CN109291300A - Compound foamed polystyrene bead and its formed body and preparation method - Google Patents
Compound foamed polystyrene bead and its formed body and preparation method Download PDFInfo
- Publication number
- CN109291300A CN109291300A CN201710607265.1A CN201710607265A CN109291300A CN 109291300 A CN109291300 A CN 109291300A CN 201710607265 A CN201710607265 A CN 201710607265A CN 109291300 A CN109291300 A CN 109291300A
- Authority
- CN
- China
- Prior art keywords
- foamed polystyrene
- compound
- bead
- polystyrene bead
- formed body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B9/00—Making granules
- B29B9/12—Making granules characterised by structure or composition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
- B29C44/02—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles for articles of definite length, i.e. discrete articles
- B29C44/04—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles for articles of definite length, i.e. discrete articles consisting of at least two parts of chemically or physically different materials, e.g. having different densities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
- B29C44/34—Auxiliary operations
- B29C44/3415—Heating or cooling
- B29C44/3426—Heating by introducing steam in the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
- B29C44/34—Auxiliary operations
- B29C44/60—Measuring, controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/22—After-treatment of expandable particles; Forming foamed products
- C08J9/224—Surface treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/22—After-treatment of expandable particles; Forming foamed products
- C08J9/228—Forming foamed products
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/06—Polystyrene
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Abstract
The invention belongs to the field of polymers, a kind of compound foamed polystyrene bead and its formed body and preparation method are specifically provided.The compound foamed polystyrene bead is by coating foamed polystyrene bead with electrocondution slurry, and then drying is made；Electrocondution slurry contains conductive filler, bonding agent, coupling agent and dispersing agent, relative to the foamed polystyrene bead of 100 parts by weight, conductive filler is 1-50 parts by weight, and bonding agent is 8-50 parts by weight, coupling agent is 0.1-5 parts by weight, and dispersing agent is 0.1-5 parts by weight.In the preparation method of bead of the invention, conductive filler is completely covered in each foamed polystyrene surface of beads, when secondary frothing forming, the conductive material extruding for being coated on surface of beads is fixed on inside formed body, and the electric conductivity or antistatic property of the formed body are uniform.In addition, the preparation method of compound foamed polystyrene bead and its formed body of the invention is simple to operation.
Description
Technical field
The invention belongs to the field of polymers, and in particular, to a kind of compound foamed polystyrene bead and its preparation side
Method, and the formed body and preparation method thereof using the compound foamed polystyrene bead.
Background technique
Currently, compound antistatic or conducting polymer foamed material receives significant attention, it is not only conductive can
Adjust that (showing antistatic property or electric conductivity according to resistivity size), chemical stability be good, the conventional conductives macromolecule such as at low cost
The advantages of composite material, and quality is lighter, specific strength is high, absorbable and shock absorbing load, is ideal electrostatic protection
(ESD) and electromagnetic shielding (EMI) material.This material is led in aerospace, precision instrument, wave absorber, Automobile Transportation etc.
The application in domain can not only save material and energy, reduce cost, and can make to operate more flexible and convenient.
Compound antistatic or conducting polymer foamed material preparation method is more, the main side used in recent research
Method has: 1) material modification method: in advance by the raw material of conductive filler (such as carbon black) incorporation foamed material, then pressing foam process
Condition is foamed and corresponding antistatic or conductive foaming material is made, wherein the conditions such as control foaming agents content are adjustable
Expansion ratio；2) ink printing method: adding conductive filler in foaminess ink, is uniformly mixed and makes electric conductivity foaming oil
Ink, then this ink is thinly printed to or is coated in foamed material surface, it is heated to can be made into antistatic or conductive foam
Plastics；3) surface bonding method: powdered conductive particle is placed in Foam Plastic Surface and coats specific adhesives, passes through pressure
It grinds in the hole for making conducting particles enter foamed plastics and antistatic or conductive foaming material is made；4) it glue infusion process: will lead
Electric filler, which is dispersed in binder solution, is made conductive gelatin, then the high foamed material of percent opening is impregnated in conductive gelatin,
Then drying is squeezed；5) Intrinsical polymer monomer oxidative polymerization method: is distributed to foam base plate by vapour deposition process (VDP)
In after, carry out oxidative polymerization method.
However, above-described preparation method has clearly disadvantageous place.Material modification method in foaming structure due to steeping
The presence in hole hinders the building of material internal conductive network, has seriously affected the antistatic property or electric conductivity of system, has been simultaneously
Improve electric conductivity and excessive conductive filler, which is added, can make matrix resin rheological property and melt strength be deteriorated, expansion ratio is big
Big reduce can not even foam；Ink printing method is expensive and production efficiency is low；Surface bonding method is not easy to make conductive material
Matter is evenly distributed, and causes electrical property inconsistent, and will be greatly reduced material antistatic property or conduction in surface conductive layer breakage
Property；Glue infusion process is adapted only to the high polyurethane of percent opening (PUR) foamed material, needs to have using to human body and environment in preparation
The harmful isocyanates (also having residual in the product) of poison, and still remain conductive filler and fall off from aperture and influence material
The possibility of antistatic or conductivity；Oxidative polymerization method complex process, product performance index, which is difficult to control, to be repeated.
