CN109278409B - A kind of MEMS piezoelectricity printing head component integrated morphology - Google Patents
A kind of MEMS piezoelectricity printing head component integrated morphology Download PDFInfo
- Publication number
- CN109278409B CN109278409B CN201810936218.6A CN201810936218A CN109278409B CN 109278409 B CN109278409 B CN 109278409B CN 201810936218 A CN201810936218 A CN 201810936218A CN 109278409 B CN109278409 B CN 109278409B
- Authority
- CN
- China
- Prior art keywords
- chip
- printing head
- driving
- control
- mems
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
Abstract
The invention discloses a kind of MEMS piezoelectricity printing head component integrated morphologies, the side of silicon interposer substrate is arranged in MEMS piezoelectricity printing head chip, driving/control IC chip is arranged in the silicon interposer substrate other side in package substrate setting between silicon interposer substrate and package substrate；Radiator is arranged in the package substrate other side, and package substrate one end is electrically connected by flexible circuit board with electrical interface；MEMS piezoelectricity printing head chip bonds together to form array arrangement ink chamber by Silicon Wafer, and each ink bottom of chamber portion is correspondingly arranged nozzle, the metal wiring layer of silicon interposer substrate upper and lower surface setting and the TSV via hole electrical connection of through-silicon interposer substrate.Present invention decreases the sizes of printing head component integration packaging, guarantee shortest electrical interconnection length and minimum interconnection resistance, the joule heat consumption of printing head component is reduced by small interconnection resistance, reduce the parasitic parameters such as interconnection resistance, capacitor and inductance, signal transmission attenuation, delay, distortion reduce, and printing head performance is promoted to be promoted.
Description
Technical field
The invention belongs to Advanced Electronic Encapsulating Technology fields, and in particular to a kind of integrated knot of MEMS piezoelectricity printing head component
Structure.
Background technique
MEMS piezoelectric ink jet printing head has the characteristics that high-resolution and high scalability, especially suitable for printed electronic, envelope
The application of the infant industries markets such as dress, weaving, 3D printing.Make compared with brake component with using monolithic piezoelectric ceramic body material, passes through
The piezoceramics film of sol-gel method or sputtering method deposition can control ink drop size preferably to adjust sum of the grayscale values and reduce function
Consumption, and become the piezoelectric actuator of mainstream in MEMS piezoelectric ink jet printing head.In order to obtain the printing effect of high quality, need pair
Each nozzle of print head carries out independent electric drive and electric control, adjusts the ink drop size of each nozzle in real time, and reduce phase
Crosstalk between adjacent nozzle.In the market usually only comprising MEMS spray head (packet in existing MEMS piezoelectric ink jet printing head component
Containing nozzle, ink channel, black chamber, movable diaphragm and piezoceramics film thereon etc.), without including driving and control circuit, at this time
Printing head component needs electrically to connect by one section of flexible or rigid printed circuit board with external driving and control circuit realization
It connects, farther out due to distance, the dead resistance of electrical connection is larger, under the big voltage operation mode of spray head, joule loss, signal transmission
It is limited that the factors such as loss, delay, distortion promote printing head performance.Driving and control circuit are integrated into printing head component
Portion becomes the development trend of MEMS piezoelectric ink jet printing head.
The print head assembly encapsulating structure of existing a kind of band IC chip (piezoelectric membrane driving circuit), using printing
Plate plate grade Surface Mount technology, IC chip is mounted on flexible printed circuit, then flexible printed circuit is mounted on MEMS spray head
On chip, the electrical connection of piezoelectric actuator passes through two exhausting holes of flexible printed circuit two sides on IC chip to MEMS spray head
Two rows electrode pad connection corresponding on MEMS head chip is realized, the disadvantage is that connecting between piezoelectric actuator and IC chip
Line is still longer, while the spray nozzle density that can be supported is limited.Another scheme uses silicon MEMS head chip and ic core
Piece forms electrical connection by the aspectant welding of soldered ball, and a flexible printed circuit is connected on silicon MEMS head chip, as entire
The external electric pathway of print head, encapsulation integrated morphology need to process prepared Chinese ink Vomitory, work in IC chip backside of wafer
Skill difficulty is larger.There are also the structures that a kind of MEMS head chip and IC chip wafer are integrated.First in a piece of SOI wafer
CMOS integrated circuit is prepared, then digs out piezoelectric ink chamber and movable diaphragm from the backside of wafer, MEMS is used in another wafer
Technique is prepared with ink feed slot and nozzle, is adhered to each other above-mentioned two wafer alignment using wafer stack bonding technology, most
Form piezoelectric material at the top in movable diaphragm region afterwards, disadvantage is as follows: (1) the part CMOS being located on movable diaphragm is integrated
Circuit is also and then moved together when piezoelectricity is braked, and the ess-strain in silicon crystal lattice will change the carrier mobility in semiconductor
Rate influences the performance of this part cmos circuit, while long-term cyclomorphosis also will affect the service life of cmos circuit.(2) wafer
On cmos circuit be not set solid cloth, that is, have a large amount of idle areas, this is not for the CMOS technology of area charging
Economical.(3) piezoelectric material eventually forms, and to the preparation process of piezoelectric material, especially technological temperature, there is harsh limitation.
Therefore, it is still to continue that building, which has high spray nozzle density, low cost, the MEMS piezoelectric ink jet printing head integrated morphology of high efficient and reliable,
Challenge.
Summary of the invention
In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the present invention is that providing a kind of MEMS piezoelectricity
Printing head component integrated morphology, with complete MEMS piezoelectricity printing head and its drive/control it is integrated between IC chip,
Particularly suitable between high density MEMS nozzle array piezoelectricity printing head and one or more driving/control IC chips
Hybrid integrated.
The invention adopts the following technical scheme:
A kind of MEMS piezoelectricity printing head component integrated morphology, including MEMS piezoelectricity printing head chip, silicon interposer substrate,
Package substrate, flexible circuit board and electrical interface；The side of silicon interposer substrate is arranged in MEMS piezoelectricity printing head chip, encapsulates base
The other side of silicon interposer substrate is arranged in plate, and driving/control ic core is provided between silicon interposer substrate and package substrate
Piece；The other side of package substrate is provided with radiator, and one end of package substrate is electrically connected by flexible circuit board with electrical interface；
MEMS piezoelectricity printing head chip bonds together to form black chamber by Silicon Wafer, and the bottom of black chamber array arrangement, each ink chamber is correspondingly arranged
There are nozzle, the metal wiring layer of silicon interposer substrate upper and lower surface setting and the TSV via hole electrical connection of through-silicon interposer substrate.
Specifically, driving/control IC chip is inverted in silicon interposer substrate and MEMS piezoelectricity printing head chip
On opposite surface, driving/control IC chip is opposite with MEMS piezoelectricity printing head chip position；Package substrate passes through
Salient point soldered ball is connect with silicon interposer substrate, and driving/control IC chip is connect by salient point with silicon interposer substrate, and driving/
Underfill is filled between control IC chip and silicon interposer substrate.
