CN109291655B - Thermal printing head with heat dissipation function - Google Patents
Thermal printing head with heat dissipation function Download PDFInfo
- Publication number
- CN109291655B CN109291655B CN201811504423.1A CN201811504423A CN109291655B CN 109291655 B CN109291655 B CN 109291655B CN 201811504423 A CN201811504423 A CN 201811504423A CN 109291655 B CN109291655 B CN 109291655B
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- heat
- bimetallic
- ceramic substrate
- bimetallic strips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/3358—Cooling arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Abstract
The invention discloses a thermal printing head with a heat dissipation function, wherein a ceramic substrate and a printed circuit board are fixed on the same side of a heat dissipation plate, the ceramic substrate and the printed circuit board are connected through packaging glue, a plurality of bimetallic strips are fixed on one side of the heat dissipation plate, which is far away from the ceramic substrate and the printed circuit board, the bimetallic strips are arranged in parallel, the connecting lines of the bimetallic strips are vertical to the plane where the bimetallic strips are located, a plurality of medium pipelines are respectively located between the bimetallic strips, and the bimetallic strips are abutted against the medium pipelines in a bending state; according to the thermal printing head with the heat dissipation function, the heat on the ceramic substrate is conducted along the heat dissipation plate and the bimetallic strip in sequence, the bimetallic strip bends towards one side of the passive layer along with the gradual increase of the heat on the bimetallic strip and is finally abutted against the medium pipeline, the heat on the bimetallic strip is taken away by the heat dissipation medium in the medium pipeline, and therefore the purpose of heat dissipation is achieved, and when the temperature of the thermal printing head is gradually reduced, the bimetallic strip gradually restores to the original shape.
Description
Technical Field
The invention relates to the technical field of thermal printers, in particular to a thermal printing head with a heat dissipation function.
Background
At present, a thermal printhead generally includes a ceramic substrate, a printed circuit board, a heat sink, a package adhesive, an integrated circuit, and a gold wire.
In a conventional thermal printhead, a plurality of heating resistors are formed on a ceramic substrate made of an insulating material, signal lines are disposed on a printed circuit board, the ceramic substrate and the printed circuit board are usually bonded to a heat sink, an integrated circuit is bonded to the ceramic substrate or the printed circuit board, the circuits are connected by gold wires, and the integrated circuit and the gold wires are encapsulated and protected by an encapsulation adhesive.
When large-energy printing is carried out, because the heating resistor bodies on the ceramic substrate generate heat in a large quantity, the heat dissipation of the heat dissipation plate is not timely, and waste heat accumulation is gradually generated during printing, so that the printing effect is poor.
Disclosure of Invention
In order to solve the technical problems in the background art, the invention provides a thermal printing head with a heat dissipation function.
The invention provides a thermal printing head with a heat dissipation function, which comprises a ceramic substrate, a printed circuit board, a heat dissipation plate, packaging glue, a plurality of bimetallic strips and a plurality of medium pipelines, wherein the ceramic substrate is provided with a plurality of grooves;
the ceramic substrate and the printed circuit board are fixed on the same side of the heat dissipation plate and connected through packaging glue;
the bimetallic strips are fixed on one side, far away from the ceramic substrate and the printed circuit board, of the heat dissipation plate, the bimetallic strips are arranged in parallel, connecting lines of the bimetallic strips are perpendicular to the plane where the bimetallic strips are located, the medium pipelines are located among the bimetallic strips respectively, and the bimetallic strips are abutted against the medium pipelines in a bending state.
Preferably, the bimetal extends into the heat sink plate.
Preferably, the active layer of the bimetal extends into the heat dissipation plate, and the passive layer of the bimetal is spaced from the heat dissipation plate by a preset distance.
Preferably, the heat radiating plate is provided with a heat conductive sheet connected with the plurality of bimetal sheets.