Method disclosed in CN102731816A is exactly foaming agent to be impregnated into styrene resin particles and obtain can
Foaminess resin particle, then surfactant is added, to obtain the expandable particle with good antistatic property, and with it
Pre-expanded beads are obtained for raw material prefoam, expanded moldings are obtained by pre-expanded beads foaming.From the patent document
Embodiment can be seen that the increase with expansion ratio, the surface conductivity sharp fall of foamed material, this is because material
Conductive network brought by the density of inner cell, size and structure change it is discontinuous and caused by；This production technology simultaneously
Very high to conductive or between antistatic ingredient and resin compatibility requirements, the surfactant that compatibility can only be used good carries out
It is antistatic modified, and electric conductivity is high but is then difficult to add with the inorganic carbon material of resin compatible difference, can not be prepared into
To conducting polyaniline ethylene foamed material.The antistatic modified polystyrol foam material of application type then just has exploitation to answer in last century end
With.CRL company once developed and and a kind of resistance of Cemoss company Joint Production and opaque antistatic coating as resisting
The basis of the novel protected packaging of electrostatic, this new packing can prevent soft copy from being destroyed by electrostatic charge.But it is antistatic modified to coat
Always it is difficult to be evenly distributed there is conductive materials, electrical property is inconsistent, and will be greatly reduced material in surface conductive layer breakage
Expect the defect of antistatic or conductivity.Attempt to adhere to conductive layer, such as US7 on foamed material surface there are many more publication,
7078,092B2 disclose a kind of radiation masking pad and its manufacturing method, and the radiation masking pad is containing with the opening to communicate with each other
The polyurethanes plastic foam material of the network of hole has one layer of metal layer to provide electric conductivity thereon.CN101242733A is
Using foam polyolefin material as matrix, it is evaporated on its surface, the metalizeds such as sputter and electroless plating.Metallize table
Although surface treatment avoids direct adhesion metal layer and is easy to the phenomenon that breakage is fallen, be also easier to cutting processing, but the technique
Complicated and production efficiency is low.
Therefore, it is still necessary to providing a kind of new antistatic or conducting polymer foamed material and preparation method thereof, next gram
Take production technology existing for above method complicated, the problems such as conductive component and matrix poor compatibility, electric conductivity are unevenly distributed.
Summary of the invention
In order to solve above-mentioned technical problem of the existing technology, the present invention provides a kind of compound foamed polystyrenes
Bead and preparation method thereof, and the formed body and preparation method thereof using the compound foamed polystyrene bead.
According to the first aspect of the invention, the present invention provides a kind of compound foamed polystyrene beads, by lead
Plasma-based material coats foamed polystyrene bead, then dry to be made；Wherein, the electrocondution slurry contain conductive filler, bonding agent,
Coupling agent and dispersing agent, and the foamed polystyrene bead relative to 100 parts by weight, the conductive filler are 1-50 weight
Part, the bonding agent is 8-50 parts by weight, and the coupling agent is 0.1-5 parts by weight, and the dispersing agent is 0.1-5 parts by weight.
According to the second aspect of the invention, the present invention provides the preparation sides of the compound foamed polystyrene bead
Method, the preparation method include:
1) first the conductive filler and the coupling agent are uniformly mixed, obtain mixture, then by the mixture, described
Dispersing agent is added sequentially in the bonding agent, is uniformly dispersed, and the electrocondution slurry is made；
2) electrocondution slurry is coated on the foamed polystyrene bead, is then dried, be made described compound
Foamed polystyrene bead.
According to the third aspect of the invention we, the present invention provides a kind of compound foamed polystyrene formed body, this is compound
Type foamed polystyrene formed body is by the way that the compound foamed polystyrene bead to be made through secondary frothing forming.
According to the fourth aspect of the invention, the present invention provides the preparation sides of the compound foamed polystyrene formed body
Method, comprising: in a mold by the compound foamed polystyrene bead filling, logical steam heating is hot-melted bead each other,
The compound foamed polystyrene formed body is made；Wherein, the pressure of steam is 0.05-0.5MPa, and the time of logical steam is
10s to 2min.
The present invention is coated to electrocondution slurry on non-modified foamed polystyrene bead, to obtain compound
Foamed polystyrene bead, then formed body is prepared by the expanded bead secondary frothing forming.The conduction of the formed body different location
Property or antistatic property are uniform；Compared with the compound polystyrol foam material of traditional coating bonding method preparation, even if due to
External force scrapes or natural erosion etc. causes the conductive layer on surface damaged, formed body of the invention still have it is outstanding antistatic and
Electric conductivity.This is because completely being covered in the preparation method of bead of the invention in each foamed polystyrene surface of beads
It is stamped conductive material, makes each bead that can form independent conductive unit；When by the bead secondary frothing forming, the table of bead
Face melts and expands, and the conductive material for being coated on surface of beads can be squeezed and is fixed on inside formed body, and therefore shape
At continuous honeycomb conductive network；Simultaneously as conductive filler does not enter into inside expanded bead, inside each conductive unit
It is all uniform complete high rate of closed hole foam structure.In addition, compound foamed polystyrene bead of the invention and its formed body
Preparation method it is simple, producer's existing foamed polystyrene molding can be used directly in easy to operate, application suitable for scale production
Body apparatus does not need additional investment for trnasforming urban land.
Detailed description of the invention
Fig. 1 is the section SEM figure of bead in the compound foamed polystyrene formed body of the preparation of embodiment 2.
