component welding equipment on the board on circuit board to be welded.
The equipment may include multiple warm areas 103 and the transfer plate 105 that is arranged among each warm area 103, which will be to
Soldered circuit board is transmitted in each warm area 103 and is heated or cooled down.The upper and lower part of each warm area 103 is respectively arranged with
Alternating temperature plate 104, the alternating temperature plate for heating circuit board to be welded or cooling circuit board to be welded, in the lower part of each warm area 103
It is provided with the temperature sensor for acquiring the actual temperature in each warm area on 104, temperature sensor is by collected temperature
It is sent to terminal 101.
In the present embodiment, terminal 101 carry out in welding test process in test circuit board, for receiving reflow soldering
The actual temperature for each warm area that temperature sensor in 102 is sent, according to the every of the temperature sensor acquisition in test process
The given temperature of each warm area of the actual temperature and reflow soldering of a warm area determines the given temperature and practical temperature of each warm area
Degree functional relation calculates each warm area and at a given temperature can according to the given temperature of each warm area and actual temperature functional relation
The actual temperature reached；When temperature in reflow soldering is recommended, the reality that can be reached at a given temperature according to each warm area
Temperature and circuit board to be welded estimate surface temperature of the circuit board to be welded in each warm area to the sensitive parameter of temperature；According to
Surface temperature of the circuit board to be welded in each warm area, determines the welding quality of circuit board to be welded；If circuit board to be welded
Welding quality is unsatisfactory for the welding quality requirement of setting, readjusts the given temperature of each warm area, until circuit board to be welded
Until the welding quality that welding quality meets setting requires, to obtain the given temperature of each warm area.
It should be understood that the actual temperature of each warm area of temperature sensor acquisition is given according to several groups of differences of each warm area
Temperature, collected actual temperature, and it is directed to each warm area, determine the given temperature and actual temperature functional relation of the warm area.
After the given temperature and actual temperature functional relation for determining each warm area, due to calculating circuit to be welded subsequently through formula (2)
When surface temperature of the plate in each warm area, the given temperature and actual temperature functional relation according to each warm area are needed, to determine reality
Border temperature, at this time it needs to be determined that the actual temperature be not necessarily exactly the collected actual temperature of temperature sensor, that is, set at this time
The given temperature of the correspondence warm area of fixed reflow soldering is not necessarily exactly to carry out giving in welding test process in test circuit board
Temperature is determined, so the given temperature and actual temperature functional relation by each warm area are needed, to determine actual temperature.
Optionally, given temperature can be sent to reflow soldering 102 by terminal 101 so that reflow soldering 102 receive to
After determining temperature, the given temperature of each warm area is set automatically.
In the present embodiment, terminal 101 can be connected to the network with reflow soldering 102.The network connection can be nothing
Line or cable network connection.
Below with reference to embodiment of the method, the process of the given temperature of reflow soldering is recommended to carry out specifically for terminal 101
It is bright.
Fig. 2 is the process signal of the temperature recommended method in a kind of reflow soldering of the application another exemplary embodiment
Figure.This method 200 provided by the embodiments of the present application is executed by terminal, this method 200 the following steps are included:
201: the given temperature of each warm area inside initialization reflow soldering.
202: according to the given temperature of the corresponding each warm area of circuit board to be welded and actual temperature functional relation, calculating each temperature
The actual temperature that area can reach at a given temperature.
203: the actual temperature that can be reached at a given temperature according to each warm area and circuit board to be welded are to the quick of temperature
Feel parameter, estimates surface temperature of the circuit board to be welded in each warm area.
204: according to surface temperature of the circuit board to be welded in each warm area, determining the welding quality of circuit board to be welded.
205: if the welding quality of circuit board to be welded is unsatisfactory for the welding quality requirement of setting, readjusting each warm area
Given temperature, until the welding quality of circuit board to be welded meets the welding quality requirement of setting, to obtain each warm area
Given temperature.
It is explained in detail below for above-mentioned each step:
201: the given temperature of each warm area in initialization reflow soldering.
Wherein, given temperature refers to the temperature being arranged to warm area each in reflow soldering.
For example, in the corresponding reflow soldering of circuit board that has completed of random selection each warm area setting temperature, to working as
Different given temperatures is respectively set in each warm area inside preceding reflow soldering.
202: according to the given temperature of the corresponding each warm area of circuit board to be welded and actual temperature functional relation, calculating each temperature
The actual temperature that area can reach at a given temperature.
In some instances, this method 200 further include: temperature sensor is set in each warm area, using test circuit
Plate carries out in welding test process, acquires the actual temperature of each warm area during the test using temperature sensor；Utilize each temperature
The given temperature and actual temperature of area during the test, generate the given temperature and reality of the corresponding each warm area of circuit board to be welded
Border temperature funtion relationship.
Wherein, test circuit board is identical as the model of circuit board to be welded.
The actual temperature of each warm area refers to that corresponding temperature sensor acquires in actual ambient temperature and warm area in warm area
The temperature arrived.
It should be noted that first time carry out reflow soldering in temperature recommend when, need first to determine given temperature with
The functional relation of actual temperature is referred to as temperature model, and during temperature model, it needs first to make one piece
Circuit board is tested, and the test circuit board is put into reflow soldering and is welded, during the welding process, receives corresponding temperature
The actual temperature for each warm area that degree sensor is sent, so that it is determined that the temperature model.
Optionally, the given temperature and actual temperature using each warm area during the test, generates circuit board pair to be welded
The given temperature and actual temperature functional relation for each warm area answered, comprising: utilize linear regression algorithm, each warm area was being tested
Given temperature and actual temperature in journey are fitted, and obtain the given temperature and reality of the corresponding each warm area of circuit board to be welded
Temperature funtion relationship；Or
Using algorithm of support vector machine, each warm area given temperature during the test and actual temperature are fitted,
Obtain the given temperature and actual temperature functional relation of the corresponding each warm area of circuit board to be welded；Or
Decision Tree algorithms are promoted using gradient, each warm area given temperature during the test and actual temperature are intended
It closes, obtains the given temperature and actual temperature functional relation of the corresponding each warm area of circuit board to be welded；Or
Using extreme gradient boosting algorithm, each warm area given temperature during the test and actual temperature are intended
It closes, obtains the given temperature and actual temperature functional relation of the corresponding each warm area of circuit board to be welded.
