CN109285918A - Preparation process of solar cell - Google Patents

Preparation process of solar cell Download PDF

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Publication number
CN109285918A
CN109285918A CN201811025440.7A CN201811025440A CN109285918A CN 109285918 A CN109285918 A CN 109285918A CN 201811025440 A CN201811025440 A CN 201811025440A CN 109285918 A CN109285918 A CN 109285918A
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CN
China
Prior art keywords
laser scribing
doping
region
silicon wafer
preparation process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811025440.7A
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Chinese (zh)
Inventor
李跃恒
高艳飞
张强
杨爱静
宋标
王涛
韩秦军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huanghe Hydropower Xining Solar Power Co ltd
Huanghe Hydropower Development Co Ltd
State Power Investment Corp Xian Solar Power Co Ltd
Original Assignee
Xining Branch Of Spic Xi'an Solar Power Co ltd
Huanghe Hydropower Development Co Ltd
State Power Investment Corp Xian Solar Power Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xining Branch Of Spic Xi'an Solar Power Co ltd, Huanghe Hydropower Development Co Ltd, State Power Investment Corp Xian Solar Power Co Ltd filed Critical Xining Branch Of Spic Xi'an Solar Power Co ltd
Priority to CN201811025440.7A priority Critical patent/CN109285918A/en
Publication of CN109285918A publication Critical patent/CN109285918A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/268Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Photovoltaic Devices (AREA)

Abstract

The invention discloses a preparation process of a solar cell, which comprises the steps of carrying out laser scribing on a silicon wafer to form a front electrode pattern, then carrying out diffusion doping and subsequent procedures, wherein laser scribing is carried out on a region printed with a front grid line in advance, the surface area of a laser scribing region is larger than that of a non-laser scribing region when diffusion doping is carried out, and the doping depth of the laser scribing region is larger than that of the non-laser scribing region, so that the doping amount of the laser scribing region is larger than that of the non-laser scribing region, and the doping amount of the non-laser scribing region is relatively lower, therefore, after the front grid line printing is carried out through screen printing, heavy doping is realized in the grid line region, shallow doping is realized in the non-grid line region, and higher filling factor FF and short-circuit current.