Fig. 2 is the photo of compound one section of foamed polystyrene formed body prepared by embodiment 2.
Fig. 3 is the photo of another section of compound foamed polystyrene formed body prepared by embodiment 2.
Specific embodiment
Specific embodiments of the present invention will be described in detail below.It should be understood that described herein specific
Embodiment is merely to illustrate and explain the present invention, and is not intended to restrict the invention.
According to the first aspect of the invention, the present invention provides a kind of compound foamed polystyrene beads, by lead
Plasma-based material coats foamed polystyrene bead, then dry to be made；Wherein, the electrocondution slurry contain conductive filler, bonding agent,
Coupling agent and dispersing agent, and the foamed polystyrene bead relative to 100 parts by weight, the conductive filler are 1-50 weight
Part, the bonding agent is 8-50 parts by weight, and the coupling agent is 0.1-5 parts by weight, and the dispersing agent is 0.1-5 parts by weight.
Preferably, relative to the foamed polystyrene bead of 100 parts by weight, the conductive filler is 5-40 weight
Part, the bonding agent is 8-50 parts by weight, and the coupling agent is 0.1-2 parts by weight, and the dispersing agent is 0.1-2 parts by weight.
Preferably, the dosage of the bonding agent is not less than the dosage of the conductive filler.
In the present invention, the foamed polystyrene bead refers to any non-modified foamed polystyrene bead, can
Commercially available expandable polystyrene particle is carried out foaming using pre-foaming machine to be made, specific preparation method is art technology
Known in personnel, therefore not to repeat here；It can also be commercially available foamed polystyrene bead, as long as post forming work in mould can be used
Skill manufactures expanded moldings.The usual foamed polystyrene bead apparent density is 10-700g/L.Hereinafter, institute
Stating foamed polystyrene bead and being also referred to as is basic foamed polystyrene bead.Electrocondution slurry coats the foamed polystyrene pearl
Grain, refers to that the surface of each bead is coated by electrocondution slurry, after the drying, the conductive material of formation is also covered on the table of bead
On face.
In the present invention, the conductive filler can be usual in the composite polymer foamed material of antistatic or conductivity
The carbon material used, such as selected from least one of carbon black, graphite, carbon nanotube and carbon fiber.The carbon black can be selected from second
Alkynes carbon black, superconduction carbon black and spy lead at least one of carbon black.The graphite can be selected from natural graphite, expansible graphite, expansion
At least one of graphite and graphene.The carbon nanotube can be selected from long time without surface modification or surface-modified single wall
Carbon nanotube and/or multi-walled carbon nanotube, the modified method in surface is known to those skilled in the art, therefore not to repeat here.
In the present invention, the bonding agent can be selected from epoxy resin, phenolic resin, Lauxite, organic siliconresin, acrylic acid
At least one of resin and polyvinyl alcohol resin.
In the present invention, the coupling agent can be selected from titanate coupling agent and/or silane coupling agent.
Preferably, the titanate coupling agent is selected from isopropyl three (dioctylphyrophosphoric acid acyloxy) titanate esters, three different hard
Resin acid isopropyl titanate, two (dioctyl pyrophosphoryl oxygroup) oxo ester acid titaniums and two (dioctyl phosphite base) tetraisopropyl titanates
At least one of.
Preferably, the silane coupling agent is selected from gamma-aminopropyl-triethoxy-silane (KH550), γ-(2,3- epoxies third
Oxygroup) propyl trimethoxy silicane (KH560), γ-(methacryloxypropyl) propyl trimethoxy silicane (KH570), γ-ammonia second
In base aminopropyl trimethoxysilane (KH792) and N- β-(aminoethyl)-γ-aminopropyltriethoxy dimethoxysilane (DL602)
At least one.
In the present invention, the dispersing agent can be selected from lauryl sodium sulfate, methyl anyl alcohol, polyacrylamide, fatty acid polyglycol
At least one of glycol ester, glycerin monostearate and glyceryl tristearate.
Dosage according to component in the electrocondution slurry is different, the compound foamed polystyrene bead can be resist it is quiet
Electricity or conductive bead.
In addition, also containing usually used in polystyrol foam material in the compound foamed polystyrene bead
Other auxiliary agents, and other auxiliary agents will not be to appearance, the expansion ratio, power of the compound foamed polystyrene bead
Performance, processing performance and electric conductivity etc. is learned to have an adverse effect.Other auxiliary agents include but is not limited to: antioxidant, slipping agent
At least one of with antitack agent etc..In addition, the dosage of other auxiliary agents all can be this field conventional selection, herein not
It repeats.
According to the second aspect of the invention, the present invention provides the preparation sides of the compound foamed polystyrene bead
Method, comprising:
1) first the conductive filler and the coupling agent are uniformly mixed, obtain mixture, then by the mixture, described
Dispersing agent is added sequentially in the bonding agent, is uniformly dispersed, and the electrocondution slurry is made；
2) electrocondution slurry is coated on the foamed polystyrene bead, is then dried, be made described compound
Foamed polystyrene bead.
In step 2), the cladding can be realized by conventional means, for example, make the foamed polystyrene bead with it is described
Then conductive material contacts are dispersed with stirring uniformly, it is ensured that the surface of each bead is coated with the electrocondution slurry.The drying
Can 60-70 DEG C at a temperature of carry out, drying time can be controlled in 0.5-3 hours.