Specifically, driving/control IC chip is inverted on package substrate, driving/control IC chip and
It is ipsilateral that silicon interposer substrate is located at package substrate, driving/control IC chip and MEMS piezoelectricity printing head chip position phase
It is right；Package substrate is connect by salient point soldered ball with silicon interposer substrate, and driving/control IC chip passes through salient point and encapsulation base
Plate connection, driving/fill underfill between control IC chip and package substrate.
Specifically, driving/control IC chip passes through wire bonding line wire bonding on package substrate, driving/
It is ipsilateral that control IC chip and silicon interposer substrate are located at package substrate, driving/control IC chip and MEMS piezoelectricity
Printing head chip position is opposite or driving/control IC chip and silicon interposer substrate are distributed in the same of package substrate side by side
Side.
Further, array is provided with piezoelectric membrane braking between MEMS piezoelectricity printing head chip and silicon interposer substrate
Device, piezoelectric membrane brake include public lower electrode, piezoelectric membrane and top electrode, the top of the side of public lower electrode and black chamber
Connection, the other side connect with multiple piezoelectric membranes respectively, and the other side of piezoelectric membrane is connect with top electrode, public lower electrode and upper
Dielectric is provided between electrode, public lower electrode is connect by the second salient point soldered ball with silicon interposer substrate, each top electrode
It is connect by corresponding first salient point soldered ball with silicon interposer substrate, is electrically insulated between multiple first salient point soldered balls, multiple second
It is electrically connected between salient point soldered ball, the first salient point soldered ball is arranged in gap and side between the row of black chamber array, the second salient point soldered ball row
Cloth is in the other side of black chamber array.
Further, public lower electrode is pectination, and the second salient point welded ball array is located at comb back, and comb teeth direction is along electric current side
To the gap between comb teeth is located at the gap position of piezoelectric membrane brake, and the seam shape between comb teeth is according between each venting chamber
The shape that misplaces setting；The comb teeth width of public lower electrode is 100~1000 microns, and comb back width is 100~1000 microns, comb teeth
Between gap be 1~100 micron.
Further, multiple stress relief holes are provided on the full wafer metal film of public lower electrode layer, stress relief hole
Width is 5~50 microns, and length is 20~500 microns；Or the aperture of stress relief hole is 5~300 microns.
Further, MEMS piezoelectricity printing head chip surrounding setting sealing ring is for sealing piezoelectric membrane brake；The
The diameter of one salient point soldered ball and the second salient point soldered ball is 20~200 microns, the spacing in same row between the first salient point soldered ball with
The spacing of respective nozzle is identical；Row's spacing between first salient point soldered ball is identical as row's spacing of corresponding nozzle.
Specifically, being provided with aperture identical with driving/control IC chip size on package substrate, radiator is stretched
Enter aperture directly to connect with driving/control IC chip back side.
Specifically, the nozzle array on MEMS piezoelectricity printing head chip includes multiple groups, each nozzle array grouping is used
One driving/control IC chip is controlled and is driven, and multiple drivings/control IC chip forms driving/control
Ic core chip arrays.
Compared with prior art, the present invention at least has the advantages that
A kind of MEMS piezoelectricity printing head component integrated morphology of the present invention, the setting of MEMS piezoelectricity printing head chip turn in silicon
Connect the side of substrate, the other side of silicon interposer substrate is arranged in package substrate, between be provided with driving/control ic core
Piece；The other side of package substrate is provided with radiator, and one end of package substrate is electrically connected by flexible circuit board with electrical interface；Silicon
The metal wiring layer of interposer substrate upper and lower surface setting and the TSV via hole electrical connection of through-silicon interposer substrate；MEMS piezoelectricity is beaten
Print head chip bonds together to form black chamber by Silicon Wafer, and the bottom of black chamber array arrangement, each ink chamber is correspondingly arranged on nozzle, black chamber
Top be active film, be the piezoelectric membrane braking that public lower electrode, piezoelectric membrane and top electrode are constituted above active film
Device, when being subjected to certain voltage between upper/lower electrode and lower electrode, piezoelectric material deformation causes active film to be pressed down against ink chamber
Interior prepared Chinese ink sprays prepared Chinese ink from nozzle, and above-mentioned MEMS piezoelectricity printing head component integrated morphology realizes the printing of MEMS piezoelectricity
Head chip and its drive/control the three-dimensional integration between IC chip, effectively raise integration density, reduce
Integrated package volume, simultaneously because MEMS piezoelectricity printing head chip and its drive/control interconnection line between IC chip
Shorten, loss and crosstalk reduce, and effectively raise the performance of MEMS piezoelectricity printing head component, and reduce power consumption, flexible electrical
Road plate improves the subsequent flexibility assembled in printer arrangement part of print head assembly, while reducing subsequent assembly to printing
When the influence and destruction of head assembly, flexible circuit board guarantee MEMS piezoelectricity printing head component space are mobile in the application, electricity is connect
The position of mouth can be relatively fixed.
Further, driving/control IC chip and silicon interposer substrate ipsilateral, the driving/control that is located at package substrate
IC chip is opposite with MEMS piezoelectricity printing head chip position, forms a kind of PoP (Package-on-Package)
Integrated morphology is encapsulated, avoids and carries out two-sided face-down bonding in the silicon interposer substrate of strip, reduces the difficulty of micro-group dress,
It shortens with being electrically connected for electrical interface.
Further, driving/control IC chip drives through wire bonding line wire bonding on package substrate
It is dynamic/to control IC chip opposite with MEMS piezoelectricity printing head chip position or driving/control IC chip and silicon
Interposer substrate is distributed in the ipsilateral of package substrate side by side, further reduced micro-group dress difficulty, but integrated print head assembly
Size also obviously increases；Apply underfill or organic encapsulating between silicon interposer substrate and package substrate, can also driving/
It is first applied with mechanical irrigation closure material around control IC chip, protects driving/control IC chip and its surrounding key
Lead is closed, then applies underfill between silicon interposer substrate and package substrate.
Further, piezoelectric membrane brake array shares public lower electrode, MEMS of the public lower electrode in nozzle array
The side of piezoelectricity printing head chip is electrically connected with salient point soldered ball.Piezoelectric membrane brake electricity operating mode is similar to plate electricity
Hold, when applying high voltage to piezoelectric membrane brake, has instantaneous big charging current, it is thin from salient point soldered ball to each piezoelectricity
Lower electrode position corresponding to film brake has low-resistance current path, reduces line power consumption, and driving/control is integrated
Apply underfill between circuit chip and silicon interposer substrate, to reduce the stress on salient point, improves driving/domination set
At the reliability of circuit chip back-off mounting process.
Further, it is contemplated that electrode matel material and silicon materials and silica, nitridation under piezoelectric membrane brake
Thermal expansion coefficient difference between silicon etc., the lower electrode of piezoelectric membrane brake are interconnected in piezoelectric membrane brake array region
The public lower electrode metal of whole piece is formed, the lower metal electrode in blocks of large area can cause thermal stress issues, so that electric under metal
The problems such as there is bubble in polar region domain, cracking, film layer fall off.
Further, public lower electrode is pectination, alleviates the stress level of piezoelectric membrane brake array lower pole region,
Guarantee simultaneously big to having each piezoelectric membrane brake from the salient point welded ball array of electrode under connection piezoelectric membrane brake
Electric current through-current capability and small direct current pressure drop.
