CN109280890A - A method of enhancing nano silver film photoelectric properties - Google Patents

A method of enhancing nano silver film photoelectric properties Download PDF

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Publication number
CN109280890A
CN109280890A CN201811054179.3A CN201811054179A CN109280890A CN 109280890 A CN109280890 A CN 109280890A CN 201811054179 A CN201811054179 A CN 201811054179A CN 109280890 A CN109280890 A CN 109280890A
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China
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nano silver
film
silver film
photoelectric properties
nanometer copper
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CN201811054179.3A
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CN109280890B (en
Inventor
方应翠
王帅
郝宏亮
李欢欢
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Hefei University of Technology
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Hefei University of Technology
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/18Metallic material, boron or silicon on other inorganic substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/18Metallic material, boron or silicon on other inorganic substrates
    • C23C14/185Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Hybrid Cells (AREA)

Abstract

The invention discloses a kind of methods for enhancing nano silver film photoelectric properties, i.e., first prepare one layer of thin layer nanometer Copper thin film on matrix before preparing nano silver film.The present invention enhances the electric conductivity and optical transmittance of nano silver film by deposition plating nanocrystalline Cu film, and method is simple, is easily achieved.

Description

A method of enhancing nano silver film photoelectric properties
Technical field
The present invention relates to nano silver film field, the method for specifically a kind of enhancing nano silver film photoelectric properties.
Background technique
Nano silver film compared with common Ag films have biggish specific surface area and higher high surface activity, and due to Its unique optics, electricity and biological characteristics are applied to bio-sensing, biological medicine, environmental improvement, catalysis, conduction, lead In the fields such as heat, wide application prospect has caused people and has widely paid attention to.
Although block silver good conductivity, when scale narrows down to nanoscale, the conductive capability of nano silver film is weak, Limit application of the nano silver film in nano photoelectric device.On the other hand, nano-Ag particles have strong surface etc. from sharp First resonance characteristics shows as having strong absorption to visible light, and enhanced intensity around nano particle.This characteristic makes nano silver exist Enhance molecule absorption, enhancing Raman scattering and enhancing fluorescent emission etc. has huge application prospect.But nano particle This certain occasions of surface plasmon resonance characteristic under play negative effect, for example strong absorb will lead to film transmission rate It is low.Therefore surface plasmon resonance is inhibited to play an important role to film transmission rate is improved.
Summary of the invention
The object of the present invention is to provide a kind of methods for enhancing nano silver film photoelectric properties, to solve prior art nanometer Ag films electric conductivity is weak, the low problem of transmitance.
In order to achieve the above object, the technical scheme adopted by the invention is as follows:
A method of enhancing nano silver film photoelectric properties, it is characterised in that: before preparing nano silver film to matrix, Nanometer Copper thin film is prepared first on matrix, then prepares nano silver film on nanometer Copper thin film.
A kind of method of enhancing nano silver film photoelectric properties, it is characterised in that: the Nanometer Copper prepared on matrix The thickness of film is greater than 3nm.
A kind of method of enhancing nano silver film electric conductivity, it is characterised in that: the preparation cleaning thin layer on matrix Nanometer Copper thin film, preparation nanometer copper method includes but is not limited to vacuum evaporation coating, vacuum magnetic-control sputtering plating method.
Nanometer Copper thin film is prepared using the method for vacuum vapor plating on matrix.
The method of a kind of enhancing nano silver film photoelectric properties, it is characterised in that: using vacuum vapor plating When method prepares nanometer Copper thin film, vacuum degree is higher than 1.0 × 10-3Pa is loaded and is steamed when being coated with using DMDE-450 type coating machine The molybdenum boat electrical current 90-100A to rise, plated film time are not less than 60s.
The method of a kind of enhancing nano silver film electric conductivity, it is characterised in that: prepared on nanometer Copper thin film clear Clean nano silver film, the method for preparing nano silver film include but is not limited to vacuum evaporation coating, vacuum magnetic-control sputtering plating.