Preferably, the medium pipe has a first arc-shaped outer surface, and in a bent state of the bimetal, a passive layer of the bimetal is formed to be close to one side of the medium pipe to form a second arc-shaped outer surface, and the second arc-shaped outer surface is matched with the first arc-shaped outer surface.
Preferably, the plurality of media tubes are made of a copper material.
Preferably, a plurality of media conduits are connected in parallel.
According to the thermal printing head with the heat dissipation function, the heat on the ceramic substrate is conducted along the heat dissipation plate and the bimetallic strip in sequence, the bimetallic strip bends towards one side of the passive layer along with the gradual increase of the heat on the bimetallic strip and is finally abutted against the medium pipeline, and the heat on the bimetallic strip is taken away by the heat dissipation medium in the medium pipeline, so that the purpose of heat dissipation is achieved.
Drawings
Fig. 1 is an isometric view of a thermal print head with heat dissipation according to the present invention;
fig. 2 is a side view of a thermal print head with a heat dissipation function according to the present invention.
Detailed Description
Fig. 1 is an isometric view of a thermal print head with a heat dissipation function according to the present invention, and fig. 2 is a side view of the thermal print head with a heat dissipation function according to the present invention, as shown in fig. 1-2.
Referring to fig. 1-2, the thermal print head with a heat dissipation function according to the present invention includes a ceramic substrate 1, a printed circuit board 2, a heat dissipation plate 3, a packaging adhesive 4, a plurality of bimetallic strips 5, and a plurality of medium pipes 6;
the ceramic substrate 1 is in a cubic structure, the ceramic substrate 1 and the printed circuit board 2 are fixed on the same side of the heat dissipation plate 3, and the ceramic substrate 1 and the printed circuit board 2 are connected through the packaging adhesive 4;
the bimetallic strips 5 are fixed on one side, far away from the ceramic substrate 1 and the printed circuit board 2, of the heat dissipation plate 3, the bimetallic strips 5 are arranged in parallel, connecting lines of the bimetallic strips 5 are perpendicular to the plane where the bimetallic strips 5 are located, the medium pipelines 6 are located among the bimetallic strips 5 respectively, and the bimetallic strips 5 are abutted against the medium pipelines 6 in a bending state.
When the thermal printing head does not work, the bimetallic strip 5 and the medium pipeline 6 close to one side of the passive layer of the bimetallic strip 5 are separated by a preset distance, in the working process of the thermal printing head, the heat on the ceramic substrate 1 is sequentially conducted along the heat dissipation plate 3 and the bimetallic strip 5, along with the gradual increase of the heat on the bimetallic strip 5, the bimetallic strip 5 bends towards one side of the passive layer and finally abuts against the medium pipeline 6, referring to one bent bimetallic strip 5 in FIG. 2, the heat on the bimetallic strip 5 is taken away by the heat dissipation medium in the medium pipeline 6, so that the purpose of heat dissipation is achieved, when the temperature of the thermal printing head is gradually reduced, the bimetallic strip 5 gradually restores the original shape, and the bimetallic strip 5 is separated from the medium pipeline 6 in the shape restoring process, so that the thermal printing head provided by the invention can automatically adjust whether to conduct the heat of the thermal printing head according, the heat on the thermal printing head can be timely dissipated, manual control is not needed, and the degree of automation is higher.
In order to improve the heat conduction efficiency between the bimetal 5 and the heat dissipation plate 3, the bimetal 5 extends into the heat dissipation plate 3, so that the contact area between the bimetal 5 and the heat dissipation plate 3 is increased, and the heat on the heat dissipation plate 3 can be conducted to the bimetal 5 in time.