Further, when stress relief hole is rectangle, longitudinal direction is along current direction, to keep big electric current logical
Stream ability；Round stress relief hole has better isotropic, so that the metal film upper stress distribution of public lower electrode layer is more equal
It is even.
Further, it is realized by the sealing ring of the MEMS piezoelectricity printing head chip surrounding of nozzle array to piezoelectric membrane
The seal protection of brake, to improve reliability and the service life of piezoelectric membrane brake；Increasingly with same row's inner nozzle spacing
It is small, it is more and more thinner with the locular wall between black chamber adjacent in row, it is difficult to salient point soldered ball is placed on the locular wall in same row between adjacent ink chamber,
Row's spacing flexibility between multiple rows of nozzle row is larger, and the locular wall between row between adjacent ink chamber can design sufficiently thick, salient point weldering
Ball is arranged in gap and side between the row of black chamber array.
Further, integrated according to driving/control in driving/control IC chip corresponding position on package substrate
The size of circuit chip forms aperture, and radiator protrudes into aperture and directly reaches driving/control IC chip back side, with
Just good heat dissipation is provided for driving/control IC chip.
Further, nozzle is designed at certain fixation position of black cavity region, and the relative position of each nozzle and accordingly black chamber is solid
It is fixed, thus nozzle array and black chamber array there is identical arrangement period, nozzle respectively to arrange between successively misaligned nozzle in the horizontal direction
The horizontal direction equivalent density of nozzle can be improved 4 times in this way, improve printing head by a quarter of horizontal direction repetition period
Resolution ratio.
In conclusion one aspect of the present invention reduces the size of printing head component integration packaging, on the other hand protect as far as possible
Demonstrate,prove shortest electrical interconnection length and minimum interconnection resistance, due to piezoelectric material need at work driving chip provide big voltage,
The charge and discharge of high current, small interconnection resistance can reduce the joule heat consumption of printing head component, at the same electrical interconnection route shorten so that
The parasitic parameters such as interconnection resistance, capacitor and inductance reduce, and signal transmission attenuation, delay, distortion reduce, and promote printing head performance
It is promoted.
Below by drawings and examples, technical scheme of the present invention will be described in further detail.
Detailed description of the invention
Fig. 1 is the planar structure schematic diagram example one for the MEMS piezoelectricity printing head that multiple nozzles constitute nozzle array；
Fig. 2 is the planar structure schematic diagram example two for the MEMS piezoelectricity printing head that multiple nozzles constitute nozzle array；
Fig. 3 is the public lower electrode layer figure signal one of piezoelectric membrane brake array；
Fig. 4 is the public lower electrode layer figure signal two of piezoelectric membrane brake array；
Fig. 5 is the public lower electrode layer figure signal three of piezoelectric membrane brake array；
Fig. 6 is the public lower electrode layer figure signal four of piezoelectric membrane brake array；
Fig. 7 is the MEMS piezoelectricity printing head chip profile structural schematic diagram of nozzle array；
Fig. 8 is one longitudinal profile structure schematic of MEMS piezoelectricity printing head assembly embodiment of nozzle array；
Fig. 9 is one horizontal cross-section structure diagram of MEMS piezoelectricity printing head assembly embodiment of nozzle array；
Figure 10 is package substrate, flexible circuit board and the electric interface structure of the MEMS piezoelectricity printing head component of nozzle array
Schematic diagram；
Figure 11 is two structural schematic diagram of MEMS piezoelectricity printing head assembly embodiment of nozzle array；
Figure 12 is three structural schematic diagram of MEMS piezoelectricity printing head assembly embodiment of nozzle array；
Figure 13 is four structural schematic diagram of MEMS piezoelectricity printing head assembly embodiment of nozzle array；
Figure 14 is that the micro-group of embodiment one fills flow chart；
Figure 15 is that the micro-group of embodiment two fills flow chart.
Wherein: 1.MEMS piezoelectricity printing head chip；11. the first salient point soldered ball；12. the second salient point soldered ball；13. black chamber；
14. public lower electrode；15. stress relief hole；16. top electrode；17. nozzle；18. piezoelectric membrane；19. dielectric；2. silicon turns
Connect substrate；21.TSV via hole；22. sealing ring；23. driving/control IC chip；24. salient point；25. underfill material
Material；26. package substrate；27. soldered ball；28. flexible circuit board；29. radiator；30. electrical interface；31. aperture；32. wire bonding
Line.
Specific embodiment
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", "upper", "lower",
"front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " side ", " one end ", " one side " etc.
The orientation or positional relationship of instruction is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of the description present invention and letter
Change description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific orientation construct and
Operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are used for description purposes only, and cannot
It is interpreted as indication or suggestion relative importance or implicitly indicates the quantity of indicated technical characteristic.Define as a result, " the
One ", the feature of " second " can explicitly or implicitly include one or more of the features.In the description of the present invention,
Unless otherwise indicated, the meaning of " plurality " is two or more.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
The present invention provides a kind of MEMS piezoelectricity printing head component integrated morphologies, including MEMS piezoelectricity printing head chip
1, silicon interposer substrate 2, driving/control IC chip 23, package substrate 26, radiator 29 and flexible circuit board 28；
The MEMS piezoelectricity printing head chip 1 of nozzle array is inverted on a side surface of silicon interposer substrate 2, silicon switching base
Another side surface of plate 2 is welded on the surface of package substrate 26 by soldered ball 27, and radiator 29 is pasted onto the another of package substrate 26
Side, the flexible circuit board 28 with electrical interface 30 are connected with package substrate 26；
Driving/control IC chip 23 can be inverted in silicon interposer substrate 2 and MEMS piezoelectricity printing head chip 1
On opposite another surface, that is, drives/control IC chip 23 and MEMS piezoelectricity printing head chip 1 to be located at silicon and turn
The two sides of substrate 2 is connect, and drives/control IC chip 23 opposite with piezoelectricity printing head 1 position of chip MEMS；
Driving/control IC chip 23 can also be inverted on package substrate 26, driving/control IC chip
23 and silicon interposer substrate 2 to be located at package substrate 26 ipsilateral, and drive/control IC chip 23 and MEMS piezoelectricity to print and spray
1 position of head chip is opposite；
Driving/control IC chip 23 can also be with wire bonding on package substrate 26, driving/control integrated circuit
It is ipsilateral that chip 23 and silicon interposer substrate 2 are located at package substrate 26, and drives/control IC chip 23 and MEMS piezoelectricity to beat
It is opposite to print 1 position of head chip；
Driving/control IC chip 23 with wire bonding or can be inverted on package substrate 26, driving/domination set
It is ipsilateral to be located at package substrate 26 at circuit chip 23 and silicon interposer substrate 2, and drives/control IC chip 23 and silicon to turn
It connects substrate 2 and tiles side by side and be distributed on the same surface of package substrate 26.
