CN109283801A - A kind of preparation method of cover board and a kind of cover board - Google Patents
A kind of preparation method of cover board and a kind of cover board Download PDFInfo
- Publication number
- CN109283801A CN109283801A CN201811125965.8A CN201811125965A CN109283801A CN 109283801 A CN109283801 A CN 109283801A CN 201811125965 A CN201811125965 A CN 201811125965A CN 109283801 A CN109283801 A CN 109283801A
- Authority
- CN
- China
- Prior art keywords
- color film
- film layer
- color
- cover board
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0279—Improving the user comfort or ergonomics
- H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
- H04M1/185—Improving the rigidity of the casing or resistance to shocks
Abstract
The invention discloses a kind of preparation methods of cover board, the first color film layer and shielding layer are set gradually by the first surface in substrate, and the shielding layer with engraved structure can be made by way of developing and exposing, to expose the predeterminable area of the first color film layer, the first color film layer of predeterminable area can be removed by the method for etching, the second color film layer of one layer of above-mentioned predeterminable area of covering finally is set on the surface of shielding layer again, in the region for being just coated with the second color film layer, cover board can show the color of the second color film layer；And it is covered with the region of the first color film layer and the second color film layer at the same time, preset color can equally be shown by the mechanism of color addition, to prepare the cover board with two different colors of textured pattern.The present invention also provides a kind of cover boards, equally have above-mentioned beneficial effect.
Description
Technical field
The present invention relates to field of mobile equipment, preparation method and a kind of cover board more particularly to a kind of cover board.
Background technique
As the continuous progress of science and technology in recent years and touch-control show the development of product industry, touch-control sensor either from
Size or performance etc. all achieve great progress.Correspondingly, details of the user for touch-control product, appearance etc. have
Higher requirement.
At this stage, in order to enable mobile device has beautiful appearance to obtain the favor of user, it will usually so that eventually
The cover board at end, such as cell phone rear cover show certain color, even with the pattern etc. of certain color, to increase user
Experience.
In the prior art, the cover board with textured pattern can be prepared, the width for the texture prepared under normal conditions
It spends thinner.But in the prior art, the cover board with two different colors of textured pattern can not be prepared.
Summary of the invention
The object of the present invention is to provide a kind of preparation methods of cover board, can prepare with different colours textured pattern
Plate；Another object of the present invention is to provide a kind of cover boards, have different colours textured pattern.
In order to solve the above technical problems, the present invention provides a kind of preparation method of cover board, which comprises
There is the first color film layer of the first color in the first surface setting of substrate；
In the first color film surface, transparent shielding layer is set；
The shielding layer is exposed and is developed, the shielding layer is etched into the shielding layer of hollow out, to expose
The predeterminable area of the first color film surface；
It is described develop to the shielding layer after, the first color film layer is etched, with the exposure substrate
The surface of the predeterminable area is corresponded in first surface；
After etching the first color film layer, there is the second color of the second color in the masking layer surface setting
Film layer, the cover board is made；Wherein, the second color film layer cover corresponded in the first surface of the substrate it is described default
The surface in region.
Optionally, the shielding layer is OC glue-line.
Optionally, described transparent shielding layer is set in the first color film surface to include:
OC glue is coated in the first color film surface；
Solidify the OC glue, to form the OC glue-line.
Optionally, the substrate is glass substrate.
Optionally, described before the first surface setting in substrate has the first color film layer of the first color
Method further include:
Clean the first surface of the substrate.
The present invention also provides a kind of cover board, the cover board is using any one of the claims 1 to 5 claim institute
State cover board prepared by method.
A kind of preparation method of cover board provided by the present invention sets gradually the first color by the first surface in substrate
Film layer and shielding layer, and the shielding layer with engraved structure can be made by way of developing and exposing, to expose
The predeterminable area of first color film layer can be removed the first color film layer of predeterminable area, finally again by the method for etching
The second color film layer of one layer of above-mentioned predeterminable area of covering is set on the surface of shielding layer, is being just coated with the second color film layer
Region, cover board can show the color of the second color film layer；And it is covered with the first color film layer and the second color at the same time
The region of film layer can equally show preset color by the mechanism of color addition, to prepare tool, there are two types of different
The cover board of the textured pattern of color.
The present invention also provides a kind of cover boards, equally have above-mentioned beneficial effect, are no longer repeated herein.
Detailed description of the invention
It, below will be to embodiment or existing for the clearer technical solution for illustrating the embodiment of the present invention or the prior art
Attached drawing needed in technical description is briefly described, it should be apparent that, the accompanying drawings in the following description is only this hair
Bright some embodiments for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is a kind of flow chart of cover board preparation method provided by the embodiment of the present invention；
Fig. 2 is a kind of structural schematic diagram of the cover board when the first color film layer is arranged provided by the embodiment of the present invention；
Fig. 3 is a kind of structural schematic diagram of the cover board when shielding layer is arranged provided by the embodiment of the present invention；
Fig. 4 is a kind of structural schematic diagram of the cover board when etching shielding layer provided by the embodiment of the present invention；
Fig. 5 is a kind of structural schematic diagram of the cover board when etching the first color film layer provided by the embodiment of the present invention；
Fig. 6 is a kind of structural schematic diagram of the cover board when the second color film layer is arranged provided by the embodiment of the present invention.
In figure: 1. substrates, 2. first color film layers, 3. shielding layers, 4. second color film layers.
Specific embodiment
Core of the invention is to provide a kind of preparation method of cover board.In the prior art, for textured pattern
Cover board needs great aligning accuracy, very due to the film of the alternate setting different colours of the different zones in textured pattern
Difficulty, so can not usually prepare the cover board with two different colors of textured pattern at this stage.
And a kind of preparation method of cover board provided by the present invention, the first face is set gradually by the first surface in substrate
Color film layer and shielding layer, and the shielding layer with engraved structure can be made by way of developing and exposing, with exposure
The predeterminable area of first color film layer out can be removed the first color film layer of predeterminable area, finally by the method for etching
Second color film layer of one layer of above-mentioned predeterminable area of covering is set on the surface of shielding layer again, is being just coated with the second color film layer
Region, cover board can show the color of the second color film layer；And it is covered with the first color film layer and the first face at the same time
The region of color film layer can equally show preset color by the mechanism of color addition, to prepare tool, there are two types of not
With the cover board of the textured pattern of color.
In order to enable those skilled in the art to better understand the solution of the present invention, with reference to the accompanying drawings and detailed description
The present invention is described in further detail.Obviously, described embodiments are only a part of the embodiments of the present invention, rather than
Whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, shall fall within the protection scope of the present invention.
Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5 and Fig. 6 are please referred to, Fig. 1 is a kind of cover board preparation provided by the embodiment of the present invention
The flow chart of method；Fig. 2 is a kind of structural representation of the cover board when the first color film layer is arranged provided by the embodiment of the present invention
Figure；Fig. 3 is a kind of structural schematic diagram of the cover board when shielding layer is arranged provided by the embodiment of the present invention；Fig. 4 is that the present invention is real
Apply a kind of structural schematic diagram of the cover board when etching shielding layer provided by example；Fig. 5 is one kind provided by the embodiment of the present invention
The structural schematic diagram of cover board when etching the first color film layer；Fig. 6 is one kind provided by the embodiment of the present invention in setting second
The structural schematic diagram of cover board when color film layer.
Referring to Fig. 1, in embodiments of the present invention, the preparation method of cover board may include:
S101: there is the first color film layer of the first color in the first surface setting of substrate.
Referring to fig. 2, aforesaid substrate 1 is mainly used for providing enough structural strengths, to support entire cover board, so that cover board
With enough structural strengths to cope with various environment and the situation in use process.Specific material in relation to substrate 1 and
The parameters such as specific thickness are referred to the prior art, depending on the circumstances, in embodiments of the present invention and are not specifically limited.
Due under normal conditions, in order to guarantee that substrate 1 has the physical properties such as enough structural strengths, while being convenient for above-mentioned color film layer
2 and subsequent etch step progress, it will usually select glass as substrate 1, i.e., aforesaid substrate 1 is usually specially glass substrate
1。
The above-mentioned first color film layer 2 with the first color is set to the first surface of substrate 1.So-called first surface,
I.e. some of substrate 1 needs to be arranged the surface of the first color film layer 22 in the embodiment of the present invention.Under normal conditions, substrate 1
There is no significant differences between 1 other surfaces of first surface and substrate.
Above-mentioned first color film layer 2 and the second set in the next steps color film layer 4 need to have different
Color.Specific structure in relation to the first color film layer 2 and the second color film layer 4 will be described in detail in subsequent content,
This is no longer repeated.
Preferably, the first surface of the substrate 1 can be cleaned before this step.I.e. to the first table of substrate 1
Face is cleaned, and to remove the spot etc. of 1 first surface of substrate, prevents spot from impacting to the appearance of cover board.
S102: transparent shielding layer is set in the first color film surface.
Referring to Fig. 3, in this step, need that transparent masking is arranged backwards to 1 one side surface of substrate in the first color film layer 2
Layer 3.Since in embodiments of the present invention, user needs to see the color of the first color film layer 2 through shielding layer 3, so needing
Shielding layer 3 is transparent shielding layer 3, i.e., shielding layer 3 needs to have permeability to light.It should be noted that due in this hair
In subsequent step in bright embodiment, shielding layer 3 can be etched by developing and exposing, it is set in this step accordingly
Shielding layer 3 be usually one layer of photoresist film layer.
Preferably, in embodiments of the present invention, the shielding layer 3 is OC glue-line.I.e. above-mentioned shielding layer 3 preferably by
OC adhesive curing is formed by OC glue-line.OC (OPTICALCLEAR) glue-line is a kind of very high organic material of transparency, Ke Yichong
The filament schlieren texture of customization when shielding layer 3 and can be formed after exposure development.Under normal conditions, in this step
In, it first can be coated with one layer of OC glue on the surface of the first color film layer 2, then OC glue-line is formed after the OC adhesive curing.
S103: being exposed shielding layer and develop, and shielding layer is etched into the shielding layer of hollow out, to expose first
The predeterminable area of color film surface.
Referring to fig. 4, in this step, can first above-mentioned shielding layer 3 is exposed, to the shielding layer 3 through overexposure into
Shielding layer 3, is etched into the shielding layer 3 of hollow out by row development.Concrete technology in relation to above-mentioned exposure and development is referred to
The prior art is no longer repeated in embodiments of the present invention.Under normal conditions, the reticle pair with engraved structure can be passed through
Shielding layer 3 is exposed, so that the region being irradiated by light in shielding layer 3 and the region not being irradiated by light generate physical property
Difference；Shielding layer 3 is etched by developer solution again later, shielding layer 3 is etched into the structure of hollow out, to expose the first color
The predeterminable area on 2 surface of film layer.
It should be noted that in this step, whole shielding layers 3 all will not be removed after developing, one can be retained
Divide shielding layer 3, to cover a part of region on 2 surface of the first color film layer, and exposes the default of 2 surface of the first color film layer
Region.
In this step, by the manufacture craft for exposing and developing, the thinner texture of lines can be produced, so that engraving
The structure of empty shielding layer 3 is finer and close.
S104: after developing to shielding layer, etching the first color film layer, right in the first surface to expose substrate
Answer the surface of predeterminable area.
Referring to Fig. 5, in this step, the first color film layer 2 can be etched by etching liquid.Due to the masking of above-mentioned hollow out
The presence of layer 3, etching liquid can only etch the corresponding first color film layer 2 of above-mentioned predeterminable area, i.e. etching liquid can only etch
The first color film layer 2 that not shielded layer 3 covers, to get rid of the corresponding first color film layer 2 of predeterminable area, thus by substrate
The surface that predeterminable area is corresponded in 1 first surface is exposed；And the first color film layer 2 that shielded layer 3 covers will not be by
Etching, will be retained.
S105: after etching the first color film layer, there is the second color film of the second color in masking layer surface setting
Layer, cover board is made.
In embodiments of the present invention, the second color film layer 4 cover corresponded in the first surface of the substrate 1 it is described pre-
If the surface in region.
Referring to Fig. 6, in this step, above-mentioned second color film layer 4 not only can overlay masking layer 3 backwards to 1 side of substrate
Surface, while can also be covered on the surface that predeterminable area is corresponded in the first surface of the substrate 1 exposed in S104.Usual situation
Under, when above-mentioned second color film layer 4 after having etched above-mentioned first color film layer 2, in substrate 1 towards the first color film layer 2
Side plating the second color of flood film layer 4.
When user sees to cover board, can usually be shown corresponding to the second color film layer 4 in above-mentioned predeterminable area
Color, and the face that the first color film layer 2 and the second color film layer 4 are superimposed can be shown in the region for being provided with shielding layer 3
Color.