Wherein, linear regression algorithm refers to using regression analysis in mathematical statistics, to determine two or more variable
Between complementary quantitative relationship algorithm.
Algorithm of support vector machine refers to the mode identification method based on Statistical Learning Theory.
Gradient promotes the decision Tree algorithms that decision Tree algorithms refer to iteration, which is made of more decision trees, Suo Youshu
Conclusion add up as final result.
Extreme gradient boosting algorithm XGBoost (eXtreme Gradient Boosting) refers to many tree-model collection
At together, the algorithm of a very powerful classifier is formed.
By using for linear regression algorithm, each warm area given temperature during the test and actual temperature are intended
It closes, obtains being illustrated for the given temperature and actual temperature functional relation of the corresponding each warm area of circuit board to be welded:
For each warm area, the actual temperature of each warm area is by this warm area and the given temperature shadow of adjacent warm area
It rings, for example, the actual temperature of warm area 2 is influenced by the given temperature of left side warm area 1, the right warm area 3 and this warm area 2, leads to
Cross the actual temperature Temperature that following formula determines the warm area 2:
Temperature=w1*left_setpoint+w2*current_setpoint+w3*righ t_setpoint
Wherein, left_setpoint is the given temperature of left side warm area, and w1 is the weight of the given temperature of left side warm area,
Current_setpoint is the given temperature of this warm area, and w2 is the weight of the given temperature of this warm area, right_setpoint
For the given temperature of the right warm area, w3 is the weight of the given temperature of the right warm area；And w1+w2+w3=1.
It should be noted that left side warm area or the right warm area may be not present for some warm areas, then it can be direct
The given temperature bring for ignoring the correspondence warm area in above-mentioned formula influences.
For example, make one piece of test circuit board according to described previously, and will at least one with tin cream on the test circuit board
A electronic component (can also be referred to as electronic device) setting sets each warm area of reflow soldering on test circuit board
Test circuit board is put into reflow soldering and carries out welding test by given temperature, and starting reflow soldering carries out welding test,
During welding test, the actual temperature for the correspondence warm area that the temperature sensor in each warm area is sent is received, adjustment is each
The given temperature of a warm area, in the actual temperature for the correspondence warm area that the temperature sensor continued in each warm area is sent,
To obtain the following table 1, which is for a warm area:
Table 1:
For each warm area, every a line in table 1 represents one group of data, by the given temperature of the multiple groups of the warm area, the temperature
The actual temperature of the practical warm area in area, the actual temperature of left side warm area and the right warm area is brought into above-mentioned formula, is determined
W1, w2 and w3, so that it is determined that the corresponding temperature model of the warm area, for example, Temperature=0.2*left_setpoint+
0.5*current_setpoint+0.3*right_setpoint。
It should be noted that the temperature sensor being arranged in each warm area in reflow soldering is more, it is consequently recommended
The precision of given temperature is higher, but considers from cost and enforcement difficulty, can choose each warm area and a temperature biography is arranged
Sensor.
It should be noted that if not being this method 200 when carrying out the temperature recommendation in reflow soldering for the first time further include:
According to the model of circuit board to be welded, the given temperature of the known circuit board model and each warm area that store in database is inquired
With the corresponding relationship between actual temperature functional relation；If inquiring known circuit board identical with the model of circuit board to be welded
Model directly acquires the corresponding relationship between the given temperature and actual temperature functional relation of corresponding each warm area, for example,
Temperature=0.2*left_setpoint+0.5*current_setpoint+0.3*r ight_setpoint.
If inquiry determines the temperature less than known circuit board model identical with the model of circuit board to be welded, basis above
Spend model.
203: the actual temperature that can be reached at a given temperature according to each warm area and circuit board to be welded are to the quick of temperature
Feel parameter, estimates surface temperature of the circuit board to be welded in each warm area.
Optionally, surface temperature T of the circuit board to be welded in each warm area is estimated by following formula (2):
T=T0+(Ta-T0)(1-e-t/τ) (2)
Wherein, T0For the initial temperature of circuit board to be welded, τ is sensitive parameter of the circuit board to be welded to temperature, and t is indicated
To acquire duration, TaFor the actual temperature that each warm area can reach at a given temperature, e is natural constant.
For example, setting 0.1s for each warm area for acquisition duration, i.e., can be determined by formula (2) to be welded
Circuit board is connect at each acquisition moment in the surface temperature of the warm area, which includes each electricity on circuit board to be welded
The surface temperature of subcomponent, and the surface temperature of each electronic component can be different.When determining that each warm area is corresponding to be welded
Connecing each electronic component on circuit board can determine each on circuit board to be welded after the surface temperature at each acquisition moment
Electronic component corresponds to the skin temperature profile of each warm area.For same electronic component, which is corresponded into each warm area
Skin temperature profile be combined, obtain temperature of the surface temperature of an electronic component as shown in Figure 3 in reflow soldering
Spend change curve.
It should be noted that multiple electronic components on same circuit board to be welded, each electronic component corresponding one
A skin temperature profile, the Fig. 3 only give the skin temperature profile schematic diagram an of electronic component.
In some instances, this method 200 further include: according to the physical parameter of test circuit board, calculate circuit to be welded
Sensitive parameter of the plate to temperature.
Wherein, test circuit board includes at least one electronic component, and each electronic component is optional as a collection point
Ground determines circuit board to be welded to the sensitive parameter of temperature according at least one collection point to the sensitive parameter of temperature；For example,
By each collection point to the set of the sensitive parameter of temperature as circuit board to be welded to the sensitive parameter of temperature, i.e., electricity to be welded
Road plate includes sensitive parameter of at least one collection point to temperature to the sensitive parameter of temperature.