Nano silver film is prepared using the method for vacuum vapor plating on nanometer Copper thin film.
The method of a kind of enhancing nano silver film electric conductivity, it is characterised in that: using the side of vacuum vapor plating When method prepares nano silver film, vacuum degree is higher than 1.0 × 10-3Pa, the molybdenum boat electrical current for loading evaporation source is 100A, when plated film Between be not less than 90s.
In the present invention, the electric conductivity of the nano silver film after the completion of preparing, can by four probe resistance rate testers into Row test;Optical transmittance is acquired with spectrophotometer.
Inhibition of the principle of the invention based on high density nucleation and nano silver surface plasmon resonance.Deposition nano silver it Before, one layer of thin layer nano copper particle is deposited on glass matrix, since to be nucleated size on matrix smaller than nano silver very for Nanometer Copper More, so the quantity of unit area matrix coker is more, that is, copper core high density on matrix is distributed, the nano silver then deposited Major part will be using Nanometer Copper as core, on Nanometer Copper surface to outgrowth, and constructs a kind of surface plasmon resonance and hinder by force Buddhist nun's system.The film consistency being prepared is high, is conducive to conduction, simultaneously because nano silver surface plasmon resonance is pressed down System, the optical transmittance of film obtain larger raising.
Compared with the prior art, the beneficial effects of the present invention are embodied in:
The present invention enhances the photoelectric properties of nano silver film by deposition plating nanocrystalline Cu film, shows as sheet resistance reduction, transmitance It improves.Method is simple, is easily achieved, and has expanded application range of the nano silver film in terms of nano photoelectric device.
Detailed description of the invention
Fig. 1 is the nano thin-film schematic diagram that the present invention makes.
Fig. 2 is the optical absorption spectra for the nano thin-film that the present invention makes.
Specific embodiment
Present invention will be further explained below with reference to the attached drawings and examples, the present embodiment only provide it is a kind of prepare example, but The scope of this patent is not limited to this embodiment.
A method of enhancing nano silver film photoelectric properties, before preparing nano silver film to matrix, first in matrix Upper preparation nanometer Copper thin film, then prepares nano silver film on plating nanocrystalline Cu film, such as Fig. 1 of the membrane structure after the completion of preparing institute Show, including matrix 1, nanometer Copper thin film 2 and nano silver film 3.
In the present invention, the thickness of the nanometer Copper thin film prepared on matrix is greater than 3nm.Vacuum vapor plating is used on matrix Method prepare nanometer Copper thin film.When preparing nanometer Copper thin film using the method for vacuum vapor plating, DMDE-450 vacuum is used Coating machine places copper evaporation source in vacuum chamber, plated film chamber pressure is fallen below 7.0*10-4Pa, to loading copper evaporation source Molybdenum boat be powered, current regulation 120A.In the present invention, the method system of vacuum vapor plating is used on nanometer Copper thin film Standby nano silver film.It, will using DMDE-450 vacuum coating equipment when preparing nano silver film using the method for vacuum vapor plating The near 7.0*10 of vacuum degree-4Pa is powered to the molybdenum boat for loading silver-colored evaporation source, current regulation 100A.
Prepared sample sheet resistance value is as shown in table 1 through the invention.As can be seen from the table, 5 nano silvers are non-conductive, and 3 Nanometer Copper is non-conductive, but then conductive in 5 nano silver bottom deposit, 3 Nanometer Copper, and individual 10 nano silver is all non-conductive, can See, can significantly enhance nano silver film electric conductivity by depositing plating nanocrystalline Cu film.Solid line shown in Fig. 2 is that first deposition 4.0nm receives The absorption spectra of sample prepared by rice 5.0nm nanometers of silverskin of copper film redeposition, dotted line are the higher 10nm nano silver film of thickness Absorption spectra.It can be seen that absorption spectra shown in solid is lower than absorption spectra shown in dotted line, the transmitance of sample corresponding to corresponding solid line It is higher than sample corresponding to dotted line, therefore the transmitance of film is improved.
The sheet resistance value table of 1 nano silver film of table and the composite membrane being deposited on different-thickness nanometer Copper thin film
Sample Electric conductivity
Glass matrix -10.0nmAg It is non-conductive
Glass matrix -5.0nmAg It is non-conductive
Glass matrix -3.0nmCu It is non-conductive
Glass matrix -3.0nmCu-5.0nmAg 45KΩ/□
Glass matrix -4.0nmCu 450KΩ/□
Glass matrix -4.0nmCu-5.0nmAg 700Ω/□

