CN109294094A - A kind of thermally conductive new material - Google Patents
A kind of thermally conductive new material Download PDFInfo
- Publication number
- CN109294094A CN109294094A CN201811273054.XA CN201811273054A CN109294094A CN 109294094 A CN109294094 A CN 109294094A CN 201811273054 A CN201811273054 A CN 201811273054A CN 109294094 A CN109294094 A CN 109294094A
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- CN
- China
- Prior art keywords
- parts
- thermally conductive
- methylimidazole
- aluminium oxide
- copper powder
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/06—Polystyrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of thermally conductive new materials to be made of following raw material according to parts by weight: 1-2 parts of aluminium oxide, 3-4 parts of brominated Polystyrene, 1-2 parts of methylimidazole, 4-6 parts of copper powder, 2-4 parts of polyamide, 1-2 parts of synergist.Compared with prior art, there are following the utility model has the advantages that interacting between each material of the present invention by the present invention, and heating conduction is good, anti-flammability is strong, easy to process, lubricity is strong, internal structure performance is stablized.
Description
Technical field
The invention belongs to field of new materials, and in particular to a kind of thermally conductive new material.
Background technique
The structural material and the function for the matter that has specific characteristics with excellent properties that new material refers to newly-developed or developing
It can material.Structural material mainly utilizes the mechanical performances such as their intensity, toughness, hardness, elasticity.Such as new ceramic material,
Amorphous alloy (glassy metal) etc..Functional material mainly utilizes functions and the physics such as its electricity, light, sound, magnetic, heat
Effect.In recent years, the new material studied in the world, developed mainly has new metal material, fine ceramics and optical fiber etc..
To there is internal structure in existing Heat Conduction Material unstable in use, and heating conduction is poor, vulnerable to temperature
Interference, lack good flame retardant effect and lubricity, make troubles to the use of Heat Conduction Material.
Summary of the invention
It is an object of the invention to overcome the deficiencies of existing technologies, provide a kind of heating conduction is good, anti-flammability is strong, be easy to plus
The thermally conductive new material that work, lubricity are strong, internal structure performance is stable.
To achieve the goals above, technical scheme is as follows:
A kind of thermally conductive new material is made of following raw material according to parts by weight:
1-2 parts of aluminium oxide, 1-2 parts of methylimidazole, 4-6 parts of copper powder, 2-4 parts of polyamide, increases 3-4 parts of brominated Polystyrene
Agent 1-2 parts of effect.
It is preferred: it is described according to parts by weight, be made of following raw material:
1 part of aluminium oxide, 3 parts of brominated Polystyrene, 1 part of methylimidazole, 4 parts of copper powder, 2 parts of polyamide, 1 part of synergist.
It is preferred: it is described according to parts by weight, be made of following raw material:
1.5 parts of aluminium oxide, 3.5 parts of brominated Polystyrene, 1.5 parts of methylimidazole, 5 parts of copper powder, kymene part, synergist
1.5 part.
It is preferred: it is described according to parts by weight, be made of following raw material:
2 parts of aluminium oxide, 4 parts of brominated Polystyrene, 2 parts of methylimidazole, 6 parts of copper powder, 4 parts of polyamide, 2 parts of synergist.
The performance of each raw material is as follows in the present invention:
Aluminium oxide: amphoteric oxide can be dissolved in inorganic acid and alkaline solution, be practically insoluble in water and nonpolarity is organic molten
Agent.Relative density (d204) 4.0, about 2000 DEG C of fusing point；
Brominated Polystyrene: being a kind of bromine system organic fire-retardant, has high flame retardant, thermal stability and photostability etc. good
Good mechanical-physical and chemical property；
Methylimidazole: being a kind of important organic intermediate.It also is used as epoxy curing agent and protecting metallic surface
Agent etc.；
Copper powder: copper is soft metal, is reddish orange band metallic luster when surface is just cut, simple substance is in aubergine.Extend
Property it is good, thermal conductivity and electric conductivity are high；
Polyamide: have good comprehensive performance, including mechanical property, heat resistance, wear resistance, chemical resistance and
Self-lubrication, and coefficient of friction is low, there is certain anti-flammability, it is easy to process, it is suitable for being increased with glass fibre and the filling of other fillers
It is strong modified, it improves performance and expands application range；
Synergist: holding power is closed as the initial bonding strength for mainly improving product in adhesive；It is mainly improved in coating
Increase with the adhesive force of matrix.
Compared with prior art, there are following the utility model has the advantages that interact between each material of the present invention by the present invention, thermal conductivity
Energy is good, anti-flammability is strong, easy to process, lubricity is strong, internal structure performance is stablized.
Specific embodiment
The present invention is described in further details below with reference to embodiment.
Embodiment 1:
1 part of aluminium oxide, 3 parts of brominated Polystyrene, 1 part of methylimidazole, 4 parts of copper powder, 2 parts of polyamide, 1 part of synergist.
Heat Conduction Material production method are as follows: by above-mentioned aluminium oxide, brominated Polystyrene, methylimidazole, copper powder, polyamide, increasing
Effect agent is proportionally added sequentially in high-speed mixer, and the revolving speed of high-speed mixer is 1000-1200rpm, controls mixing material
The temperature of material rises to 145 DEG C, and mixing material is added in low-speed mixer and is cooled down, and the temperature for controlling mixing material is 50-
At 60 DEG C, mixing material is taken out；Mixing material is put on the lower electrode dielectric of ion body device, treated, and mixture is put
Enter in single screw extrusion machine, process is hot-forming twice, then through air-cooled up to material of the present invention.