In order to solve the problem that if the active layer and the passive layer of the bimetal 5 extend into the heat dissipation plate 3, the part of the bimetal 5 in the heat dissipation plate 3 is also bent due to the immobility of the bimetal 5 in the heat dissipation plate 3, and the part of the bimetal 5 in the heat dissipation plate 3 is acted with the heat dissipation plate 3, which is not beneficial for the bimetal 5 to be fixed on the heat dissipation plate 3, referring to fig. 2, in the present embodiment, the active layer of the bimetal 5 extends into the heat dissipation plate 3, and the passive layer of the bimetal 5 is spaced from the heat dissipation plate 3 by a predetermined distance, so that the part of the bimetal 5 extending into the heat dissipation plate 3 is not bent and is not acted with the heat dissipation plate 3, and the heat on the heat dissipation plate 3 is transferred to the active layer first and then to the passive layer through the active layer, and the active layer is deformed before the passive layer, and then the bending of bimetallic strip 5 is more timely, and the heat on the thermal printing head can be more timely distributed out.
Further, the heat dissipating plate 3 is provided with a heat conductive sheet connected to the plurality of bimetal sheets 5, and if the temperature of a certain portion of the heat dissipating plate 3 is rapidly increased, the heat conductive sheet can conduct the heat of the certain portion to all the bimetal sheets 5, and all the bimetal sheets 5 radiate the heat of the certain portion.
The medium pipeline 6 is provided with a first arc-shaped outer surface, a passive layer of the bimetallic strip 5 forms a second arc-shaped outer surface close to one side of the medium pipeline 6 under the bending state of the bimetallic strip 5, and the second arc-shaped outer surface is matched with the first arc-shaped outer surface, so that the contact area between the bimetallic strip 5 and the medium pipeline 6 can be increased, and the heat transfer rate between the bimetallic strip 5 and the medium pipeline 6 is higher.
In this embodiment, the plurality of medium pipes 6 are made of a copper material, and the plurality of medium pipes 6 are connected in parallel.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (6)
1. A thermal printing head with a heat dissipation function is characterized by comprising a ceramic substrate (1), a printed circuit board (2), a heat dissipation plate (3), packaging glue (4), a plurality of bimetallic strips (5) and a plurality of medium pipelines (6);
the ceramic substrate (1) and the printed circuit board (2) are fixed on the same side of the heat dissipation plate (3), and the ceramic substrate (1) and the printed circuit board (2) are connected through packaging glue (4);
the bimetallic strips (5) are fixed on one side, away from the ceramic substrate (1) and the printed circuit board (2), of the heat dissipation plate (3), the bimetallic strips (5) are arranged in parallel, connecting lines of the bimetallic strips (5) are perpendicular to the plane where the bimetallic strips (5) are located, the medium pipelines (6) are located among the bimetallic strips (5), and the bimetallic strips (5) are abutted against the medium pipelines (6) in a bending state;
the medium pipeline (6) is provided with a first arc-shaped outer surface, a passive layer of the bimetallic strip (5) forms a second arc-shaped outer surface close to one side of the medium pipeline (6) under the bending state of the bimetallic strip (5), and the second arc-shaped outer surface is matched with the first arc-shaped outer surface.
2. The thermal head having a heat dissipating function according to claim 1, wherein the bimetal (5) extends into the heat dissipating plate (3).
3. The thermal head having a heat dissipating function according to claim 1, wherein the active layer of the bimetal (5) extends into the heat dissipating plate (3), and the passive layer of the bimetal (5) is spaced from the heat dissipating plate (3) by a predetermined distance.
4. A thermal head having a heat dissipating function according to any one of claims 2 to 3, wherein the heat dissipating plate (3) is provided with a heat conducting plate connected to the plurality of bimetal plates (5).
5. The thermal head with a heat dissipating function according to claim 1, wherein the plurality of medium conduits (6) are made of a copper material.