Claims (6)

1. a kind of method for enhancing nano silver film photoelectric properties, it is characterised in that: first before preparing nano silver film to matrix Nanometer Copper thin film is first prepared on matrix, and nano silver film is then prepared on plating nanocrystalline Cu film.
2. a kind of method for enhancing nano silver film photoelectric properties according to claim 1, it is characterised in that: made on matrix The thickness of standby nanometer Copper thin film is greater than 3nm.
3. a kind of method for enhancing nano silver film photoelectric properties according to claim 1, it is characterised in that: on matrix Clean nanometer Copper thin film is prepared, the method for preparing Nanometer Copper includes but is not limited to vacuum evaporation coating, vacuum magnetic-control sputtering plating.
4. a kind of method for enhancing nano silver film photoelectric properties according to claim 3, it is characterised in that: use vacuum When the method for evaporation coating prepares nanometer Copper thin film, vacuum degree is higher than 1.0 × 10-3Pa, for using DMDE-450 type coating machine When being coated with, the molybdenum boat electrical current for loading evaporation source is 110-120A, and plated film time is not less than 60s.
5. a kind of method for enhancing nano silver film photoelectric properties according to claim 1, it is characterised in that: in Nanometer Copper Preparation cleaning nano silver film on film, the method for preparing nano silver film includes but is not limited to vacuum evaporation coating, vacuum magnetic control Sputtering plating.
6. a kind of method for enhancing nano silver film photoelectric properties according to claim 1, it is characterised in that: use vacuum When the method for evaporation coating prepares nano silver film, vacuum degree is higher than 1.0 × 10-3Pa loads the molybdenum boat electrical current of evaporation source For 90-100A, plated film time is not less than 90s.
CN201811054179.3A 2018-09-11 2018-09-11 Method for enhancing photoelectric performance of nano silver film Active CN109280890B (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2065486A1 (en) * 2007-11-30 2009-06-03 Commissariat à l'Energie Atomique Method of depositing metal nanoparticles by physical deposition in vapour phase
CN102660733A (en) * 2012-05-09 2012-09-12 复旦大学 Silver nanoparticle film with mixed valent state, preparation method thereof and application thereof
CN104681208A (en) * 2015-03-18 2015-06-03 合肥工业大学 Method for improving conductivity of nano-silver thin films
CN104818461A (en) * 2015-04-09 2015-08-05 河南科技大学 Nanometer silver clapped copper particle film composite material preparation method
CN105925935A (en) * 2016-05-17 2016-09-07 苏州市康普来表面处理科技有限公司 Physical vapor deposition technology applied to communication system assembly for replacing water electroplating
CN105925947A (en) * 2016-05-17 2016-09-07 河北大学 Nanometer multi-layer transparent conducting thin film
US20160343887A1 (en) * 2015-05-20 2016-11-24 King Fahd University Of Petroleum And Minerals Silver nanoparticles on conducting electrode as plasmonic scattering nanomaterial and related photovoltaic cells

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2065486A1 (en) * 2007-11-30 2009-06-03 Commissariat à l'Energie Atomique Method of depositing metal nanoparticles by physical deposition in vapour phase
CN102660733A (en) * 2012-05-09 2012-09-12 复旦大学 Silver nanoparticle film with mixed valent state, preparation method thereof and application thereof
CN104681208A (en) * 2015-03-18 2015-06-03 合肥工业大学 Method for improving conductivity of nano-silver thin films
CN104818461A (en) * 2015-04-09 2015-08-05 河南科技大学 Nanometer silver clapped copper particle film composite material preparation method
US20160343887A1 (en) * 2015-05-20 2016-11-24 King Fahd University Of Petroleum And Minerals Silver nanoparticles on conducting electrode as plasmonic scattering nanomaterial and related photovoltaic cells
CN105925935A (en) * 2016-05-17 2016-09-07 苏州市康普来表面处理科技有限公司 Physical vapor deposition technology applied to communication system assembly for replacing water electroplating
CN105925947A (en) * 2016-05-17 2016-09-07 河北大学 Nanometer multi-layer transparent conducting thin film

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