Collection point refers to time constant to the sensitive parameter of temperature, indicates on a test circuit board or circuit board to be welded
Each electronic component to the sensitivity of temperature.Optionally, according to the physical parameter of test circuit board, circuit to be welded is calculated
Sensitive parameter of the plate to temperature, comprising: (1) determines at least one collection point to the sensitive parameter of temperature according to the following formula:
Wherein, τ is sensitive parameter of the collection point to temperature, CpFor the specific heat capacity of collection point, ρ is the density of collection point, and V is
The volume of collection point, h are the convection transfer rate in reflow soldering, AheatFor the surface area of collection point.
It should be understood that when testing only one electronic component in circuit board or circuit board to be welded, then the electronic component
It is used as the test circuit board or circuit board to be welded to the sensitive parameter of temperature the sensitive parameter of temperature.In addition, above-mentioned ginseng
Number: CpFor the specific heat capacity of collection point, ρ is the density of collection point, and V is the volume of collection point, and h is the heat convection in reflow soldering
Coefficient and AheatFor the surface area of collection point, belong to the physical parameter of electronic component, after electronic components fabrication comes out, the electricity
The physical parameter of subcomponent determines that, is assured that the sensitive parameter to temperature according to these physical parameters.
In some instances, this method 200 further include: after carrying out welding test using test circuit board, save test
The model of circuit board, test circuit board to the sensitive parameter of temperature, the given temperature of each warm area and actual temperature functional relation it
Between corresponding relationship and each warm area given temperature.
For example, the model of circuit board will be tested, sensitive parameter of each electronic component to temperature, each temperature on test circuit board
The given temperature of corresponding relationship and each warm area between the given temperature and actual temperature functional relation in area is stored into terminal
Pre-stored location in.
It should be noted that for the test circuit board and circuit board to be welded of same model, the material of the circuit board with
And the electronic component on circuit board is identical, and the material of identical electronic component, layout on circuit boards and circuit
Connection relationship is also identical.
Circuit board model will be tested, on the test circuit board each electronic component to the sensitive parameter of temperature, each warm area
The given temperature of corresponding relationship and each warm area between given temperature and actual temperature functional relation is recorded in the terminal
It achieves, the same or similar test circuit board of model can be searched in record achieves when welding other circuit boards, when to be welded
Connect circuit board it is identical as the test model of circuit board when, can direct corresponding each warm area given temperature as recommended temperature,
When circuit board to be welded is similar to the test model of circuit board, then by each electronic component on test circuit board to the quick of temperature
Sense parameter obtains temperature model as corresponding to electronic component on circuit board to be welded to the sensitive parameter value of temperature, thus
Circuit board is tested without making, saves circuit board making expense, even if not found in record achieves same or similar
Test circuit board, at most also only need to manufacture experimently one piece of test circuit board and can determine each electronic component on circuit board to be welded
To the sensitive parameter of temperature.
In some instances, before carrying out welding test using test circuit board, this method 200 further include: such as Fig. 4 institute
Show, 401: according to the model of circuit board to be welded, inquiring the known circuit board model stored in database, sensitive parameter and each
Corresponding relationship between the given temperature and actual temperature functional relation of warm area；Or the model according to circuit board to be welded, inquiry
The given temperature of the known circuit board model and each warm area that are stored in database；402: if inquiry less than with circuit board to be welded
The similar or identical known circuit board model of model, then welding test is carried out using test circuit board；403: if inquire with
The similar known circuit board model of the model of circuit board to be welded directly acquires the given of corresponding sensitive parameter and each warm area
Corresponding relationship between temperature and actual temperature functional relation；404: if inquire it is identical with the model of circuit board to be welded
Know circuit board model, directly acquires the given temperature of corresponding each warm area；Wherein, when circuit board to be welded and known circuit board
When similarity is greater than threshold value, then the model of circuit board to be welded is similar to known circuit board model.
For example, according to described previously, when taking circuit board to be welded, according to the model of the circuit board to be welded in terminal
Pre-stored location in search record achieve in whether there is same model test circuit board or similar test circuit board, when
There are identical test circuit board, then the given temperature of corresponding each warm area is directly acquired as recommended temperature, when there are similar
Test circuit board when, then directly using the test circuit board to the sensitive parameter of temperature as circuit board to be welded to the quick of temperature
Feel parameter, and directly acquires temperature model to calculate the actual temperature of each warm area, and determining and quick according to the actual temperature
Sense parameter determines surface temperature of each electronic component in each warm area on circuit board to be welded, same or similar if it does not exist
Test circuit board, then need to make a test circuit board for weld test, and to the new production in reflow soldering
Test circuit board carries out welding test, redefines the corresponding temperature model of test circuit board and the new production of the new production
Test circuit board to each electronic component on the test circuit board of the sensitive parameter of temperature and the new production in Reflow Soldering
Skin temperature profile in furnace.
It should be noted that can be the ruler on two circuit boards for similar test circuit board and circuit board to be welded
It is very little in threshold range, be all size phase difference in threshold range, and the electronic component types on two circuit boards are phases e.g.
With, and the number difference of the electronic component of each type on two circuit boards is in predetermined threshold.
204: according to surface temperature of the circuit board to be welded in each warm area, determining the welding quality of circuit board to be welded.
Optionally, the surface temperature according to circuit board to be welded in each warm area calculates the process window of circuit board to be welded
Oral index PWIs value, PWIs value indicate the welding quality of circuit board to be welded.
Wherein, process window index PWIs (Process Window Indexs) refers to the quantization side of temperature curve performance
Formula.
Optionally, the surface temperature according to circuit board to be welded in each warm area calculates the process window of circuit board to be welded
Oral index PWIs value, comprising:
The PWIs value of circuit board to be welded is calculated by following formula (3):
Wherein, i refers to each collection point on circuit board to be welded, and j refers to assessment parameter corresponding with i, and N is to be welded
Collection point number on circuit board, M are assessment number of parameters,It is j-th of i-th of collection point
Assess parameter values,For i-th collection point j-th of assessment parameter preset upper limit with it is preset
The average value of lower limit,For the preset upper limit of j-th of assessment parameter of i-th of collection point and the difference of preset lower limit；
Wherein, since N and M are positive integer, i and j are also positive integer.