When driving/control IC chip 23 is inverted in silicon interposer substrate 2 and MEMS piezoelectricity printing head chip 1 relatively
Another surface on when, beaten between MEMS piezoelectricity printing head chip 1 and driving/control IC chip 23 by MEMS piezoelectricity
The salient point on the first salient point soldered ball 11, the second salient point of soldered ball 12, driving/control IC chip 23 on print head chip 1
24, the TSV via hole 21 of the metal wiring layer on about 2 two surfaces of silicon interposer substrate and through-silicon interposer substrate 2
(Through-silicon-via) electrical connection is realized；
It, can be by multiple drivings/control IC chip 23 when MEMS piezoelectricity printing head chip 1 is elongated strip
It is arranged to make up one-dimensional array along 1 length direction of MEMS piezoelectricity printing head chip, jointly on MEMS piezoelectricity printing head chip 1
Each piezoelectric membrane brake drive/control.
Each driving/control IC chip control and driving are distributed in the piezoelectric membrane brake of its adjacent locations
(nozzle 17), these piezoelectric membrane brakes (nozzle 17) for being distributed in its adjacent locations constitute a grouping.
One dimensional driving/control IC chip array brakes the piezoelectric membrane on MEMS piezoelectricity printing head chip 1
Device opsition dependent is grouped driving/control.
Piezoelectric membrane 18 can be using the physical deposition methods formation such as sputtering, evaporation, be also possible to solidifying using colloidal sol-
What the chemical depositions such as glue, chemical reaction deposit were formed, can also laminar body piezoelectric, pass through high-precision micro-group at this time
Dress technique is mounted in active film.
Realize that the sealing to piezoelectric membrane brake is protected by the sealing ring 22 of 1 surrounding of MEMS piezoelectricity printing head chip
Shield, to improve reliability and the service life of piezoelectric membrane brake；Sealing ring 22 is usually organic material.
Driving/apply underfill 25 between control IC chip 23 and silicon interposer substrate 2, it is convex to reduce
Stress on point 24 improves the reliability that driving/control IC chip 23 is buckled to mounting process.
Silicon interposer substrate 2 is electrically connected by soldered ball 27 with package substrate 26, applies bottom between silicon switching base 2 and package substrate 26
Portion's packing material or organic Embedding Material.
In driving/23 corresponding position of control IC chip on package substrate 26, according to driving/control ic core
The size of piece 23 forms aperture 31.
Radiator 29 protrudes into aperture 31 and directly reaches driving/control IC chip 23 back side, to be driving/control
IC chip 23 processed provides good heat dissipation.
Package substrate 26 is electrically connected by one section of flexible circuit board 28 with the realization of electrical interface 30.Electrical interface 30 is entire nozzle
The external electrical connection interface of the MEMS piezoelectricity printing head component of array.The form of electrical interface 30 is various, is preferentially to insert i.e.
Pluggable connector.
Flexible circuit board 28 improves the subsequent flexibility assembled in printer arrangement part of print head assembly, reduces simultaneously
Influence and destruction of the subsequent assembly to print head assembly.
When flexible circuit board 28 guarantees MEMS piezoelectricity printing head component space is mobile in the application, the position of electrical interface 30
It can be relatively fixed.
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.The present invention being described and shown in usually here in attached drawing is real
The component for applying example can be arranged and be designed by a variety of different configurations.Therefore, below to the present invention provided in the accompanying drawings
The detailed description of embodiment be not intended to limit the range of claimed invention, but be merely representative of of the invention selected
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are obtained without creative efforts
The every other embodiment obtained, shall fall within the protection scope of the present invention.
Embodiment one:
Spray nozzle density is an important technology index of ink jet printing head, and spray nozzle density is bigger, the resolution of printing head
Rate is higher.Due to the limitation of nozzle minimum spacing, the density of single row of nozzles is very limited, constitutes nozzle array using multiple rows of nozzle
It is the effective means for improving spray nozzle density.The MEMS piezoelectricity printing head chip of nozzle array is in long narrow strip, and width is at 1 centimetre
Left and right, up to up to 7~10 centimetres.MEMS piezoelectricity printing head chip (group is only illustrated due to biggish length-width ratio, in figure
Part) along its length on part.
The floor map example that a kind of 4 row's nozzles composition nozzle array is provided in Fig. 1, wherein 4 row's nozzles do not have between respectively arranging
Have dislocation.For simplicity, the array arrangement of corresponding black chamber 13 is only drawn in Fig. 1, it is generally the case that nozzle 17 is designed at black chamber
Certain of 13 regions fixes position, and the relative position of each nozzle 17 and corresponding black chamber 13 is fixed, so nozzle array and black chamber array
There is identical arrangement period.
Fig. 2 provides the floor map example that another 4 row's nozzles constitute nozzle array, wherein 4 row's nozzles respectively arrange between
The a quarter of horizontal direction successively misaligned nozzle horizontal direction repetition period, in this way can be by the horizontal direction equivalent density of nozzle
Improve 4 times.The electricity working model of piezoelectric membrane brake is similar to capacitor, the upper/lower electrode 14,16 of piezoelectric membrane brake
Between apply voltage when, piezoelectric membrane 18 generate deformation.
With row nozzle between arrangement period can it is small to tens microns, ink cavity wall is more and more thinner, to meet increasing spray
Mouth density requirements, an electrode (lower electrode) for each piezoelectric membrane brake is in parallel, by public pin powered, then pass through
Control another electrode (top electrode) of each piezoelectric membrane brake independently to control the ink-jet of respective nozzle.It is connected in figure
It is to be electrically connected, and connect each piezoelectric membrane system between second salient point soldered ball 12 of the public lower electrode 14 of piezoelectric membrane brake
The lower electrode 14 of dynamic device.
Connect is electrical isolation, each first salient point between the first salient point soldered ball 11 of piezoelectric membrane brake top electrode 16
Soldered ball 11 connects the top electrode 16 of an adj acent piezoelectric film brake.
It is limited by MEMS piezoelectricity printing head heat resisting temperature, in particular by the limit of piezoelectric film material heat resisting temperature
System, connect electrode 14 under piezoelectric membrane brake the second salient point soldered ball 12 and connection piezoelectric membrane brake top electrode 16 the
One salient point soldered ball 11 uses low temperature solder materials, such as material containing indium, bismuth-containing.
First salient point soldered ball 11 and the specific location of the second salient point soldered ball 12 arrangement will avoid the work of piezoelectric membrane brake
Dynamic film portion avoids closing on piezoelectric membrane so that the first salient point soldered ball 11 and the second salient point soldered ball 12 are located at rigid region
When the active film movement of brake, stress impact that the first salient point soldered ball 11 and the second salient point soldered ball 12 are subject to.
The diameter of first salient point soldered ball 11 and the second salient point soldered ball 12 connection pressure in 20~200 micron ranges, same row
Spacing between first salient point soldered ball 11 of conductive film brake top electrode is by corresponding injector spacing (between corresponding ink chamber 13
Away from) determine, the spacing and phase in usual same row between the first salient point soldered ball 11 of connection piezoelectric membrane brake top electrode 16
The injector spacing (corresponding ink chamber spacing) answered is identical；Row's spacing of first salient point soldered ball 11 arranges spacing (phase by corresponding nozzle
The black chamber row spacing answered) it determines, usually between the row between the first salient point soldered ball 11 of connection piezoelectric membrane brake top electrode 16
Away from identical as corresponding nozzle row spacing (corresponding ink chamber arranges spacing).As same row's inner nozzle spacing is smaller and smaller, in row
Locular wall between adjacent ink chamber is more and more thinner, it is difficult to place the first salient point soldered ball 11 and the on the locular wall in same row between adjacent ink chamber
Two salient point soldered balls 12.Row's spacing flexibility between multiple rows of nozzle row is larger, what the locular wall between row between adjacent ink chamber can design
Sufficiently thick, as depicted in figs. 1 and 2, salient point soldered ball 11 is arranged in gap and side between the row of black chamber array.