It, can be by other auxiliary agents when also containing other auxiliary agents in the compound foamed polystyrene bead
It is uniformly mixed with components such as the conductive filler, bonding agents, forms the electrocondution slurry.
According to the third aspect of the invention we, the present invention provides a kind of compound foamed polystyrene formed body, this is compound
Type foamed polystyrene formed body is by the way that the compound foamed polystyrene bead to be made through secondary frothing forming.
According to the present invention, the surface resistivity of the compound foamed polystyrene formed body can be 10-109Ω, it is excellent
It is selected as 102-107Ω.According to the size of the surface resistivity, the compound foamed polystyrene formed body has antistatic
Property or electric conductivity.In addition, what the endpoint value in the range for the surface resistivity being previously mentioned represented is the surface resistivity
The order of magnitude, for example, 1 × 107Ω~9.9 × 107Ω is represented by 107Ω。
Under preferable case, the apparent density of the compound foamed polystyrene formed body is 30-500g/L.
Can be used secondary forming process in general film the compound foamed polystyrene bead is processed into it is described multiple
Mould assembly foamed polystyrene formed body (such as being processed into plate), the present invention do not need to significantly alter manufacturing technique method,
Condition and equipment adapt to the existing general cost-effectiveness requirement for preparing post forming foaming body in mould.
For this purpose, according to the fourth aspect of the invention, the present invention provides the compound foamed polystyrene formed bodys
Preparation method, comprising: by the preparation method of the compound foamed polystyrene formed body, comprising: by the compound polyphenyl
Ethylene expanded bead is filled in a mold, and logical steam heating is hot-melted bead each other, and the compound polystyrene hair is made
Steep formed body；Wherein, the pressure of steam is 0.05-0.5MPa, and the time for leading to steam is 10s to 2min.
It is described further below with reference to embodiment, but the scope of the invention is not limited to these embodiments.
In the following examples and comparative examples, the apparent density of foamed polystyrene bead is respectively 30g/L, 60g/L, 90g/
Commercially available expandable polystyrene particle is foamed to obtain by L by using pre-foaming machine respectively.
Test equipment and method:
1, microscopic appearance is tested: disconnected, section metal spraying, using scanning electron microscopy that the expanded bead of formed body is quenched through liquid nitrogen
Mirror (SEM, model XL-30 are purchased from FEI Co. of the U.S.) investigates the foam structure inside expanded bead.
2, it apparent density: uses density tester (CPA225D, density attachment YDK01, German Satorius company), presses
According to GB/T6343-2009 standard testing, obtained using drainage.
3, surface resistivity: measuring according to method specified in GB/T 1410-2006, and each sample is arbitrarily taking three
Position measure (being denoted as surface resistivity A, surface resistivity B, surface resistivity C respectively), investigate sample conductive capability whether
Uniformly.
Embodiment 1
The present embodiment is for illustrating compound foamed polystyrene bead and its formed body of the invention and respective preparation
Method.
Conductive filler is acetylene carbon black；Bonding agent is phenolic resin；Coupling agent is Silane coupling agent KH550；Dispersing agent is
Glycerin monostearate.
(1) preparation of compound anti-static polyphenylacetylene expanded bead
Weigh acetylene carbon black 0.04kg, phenolic resin 0.05kg, Silane coupling agent KH550 1g, glyceryl monostearate
1g.The conductive filler and coupling agent are mixed 5 minutes, then gained mixture and dispersing agent are added sequentially in bonding agent
It is mixed 5 minutes, obtains surface of beads covering electrocondution slurry.
Weigh the basis 60g/L foamed polystyrene bead 0.6kg, is slowly added to electrocondution slurry obtained under stiring
In, it stirs evenly, so that slurry is uniformly wrapped in the surface of basic foamed polystyrene bead, and exist using fluidized bed drying equipment
Dry 2h, obtains compound anti-static polyphenylacetylene expanded bead at 60-70 DEG C.
(2) preparation of compound anti-static polyphenylacetylene expanded moldings
Compound anti-static polyphenylacetylene expanded bead filling produced above is put into the sheet-forming machine of preheating, mould
105-115 DEG C of steam of interior importing heats, and holding pressure is 0.08-0.15MPa, and leading to steaming time is 30s, then cooling, demoulding,
Compound anti-static polyphenylacetylene foaming plate is made.The plate appearance is smoothly regular, using the observation period section SEM, abscess knot
Structure is completely uniform.The performance of plate is as shown in table 1.
Embodiment 2
The present embodiment is for illustrating compound foamed polystyrene bead and its formed body of the invention and respective preparation
Method.
Conductive filler is pearl superconduction carbon black；Bonding agent is epoxy resin；Coupling agent is three isostearic acid isopropyl titanates；
Dispersing agent is fatty acid polyethylene glycol ester.
(1) preparation of compound-type conducting foamed polystyrene bead
Weigh weight pearl superconduction carbon black 0.15kg, epoxy resin 0.15kg, three isostearic acid isopropyl titanate 5g, fatty acid
Macrogol ester 4g.The conductive filler and coupling agent are mixed 5 minutes, then gained mixture and dispersing agent are sequentially added
It is mixed 5 minutes in bonding agent, obtains surface of beads covering electrocondution slurry.