The color that above-mentioned first color film layer 2 and the second color film layer 4 need to have different.Specifically, of the invention real
It applies and the structure of two kind of first color film layer 2 and the second color film layer 4 is specifically provided in example.
The first: the first color film layer 2 is the first colored ink layers arc with the first color；Second color film
Layer 4 is the second colored ink layers arc with the second color.
In this configuration, when above-mentioned first color film layer 2 is arranged, it is thus only necessary to be coated with one in the first surface of substrate 1
Layer has the first colored film layer of the first color；Correspondingly, when above-mentioned second color film layer 4 is arranged, it is thus only necessary in substrate 1
One layer of second color film layer 4 with the second color is coated with towards 2 side of the first color film layer.This structure is either from knot
Structure itself is still all very simple and easy from preparation method, can greatly save the cost of manufacture of cover board.
Second: the first color film layer 2 includes the lower first color film layer positioned at 1 first surface of substrate, and is located at lower the
Upper first color film layer of the one color film layer backwards to 1 one side surface of substrate；Accordingly.Second color film layer 4 includes being located at substrate 1
First surface and shielding layer 3 and are located at lower second color film layer and carry on the back backwards to the lower second color film layer of 1 one side surface of substrate
To the upper second color film layer of 1 one side surface of substrate；Wherein, the refractive index of lower first color film layer and upper first color film layer
Refractive index is different；The refractive index of lower second color film layer is different from the refractive index of upper second color film layer.
In this configuration, understand first the first color film layer and upper first color film in the case where the first surface of substrate 1 successively stacks
Layer；The second color film layer and upper second color film layer in the case where substrate 1 is successively stacked towards 3 side of shielding layer again later.It needs
Bright, lower first color film layer needs are used cooperatively with upper first color film layer in this configuration, and lower second color film layer
It needs to be used cooperatively with upper second color film layer, corresponding color is generated by film interference.Due to above-mentioned lower first color
Film layer is different with the refractive index of upper first color film layer, while the refraction of above-mentioned lower second color film layer and upper second color film layer
Rate is different, when ambient exposes to upper first color film layer and upper second color film layer, has some light upper the
Two surfaces up and down of one color film layer and upper second color film layer are reflected, this two parts light can interfere from
And corresponding color is shown according to the thickness of upper first color film layer and upper second color film layer.
Different from above structure, in said structure, due to cover board color by colored first colored ink layers arc and
Second colored ink layers arc determines, and very rare in the color category of colored ink layers arc at this stage, using with pre-set color
First colored ink layers arc and the second colored ink layers arc are not typically available the color that user likes.And in this configuration, due to lid
The color that plate is presented is determined by the thickness of upper first color film layer and upper second color film layer, as long as slightly changing upper the
The thickness of one color film layer and upper second color film layer can be obtained by different colors, so as to according to the hobby of user
Cover board is allowed to show a variety of different colors；Upper first color film layer and upper second color film layer are arranged to thickness simultaneously
The film for spending gradual change, can also further obtain the cover board of color gradient, to further enrich the color category of cover board.
A kind of preparation method of cover board provided by the embodiment of the present invention, by being set gradually in the first surface of substrate 1
First color film layer 2 and shielding layer 3, and the shielding layer with engraved structure can be made by way of developing and exposing
3, it, can be by the first color film layer 2 of predeterminable area by the method for etching to expose the predeterminable area of the first color film layer 2
Removal is finally arranged the second color film layer 4 of one layer of above-mentioned predeterminable area of covering on the surface of shielding layer 3 again, is being just coated with
The region of second color film layer 4, cover board can show the color of the second color film layer 4；And it is covered with the first color at the same time
The region of film layer 2 and the second color film layer 4 can equally show preset color by the mechanism of color addition, thus
Prepare the cover board with two different colors of textured pattern.
The present invention also provides a kind of cover board, which is specially the cover board as provided in any of the above-described kind of inventive embodiments
Cover board made of preparation method is prepared, detailed content please refer to foregoing invention embodiment, are no longer repeated herein.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with it is other
The difference of embodiment, same or similar part may refer to each other between each embodiment.For being filled disclosed in embodiment
For setting, since it is corresponded to the methods disclosed in the examples, so being described relatively simple, related place is referring to method part
Explanation.