Wherein,It is determined by surface temperature of the circuit board to be welded in each warm area.
It should be understood that above-mentioned formula (3) are to choose maximum from the numerical value of the corresponding assessment parameter in each collection point in multiple collection points
Assess numerical value of the numerical value of parameter as PWI.
Optionally, assessment parameter includes at least one of the following: leaching temperature time of the circuit board to be welded in reflow soldering, temperature
Spend peak value, molten tin time, the duration more than preset temperature, the first cooling rate and the second cooling rate.
Wherein, the leaching warm time refers to surface temperature of the electronic component in reflow soldering between the warm temperature of the leaching corresponding time
Every optionally, soaking warm temperature can be 150-180 degrees Celsius, bent according to surface temperature of the electronic component in reflow soldering
Line, as shown in figure 3, to determine that 150-180 degrees Celsius of corresponding time interval is 65.8s.The leaching temperature time is previously provided with the upper limit
Value and lower limit value, e.g., upper limit value 100s, lower limit value 60s.
Temperature peak refers to that surface temperature of the electronic component in reflow soldering is maximum temperature, optionally, such as Fig. 3 institute
Show, according to skin temperature profile of the electronic component in reflow soldering, to determine that its surface temperature peak degree Celsius is
246.3 degree Celsius.The temperature peak is previously provided with upper limit value and lower limit value, and e.g., upper limit value is 250 degrees Celsius, and lower limit value is
235 degrees Celsius.
The molten tin time refers to that surface temperature of the electronic component in reflow soldering is the duration that tin cream melts, optional
Ground, the molten tin time corresponding molten tin temperature can be 217 degrees Celsius or 210-217 degrees Celsius, returned according to the electronic component
Skin temperature profile in fluid welding furnace, as shown in figure 3, to determine that 217 degrees Celsius of corresponding duration are 76.8s or 210-
217 degrees Celsius of corresponding time intervals are 72.8s.The molten tin time is previously provided with upper limit value and lower limit value, and e.g., upper limit value is
90s, lower limit value 40s.
Duration more than preset temperature refers to that surface temperature of the electronic component in reflow soldering is holding for high temperature
Continuous time, optionally, high-temperature temperature can be 220 or more degrees Celsius, according to surface temperature of the electronic component in reflow soldering
It writes music line, as shown in figure 3, to determine that 220 or more degrees Celsius of corresponding duration time intervals are 58.8s.The duration is preparatory
Equipped with upper limit value and lower limit value, e.g., upper limit value 80s, lower limit value 40s.
First cooling rate refers to surface temperature of the electronic component in reflow soldering from peak temperature to molten tin temperature
Temperature cooling rate, optionally, the molten tin temperature can be 217 degrees Celsius, according to table of the electronic component in reflow soldering
Face temperature curve, as shown in figure 3, temperature peak to 217 degrees Celsius of temperature cooling rate is -1.7.First cooling rate is pre-
It is first equipped with upper limit value and lower limit value, e.g., upper limit value is -4, and lower limit value is -1.
Second cooling rate refers to that surface temperature of the electronic component in reflow soldering is Celsius from molten tin temperature to making a reservation for
The temperature cooling rate of degree, optionally, the molten tin temperature can be 217 degrees Celsius, according to the electronic component in reflow soldering
Skin temperature profile, as shown in figure 3, come determine 217-130 degrees Celsius temperature cooling rate be -1.1.The second cooling speed
Rate is previously provided with upper limit value and lower limit value, and e.g., upper limit value is -4, and lower limit value is -1.
It should be noted that each electronic component on circuit board to be welded has above-mentioned multiple assessment parameters, it is optional
Ground, if assessment parameter is above-mentioned six parameters, and tool is there are five electronic component on the soldered circuit board, then each electronic component
With above-mentioned six assessments parameter, then the assessment parameter of the circuit board to be welded be all electronic components assessment parameter it
With, be 30 assessment parameters, the corresponding PWI value of this 30 assessment parameters is determined according to above-mentioned formula (3) respectively, and determine this
Maximum value in the corresponding PWI value of 30 assessment parameters, as the PWI value of circuit board to be welded, when PWI value means more greatly table
Face temperature is remoter apart from ideal surfaced temperature, then the ideal given temperature of given temperature distance of reflow soldering is bigger, temperature error
Bigger, technique is poor.Mean that surface temperature is closer apart from ideal surfaced temperature when PWI value is smaller, then reflow soldering is given
The ideal given temperature of temperature distance is smaller, and temperature error is smaller, and technique is preferable.
For example, being with the assessment parameter " soaking the warm time " of 001 electronic component on circuit board to be welded according to described previously
Example, calculates its PWI value, according to skin temperature profile of the electronic component in reflow soldering, as shown in figure 3, to determine 150-
180 degrees Celsius of corresponding time intervals are 65.8s, are determined in formula (3)For 001 collection point
The leaching temperature time assessment parameter values be 65.8,Parameter is assessed for the leaching temperature time of 001 collection point
Preset upper limit and preset lower limit average value be (100+60)/2=80,For the leaching temperature time of 001 collection point
The difference of the preset upper limit and preset lower limit of assessing parameter is 100-60=40, is updated in formula (4):
Should be understood that above-mentioned formula 3) in refer to all assessment parameters for all electronic components of circuit board to be welded and
Speech selects the maximum value of the PWI value obtained by formula (4), and formula (4) is for an electronics in circuit board to be welded
For one assessment parameter of element, and the formula (4) is got from formula (3), or, formula (3) is by formula (4) group
Made of conjunction.