Weighing the basis 30g/L foamed polystyrene bead is 0.4kg, is slowly added to electrocondution slurry obtained under stiring
In, it stirs evenly, so that slurry is uniformly wrapped in the surface of basic foamed polystyrene bead, and exist using fluidized bed drying equipment
Dry 2h, obtains compound-type conducting foamed polystyrene bead at 60-70 DEG C.
(2) preparation of compound-type conducting foamed polystyrene formed body
Compound-type conducting foamed polystyrene bead filling produced above is put into the sheet-forming machine of preheating, in mould
It imports 105-115 DEG C of steam to heat, holding pressure is 0.08-0.15MPa, and leading to steaming time is 45s, then cooling, demoulding, most
Obtained compound-type conducting foamed polystyrene board material eventually.The plate appearance is smoothly regular, and Fig. 1 is the section of bead in the plate
SEM figure is wrapped in conductive filler, the visible internal Cell structure in left side bead section is complete, hole as seen from the figure outside the bead of right side
Wall is smooth.Fig. 2 and Fig. 3 is the section photo of plate different location, the conduction for having conductive material to be formed as seen from the figure, inside plate
Network, and similar honeycomb is presented in the conductive network of each section.Its performance is as shown in table 1.
Embodiment 3
The present embodiment is for illustrating compound foamed polystyrene bead and its formed body of the invention and respective preparation
Method.
Conductive filler is graphene；Bonding agent is acrylic resin；Coupling agent is two (dioctyl phosphite base) metatitanic acids four
Isopropyl ester；Dispersing agent is methyl anyl alcohol.
(1) preparation of compound-type conducting foamed polystyrene bead
Weigh graphene 0.15kg, acrylic resin 0.25kg, two (dioctyl phosphite base) tetraisopropyl titanate 2g, first
Base amylalcohol 2g.The conductive filler and coupling agent are mixed 5 minutes, then gained mixture and dispersing agent are added sequentially to glue
It connects in agent and is mixed 5 minutes, obtain surface of beads covering electrocondution slurry.
The basis 90g/L foamed polystyrene bead 1kg is weighed, is slowly added in electrocondution slurry obtained under stiring,
It stirs evenly, so that slurry is uniformly wrapped in the surface of basic foamed polystyrene bead, and using fluidized bed drying equipment in 60-
Dry 1.5h, obtains compound-type conducting foamed polystyrene bead at 70 DEG C.
(3) preparation of compound-type conducting foamed polystyrene formed body
Compound-type conducting foamed polystyrene bead filling produced above is put into the sheet-forming machine of preheating, in mould
It imports 105-115 DEG C of steam to heat, holding pressure is 0.08-0.15MPa, and leading to steaming time is 45s, then cooling, demoulding, most
Obtained compound-type conducting foamed polystyrene board material eventually.The plate appearance is smoothly regular, using the observation period section SEM, abscess knot
Structure is completely uniform.Its performance is as shown in table 1.
Embodiment 4
The present embodiment is for illustrating compound foamed polystyrene bead and its formed body of the invention and respective preparation
Method.
Conductive filler is multi-walled carbon nanotube (MWNTs)；Bonding agent is polyvinyl alcohol resin；Coupling agent is silane coupling agent
KH792；Dispersing agent is glyceryl tristearate.
(1) preparation of compound anti-static polyphenylacetylene expanded bead
Weigh multi-walled carbon nanotube 0.01kg, polyvinyl alcohol resin 0.1kg, KH792 1g, glyceryl tristearate 1g.It will
The conductive filler and coupling agent are mixed 5 minutes, then gained mixture and dispersing agent are added sequentially to mix in bonding agent
Stirring 5 minutes, obtains surface of beads covering electrocondution slurry.
Weigh the basis 30g/L foamed polystyrene bead 0.3kg, is slowly added to electrocondution slurry obtained under stiring
In, it stirs evenly, so that slurry is uniformly wrapped in the surface of basic foamed polystyrene bead, and exist using fluidized bed drying equipment
Dry 1h, obtains compound anti-static polyphenylacetylene expanded bead at 60-70 DEG C.
(2) preparation of compound anti-static polyphenylacetylene expanded moldings
Compound anti-static polyphenylacetylene expanded bead filling produced above is put into the sheet-forming machine of preheating, mould
105-115 DEG C of steam of interior importing heats, and holding pressure is 0.08-0.15MPa, and leading to steaming time is 20s, then cooling, demoulding,
Compound anti-static polyphenylacetylene foaming plate is finally made.The plate appearance is smoothly regular, using the observation period section SEM, bubble
Pore structure is completely uniform.Its performance is as shown in table 1.
Embodiment 5
The present embodiment is for illustrating compound foamed polystyrene bead and its formed body of the invention and respective preparation
Method.
Compound foamed polystyrene bead and formed body are prepared according to the method for embodiment 2, unlike, by 0.4kg
30g/L basic intumescent polystyrene bead substituted with the 90g/L basic intumescent polystyrene bead of 1.2kg, finally obtain multiple
Mould assembly conducting polyaniline ethylene expanded bead and plate.The plate appearance is smoothly regular, using the observation period section SEM, foam structure
It is complete uniform.Its performance is as shown in table 1.
Comparative example 1
By 30g/L basic intumescent polystyrene bead directly adopt in the process conditions mould of 1 step of embodiment (2) it is secondary at
Expanded moldings plate is made in type.Its performance is as shown in table 1.
Comparative example 2
Surface covering electrocondution slurry is prepared according to the method for embodiment 1, unlike, first 60g/L basic intumescent is gathered
Styrene beads directly adopt post forming in the process conditions mould of 1 step of embodiment (2) and expanded moldings plate are made, then use
Prepared electrocondution slurry is uniformly coated to the surface of the expanded moldings plate by the method for 1 step of embodiment (1), uses baking
Case dry 2h at 60-70 DEG C, obtains compound foamed polystyrene board material.Its performance is as shown in table 1.
Comparative example 3
According to the method preparation surface covering electrocondution slurry of 2 step of embodiment (1), the difference is that, first by the base of 30g/L
Plinth expanded polystyrene bead directlys adopt post forming in the process conditions mould of 2 step of embodiment (2) and expanded moldings is made
Plate, then prepared electrocondution slurry is uniformly coated to the expanded moldings plate with the method for step (1) in embodiment 2
Surface dries 2h using baking oven at 60-70 DEG C, obtains compound foamed polystyrene board material.Its performance is as shown in table 1.
Comparative example 4
According to the method preparation surface covering electrocondution slurry of 3 step of embodiment (1), the difference is that, first by the basis 90g/L
Expanded polystyrene bead directlys adopt post forming in the process conditions mould of 3 step of embodiment (2) and expanded moldings plate is made
Material, then prepared electrocondution slurry is uniformly coated to the method for 3 step of embodiment (1) table of the expanded moldings plate
Face dries 2h using baking oven at 60-70 DEG C, obtains compound foamed polystyrene board material.Its performance is as shown in table 1.
Comparative example 5
According to the method preparation surface covering electrocondution slurry of 4 step of embodiment (1), the difference is that, the basis 30g/L is sent out
Foamed polystyrene bead directlys adopt post forming in the process conditions mould of 1 step of embodiment (2) and expanded moldings plate is made,
Prepared electrocondution slurry is uniformly coated to the method for 2 step of embodiment (1) surface of the expanded moldings plate again, is made
2h is dried at 60-70 DEG C with baking oven, obtains compound foamed polystyrene board material.Its performance is as shown in table 1.
Table 1
Table 1 shows that the sample prepared by embodiment 1-5, the surface resistivity difference very little at any three illustrates sample
Conductive component be evenly distributed, the antistatic or conductivity uniformity of expanded moldings.
By comparative example 1 as can be seen that with general basic foamed polystyrene bead common in the market with identical work
The expanded moldings without any modification are prepared in skill, and insulation performance is fine, surface resistivity be far longer than it is antistatic or
The range that conductive material needs, is unsuitable to apply to the every field required to antistatic or electric conductivity.
Comparative example 2-5 is that foaming is first prepared with identical technique with basic foamed polystyrene bead respectively
Body, then cover identical cementability conductive material to product surface with produce compound antistatic of this process route or is led
Voltolisation styrene expanded moldings.By comparative example 2-5 it is found that being compared due to finite surface area compared with the product of embodiment 1-4
The method of example 2-5 can not adhere to the conductive material of sufficient amount, therefore antistatic or conductivity can be poor, there is also surface fracture or invades
After erosion, possibility that the antistatic and electric conductivity of expanded moldings declines to a great extent；Sheet resistance at any the three of comparative example 2-5
Rate difference is bigger, illustrates that surface coating technology causes the conductive component of sample uneven, expanded moldings antistatic or leads
Electric energy power is inconsistent, it is difficult to apply to high-grade, precision and advanced field of industrial production.
Embodiment 5 and 2 is compared it is found that using the modified foaming of same conductive as apparent density reduces
Declining does not occur in the surface conductivity of material slightly to be improved instead, this is because conductive material does not enter into macromolecule foaming pearl
Intragranular portion is uniform complete high rate of closed hole foam structure inside each conductive unit；The conductive network of expanded moldings is
Continuously distributed along bead unit outer surface, the foam structure variation inside bead is with difference hardly to expanded moldings
Interior conductive network impacts.
Keep surface conductive layer damaged in addition, the plate of embodiment 2 and comparative example 3 is carried out external force scraping with identical dynamics,
The electric conductivity of plate is as shown in table 2 after breakage:
Table 2
| Project | Surface resistivity A (Ω) | Surface resistivity B (Ω) | Surface resistivity C (Ω) |
| Embodiment 2 | 7×102 | 8×102 | 8×102 |
| Comparative example 3 | > 1014 | > 1014 | > 1014 |
As shown in Table 2, in the case where surface conductance component is damaged, conductive network inside the plate of embodiment 2 according to
It can so guarantee that material has outstanding electric conductivity, and comparative example 3 is changed into insulating materials due to conductive layer breakage.
It can be concluded that, it can be produced using preparation method of the invention from result above and have excellent post forming performance
Compound antistatic or conducting polyaniline ethylene expanded bead, and using secondary forming process and equipment in general steam-heated mo(u)ld
The antistatic or conductive compound polystyrene formed body that flat appearance is uniform, expansion ratio is high can be manufactured.Compared to
It foams again after conductive filler modified matrix resin common at present and the technological means such as conductive coating modification after matrix resin foaming,
The present invention can generate more useful effect.
The preferred embodiment of the present invention has been described above in detail, still, during present invention is not limited to the embodiments described above
Detail within the scope of the technical concept of the present invention can be with various simple variants of the technical solution of the present invention are made, this
A little simple variants all belong to the scope of protection of the present invention.In addition, can also be between a variety of different embodiments of the invention
Row any combination, as long as it does not violate the idea of the present invention, it should also be regarded as the disclosure of the present invention.
Claims (10)
1. a kind of compound foamed polystyrene bead, which is characterized in that the compound foamed polystyrene bead be by with
Electrocondution slurry coats foamed polystyrene bead, then dry to be made；Wherein, the electrocondution slurry contains conductive filler, bonding
Agent, coupling agent and dispersing agent, and the foamed polystyrene bead relative to 100 parts by weight, the conductive filler are 1-50
Parts by weight, the bonding agent are 8-50 parts by weight, and the coupling agent is 0.1-5 parts by weight, and the dispersing agent is 0.1-5 weight
Part.
2. compound foamed polystyrene bead according to claim 1, wherein the table of the foamed polystyrene bead
Sight density is 10-700g/L；The conductive filler is selected from least one of carbon black, graphite, carbon nanotube and carbon fiber.
3. compound foamed polystyrene bead according to claim 1, wherein the bonding agent be selected from epoxy resin,
At least one of phenolic resin, Lauxite, organic siliconresin, acrylic resin and polyvinyl alcohol resin.
4. compound foamed polystyrene bead according to claim 1, wherein the coupling agent is coupled selected from titanate esters
Agent and/or silane coupling agent；The titanate coupling agent be preferably selected from isopropyl three (dioctylphyrophosphoric acid acyloxy) titanate esters,
Three isostearic acid isopropyl titanates, two (dioctyl pyrophosphoryl oxygroup) oxo ester acid titaniums and two (dioctyl phosphite base) metatitanic acids four
At least one of isopropyl ester；The silane coupling agent is preferably selected from gamma-aminopropyl-triethoxy-silane, γ-(2,3- epoxy third
Oxygroup) propyl trimethoxy silicane, γ-(methacryloxypropyl) propyl trimethoxy silicane, γ-aminoethylaminopropyl trimethoxy
At least one of base silane and N- β-(aminoethyl)-γ-aminopropyltriethoxy dimethoxysilane.
5. compound foamed polystyrene bead according to claim 1, wherein the dispersing agent is selected from dodecyl sulphur
In sour sodium, methyl anyl alcohol, polyacrylamide, fatty acid polyethylene glycol ester, glycerin monostearate and glyceryl tristearate
It is at least one.
6. the preparation method of compound foamed polystyrene bead described in any one of claim 1-5, which is characterized in that should
Preparation method includes:
1) first the conductive filler and the coupling agent are uniformly mixed, obtain mixture, then by the mixture, the dispersion
Agent is added sequentially in the bonding agent, is uniformly dispersed, and the electrocondution slurry is made；
2) electrocondution slurry is coated on the foamed polystyrene bead, is then dried, the compound polyphenyl is made
Ethylene expanded bead.
7. a kind of compound foamed polystyrene formed body, which is characterized in that the compound foamed polystyrene formed body be by
Compound foamed polystyrene bead described in any one of claim 1-5 is made through secondary frothing forming.
8. compound foamed polystyrene formed body according to claim 7, wherein the compound foamed polystyrene
The surface resistivity of formed body is 10-109Ω, preferably 102-107Ω。
9. compound foamed polystyrene formed body according to claim 7 or 8, wherein the compound polystyrene
The apparent density of expanded moldings is 30-500g/L.
10. the preparation method of compound foamed polystyrene formed body, feature described in any one of claim 7-9 exist
In, the preparation method include: by the compound foamed polystyrene bead filling in a mold, logical steam heating make bead that
This heat fusion, so that the compound foamed polystyrene formed body be made；Wherein, the pressure of steam is 0.05-0.5MPa, is led to
The time of steam is 10s to 2min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710607265.1A CN109291300A (en) | 2017-07-24 | 2017-07-24 | Compound foamed polystyrene bead and its formed body and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710607265.1A CN109291300A (en) | 2017-07-24 | 2017-07-24 | Compound foamed polystyrene bead and its formed body and preparation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109291300A true CN109291300A (en) | 2019-02-01 |
Family
ID=65167159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710607265.1A Pending CN109291300A (en) | 2017-07-24 | 2017-07-24 | Compound foamed polystyrene bead and its formed body and preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109291300A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111117206A (en) * | 2019-12-20 | 2020-05-08 | 美瑞新材料股份有限公司 | Conductive foamed thermoplastic polyurethane elastomer bead as well as preparation method and application thereof |
| CN113583437A (en) * | 2021-08-31 | 2021-11-02 | 浙江理工大学绍兴柯桥研究院有限公司 | Polymer composite material and preparation method thereof |