Embodiment 2:
1.5 parts of aluminium oxide, 3.5 parts of brominated Polystyrene, 1.5 parts of methylimidazole, 5 parts of copper powder, kymene part, synergist
1.5 part.
Heat Conduction Material production method are as follows: by above-mentioned aluminium oxide, brominated Polystyrene, methylimidazole, copper powder, polyamide, increasing
Effect agent is proportionally added sequentially in high-speed mixer, and the revolving speed of high-speed mixer is 1000-1200rpm, controls mixing material
The temperature of material rises to 145 DEG C, and mixing material is added in low-speed mixer and is cooled down, and the temperature for controlling mixing material is 50-
At 60 DEG C, mixing material is taken out；Mixing material is put on the lower electrode dielectric of ion body device, treated, and mixture is put
Enter in single screw extrusion machine, process is hot-forming twice, then through air-cooled up to material of the present invention.
Embodiment 3:
2 parts of aluminium oxide, 4 parts of brominated Polystyrene, 2 parts of methylimidazole, 6 parts of copper powder, 4 parts of polyamide, 2 parts of synergist.
Heat Conduction Material production method are as follows: by above-mentioned aluminium oxide, brominated Polystyrene, methylimidazole, copper powder, polyamide, increasing
Effect agent is proportionally added sequentially in high-speed mixer, and the revolving speed of high-speed mixer is 1000-1200rpm, controls mixing material
The temperature of material rises to 145 DEG C, and mixing material is added in low-speed mixer and is cooled down, and the temperature for controlling mixing material is 50-
At 60 DEG C, mixing material is taken out；Mixing material is put on the lower electrode dielectric of ion body device, treated, and mixture is put
Enter in single screw extrusion machine, process is hot-forming twice, then through air-cooled up to material of the present invention.
Claims (4)
1. a kind of thermally conductive new material, it is characterised in that: according to parts by weight, be made of following raw material:
1-2 parts of aluminium oxide, 3-4 parts of brominated Polystyrene, 1-2 parts of methylimidazole, 4-6 parts of copper powder, 2-4 parts of polyamide, synergist
1-2 parts.
2. thermally conductive new material as described in claim 1, it is characterised in that: according to parts by weight, be made of following raw material:
1 part of aluminium oxide, 3 parts of brominated Polystyrene, 1 part of methylimidazole, 4 parts of copper powder, 2 parts of polyamide, 1 part of synergist.
3. thermally conductive new material as described in claim 1, it is characterised in that: according to parts by weight, be made of following raw material:
1.5 parts of aluminium oxide, 3.5 parts of brominated Polystyrene, 1.5 parts of methylimidazole, 5 parts of copper powder, kymene part, synergist 1.5
Part.
4. thermally conductive new material as described in claim 1, it is characterised in that: according to parts by weight, be made of following raw material:
2 parts of aluminium oxide, 4 parts of brominated Polystyrene, 2 parts of methylimidazole, 6 parts of copper powder, 4 parts of polyamide, 2 parts of synergist.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811273054.XA CN109294094A (en) | 2018-10-30 | 2018-10-30 | A kind of thermally conductive new material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811273054.XA CN109294094A (en) | 2018-10-30 | 2018-10-30 | A kind of thermally conductive new material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109294094A true CN109294094A (en) | 2019-02-01 |
Family
ID=65158054
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811273054.XA Pending CN109294094A (en) | 2018-10-30 | 2018-10-30 | A kind of thermally conductive new material |
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| CN (1) | CN109294094A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102558609A (en) * | 2011-12-13 | 2012-07-11 | 金发科技股份有限公司 | Method for improving thermal conductivity of thermal conductive polymer |
| CN105199184A (en) * | 2015-10-30 | 2015-12-30 | 太仓市天合新材料科技有限公司 | Novel heat conduction material |
| CN107698966A (en) * | 2017-11-07 | 2018-02-16 | 广西小草信息产业有限责任公司 | A kind of heat conduction new material and preparation method thereof |
| US20180094183A1 (en) * | 2015-06-30 | 2018-04-05 | Laird Technologies, Inc. | Thermal interface materials with low secant modulus of elasticity and high thermal conductivity |
| CN107880548A (en) * | 2017-11-10 | 2018-04-06 | 无锡艾科瑞思产品设计与研究有限公司 | A kind of computer conductive heat conducting material formula and its preparation technology |
-
2018
- 2018-10-30 CN CN201811273054.XA patent/CN109294094A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102558609A (en) * | 2011-12-13 | 2012-07-11 | 金发科技股份有限公司 | Method for improving thermal conductivity of thermal conductive polymer |
| US20180094183A1 (en) * | 2015-06-30 | 2018-04-05 | Laird Technologies, Inc. | Thermal interface materials with low secant modulus of elasticity and high thermal conductivity |
| CN105199184A (en) * | 2015-10-30 | 2015-12-30 | 太仓市天合新材料科技有限公司 | Novel heat conduction material |
| CN107698966A (en) * | 2017-11-07 | 2018-02-16 | 广西小草信息产业有限责任公司 | A kind of heat conduction new material and preparation method thereof |
| CN107880548A (en) * | 2017-11-10 | 2018-04-06 | 无锡艾科瑞思产品设计与研究有限公司 | A kind of computer conductive heat conducting material formula and its preparation technology |
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Application publication date: 20190201 |