6. The thermal print head with a heat dissipation function according to claim 1, wherein a plurality of the media ducts (6) are connected in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811504423.1A CN109291655B (en) | 2018-12-10 | 2018-12-10 | Thermal printing head with heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811504423.1A CN109291655B (en) | 2018-12-10 | 2018-12-10 | Thermal printing head with heat dissipation function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109291655A CN109291655A (en) | 2019-02-01 |
| CN109291655B true CN109291655B (en) | 2020-05-12 |
Family
ID=65142728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811504423.1A Active CN109291655B (en) | 2018-12-10 | 2018-12-10 | Thermal printing head with heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109291655B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112248657B (en) * | 2020-10-22 | 2021-07-02 | 湖南凯通电子有限公司 | Cooling device and cooling method for thermal printing head |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH048552A (en) * | 1990-04-27 | 1992-01-13 | Mitsubishi Electric Corp | Heat sink device of thermal head |
| JP2003237123A (en) * | 2002-02-15 | 2003-08-27 | Fuji Photo Film Co Ltd | Cooling device for thermal head |
| JP2006044126A (en) * | 2004-08-06 | 2006-02-16 | Sony Corp | Thermal head and thermal-head printer |
| JP2006334847A (en) * | 2005-05-31 | 2006-12-14 | Fujifilm Holdings Corp | Method for cooling thermal head and heatsink |
| CN201300585Y (en) * | 2008-12-05 | 2009-09-02 | 山东华菱电子有限公司 | Heat-sensitive printing head |
| CN202428839U (en) * | 2012-01-10 | 2012-09-12 | 杭州科威数码技术有限公司 | Thermal print head with cooling liquid channel |
| CN103871975B (en) * | 2014-02-26 | 2017-02-01 | 江西创成电子有限公司 | Chip packaging and radiating method |
| CN104159436A (en) * | 2014-08-15 | 2014-11-19 | 韩百萍 | Radiator with self-cleaning radiating fins |
| JP6409846B2 (en) * | 2016-10-18 | 2018-10-24 | トヨタ自動車株式会社 | Semiconductor device |
-
2018
- 2018-12-10 CN CN201811504423.1A patent/CN109291655B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN109291655A (en) | 2019-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW519866B (en) | Heat sink with fins | |
| JP6371990B2 (en) | Thermoelectric conversion module and manufacturing method thereof, and thermoelectric power generation system and manufacturing method thereof | |
| US8391011B2 (en) | Cooling device | |
| JP5858594B2 (en) | Thermal management device and method of manufacturing thermal management device | |
| CN105027687A (en) | Method for manufacturing a non-planar printed circuit board assembly | |
| US6260610B1 (en) | Convoluted fin heat sinks with base topography for thermal enhancement | |
| JP6862896B2 (en) | Semiconductor devices and methods for manufacturing semiconductor devices | |
| US7487825B2 (en) | Heat dissipation device | |
| CN105611804B (en) | Heat conductive pad, radiator and electronic product | |
| KR20060102469A (en) | Heat receiving sheet, electronic apparatus, and fabrication method for heat receiving sheet | |
| CN109291655B (en) | Thermal printing head with heat dissipation function | |
| CN109291656B (en) | Thermal printing head with good heat dissipation | |
| JP3128948U (en) | Electric circuit board structure with heat dissipation layer | |
| JP2017123379A (en) | Semiconductor device | |
| CN1964614B (en) | Circuit arrangement, especially frequency converter | |
| JPH09298259A (en) | Heat sink and manufacture thereof | |
| WO2018070192A1 (en) | Electronic device and production method therefor | |
| JP3564560B2 (en) | Flexible thin plate heat pipe | |
| CN212115767U (en) | Circuit board assembly and electronic device | |
| KR102524167B1 (en) | Electronic chip device with improved thermal resistance and associated manufacturing process | |
| CN209659834U (en) | Heat removal devices and electronic device | |
| JP3144915U (en) | Radiator with electronic circuit module | |
| JPS58188188A (en) | Printed circuit board heat sink structure | |
| JP3077725U (en) | Fixing structure of high-density heat radiation fins | |
| JP5367287B2 (en) | Heat transfer components and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |