CN109291471A - A kind of thickness product frp layer plywood cutting polishing processing method - Google Patents

A kind of thickness product frp layer plywood cutting polishing processing method Download PDF

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Publication number
CN109291471A
CN109291471A CN201811088252.9A CN201811088252A CN109291471A CN 109291471 A CN109291471 A CN 109291471A CN 201811088252 A CN201811088252 A CN 201811088252A CN 109291471 A CN109291471 A CN 109291471A
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CN
China
Prior art keywords
frp layer
shallow slot
layer plywood
processing method
component
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Granted
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CN201811088252.9A
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Chinese (zh)
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CN109291471B (en
Inventor
梁自禄
喻雄
曾竟成
彭超义
路忠林
刘海洋
王运河
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National University of Defense Technology
Zhuzhou Times New Material Technology Co Ltd
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Zhuzhou Times New Material Technology Co Ltd
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Priority to CN201811088252.9A priority Critical patent/CN109291471B/en
Publication of CN109291471A publication Critical patent/CN109291471A/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28Shaping operations therefor
    • B29C70/54Component parts, details or accessories; Auxiliary operations, e.g. feeding or storage of prepregs or SMC after impregnation or during ageing
    • B29C70/545Perforating, cutting or machining during or after moulding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B23/00Portable grinding machines, e.g. hand-guided; Accessories therefor
    • B24B23/02Portable grinding machines, e.g. hand-guided; Accessories therefor with rotating grinding tools; Accessories therefor
    • B24B23/028Angle tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/06Grooving involving removal of material from the surface of the work

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Veneer Processing And Manufacture Of Plywood (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

The invention discloses a kind of thick product frp layer plywood cutting polishing processing methods, comprising the following steps: S1: scratches vacuum bag film with tool beyond the component that is higher by of housing mould upper flange platform in thick product frp layer plywood;S2: marking is carried out being higher by component face to be processed, determines at least two mark lines;S3: carrying out vertical grooving along mark line with cutting machine, forms shallow slot, the length of shallow slot with need processing length consistent;S4: polishing to shallow slot region surface with angle grinder, until when shallow slot i.e. will be invisible;S5: keeping step S3 and S4 circulation to carry out, until molding bonding plane needed for being formed after being higher by component polishing.The present invention has the advantages that easy to operate, processing quality is high, can discharge stress and deformation in advance, can prevent micro-crack and larger residual stress.

Description

A kind of thickness product frp layer plywood cutting polishing processing method
Technical field
The invention mainly relates to the processing technology of thick product frp layer plywood more particularly to a kind of thick product frp layers Plywood cutting polishing processing method.
Background technique
Because of the variation of external environment in glass reinforced plastic curing process, the heat release of itself, mould in resin solidification reaction process Tool, auxiliary material heating conduction difference lead in the practical solidification process of laminate that there are temperature gradients;Non-uniform temperature field makes respectively Resin and non-concurrent solidification in laying, so as to cause frp layer plywood, there are residual stress and residual deformation.For the ease of The flatness that demoulding and laminate are glued, the frp layer plywood end after solidification can be higher by housing mould a part, therefore need Cutting polishing is carried out to the frp layer plywood end for being higher by housing mould a part, to guarantee flatness, but after solidification Frp layer plywood generates violent plastic deformation in cutting bruting process, and there are biggish ess-strain and localized hyperthermias. Existing conventional method is to be also easy to produce micro-crack and larger residual after solidification using polishing after the mechanically direct transverse cuts by the raised area Residue stress, stress and deformation cannot discharge when routine is cut, and easily make the lower frp layer plywood of Interlaminar shear strengths itself When cutting polishing.
Summary of the invention
The technical problem to be solved by the present invention is to overcome the deficiencies in the prior art, provide a kind of easy to operate, processing quality Height can discharge stress and deformation in advance, can prevent that the thick product frp layer plywood of micro-crack and larger residual stress is cut Cut polishing processing method.
In order to solve the above technical problems, the invention adopts the following technical scheme:
A kind of thickness product frp layer plywood cutting polishing processing method, comprising the following steps:
S1: vacuum bag film is scratched with tool beyond the component that is higher by of housing mould upper flange platform in thick product frp layer plywood;
S2: marking is carried out being higher by component face to be processed, determines at least two mark lines;
S3: carrying out vertical grooving along mark line with cutting machine, forms shallow slot, the length of shallow slot with need processing length consistent;
S4: polishing to shallow slot region surface with angle grinder, until when shallow slot i.e. will be invisible;
S5: keeping step S3 and S4 circulation to carry out, until molding bonding plane needed for being formed after being higher by component polishing.
As a further improvement of the above technical scheme:
In step s3, cutting machine deflectable angle, θ in vertical plane, < ± 45 ° θ.
In step s3, cutting machine is in the deflectable angle beta of horizontal plane, < ± 45 ° β.
In step s3, the depth of shallow slot is set as h, 1mm < h < 5mm.
In step s3, the width of shallow slot is set as b, 2mm < b < 4mm.
In step s 5, molding bonding plane height molds bonding plane height not above flange platform die joint height 2mm Flange platform die joint height 5mm can be lower than.
In step S1 into step S5, it is ensured that be higher by component face temperature to be processed lower than 40 DEG C, surface hardness Barcol is higher than 50HBa。
Compared with the prior art, the advantages of the present invention are as follows:
Thick product frp layer plywood cutting polishing processing method of the invention, S1: exceeds shell in thick product frp layer plywood The component that is higher by of mould upper flange platform scratches vacuum bag film with tool;S2: carrying out marking being higher by component face to be processed, Determine at least two mark lines;S3: vertical grooving is carried out along mark line with cutting machine, forms shallow slot, the length and needs of shallow slot Processing length is consistent;S4: polishing to shallow slot region surface with angle grinder, until when shallow slot i.e. will be invisible;S5: it protects It holds step S3 and S4 circulation to carry out, until molding bonding plane needed for being formed after being higher by component polishing.Using this method, make whole height Component forms Slice by slice cutting polishing out, i.e., first carries out vertical grooving in face to be processed, a plurality of shallow slot is formed, to discharge stress in advance And face to be processed is separated into a plurality of strip shape body by deformation, each shallow slot, is then carrying out polishing strip to shallow slot region surface Body, it is reciprocal with this, until molding bonding plane needed for being formed after being higher by component polishing.More traditional will be higher by portion using mechanically direct For the mode polished after part transverse cuts, using Slice by slice cutting polishing mode, stress and deformation can be discharged in advance, can be prevented Thick product frp layer plywood generates micro-crack and larger residual stress when cutting polishing, moreover it is possible to avoid disposably cutting institute's band The localized hyperthermia's problem come, it is easy to operate, improve the Forming Quality of thick product frp layer plywood.
Detailed description of the invention
Fig. 1 is the schematic perspective view of thick product frp layer plywood in the present invention.
Fig. 2 is the schematic view of the front view that thick product frp layer plywood is higher by component in the present invention.
Fig. 3 is the overlooking structure diagram that thick product frp layer plywood is higher by component in the present invention.
Fig. 4 is the flow chart of thick product frp layer plywood cutting polishing processing method of the invention.
Each label indicates in figure:
1, frp layer plywood;2, housing mould;3, flange platform;4, it is higher by component;5, shallow slot.
Specific embodiment
The present invention is described in further details below with reference to Figure of description and specific embodiment.
Fig. 1 to Fig. 4 shows a kind of embodiment of thick product frp layer plywood cutting polishing processing method of the invention, tool Body is to carry out cutting polishing to leaf heel part after wind electricity blade shell forms, comprising the following steps:
S1: vacuum bag is scratched with tool beyond the component 4 that is higher by of 2 upper flange platform 3 of housing mould in thick product frp layer plywood 1 Film;
S2: marking is carried out being higher by the face to be processed of component 4, determines at least two mark lines;
S3: carrying out vertical grooving along mark line with cutting machine, forms shallow slot 5, the length of shallow slot 5 with need processing length consistent;
S4: polishing to 5 region surface of shallow slot with angle grinder, until when shallow slot 5 i.e. will be invisible;
S5: keeping step S3 and S4 circulation to carry out, until molding bonding plane needed for being formed after being higher by the polishing of component 4.
Using this method, so that the whole component 4 that is higher by is formed Slice by slice cutting polishing, i.e., first vertically cut in face to be processed Slot forms a plurality of shallow slot 5, and to discharge stress and deformation in advance, face to be processed is separated into a plurality of strip shape body by each shallow slot 5, then Polishing strip shape body is being carried out to 5 region surface of shallow slot, it is reciprocal with this, required molding is formed until being higher by after component 4 is polished Bonding plane.It is more traditional using it is mechanically direct will be higher by the mode polished after 4 transverse cuts of component for, using the Slice by slice cutting Polishing mode can discharge stress and deformation in advance, can prevent thick product frp layer plywood 1 from generating micro-crack when cutting polishing With larger residual stress, moreover it is possible to it avoids disposably cutting brought localized hyperthermia problem, it is easy to operate, improve thick product The Forming Quality of frp layer plywood 1.
In the present embodiment, in step s3, cutting machine deflectable angle, θ in vertical plane, < ± 45 ° θ.The present embodiment In, θ=20 °, cutting machine is at 20 ° of vertical plane intrinsic deflection, so that cutter will not just correspond to the fibre of thick product frp layer plywood 1 Layer direction is tieed up, the layer structure for destroying thick product frp layer plywood 1 itself can be prevented, it is easy to operate, ingenious.
In the present embodiment, in step s3, cutting machine is in the deflectable angle beta of horizontal plane, < ± 45 ° β.In the present embodiment, β =8 °, cutting machine forms flume structure in 8 ° of horizontal deflecting facet, further such that cutter will not just correspond to thick product frp layer The fibrous layer direction of plywood 1 can prevent the layer structure for destroying thick product frp layer plywood 1 itself, easy to operate, ingenious.
In the present embodiment, in step s3, the depth of shallow slot 5 is set as h, 1mm < h < 5mm.In the present embodiment, h=3 Mm discharges stress and deformation to guarantee quickly to form shallow slot 5 in advance.
In the present embodiment, in step s3, the width of shallow slot 5 is set as b, 2mm < b < 4mm.In the present embodiment, b=3 Mm discharges stress and deformation to guarantee quickly to form shallow slot 5 in advance.
In the present embodiment, in step s 5, molding bonding plane height is not above 3 die joint height 2mm of flange platform, molding Bonding plane height cannot be below 3 die joint height 5mm of flange platform.In this way, can guarantee that molding bonding plane meets molding and requires.
In the present embodiment, in step S1 into step S5, it is ensured that it is higher by the face temperature to be processed of component 4 and is lower than 40 DEG C, surface Hardness Barcol is higher than 50HBa.It will cause localized hyperthermia's problem in this way, making whole process not, improve molding matter Amount.
Although the present invention is disclosed as above with preferred embodiment, however, it is not intended to limit the invention.It is any to be familiar with ability The technical staff in domain, without deviating from the scope of the technical scheme of the present invention, all using the technology contents pair of the disclosure above Technical solution of the present invention makes many possible changes and modifications or equivalent example modified to equivalent change.Therefore, all Without departing from the content of technical solution of the present invention, according to the present invention technical spirit any simple modification made to the above embodiment, Equivalent variations and modification, all shall fall within the protection scope of the technical scheme of the invention.

Claims (7)

1. a kind of thickness product frp layer plywood cutting polishing processing method, which comprises the following steps:
S1: it is drawn in thick product frp layer plywood (1) beyond component (4) tool that is higher by of housing mould (2) upper flange platform (3) Open vacuum bag film;
S2: marking is carried out being higher by component (4) face to be processed, determines at least two mark lines;
S3: carrying out vertical grooving along mark line with cutting machine, formed shallow slot (5), the length of shallow slot (5) and needs processing length one It causes;
S4: polishing to shallow slot (5) region surface with angle grinder, until when shallow slot (5) i.e. will be invisible;
S5: keeping step S3 and S4 circulation to carry out, until molding bonding plane needed for being formed after being higher by component (4) polishing.
2. thickness product frp layer plywood cutting polishing processing method according to claim 1, it is characterised in that: in step In S3, cutting machine deflectable angle, θ in vertical plane, < ± 45 ° θ.
3. thickness product frp layer plywood cutting polishing processing method according to claim 2, it is characterised in that: in step In S3, cutting machine is in the deflectable angle beta of horizontal plane, < ± 45 ° β.
4. thickness product frp layer plywood cutting polishing processing method according to any one of claim 1 to 3, feature Be: in step s3, the depth of shallow slot (5) is set as h, 1mm < h < 5mm.
5. thickness product frp layer plywood cutting polishing processing method according to any one of claim 1 to 3, feature Be: in step s3, the width of shallow slot (5) is set as b, 2mm < b < 4mm.
6. thickness product frp layer plywood cutting polishing processing method according to any one of claim 1 to 3, feature Be: in step s 5, molding bonding plane height molds bonding plane height not above flange platform (3) die joint height 2mm Flange platform (3) die joint height 5mm can be lower than.
7. thickness product frp layer plywood cutting polishing processing method according to any one of claim 1 to 3, feature It is: in step S1 into step S5, it is ensured that be higher by component (4) face temperature to be processed lower than 40 DEG C, surface hardness Barcol is higher than 50HBa。
CN201811088252.9A 2018-09-18 2018-09-18 Cutting and polishing processing method for thick workpiece glass fiber reinforced plastic laminated plate Active CN109291471B (en)

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Application Number Priority Date Filing Date Title
CN201811088252.9A CN109291471B (en) 2018-09-18 2018-09-18 Cutting and polishing processing method for thick workpiece glass fiber reinforced plastic laminated plate

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Application Number Priority Date Filing Date Title
CN201811088252.9A CN109291471B (en) 2018-09-18 2018-09-18 Cutting and polishing processing method for thick workpiece glass fiber reinforced plastic laminated plate

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CN109291471B CN109291471B (en) 2021-05-07

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JPH08128197A (en) * 1994-10-27 1996-05-21 Eiji Eguchi Elimination of excess water and bubbles and concrete sheathing board having function to increase bond stress of finish material
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CN104552904A (en) * 2013-10-11 2015-04-29 波音公司 Method and apparatus for forming bend in composite panel
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JPH08128197A (en) * 1994-10-27 1996-05-21 Eiji Eguchi Elimination of excess water and bubbles and concrete sheathing board having function to increase bond stress of finish material
JPH097149A (en) * 1995-06-22 1997-01-10 Fuji Electric Co Ltd Method for working magnetic head slider
CN1725459A (en) * 2004-07-21 2006-01-25 宏齐科技股份有限公司 Semiconductor substrate structure and process method thereof
CN101175603A (en) * 2005-05-18 2008-05-07 东洋橡胶工业株式会社 Polishing pad, process for producing the same, and process for producing semiconductor device using said polishing pad
CN101043013A (en) * 2006-03-24 2007-09-26 统宝光电股份有限公司 Substrates carrier for bearing substrates and manufacturing method thereof
CN101407011A (en) * 2008-11-06 2009-04-15 海特克液压有限公司 Technique for processing rotor slot of vane pump
CN201684968U (en) * 2010-06-01 2010-12-29 上海艾郎风电科技发展有限公司 Blade root milling machine of MW level wind driven generator
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CN104552904A (en) * 2013-10-11 2015-04-29 波音公司 Method and apparatus for forming bend in composite panel
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Effective date of registration: 20240109

Address after: 412007 Haitian Road, Tianyuan District, Zhuzhou, Hunan Province, No. 18

Patentee after: ZHUZHOU TIMES NEW MATERIAL TECHNOLOGY Co.,Ltd.

Patentee after: National University of Defense Technology

Address before: 412007 Haitian Road, Tianyuan District, Zhuzhou, Hunan Province, No. 18

Patentee before: ZHUZHOU TIMES NEW MATERIAL TECHNOLOGY Co.,Ltd.