Description

A kind of preparation process of solar battery
Technical field
The present invention relates to technical field of solar cell manufacturing more particularly to a kind of preparation processes of solar battery.
Background technique
Solar energy is a kind of clean, efficient and never-exhausted new energy, is important one of renewable energy.With too The development of positive energy industry, more clients and solar battery manufacturer increasingly pay attention to the production of high efficiency solar cell. In recent years, the manufacturing process of high performance solar batteries is had conducted extensive research both at home and abroad, is had as the result is shown: starched in front gate line Expect that overlay area carries out heavy doping diffusion, higher fill factor FF can be obtained, to obtain higher battery conversion efficiency. Conventional diffusion is uniformly to spread, and diffusing, doping amount, which becomes larger, will lead to the compound increase of non-frontal grid line printing zone, therefore can lead Cause the reduction of battery conversion efficiency.Fill factor FF and short circuit current Isc are very difficult to balance.
Therefore, it is necessary to be improved to solar cell fabrication process.
Summary of the invention
The invention proposes a kind of preparation process of solar battery, to reduce compound same of non-frontal grid region When, improve the contact in front gate line region.
To solve the above-mentioned problems, the invention provides the following technical scheme:
A kind of preparation process of solar battery, comprising the following steps:
S1: carrying out laser scribing to silicon wafer, and the figure that wherein laser scribing is formed is identical as silk-screen printing positive electrode pattern, The silk-screen printing positive electrode pattern includes front gate line figure;
S2: being diffused doping to the silicon wafer after laser scribing, forms heavy doping, Qi Taqu in front gate line graphics field Domain forms shallow doping;
S3: the silicon wafer after diffusing, doping is successively performed etching, plated film;
S4: carrying out silk-screen printing, and the front gate line set that wherein silk-screen printing is formed is imprinted on the figure of laser scribing formation.
In one embodiment of the invention, the silicon wafer that the laser scribing uses is the silicon after original silicon chip or making herbs into wool Piece.
In one embodiment of the invention, the width of the grid line for the figure that laser scribing is formed is 20 micron -200 micro- Rice.
In one embodiment of the invention, the depth of the grid line for the figure that laser scribing is formed is not more than 2 microns.
The present invention due to using the technology described above, is allowed to compared with prior art, have the advantages that following and actively imitate Fruit:
(1) present invention by first to silicon wafer carry out laser scribing formed front electrode figure again be diffused doping and it is subsequent Program, due to carrying out laser scribing, when being diffused doping, laser scribing region in the region that front gate line prints in advance Surface area is greater than the area of non-laser scribe area, and the doping depth in laser scribing region is greater than non-laser scribe area, therefore The doping in laser scribing region is greater than the doping of non-laser scribe area, the doping of non-laser scribe area relatively low one A bit, therefore after the printing of silk-screen printing front gate line, grid region realizes heavy doping, and non-grid region, which realizes, shallowly mixes It is miscellaneous, higher fill factor FF and short circuit current Isc can be obtained simultaneously.
Detailed description of the invention
Fig. 1 is the flow diagram of the preparation process of solar battery provided in an embodiment of the present invention.
Specific embodiment
Make below in conjunction with preparation process of the drawings and specific embodiments to solar battery proposed by the present invention further detailed It describes in detail bright.According to following explanation and claims, advantages and features of the invention will be become apparent from.It should be noted that attached drawing is equal Using very simplified form and using non-accurate ratio, only to facilitate, lucidly aid in illustrating the embodiment of the present invention Purpose.
Referring to FIG. 1, as shown in Figure 1, the preparation process of solar battery provided in an embodiment of the present invention includes following step It is rapid:
S1: carrying out laser scribing to silicon wafer, and the figure that wherein laser scribing is formed is identical as silk-screen printing positive electrode pattern, The silk-screen printing positive electrode pattern includes front gate line figure.
Wherein, the silicon wafer that the laser scribing uses is the silicon wafer after original silicon chip or making herbs into wool.
S2: being diffused doping to the silicon wafer after laser scribing, forms heavy doping, Qi Taqu in front gate line graphics field Domain forms shallow doping.
Wherein, the width of the grid line for the figure that laser scribing is formed is 20 microns -200 microns.The figure that laser scribing is formed The depth of the grid line of shape is not more than 2 microns.
S3: the silicon wafer after diffusing, doping is successively performed etching, plated film;
S4: carrying out silk-screen printing, and the front gate line set that wherein silk-screen printing is formed is imprinted on the figure of laser scribing formation.
It is further described with reference to embodiments.
Embodiment 1
The preparation process of solar battery provided in this embodiment comprises the steps of:
(1) it chooses 156 × 156mm crystalline silicon wafer and carries out laser scribing, the width of laser scribing figure is 30 microns, is swashed The depth of light scribing line is 0.3 micron;
(2) crystalline silicon wafer Jing Guo laser scribing carries out making herbs into wool, diffusion, etching, plated film;
(3) crystalline silicon wafer after plated film carries out silk-screen printing, and wherein the front gate line of silk-screen printing is covered on laser scribing Figure on.
(4) solar battery sheet is prepared through follow-up sintering technique again, is found by test, the sun that the present invention obtains The photoelectric conversion efficiency of energy cell piece increases, and specific data are shown in Table 1.
Table 1
Technique Uoc Isc FF Ncell
Conventional crystal silicon battery technique 0 0 0 0
Laser scribing battery process 0.2mV 30mA 0.5 0.19%
As can be seen from Table 1: the cell piece efficiency gain 0.19% of laser scribe method preparation, mainly due to short-circuit electricity The gain of stream and fill factor.
Embodiment 2
The preparation process of solar battery provided in this embodiment comprises the steps of:
(1) it chooses 156.75 × 156.75mm crystalline silicon wafer and carries out laser scribing, the width of laser scribing figure is 10 micro- Rice, the depth of laser scribing are 1 micron;
(2) crystalline silicon wafer Jing Guo laser scribing carries out making herbs into wool, diffusion, etching, plated film;
(3) crystalline silicon wafer after plated film carries out silk-screen printing, and wherein the front gate line of silk-screen printing is covered on laser scribing Figure on.
(4) solar battery sheet is prepared through follow-up sintering technique again, is found by test, the sun that the present invention obtains The photoelectric conversion efficiency of energy cell piece increases, and specific data are shown in Table 2.
Table 2
Technique Uoc Isc FF Ncell
Conventional crystal silicon battery technique 0 0 0 0
Laser scribing battery process 0.1mV 10mA 0.15 0.06%
As can be seen from Table 2: the cell piece efficiency gain 0.06% of laser scribe method preparation, mainly due to short-circuit electricity The gain of stream and fill factor.
Foregoing description is only the description to present pre-ferred embodiments, not to any restriction of the scope of the invention, this hair Any change, the modification that the those of ordinary skill in bright field does according to the disclosure above content, belong to the protection of claims Range.

Claims (4)

1. a kind of preparation process of solar battery, which comprises the following steps:
S1: carrying out laser scribing to silicon wafer, and the figure that wherein laser scribing is formed is identical as silk-screen printing positive electrode pattern, described Silk-screen printing positive electrode pattern includes front gate line figure;
S2: being diffused doping to the silicon wafer after laser scribing, forms heavy doping, other region shapes in front gate line graphics field At shallow doping;
S3: the silicon wafer after diffusing, doping is successively performed etching, plated film;
S4: carrying out silk-screen printing, and the front gate line set that wherein silk-screen printing is formed is imprinted on the figure of laser scribing formation.
2. the preparation process of solar battery as described in claim 1, which is characterized in that the silicon wafer that the laser scribing uses For the silicon wafer after original silicon chip or making herbs into wool.
3. the preparation process of solar battery as claimed in claim 1 or 2, which is characterized in that the figure that laser scribing is formed Grid line width be 20 microns -200 microns.
4. the preparation process of solar battery as claimed in claim 3, which is characterized in that the grid for the figure that laser scribing is formed The depth of line is not more than 2 microns.
CN201811025440.7A 2018-09-04 2018-09-04 Preparation process of solar cell Pending CN109285918A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811025440.7A CN109285918A (en) 2018-09-04 2018-09-04 Preparation process of solar cell

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Application Number Priority Date Filing Date Title
CN201811025440.7A CN109285918A (en) 2018-09-04 2018-09-04 Preparation process of solar cell

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110085702A (en) * 2019-04-19 2019-08-02 通威太阳能(成都)有限公司 A kind of high-efficiency photovoltaic battery production method that laser cutting loss is effectively reduced

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101533871A (en) * 2009-04-01 2009-09-16 常州天合光能有限公司 Selective diffusion technology for crystalline silicon solar cell
CN101783374A (en) * 2010-01-25 2010-07-21 宁波太阳能电源有限公司 Method for manufacturing silicon solar cell
CN101866984A (en) * 2010-05-18 2010-10-20 常州亿晶光电科技有限公司 Method for selectively doping emitting stage on surface of crystalline silicon cell film
CN101969082A (en) * 2010-04-20 2011-02-09 常州天合光能有限公司 Process for manufacturing solar cell by twice screen printing and grooving
CN102800757A (en) * 2012-08-28 2012-11-28 英利集团有限公司 N-type solar cell and manufacturing process thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101533871A (en) * 2009-04-01 2009-09-16 常州天合光能有限公司 Selective diffusion technology for crystalline silicon solar cell
CN101783374A (en) * 2010-01-25 2010-07-21 宁波太阳能电源有限公司 Method for manufacturing silicon solar cell
CN101969082A (en) * 2010-04-20 2011-02-09 常州天合光能有限公司 Process for manufacturing solar cell by twice screen printing and grooving
CN101866984A (en) * 2010-05-18 2010-10-20 常州亿晶光电科技有限公司 Method for selectively doping emitting stage on surface of crystalline silicon cell film
CN102800757A (en) * 2012-08-28 2012-11-28 英利集团有限公司 N-type solar cell and manufacturing process thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
杨志刚 等: "《小型太阳能光伏电源实用技术》", 31 January 2009, 科学普及出版社 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110085702A (en) * 2019-04-19 2019-08-02 通威太阳能(成都)有限公司 A kind of high-efficiency photovoltaic battery production method that laser cutting loss is effectively reduced
CN110085702B (en) * 2019-04-19 2021-06-01 通威太阳能(成都)有限公司 Efficient photovoltaic cell manufacturing method capable of effectively reducing laser cutting loss

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PB01 Publication
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SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20191028

Address after: 710100 East Chang'an Avenue, Xi'an, Shaanxi Aerospace base, No. 589

Applicant after: STATE POWER INVESTMENT CORPORATION XI'AN SOLAR POWER Co.,Ltd.

Applicant after: Huanghe hydropower Xining Solar Power Co.,Ltd.

Applicant after: HUANGHE HYDROPOWER DEVELOPMENT Co.,Ltd.

Applicant after: Huanghe Hydropower Development Co., Ltd.

Address before: 710100 East Chang'an Avenue, Xi'an, Shaanxi Aerospace base, No. 589

Applicant before: STATE POWER INVESTMENT CORPORATION XI'AN SOLAR POWER Co.,Ltd.

Applicant before: XINING BRANCH OF SPIC XI'AN SOLAR POWER Co.,Ltd.

Applicant before: HUANGHE HYDROPOWER DEVELOPMENT Co.,Ltd.

Applicant before: Huanghe Hydropower Development Co., Ltd.

TA01 Transfer of patent application right
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20190129

WD01 Invention patent application deemed withdrawn after publication