205: if the welding quality of circuit board to be welded is unsatisfactory for the welding quality requirement of setting, readjusting each warm area
Given temperature, until the welding quality of circuit board to be welded meets the welding quality requirement of setting, to obtain each warm area
Given temperature.
Wherein, welding quality requires to be the PWI value for reaching expected circuit board to be welded, for example, welding quality requirement is small
In or equal to circuit board to be welded PWI given threshold.
Optionally, if the welding quality of circuit board to be welded is unsatisfactory for the welding quality requirement of setting, each temperature is readjusted
The given temperature in area selects the weldering of best circuit board to be welded until reaching preset time in the preset time
Quality is connect, to obtain the given temperature of each warm area.
Optionally, the mode for readjusting the given temperature of each warm area may include: by formula (3) as genetic algorithm
Fitness function, the requirement for being made a variation and being intersected according to genetic algorithm carry out variation and crossover operation to the given temperature of each warm area,
Update given temperature.
Genetic algorithm is the natural selection for simulating Darwinian evolutionism and the biological evolution process of genetic mechanisms
Computation model is a kind of method by simulating natural evolution process searches optimal solution.
Genetic algorithm is directly to operate to structure objects, using the optimization method of randomization, does not need to determine rule
The search space that can obtain and instruct automatically optimization, is adaptively adjusted the direction of search.
Genetic algorithm is encoded one using randomized technique guidance with all individual for object in a kind of groups
Parameter space carry out effective search.Wherein, intersect and make a variation and constitute the genetic manipulation of genetic algorithm.
For example, reflow soldering there are 14 warm areas according to described previously, which is determined according to the given temperature of each warm area
The temperature array is carried out the intersection of genetic algorithm and made a variation by the initial given temperature array [T1, T2 ... T14] of brazier
To multiple groups given temperature array, and calculated according to the given temperature in each given temperature array each on circuit board to be welded
Surface temperature and skin temperature profile of the electronic component in reflow soldering, so that it is determined that the corresponding PWI value of every group of data, directly
To expected PWI value is determined, then the corresponding given temperature data of the PWI value are directly acquired.
It should be noted that needing will be in given temperature array when carrying out genetic algorithm intersection to given temperature array
The data of the same position intersected, since the given temperature of reflow soldering has certain changing rule, i.e. this time
The given temperature of the warm area of fluid welding furnace has certain rule, and when rule follows the temperature change shown in Fig. 3, so
The data of the same position are carried out to intersect the appearance that can reduce invalid data group, reduce calculation amount, accelerate to determine finally
Given temperature.
Technical scheme is described in detail below with reference to exemplary application scene:
Scene 1: obtaining the model of circuit board to be welded, and the regional search that prestores in the terminal whether there is and the model phase
Same or similar test circuit board, the given temperature that identical test circuit board then directly acquires corresponding each warm area if it exists are made
For recommended temperature, similar test circuit board, which is then prestored from this, if it exists directly acquires out the corresponding each electricity of the model in region
Subcomponent is to the sensitive parameter and the corresponding temperature model of each warm area of temperature, according to the given of warm area each in reflow soldering
Temperature determines the actual temperature of each warm area, determines each electronic component according to formula (2), sensitive parameter and actual temperature
In the skin temperature profile in reflow soldering of surface temperature and each electronic component of each warm area, according to the surface temperature
Curve and formula (3) determine the PWI value of circuit board to be welded, when the PWI value is unsatisfactory for expected value, then adjust each
The given temperature of warm area, and the PWI value for the corresponding circuit board to be welded of given temperature for computing repeatedly each warm area adjusted,
Determine that the final given temperature of reflow soldering, terminal will until PWI value meets expected value, and according to final PWI value
Determining final given temperature is sent to circuit brazier, so that each warm area is arranged according to these given temperatures in reflow soldering
Circuit board to be welded is put into reflow soldering and is welded by given temperature.
If not in the terminal prestore regional search to the same or similar test circuit board of the model, need to make
The test circuit board of one piece of same model, and the reality for acquiring the warm area is set in the alternating temperature plate of each warm area of reflow soldering
Test circuit board is put into reflow soldering by the temperature sensor of border temperature, and by terminal to each warm area of reflow soldering
Given temperature is configured, so that reflow soldering is after actuation, each warm area is heated or dropped according to the given temperature of setting
Temperature carries out welding machine test to test circuit board, and multiple groups given temperature can be arranged to each warm area of reflow soldering in terminal, and temperature passes
The multiple groups actual temperature for collecting each warm area is sent to terminal by sensor, terminal receive multiple groups actual temperature and multiple groups to
Determine temperature and determines temperature model.The sensitivity of temperature is joined according to each electronic component that formula (1) calculates circuit board to be welded
Number, according to formula (2), sensitive parameter and actual temperature, determine each electronic component each warm area surface temperature with
And skin temperature profile of each electronic component in reflow soldering, it is determined according to the skin temperature profile and formula (3)
The PWI value of circuit board to be welded then adjusts the given temperature of each warm area, and repeat when the PWI value is unsatisfactory for expected value
The PWI value for calculating the corresponding circuit board to be welded of given temperature of each warm area adjusted, until PWI value meets expected value
Until, and determine that the final given temperature of reflow soldering, terminal send out determining final given temperature according to final PWI value
It send to circuit brazier, so that the given temperature of each warm area is arranged according to these given temperatures for reflow soldering, by circuit to be welded
Plate is put into reflow soldering and is welded.
After completing circuit board completion welding to be welded, by its corresponding model and each electronic component to the quick of temperature
Feel parameter and stores prestoring in region to terminal, when being welded so as to the circuit board to be welded of subsequent same or similar model,
It can directly acquire temperature model according to sensitive parameter, and determine each electronic component in the surface temperature of each warm area and each
Skin temperature profile of the electronic component in reflow soldering.
It should be noted that the probability for finding the same or similar known circuit board is smaller in practical application scene,
Even if finding similar known circuit board, in order to accurately carry out temperature recommendation, first test circuit board can be tested,
And determine that the given temperature of the corresponding each warm area of the test circuit board is corresponding as circuit board to be welded by the above method
Recommended temperature.
Fig. 5 is a kind of structural schematic diagram of calculating equipment of the application another exemplary embodiment.As shown in figure 5, the meter
Calculating equipment 500 may include: processor 501 and memory 502；
Memory 502, for storing computer program；
Processor 501, for executing computer program, to be used for: the given temperature of each warm area in initialization reflow soldering；
According to the given temperature of the corresponding each warm area of circuit board to be welded and actual temperature functional relation, each warm area is calculated in given temperature
The actual temperature that can reach down；The actual temperature that can be reached at a given temperature according to each warm area and circuit board pair to be welded
The sensitive parameter of temperature estimates surface temperature of the circuit board to be welded in each warm area；According to circuit board to be welded in each warm area
Interior surface temperature determines the welding quality of circuit board to be welded；If the welding quality of circuit board to be welded is unsatisfactory for setting
Welding quality requirement, readjusts the given temperature of each warm area, until the welding quality of circuit board to be welded meets the weldering of setting
Until connecing quality requirement, to obtain the given temperature of each warm area.
In some instances, processor 501 are also used to: temperature sensor are arranged in each warm area, using test circuit
Plate carries out in welding test process, acquires the actual temperature of each warm area during the test using temperature sensor；Utilize each temperature
The given temperature and actual temperature of area during the test, generate the given temperature and reality of the corresponding each warm area of circuit board to be welded
Border temperature funtion relationship；Wherein, test circuit board is identical as the model of circuit board to be welded.
Optionally, processor 501 are specifically used for: the given temperature and actual temperature of each warm area during the test are utilized,
Generate the given temperature and actual temperature functional relation of the corresponding each warm area of circuit board to be welded, comprising: calculate using linear regression
Method is fitted each warm area given temperature during the test and actual temperature, and it is corresponding each to obtain circuit board to be welded
The given temperature and actual temperature functional relation of warm area；Or
Using algorithm of support vector machine, each warm area given temperature during the test and actual temperature are fitted,
Obtain the given temperature and actual temperature functional relation of the corresponding each warm area of circuit board to be welded；Or
Decision Tree algorithms are promoted using gradient, each warm area given temperature during the test and actual temperature are intended
It closes, obtains the given temperature and actual temperature functional relation of the corresponding each warm area of circuit board to be welded；Or
Using extreme gradient boosting algorithm, each warm area given temperature during the test and actual temperature are intended
It closes, obtains the given temperature and actual temperature functional relation of the corresponding each warm area of circuit board to be welded.
Optionally, processor 501 are specifically used for: according to the model of circuit board to be welded, inquiring in database and store
Know the corresponding relationship between circuit board model, the given temperature of sensitive parameter and each warm area and actual temperature functional relation；Or
According to the model of circuit board to be welded, the given temperature of the known circuit board model and each warm area that store in database is inquired；
If inquiring the known circuit board model similar or identical less than with the model of circuit board to be welded, carried out using test circuit board
Welding test；If inquiring known circuit board model similar with the model of circuit board to be welded, corresponding sensitivity is directly acquired
Corresponding relationship between parameter and the given temperature and actual temperature functional relation of each warm area；If inquiring and circuit to be welded
The identical known circuit board model of the model of plate, directly acquires the given temperature of corresponding each warm area；Wherein, when circuit to be welded
When the similarity of plate and known circuit board is greater than threshold value, then the model of circuit board to be welded is similar to known circuit board model.
In some instances, processor 501 are also used to: according to the physical parameter of test circuit board, calculating circuit to be welded
Sensitive parameter of the plate to temperature.
Optionally, test circuit board includes at least one electronic device, and each electronic component is as a collection point；
Optionally, processor 501 are specifically used for: (1) determines that the sensitivity of temperature is joined at least one collection point according to the following formula
Number:
According at least one collection point to the sensitive parameter of temperature, determine circuit board to be welded to the sensitive parameter of temperature；
Wherein, τ is sensitive parameter of the collection point to temperature, CpFor the specific heat capacity of collection point, ρ is the density of collection point, and V is
The volume of collection point, h are the convection transfer rate in reflow soldering, AheatFor the surface area of collection point.
Optionally, processor 501 are specifically used for: estimating surface of the circuit board to be welded in each warm area by following formula (2)
Temperature:
T=T0+(Ta-T0)(1-e-t/τ) (2)
Wherein, T0For the initial temperature of circuit board to be welded, τ is sensitive parameter of the circuit board to be welded to temperature, and t is indicated
To acquire duration, TaThe actual temperature that can reach at a given temperature for each warm area.
Optionally, processor 501 are specifically used for: according to surface temperature of the circuit board to be welded in each warm area, calculate to
The process window index PWIs value of soldered circuit board, PWIs value indicate the welding quality of circuit board to be welded.
Optionally, processor 501 are specifically used for: the PWIs value of circuit board to be welded is calculated by following formula (3):
Wherein, i refers to each collection point on circuit board to be welded, and j refers to assessment parameter corresponding with i, and N is to be welded
Collection point number on circuit board, M are assessment number of parameters,It is j-th of i-th of collection point
Assess parameter values,For i-th collection point j-th of assessment parameter preset upper limit with it is preset
The average value of lower limit,For the preset upper limit of j-th of assessment parameter of i-th of collection point and the difference of preset lower limit
Value；Wherein, since N and M are positive integer, i and j are also positive integer.
Wherein,It is determined by surface temperature of the circuit board to be welded in each warm area.
Optionally, assessment parameter includes at least one of the following: leaching temperature time of the circuit board to be welded in reflow soldering, temperature
Spend peak value, molten tin time, the duration more than preset temperature, the first cooling rate and the second cooling rate.
In some instances, processor 501 are also used to: after carrying out welding test using test circuit board, saving test
The sensitive parameter of the model of circuit board and test circuit board to temperature.