Since multiple piezoelectric membrane brakes share the second salient point soldered ball 12, so the quantity of the second salient point soldered ball 12 and row
Mode for cloth is more flexible, but needs to meet current carrying capacity when connected piezoelectric membrane brake works at the same time.As Fig. 1~
Shown in 6, the second salient point soldered ball 12 is arranged in the other side of black chamber array, electricity under the second salient point soldered ball 12 and piezoelectric membrane brake
Pole 14 is directly electrically connected.In view of 14 metal material of electrode under piezoelectric membrane brake and silicon materials and silica, nitridation
Thermal expansion coefficient difference between silicon etc., the lower electrode 14 of piezoelectric membrane brake are interconnected in piezoelectric membrane brake array area
Domain forms the public lower electrode metal of whole piece, and the lower metal electrode in blocks of large area can cause thermal stress issues, so that under metal
The problems such as there is bubble in electrode zone, cracking, film layer fall off, in addition, the bar shaped because MEMS piezoelectricity printing head chip 1 is grown up,
Length-width ratio may cause MEMS wafer and MEMS chip warpage up to 10:1 or more, biggish stress.In order to alleviate piezoelectric membrane
The stress level of brake array lower pole region, while guaranteeing the second salient point from electrode 14 under connection piezoelectric membrane brake
12 array of soldered ball needs thin to piezoelectricity to having big electric current through-current capability and small direct current pressure drop between each piezoelectric membrane brake
The figure of the public lower electrode layer 14 of film brake array is designed.
In the public lower electrode layer figure of piezoelectric membrane brake array shown in Fig. 3, along current direction, piezoelectric membrane braking
The public lower electrode 14 of device array is divided into pectination.Connect 12 array of the second salient point soldered ball of electrode 14 under piezoelectric membrane brake
Positioned at comb back, gap of the comb teeth direction between current direction, comb teeth is located at the gap position of piezoelectric membrane brake, does not influence phase
The normal work of adjacent piezoelectric membrane brake.100~1000 microns of comb teeth width of the public lower electrode 14 of pectination, the width of comb back
100~1000 microns, 1~100 micron of the gap between comb teeth.
The public lower electrode layer figure of piezoelectric membrane brake array shown in Fig. 3 corresponds to MEMS nozzle array shown in FIG. 1
Array structure.For MEMS nozzle array structure shown in Fig. 2, due to Heterogeneous Permutation between each venting chamber, the public lower electrode of pectination
14 will also have corresponding change, as shown in Figure 4.The shape in the gap between comb teeth is according to the dislocation change in shape between each venting chamber.
The public lower electrode layer figure of piezoelectric membrane brake array of another low stress is as shown in Figure 5 and Figure 6, public
Stress relief hole 15 is dug on the full wafer metal film of lower electrode layer 14, stress relief hole 15 can be rectangle, square, circle
Deng, but not limited to this.Rectangle stress relief hole as shown in Figure 5 and round stress relief hole shown in fig. 6 are more common.
When stress relief hole 15 is rectangle, longitudinal direction is along current direction, to keep big electric current through-current capability.
5~50 microns of the width of rectangle stress relief hole 15,20~500 microns of length.
Round stress relief hole has better isotropic, so that the metal film upper stress distribution of public lower electrode 14 is more equal
It is even.5~300 microns of the aperture of round stress relief hole.
The arrangement of stress relief hole 15 can be the period and be uniformly distributed, and be also possible to non-uniform Distribution.Specific structure and work
Skill is different, and the distribution density of stress relief hole 15 is also different.The placement location of stress relief hole 15 will avoid piezoelectric membrane 18
Region, in order to avoid influence the work of the piezoelectric membrane brake.
AA ' straight line splits the MEMS piezoelectricity printing head chip 1 of nozzle array along Fig. 1, and cross-section structure is as shown in Figure 7.
MEMS piezoelectricity printing head bonds together to form black chamber 13 by Silicon Wafer, and nozzle 17 is arranged at black 13 bottom of chamber, is that activity is thin at the top of black chamber 13
Film, active film top are the piezoelectric membrane brakes that public lower electrode 14, piezoelectric membrane 18 and top electrode 16 are constituted.When powering on
When being subjected to certain voltage between pole 16 and public lower electrode 14, piezoelectric material deformation causes active film to be pressed down against black chamber 13
Interior prepared Chinese ink sprays prepared Chinese ink from nozzle 17；Piezoelectric membrane brake array shares public lower electrode 14, and public lower electrode 14 exists
The side of the MEMS piezoelectricity printing head chip 1 of nozzle array is electrically connected with the second salient point soldered ball 12.
Piezoelectric membrane brake electricity operating mode is similar to capacity plate antenna, is applying high voltage to piezoelectric membrane brake
When, instantaneous big charging current is had, to reduce line power consumption, is needed from the second salient point soldered ball 12 to each piezoelectric membrane
There is low-resistance current path in public lower 14 position of electrode corresponding to brake.The top electrode of each piezoelectric membrane brake
16 are independent from each other, and the first salient point soldered ball 11 of connection piezoelectric membrane brake top electrode is also mutually indepedent.
The MEMS piezoelectricity printing head component integrated morphology of nozzle array disclosed by the invention is as shown in figure 8, nozzle array
MEMS piezoelectricity printing head chip 1 and driving/control IC chip 23 be inverted in up and down the two of silicon interposer substrate 2 respectively
A surface.Electrical connection between the MEMS piezoelectricity printing head chip 1 and driving/control IC chip 23 of nozzle array passes through
Respective salient point soldered ball (the first salient point soldered ball 11, the second salient point soldered ball 12, salient point 24 etc.), silicon interposer substrate 2 in said chip
TSV (Through-silicon-via) via hole 21 of metal wiring layer and through-silicon interposer substrate 2 on upper and lower two surfaces
It realizes.On the one hand the size of printing head component integration packaging is reduced, on the other hand guarantees shortest electrical interconnection length and most
Small interconnection resistance.Since piezoelectric material needs driving chip to provide the charge and discharge of big voltage, high current, small interconnection electricity at work
Resistance can reduce the joule heat consumption of printing head component.Pass through the sealing of 1 surrounding of MEMS piezoelectricity printing head chip of nozzle array
Ring 22 realizes the seal protection to piezoelectric membrane brake, to improve reliability and the service life of piezoelectric membrane brake.
Please refer to Figure 14, driving/apply underfill between control IC chip 23 and silicon interposer substrate 2
25, to reduce the stress on salient point 24, improve the reliability that driving/control IC chip 23 is buckled to mounting process.Silicon
Interposer substrate 2 is electrically connected by soldered ball 27 with package substrate 26.Underfill can be applied between silicon interposer substrate 2 and package substrate 26
Material.In driving/23 corresponding position of control IC chip on package substrate 26, according to driving/control IC chip
23 size forms aperture 31.Radiator 29 protrudes into aperture 31 and directly reaches driving/23 back side of control IC chip,
To provide good heat dissipation for driving/control IC chip 23.
Package substrate 26 is electrically connected by one section of flexible circuit board 28 with the realization of electrical interface 30.Electrical interface 30 is entire nozzle
The external electrical connection interface of the MEMS piezoelectricity printing head component of array.The form of electrical interface 30 is various, is preferentially to insert i.e.
Pluggable connector.When flexible circuit board 28 guarantees MEMS piezoelectricity printing head component space is mobile in the application, electricity
It the position of interface 30 can be relatively fixed.Flexible circuit board 28 improves that print head assembly is subsequent to be assembled in printer arrangement part
Flexibility, while reducing influence and destruction of the subsequent assembly to print head assembly.
The length of flexible circuit board 28 is optional according to concrete application.It is flexible in MEMS piezoelectricity printing head component movement
The length and flexibility of circuit board 28 guarantee what the join domain between flexible circuit board 28 and package substrate 26, electrical interface 30 was subject to
It stretches and extrusion stress is within the join domain bonding strength allowed band.
The height of soldered ball 27 can be greater than the sum of 24 height of driving/23 thickness of control IC chip and salient point, such as Fig. 8
It is shown, it might be less that the sum of 24 height of driving/23 thickness of control IC chip and salient point, at this time on package substrate 26
Aperture 31 is slightly larger than driving/control IC chip 23 size, to drive/control the insertion of IC chip 23 to open
Hole 31.
Package substrate 26 can be organic substrate, and flexible circuit board 28 can be the one of each lamination of package substrate 26 at this time
Partially (such as middle layer or surface layer) is also possible to and package substrate 26 mutually independent (package substrate 26 and flexible circuit at this time
Electrical connection is formed using welding form between plate 28).Package substrate 26 is also possible to the inorganic substrates such as ceramics (package substrate 26 at this time
Electrical connection is formed using welding form between flexible circuit board 28).Package substrate 26 is also possible to identical as flexible circuit board 28
Organic flexible substrate, flexible circuit board 28 can be a part of each lamination of package substrate 26 at this time, be also possible to whole.
Flexible circuit board 28 and package substrate 26 can be integrated, be also possible to discrete.
29 material of radiator can be the metal materials such as aluminium, copper, alloy, but not limited to this.Radiator 29 and driving/control
Apply thermal interfacial material between IC chip 23, to reduce interface resistance, improves radiating efficiency.
The method of multiple piezoelectricity printing head component splicings is generallyd use to realize the wide cut printing of printer.High-precision is beaten
The requirement printed to splicing precision is very high, and splicing number increases, and splicing difficulty is increased sharply.In order to increase the printing breadth of printer, increase
The print span for adding single piezoelectricity printing head component is also an effective approach.At this moment just need to increase nozzle array
The length of nozzle is respectively arranged in MEMS piezoelectricity printing head chip top nozzle array.In the feelings for not changing each nozzle row's inner nozzle period
Under condition, increase nozzle quantity.The length of one nozzle row can achieve 70-100 millimeters or more.In view of the injection of same row's nozzle
It the problems such as synchronism, driving/control IC chip size, I/O number, cost, will be on MEMS piezoelectricity printing head chip
Nozzle array be transversely grouped, the grouping of each nozzle array is controlled using a driving/control IC chip
And driving.The nozzle array grouping of same row is controlled by different driving/control IC chip and driving, and difference row's is adjacent
The nozzle array for belonging to same grouping controlled by the same driving/control IC chip and driving.So on the one hand easily
In needing the isometric wiring of synchronous link in silicon interposer substrate 2, on the other hand it is easy to piezoelectricity printing head length component (breadth) expansion
Exhibition.It can be used for the MEMS piezoelectricity printing head chip of different length with a driving/control IC chip.Increase nozzle
Array length, or when increase nozzle array density, without change driving/control IC chip model, it is only necessary to increase number
Amount, while driving/control algolithm and driving/control program also have reproducibility.The MEMS piezoelectricity that Fig. 9 provides nozzle array is beaten
Nozzle component horizontal cross-section structure diagram is printed, wherein the case where only drawing two drivings/control IC chip, encapsulates base
Dig out two apertures according to two drivings/control IC chip positions and dimensions on plate 26, respectively expose two driving/
Control the back side of IC chip.
On radiator 29 according to two drivings/control IC chip positions and dimensions design two boss, two
Boss protrudes into two apertures, and by thermal interfacial material and two drivings/control IC chip rear-face contact, respectively
Two drivings/control IC chip provides good heat dissipation.Along the direction that nozzle array is arranged, multiple driving/domination sets
Driving in a row/control IC chip array is also organized at circuit chip 23.Nozzle array, black chamber array, piezoelectric membrane system
Dynamic device array is corresponding, there is the identical period.
Figure 10 provides package substrate 26, flexible circuit board 28 and the electricity in the MEMS piezoelectricity printing head component of nozzle array
The schematic diagram of 30 structure of interface；Package substrate 26 is also in elongated strip, and the aperture 31 of four rows corresponds on package substrate 26
Four drivings/control IC chip, each driving/control IC chip, which is only controlled and driven, is distributed in its surrounding
Piezoelectric membrane brake (nozzle), these piezoelectric membrane brakes (nozzle) for being distributed in its surrounding belong to same grouping.Each
Driving/control IC chip works independently.Have benefited from the multilayer wiring and high wiring density of flexible circuit board 28, flexible electrical
The width of road plate 28 can be less than the length of package substrate 26, to improve the curved flexibility of flexible circuit board 28.Flexible circuit
Plate 28 is broadened with 26 connecting pin width gradual change of package substrate.Electrical interface 30 can be individual interface, can also be by multiple parallel
Electrical interface composition.
Embodiment two:
Figure 15 is please referred to, driving/control IC chip 23 is inverted on package substrate 26, and underfill is arranged
Material 25；Again by soldered ball 27, realization is electrically connected with silicon interposer substrate 2, beats to realize with the MEMS piezoelectricity of nozzle array
Print the electrical connection of head chip 1.Silicon interposer substrate 2 is inverted in the same of package substrate 26 with driving/control IC chip 23
One surface, silicon interposer substrate 2 are located at 23 top of driving/control IC chip.Soldered ball 27 is distributed in silicon interposer substrate 2
Surrounding avoids driving/control IC chip 23 region.The height of soldered ball 27 is greater than driving/control IC chip 23
The sum of 24 height of thickness and salient point.Driving/apply underfill between control IC chip 23 and silicon interposer substrate 2
25, apply underfill or organic Embedding Material between silicon interposer substrate 2 and package substrate 26.The MEMS piezoelectricity of nozzle array
Two structural schematic diagram of printing head assembly embodiment is shown in Figure 11.
Embodiment two forms a kind of PoP (Package-on-Package) encapsulation integrated morphology.Compared with embodiment one
Compared with embodiment two, which is avoided, carries out two-sided face-down bonding in the silicon interposer substrate 2 of strip, reduces the difficulty of micro-group dress；
It shortens and (no longer needs through soldered ball 27) with being electrically connected for electrical interface 30；Driving/control IC chip 23 and nozzle array
MEMS piezoelectricity printing head chip 1 between electrical connection distance increased and (needed through soldered ball 27), but increase it is limited.It needs
Soldered ball 27 has big voltage, big alternating current ability to work.In addition, to driving/control IC chip 3 in embodiment two
Heat-sinking capability does not have embodiment one good.
Embodiment three:
The speed of each I/O pin of driving/control IC chip 23 is not high, and wire bonding also can satisfy drive
Dynamic/requirement of the control each I/O pin of IC chip 23 to through-current capability, direct current pressure drop and signal integrity, can adopt
It replaces the flipchip bump in embodiment two to be bonded with wire bonding, realizes driving/control IC chip 23 in encapsulation base
Micro-group dress on plate 26, to further decrease the difficulty of micro-group dress.Meanwhile because driving/control IC chip 23 directly pastes
On package substrate 26, driving/thermal resistance between control IC chip 23 and package substrate 26 is less than embodiment two, institute
To be better than embodiment two to driving/23 heat dissipation effect of control IC chip.The MEMS piezoelectricity printing head of nozzle array
Three structural schematic diagram of assembly embodiment is shown in attached drawing 12.Apply underfill between silicon interposer substrate 2 and package substrate 26 or has
Mechanical irrigation envelope, can also first be applied with mechanical irrigation closure material around driving/control IC chip 23, protect driving/domination set
Apply underfill at the bonding wire of circuit chip 23 and its surrounding, then between silicon interposer substrate 2 and package substrate 26.
Example IV:
The silicon of driving/control IC chip 23 and the MEMS piezoelectricity printing head chip 1 of carrying nozzle array is turned
2 assembled side-by-side of substrate is connect on package substrate 26.The connection that is electrically connected of driving/between control IC chip 23 and package substrate 26
Cross the realization of wire bonding line 32；The ball grid array being made up of soldered ball 27 is electrically connected between silicon interposer substrate 2 and package substrate 26
It realizes.Embodiment three further reduced micro-group dress difficulty, but the size of integrated print head assembly also obviously increases.
In conclusion the present invention realizes MEMS piezoelectricity printing head chip and it drives/control between IC chip
Three-dimensional integration, effectively raise the integration density of MEMS piezoelectricity printing head component, realize MEMS piezoelectricity printing
The integrated miniaturization of nozzle component, it is often more important that, MEMS piezoelectricity printing head chip and its drive/control IC chip
Between electrical interconnection line effectively shorten so that under the big voltage operation mode of spray head, joule loss is signal transmission attenuation, delay, abnormal
Change is effectively suppressed, and improves the overall performance of MEMS piezoelectricity printing head component.
In four embodiments, implement one integrated difficulty maximum, but implements one either in electrical property or hot property
Aspect is also best.From embodiment one to embodiment three, MEMS piezoelectricity printing head component, which integrates difficulty, successively to be weakened, although
Assembly volume does not have significant changes, but assembly property also can successively be deteriorated.In four embodiments, implement the four integrated difficulty for being
Minimum, from integrated package volume and aspect of performance also compared with other three embodiments it is poor, but compared with currently available technology,
MEMS piezoelectricity printing head component integrated morphology disclosed in implementing four still has superiority of effectiveness, is suitable for middle-end MEMS pressure
Electric printing head market.
The above content is merely illustrative of the invention's technical idea, and this does not limit the scope of protection of the present invention, all to press
According to technical idea proposed by the present invention, any changes made on the basis of the technical scheme each falls within claims of the present invention
Protection scope within.
Claims (10)
1. a kind of MEMS piezoelectricity printing head component integrated morphology, which is characterized in that including MEMS piezoelectricity printing head chip
(1), silicon interposer substrate (2), package substrate (26), flexible circuit board (28) and electrical interface (30)；MEMS piezoelectricity printing head core
Piece (1) setting is in the side of silicon interposer substrate (2), and package substrate (26) setting is in the other side of silicon interposer substrate (2), silicon switching
Driving/control IC chip (23) is provided between substrate (2) and package substrate (26)；The other side of package substrate (26)
It is provided with radiator (29), one end of package substrate (26) is electrically connected by flexible circuit board (28) with electrical interface (30)；MEMS
Piezoelectricity printing head chip (1) is bonded together to form black chamber (13) by Silicon Wafer, black chamber (13) array arrangement, the bottom of each ink chamber (13)
Portion is correspondingly arranged on nozzle (17), the metal wiring layer and through-silicon interposer substrate (2) of the setting of silicon interposer substrate (2) upper and lower surface
TSV via hole (21) electrical connection.
2. a kind of MEMS piezoelectricity printing head component integrated morphology according to claim 1, which is characterized in that driving/control
IC chip (23) processed is inverted on surface opposite with MEMS piezoelectricity printing head chip (1) on silicon interposer substrate (2),
Driving/control IC chip (23) is opposite with piezoelectricity printing head chip (1) position MEMS；Package substrate (26) passes through convex
Point soldered ball (27) is connect with silicon interposer substrate (2), and driving/control IC chip (23) passes through salient point (24) and silicon switching base
Plate (2) connection, driving/fill underfill (25) between control IC chip (23) and silicon interposer substrate (2).
3. a kind of MEMS piezoelectricity printing head component integrated morphology according to claim 1, which is characterized in that driving/control
IC chip (23) processed is inverted on package substrate (26), driving/control IC chip (23) and silicon interposer substrate
(2) ipsilateral positioned at package substrate (26), driving/control IC chip (23) and MEMS piezoelectricity printing head chip (1) position
It sets opposite；Package substrate (26) is connect by salient point soldered ball (27) with silicon interposer substrate (2), driving/control IC chip
(23) connect with package substrate (26) by salient point (24), driving/control IC chip (23) and package substrate (26) it
Between fill underfill (25).
4. a kind of MEMS piezoelectricity printing head component integrated morphology according to claim 1, which is characterized in that driving/control
For IC chip (23) processed through wire bonding line (32) wire bonding on package substrate (26), driving/control is integrated electric
It is ipsilateral that road chip (23) and silicon interposer substrate (2) are located at package substrate (26), driving/control IC chip (23) and MEMS
Piezoelectricity printing head chip (1) position is opposite or driving/control IC chip (23) and silicon interposer substrate (2) are distributed side by side
In the ipsilateral of package substrate (26).
5. a kind of MEMS piezoelectricity printing head component integrated morphology according to any one of claim 1 to 4, feature exist
In array is provided with piezoelectric membrane brake between MEMS piezoelectricity printing head chip (1) and silicon interposer substrate (2), and piezoelectricity is thin
Film brake includes public lower electrode (14), piezoelectric membrane (18) and top electrode (16), side and the ink of public lower electrode (14)
The top of chamber (13) connects, and the other side is connect with multiple piezoelectric membranes (18) respectively, the other side of piezoelectric membrane (18) with power on
Pole (16) connection, is provided with dielectric (19) between public lower electrode (14) and top electrode (16), and public lower electrode (14) is logical
It crosses the second salient point soldered ball (12) to connect with silicon interposer substrate (2), each top electrode (16) passes through corresponding first salient point soldered ball
(11) connect with silicon interposer substrate (2), be electrically insulated between multiple first salient point soldered balls (11), multiple second salient point soldered balls (12) it
Between be electrically connected, the first salient point soldered ball (11) is arranged in gap and side between the row of black chamber (13) array, the second salient point soldered ball (12)
It is arranged in the other side of black chamber (13) array.