| CN113999455A (en) * | 2021-11-23 | 2022-02-01 | 成都佳驰电子科技股份有限公司 | Preparation method of conductive EPP foam with isolation structure |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5889704A (en) * | 1981-11-25 | 1983-05-28 | 藤森工業株式会社 | Conductive bead |
| JPS5892540A (en) * | 1981-11-30 | 1983-06-01 | Fujimori Kogyo Kk | Conductive foam molding body and manufacture therefor |
| US4496627A (en) * | 1981-11-25 | 1985-01-29 | Fujimori Kogyo Co., Ltd. | Electrical conductive foam beads and molded electrical conductive foamed articles obtained therefrom |
| JPS60141732A (en) * | 1983-12-28 | 1985-07-26 | Kanegafuchi Chem Ind Co Ltd | Expandable conductive styrene resin beads, foam therefrom and its manufacture |
| CN1183448A (en) * | 1996-09-16 | 1998-06-03 | 希巴特殊化学控股公司 | Antistatic composition |
| CN101619140A (en) * | 2009-06-23 | 2010-01-06 | 罗付生 | Processing technology for surface modification of prefoaming polystyrene particles |
| CN103415559A (en) * | 2011-03-04 | 2013-11-27 | 积水化成品工业株式会社 | Expanded composite polystyrene resin particles and molded foam thereof |
-
2017
- 2017-07-24 CN CN201710607265.1A patent/CN109291300A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5889704A (en) * | 1981-11-25 | 1983-05-28 | 藤森工業株式会社 | Conductive bead |
| US4496627A (en) * | 1981-11-25 | 1985-01-29 | Fujimori Kogyo Co., Ltd. | Electrical conductive foam beads and molded electrical conductive foamed articles obtained therefrom |
| JPS5892540A (en) * | 1981-11-30 | 1983-06-01 | Fujimori Kogyo Kk | Conductive foam molding body and manufacture therefor |
| JPS60141732A (en) * | 1983-12-28 | 1985-07-26 | Kanegafuchi Chem Ind Co Ltd | Expandable conductive styrene resin beads, foam therefrom and its manufacture |
| CN1183448A (en) * | 1996-09-16 | 1998-06-03 | 希巴特殊化学控股公司 | Antistatic composition |
| CN101619140A (en) * | 2009-06-23 | 2010-01-06 | 罗付生 | Processing technology for surface modification of prefoaming polystyrene particles |
| CN103415559A (en) * | 2011-03-04 | 2013-11-27 | 积水化成品工业株式会社 | Expanded composite polystyrene resin particles and molded foam thereof |
Non-Patent Citations (2)
| Title |
|---|
| 李凤生，崔平，杨毅等: "《微纳米粉体后处理技术及应用》", 30 September 2005, 国防工业出版社 * |
| 郝素娥，张巨生等: "《稀土改性导电陶瓷材料》", 30 September 2009, 国防工业出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111117206A (en) * | 2019-12-20 | 2020-05-08 | 美瑞新材料股份有限公司 | Conductive foamed thermoplastic polyurethane elastomer bead as well as preparation method and application thereof |
| CN113583437A (en) * | 2021-08-31 | 2021-11-02 | 浙江理工大学绍兴柯桥研究院有限公司 | Polymer composite material and preparation method thereof |
| CN113999455A (en) * | 2021-11-23 | 2022-02-01 | 成都佳驰电子科技股份有限公司 | Preparation method of conductive EPP foam with isolation structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109291300A (en) | Compound foamed polystyrene bead and its formed body and preparation method | |
| US11390056B2 (en) | Low density microspheres | |
| CN104788909B (en) | A kind of heat conductive insulating composite and preparation method thereof | |
| US4889750A (en) | Conductive coatings and foams for anti-static protection, energy absorption, and electromagnetic compatibility | |
| US4818437A (en) | Conductive coatings and foams for anti-static protection, energy absorption, and electromagnetic compatability | |
| US20090311436A1 (en) | Conductive composite materials with graphite coated particles | |
| JP7321940B2 (en) | Multifunctional nanocomposites reinforced with impregnated cellular carbon nanostructures | |
| US20120301627A1 (en) | Coatings with organic polymeric fillers for molded smc articles | |
| US20080280031A1 (en) | Conductive coatings produced by monolayer deposition on surfaces | |
| US20080118736A1 (en) | Conductive composite compositions with fillers | |
| WO2007049588A1 (en) | Conductive coating material | |
| CN104201388B (en) | The application in preparation method of the preparation method of composite lithium ion battery cathode material and Petropols | |
| CN107674559A (en) | High-antistatic PEKK electrostatic spraying powder coating, its preparation method and application | |
| CN110054835A (en) | A kind of preparation method of high magnification conductivity type polypropylene foaming beads | |
| WO2020111849A1 (en) | Method for manufacturing semi-conductive polypropylene resin foamed particles and foamed molded article | |
| JP2011225756A (en) | Low dielectric resin composition | |
| US20050074480A1 (en) | High temperature and high humidity release coating for polymer film | |
| CN105951508B (en) | A kind of preparation method of Novel paper | |
| CN111073131A (en) | Composite flame-retardant conductive polypropylene foamed bead and molded body and preparation method thereof | |
| CN109504227A (en) | A kind of production method of printer barcode ribbon back coating | |
| JP2000514862A (en) | Platinum-containing thermal barrier composition | |
| JP2010158654A (en) | Carbon fiber-containing film, method for producing the same, coating agent to be used therefor, resin or rubber molding having carbon fiber-containing film thereon, and method for producing the same | |
| KR101662546B1 (en) | manufacturing method of expandable polystyrene having improved insulation property | |
| JPS5857446B2 (en) | Resin-impregnated base material and its manufacturing method | |
| JP5603098B2 (en) | Method for producing molded body and molded body |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190201 |