In addition, computer program is handled by one or more the embodiment of the invention provides a kind of computer storage medium
When device executes, one or more processors is caused to realize temperature recommended method in the reflow soldering in Fig. 2 embodiment of the method
Step.
In addition, containing in some processes of the description in above-described embodiment and attached drawing according to particular order appearance
Multiple operations, but it should be clearly understood that these operations can not execute or parallel according to its sequence what appears in this article
It executes, serial number of operation such as 201,202,203 etc. is only used for distinguishing each different operation, and serial number itself does not represent
Any executes sequence.In addition, these processes may include more or fewer operations, and these operations can be held in order
Capable or parallel execution.It should be noted that the description such as " first " herein, " second ", is for distinguishing different message, setting
Standby, module etc. does not represent sequencing, does not also limit " first " and " second " and is different type.
The apparatus embodiments described above are merely exemplary, wherein described, unit can as illustrated by the separation member
It is physically separated with being or may not be, component shown as a unit may or may not be physics list
Member, it can it is in one place, or may be distributed over multiple network units.It can be selected according to the actual needs
In some or all of the modules achieve the purpose of the solution of this embodiment.Those of ordinary skill in the art are not paying creativeness
Labour in the case where, it can understand and implement.
Through the above description of the embodiments, those skilled in the art can be understood that each embodiment can
It is realized by the mode of required general hardware platform is added, naturally it is also possible to which reality is come in conjunction with by way of hardware and software
It is existing.Based on this understanding, substantially the part that contributes to existing technology can be to calculate in other words for above-mentioned technical proposal
The form of machine product embodies, and it wherein includes the meter of computer usable program code that the present invention, which can be used in one or more,
The computer journey implemented in calculation machine usable storage medium (including but not limited to magnetic disk storage, CD-ROM, optical memory etc.)
The form of sequence product.
The present invention be referring to according to the method for the embodiment of the present invention, the process of equipment (system) and computer program product
Figure and/or block diagram describe.It should be understood that every one stream in flowchart and/or the block diagram can be realized by computer program instructions
The combination of process and/or box in journey and/or box and flowchart and/or the block diagram.It can provide these computer programs
Instruct the processing of general purpose computer, special purpose computer, Embedded Processor or other programmable media data processing equipments
Device is to generate a machine, so that the finger executed by the processor of computer or other programmable media data processing equipments
It enables and generates to specify in one or more flows of the flowchart and/or one or more blocks of the block diagram
The device of function.
These computer program instructions, which may also be stored in, is able to guide computer or other programmable media data processings are set
In standby computer-readable memory operate in a specific manner, so that instruction stored in the computer readable memory generates
Manufacture including command device, the command device are realized in one or more flows of the flowchart and/or one, block diagram
The function of being specified in box or multiple boxes.
These computer program instructions can also be loaded on computer or other programmable media data processing equipments, be made
It obtains and executes series of operation steps on a computer or other programmable device to generate computer implemented processing, thus counting
The instruction executed on calculation machine or other programmable devices is provided for realizing in one or more flows of the flowchart and/or side
The step of function of being specified in block diagram one box or multiple boxes.
In a typical configuration, calculating equipment includes one or more processors (CPU), input/output interface, net
Network interface and memory.
Memory may include the non-volatile memory in computer-readable medium, random access memory (RAM) and/or
The forms such as Nonvolatile memory, such as read-only memory (ROM) or flash memory (flash RAM).Memory is computer-readable medium
Example.
Computer-readable medium includes permanent and non-permanent, removable and non-removable media can be by any method
Or technology come realize information store.Information can be computer readable instructions, data structure, the module of program or other data.
The example of the storage medium of computer includes, but are not limited to phase change memory (PRAM), static random access memory (SRAM), moves
State random access memory (DRAM), other kinds of random access memory (RAM), read-only memory (ROM), electric erasable
Programmable read only memory (EEPROM), flash memory or other memory techniques, read-only disc read only memory (CD-ROM) (CD-ROM),
Digital versatile disc (DVD) or other optical storage, magnetic cassettes, tape magnetic disk storage or other magnetic storage devices
Or any other non-transmission medium, can be used for storage can be accessed by a computing device information.As defined in this article, it calculates
Machine readable medium does not include temporary computer readable media (transitory media), such as the data-signal and carrier wave of modulation.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features；
And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (13)
1. the temperature recommended method in a kind of reflow soldering characterized by comprising
Initialize the given temperature of each warm area in the reflow soldering；
According to the given temperature of the corresponding each warm area of circuit board to be welded and actual temperature functional relation, each warm area is calculated given
At a temperature of the actual temperature that can reach；
The actual temperature that can be reached at a given temperature according to each warm area and circuit board to be welded estimate the sensitive parameter of temperature
Count surface temperature of the circuit board to be welded in each warm area；
According to surface temperature of the circuit board to be welded in each warm area, the welding quality of the circuit board to be welded is determined；
If the welding quality of the circuit board to be welded is unsatisfactory for the welding quality requirement of setting, the given of each warm area is readjusted
Temperature, until the welding quality of the circuit board to be welded meets the welding quality requirement of setting, to obtain each warm area
Given temperature.
2. the method according to claim 1, wherein further include:
Temperature sensor is set in each warm area, is carried out in welding test process using test circuit board, utilizes the temperature
Sensor acquires the actual temperature of each warm area during the test；
Using the given temperature and actual temperature of each warm area during the test, the corresponding each warm area of circuit board to be welded is generated
Given temperature and actual temperature functional relation；Wherein, the test circuit board is identical as the model of the circuit board to be welded.
3. according to the method described in claim 2, it is characterized in that, given temperature and reality using each warm area during the test
Border temperature generates the given temperature and actual temperature functional relation of the corresponding each warm area of circuit board to be welded, comprising:
Using linear regression algorithm, each warm area given temperature during the test and actual temperature are fitted, obtain to
The given temperature and actual temperature functional relation of the corresponding each warm area of soldered circuit board；Or
Using algorithm of support vector machine, each warm area given temperature during the test and actual temperature are fitted, obtained
The given temperature and actual temperature functional relation of the corresponding each warm area of circuit board to be welded；Or
Decision Tree algorithms are promoted using gradient, each warm area given temperature during the test and actual temperature are fitted,
Obtain the given temperature and actual temperature functional relation of the corresponding each warm area of circuit board to be welded；Or
Using extreme gradient boosting algorithm, each warm area given temperature during the test and actual temperature are fitted, obtained
To the given temperature and actual temperature functional relation of the corresponding each warm area of circuit board to be welded.