Professional further appreciates that, unit described in conjunction with the examples disclosed in the embodiments of the present disclosure
And algorithm steps, can be realized with electronic hardware, computer software, or a combination of the two, in order to clearly demonstrate hardware and
The interchangeability of software generally describes each exemplary composition and step according to function in the above description.These
Function is implemented in hardware or software actually, the specific application and design constraint depending on technical solution.Profession
Technical staff can use different methods to achieve the described function each specific application, but this realization is not answered
Think beyond the scope of this invention.
The step of method described in conjunction with the examples disclosed in this document or algorithm, can directly be held with hardware, processor
The combination of capable software module or the two is implemented.Software module can be placed in random access memory (RAM), memory, read-only deposit
Reservoir (ROM), electrically programmable ROM, electrically erasable ROM, register, hard disk, moveable magnetic disc, CD-ROM or technology
In any other form of storage medium well known in field.
Finally, it is to be noted that, herein, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning
Covering non-exclusive inclusion, so that the process, method, article or equipment for including a series of elements not only includes that
A little elements, but also including other elements that are not explicitly listed, or further include for this process, method, article or
The intrinsic element of equipment.In the absence of more restrictions, the element limited by sentence "including a ...", is not arranged
Except there is also other identical elements in the process, method, article or apparatus that includes the element.
The preparation method to a kind of cover board provided by the present invention and a kind of cover board method and device have carried out in detail above
It is thin to introduce.Used herein a specific example illustrates the principle and implementation of the invention, and above embodiments are said
It is bright to be merely used to help understand method and its core concept of the invention.It should be pointed out that for the ordinary skill of the art
, without departing from the principle of the present invention, can be with several improvements and modifications are made to the present invention for personnel, these improvement
It is also fallen within the protection scope of the claims of the present invention with modification.
Claims (6)
1. a kind of preparation method of cover board, which is characterized in that the described method includes:
There is the first color film layer of the first color in the first surface setting of substrate；
In the first color film surface, transparent shielding layer is set；
The shielding layer is exposed and is developed, the shielding layer is etched into the shielding layer of hollow out, it is described to expose
The predeterminable area of first color film surface；
It is described develop to the shielding layer after, the first color film layer is etched, with the first of the exposure substrate
The surface of the predeterminable area is corresponded in surface；
After etching the first color film layer, there is the second color film of the second color in the masking layer surface setting
Layer, the cover board is made；Wherein, the second color film layer covers in the first surface of the substrate and corresponds to the preset areas
The surface in domain.
2. the method according to claim 1, wherein the shielding layer is OC glue-line.
3. according to the method described in claim 2, it is characterized in that, it is described be arranged in the first color film surface it is transparent
Shielding layer includes:
OC glue is coated in the first color film surface；
Solidify the OC glue, to form the OC glue-line.
4. the method according to claim 1, wherein the substrate is glass substrate.
5. the method according to claim 1, wherein there is the first face in the first surface setting in substrate
Before first color film layer of color, the method also includes:
Clean the first surface of the substrate.
6. a kind of cover board, which is characterized in that the cover board is using side described in any one of the claims 1 to 5 claim
Cover board prepared by method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811125965.8A CN109283801A (en) | 2018-09-26 | 2018-09-26 | A kind of preparation method of cover board and a kind of cover board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811125965.8A CN109283801A (en) | 2018-09-26 | 2018-09-26 | A kind of preparation method of cover board and a kind of cover board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109283801A true CN109283801A (en) | 2019-01-29 |
Family
ID=65182305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811125965.8A Withdrawn CN109283801A (en) | 2018-09-26 | 2018-09-26 | A kind of preparation method of cover board and a kind of cover board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109283801A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113747710A (en) * | 2021-08-27 | 2021-12-03 | 维达力实业(深圳)有限公司 | Cover plate, preparation method thereof and electronic equipment |
| CN114347708A (en) * | 2021-12-31 | 2022-04-15 | Oppo广东移动通信有限公司 | Electronic device, shell, diaphragm and preparation method of diaphragm |
-
2018
- 2018-09-26 CN CN201811125965.8A patent/CN109283801A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113747710A (en) * | 2021-08-27 | 2021-12-03 | 维达力实业(深圳)有限公司 | Cover plate, preparation method thereof and electronic equipment |
| CN114347708A (en) * | 2021-12-31 | 2022-04-15 | Oppo广东移动通信有限公司 | Electronic device, shell, diaphragm and preparation method of diaphragm |
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