4. according to the method described in claim 2, it is characterized in that, being gone back before carrying out welding test using test circuit board
Include:
According to the model of the circuit board to be welded, inquire the known circuit board model stored in database, sensitive parameter and
Corresponding relationship between the given temperature and actual temperature functional relation of each warm area；Or
According to the model of the circuit board to be welded, inquire the known circuit board model and each warm area stored in database to
Determine temperature；
If inquiry is less than the known circuit board model similar or identical with the model of the circuit board to be welded, using test electricity
Road plate carries out welding test；
If inquiring known circuit board model similar with the model of the circuit board to be welded, corresponding sensitive ginseng is directly acquired
Corresponding relationship between the given temperature and actual temperature functional relation of several and each warm area；
If inquiring known circuit board model identical with the model of the circuit board to be welded, corresponding each warm area is directly acquired
Given temperature；
Wherein, when the similarity of the circuit board to be welded and the known circuit board is greater than threshold value, then the electricity to be welded
The model of road plate is similar to known circuit board model.
5. according to the method described in claim 2, it is characterized in that, the method also includes:
According to the physical parameter of test circuit board, the circuit board to be welded is calculated to the sensitive parameter of temperature.
6. according to the method described in claim 5, it is characterized in that, the test circuit board includes at least one electronic component,
Each electronic component is as a collection point；
According to the physical parameter of test circuit board, the circuit board to be welded is calculated to the sensitive parameter of temperature, comprising:
(1) determines at least one described collection point to the sensitive parameter of temperature according to the following formula:
According at least one described collection point to the sensitive parameter of temperature, determine that the circuit board to be welded joins the sensitivity of temperature
Number；
Wherein, τ is sensitive parameter of the collection point to temperature, CpFor the specific heat capacity of collection point, ρ is the density of collection point, and V is acquisition
The volume of point, h is the convection transfer rate in reflow soldering, AheatFor the surface area of collection point.
7. method according to claim 1-6, which is characterized in that can be reached at a given temperature according to each warm area
The actual temperature arrived and circuit board to be welded estimate table of the circuit board to be welded in each warm area to the sensitive parameter of temperature
Face temperature, comprising:
Surface temperature of the circuit board to be welded in each warm area is estimated by following formula (2):
T=T0+(Ta-T0)(1-e-t/τ) (2)
Wherein, T0For the initial temperature of circuit board to be welded, τ is sensitive parameter of the circuit board to be welded to temperature, and t is expressed as adopting
Collect duration, TaThe actual temperature that can reach at a given temperature for each warm area.
8. method according to claim 1-6, which is characterized in that according to the circuit board to be welded in each warm area
Interior surface temperature determines the welding quality of the circuit board to be welded, comprising:
According to surface temperature of the circuit board to be welded in each warm area, the process window for calculating the circuit board to be welded refers to
Number PWIs value, the PWIs value indicate the welding quality of the circuit board to be welded.
9. according to the method described in claim 8, it is characterized in that, surface according to the circuit board to be welded in each warm area
Temperature calculates the process window index PWIs value of the circuit board to be welded, comprising:
The PWIs value of the circuit board to be welded is calculated by following formula (3):
Wherein, i refers to each collection point on circuit board to be welded, and j refers to assessment parameter corresponding with i, and N is circuit to be welded
Collection point number on plate, M are assessment number of parameters,For j-th of assessment of i-th of collection point
Parameter values,For the preset upper limit and preset lower limit of j-th of assessment parameter of i-th of collection point
Average value,For the preset upper limit of j-th of assessment parameter of i-th of collection point and the difference of preset lower limit；
Wherein,It is determined by surface temperature of the circuit board to be welded in each warm area.
10. according to the method described in claim 9, it is characterized in that, the assessment parameter include at least one of the following: it is to be welded
Leaching of the circuit board in reflow soldering warm time, temperature peak, molten tin time, the duration more than preset temperature, first
Cooling rate and the second cooling rate.
11. method according to claim 2 or 4, which is characterized in that the method also includes:
After carrying out welding test using test circuit board, the model for testing circuit board, the test circuit board pair are saved
Corresponding relationship and each warm area between the sensitive parameter of temperature, the given temperature of each warm area and actual temperature functional relation are given
Determine temperature.
12. a kind of calculating equipment characterized by comprising including memory and processor；
The memory, for storing computer program；
The processor, for executing the computer program, to be used for:
Initialize the given temperature of each warm area in the reflow soldering；
According to the given temperature of the corresponding each warm area of circuit board to be welded and actual temperature functional relation, each warm area is calculated given
At a temperature of the actual temperature that can reach；
The actual temperature that can be reached at a given temperature according to each warm area and circuit board to be welded estimate the sensitive parameter of temperature
Count surface temperature of the circuit board to be welded in each warm area；
According to surface temperature of the circuit board to be welded in each warm area, the welding quality of the circuit board to be welded is determined；
If the welding quality of the circuit board to be welded is unsatisfactory for the welding quality requirement of setting, the given of each warm area is readjusted
Temperature, until the welding quality of the circuit board to be welded meets the welding quality requirement of setting, to obtain each warm area
Given temperature.
13. a kind of computer readable storage medium for being stored with computer program, which is characterized in that computer program by one or
When multiple processors execute, one or more of processors is caused to realize the step in any one of claim 1-11 the method
Suddenly.
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| CN201811493654.7A CN109299584A (en) | 2018-12-07 | 2018-12-07 | Temperature recommended method, equipment and storage medium in reflow soldering |
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