6. a kind of MEMS piezoelectricity printing head component integrated morphology according to claim 5, which is characterized in that public lower electricity
Pole (14) is pectination, and the second salient point soldered ball (12) array is located at comb back, and gap of the comb teeth direction between current direction, comb teeth is located at
The gap position of piezoelectric membrane brake, the seam shape between comb teeth are arranged according to the dislocation shape between each venting chamber (13)；It is public
Descend altogether electrode (14) comb teeth width be 100~1000 microns, comb back width be 100~1000 microns, between comb teeth gap be 1~
100 microns.
7. a kind of MEMS piezoelectricity printing head component integrated morphology according to claim 5, which is characterized in that public lower electricity
It is provided with multiple stress relief holes (15) on the full wafer metal film of pole layer (14), the width of stress relief hole (15) is 5~50 micro-
Rice, length are 20~500 microns；Or the aperture of stress relief hole (15) is 5~300 microns.
8. a kind of MEMS piezoelectricity printing head component integrated morphology according to claim 5, which is characterized in that MEMS piezoelectricity
Printing head chip (1) surrounding setting sealing ring (22) is for sealing piezoelectric membrane brake；First salient point soldered ball (11) and
The diameter of two salient point soldered balls (12) is 20~200 microns, spacing and corresponding spray in same row between the first salient point soldered ball (11)
The spacing of mouth (17) is identical；Row's spacing between first salient point soldered ball (11) is identical as row's spacing of corresponding nozzle (17).
9. a kind of MEMS piezoelectricity printing head component integrated morphology according to claim 1, which is characterized in that package substrate
(26) aperture (31) identical with driving/control IC chip (23) size is provided on, radiator (29) protrudes into aperture
(31) it is directly connect with driving/control IC chip (23) back side.
10. a kind of MEMS piezoelectricity printing head component integrated morphology according to claim 1, which is characterized in that MEMS pressure
Nozzle array on electric printing head chip (1) includes multiple groups, and each nozzle array grouping is using the integrated electricity of a driving/control
Road chip (23) is controlled and is driven, and multiple drivings/control IC chip (23) forms driving/control IC chip
Array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810936218.6A CN109278409B (en) | 2018-08-16 | 2018-08-16 | A kind of MEMS piezoelectricity printing head component integrated morphology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810936218.6A CN109278409B (en) | 2018-08-16 | 2018-08-16 | A kind of MEMS piezoelectricity printing head component integrated morphology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109278409A CN109278409A (en) | 2019-01-29 |
| CN109278409B true CN109278409B (en) | 2019-07-23 |
Family
ID=65183651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810936218.6A Active CN109278409B (en) | 2018-08-16 | 2018-08-16 | A kind of MEMS piezoelectricity printing head component integrated morphology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109278409B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110366355B (en) * | 2019-07-12 | 2020-06-12 | 湖南维胜科技有限公司 | Flexible printed substrate |
| CN112265260A (en) * | 2020-09-28 | 2021-01-26 | 西安交通大学 | Integrated driving and controlling structure for array printing nozzle |
| CN114496350A (en) * | 2020-10-23 | 2022-05-13 | 荣耀终端有限公司 | Electrode, electronic device and device |
| CN114228341B (en) * | 2021-12-16 | 2023-04-14 | 山东中康国创先进印染技术研究院有限公司 | Piezoelectric ink jet head and ink jet printing equipment |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008034458A (en) * | 2006-07-26 | 2008-02-14 | Fujitsu Ltd | Defect inspection method and defect inspection device |
| JP2017094580A (en) * | 2015-11-24 | 2017-06-01 | セイコーエプソン株式会社 | Wiring structure, mems device, liquid injection head, liquid injection device, manufacturing method for mems device, manufacturing method for liquid injection head and manufacturing method for liquid injection device |
| JP6728718B2 (en) * | 2016-02-01 | 2020-07-22 | セイコーエプソン株式会社 | MEMS device and liquid jet head |
| JP6707974B2 (en) * | 2016-04-27 | 2020-06-10 | セイコーエプソン株式会社 | MEMS device, liquid ejecting head, and liquid ejecting apparatus |
| JP6708015B2 (en) * | 2016-06-27 | 2020-06-10 | セイコーエプソン株式会社 | MEMS device, liquid ejecting head, liquid ejecting apparatus, and method for manufacturing MEMS device |
| JP6714851B2 (en) * | 2016-06-28 | 2020-07-01 | セイコーエプソン株式会社 | MEMS device, liquid jet head, manufacturing method of MEMS device, and manufacturing method of liquid jet head |
| JP6805690B2 (en) * | 2016-09-30 | 2020-12-23 | セイコーエプソン株式会社 | A method for manufacturing a MEMS device, a liquid injection head, a liquid injection device, and a MEMS device. |
-
2018
- 2018-08-16 CN CN201810936218.6A patent/CN109278409B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN109278409A (en) | 2019-01-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109278409B (en) | A kind of MEMS piezoelectricity printing head component integrated morphology | |
| CN102339913B (en) | High-voltage LED (Light Emitting Diode) device and manufacturing method thereof | |
| US7619303B2 (en) | Integrated circuit package | |
| US7521724B2 (en) | Light emitting diode package and process of making the same | |
| US9437579B2 (en) | Multiple die face-down stacking for two or more die | |
| US20100171206A1 (en) | Package-on-Package Device, Semiconductor Package, and Method for Manufacturing The Same | |
| CN104716247A (en) | Light emitting device | |
| WO2012145477A1 (en) | Multiple die face-down stacking for two or more die | |
| TW201101398A (en) | Package process and package structure | |
| CN102832331B (en) | Wafer level LED packaging structure | |
| WO2006018671A1 (en) | Mixed wire semiconductor lead frame package | |
| CN110034212A (en) | The preparation method and transfer method of vertical structure bar shaped Micro-LED | |
| CN214043635U (en) | Intelligent power module and power electronic equipment | |
| CN202394958U (en) | Wafer-level semiconductor packaging structure | |
| CN107808873A (en) | Multiple cross tie parts between tube core | |
| CN202871783U (en) | Chip-embedded type stacking-wafer level packaging structure | |
| CN107275323B (en) | A kind of chip stack stereo encapsulation structure | |
| CN100414704C (en) | Plane flip-chip LED integrated chip and producing method | |
| CN113707787A (en) | Spherical inverted micro LED, manufacturing method thereof and display panel | |
| WO2014149579A1 (en) | Insulated top side bump connection for a power device, for example for gate, source and drain contacts of a power field effect transistor | |
| CN100382344C (en) | Light-emitting diode packaging structure and method for making same | |
| TW201240042A (en) | Flip-chip molded package having non-array bumps and its fabricating method | |
| TW201025554A (en) | Multiple flip-chip package | |
| CN114334857A (en) | Chip packaging structure and method | |
| CN212257453U (en) | Substrate, LED module and light-emitting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230612 Address after: Room 628, 1st Floor, Zone C, Building 24, Science and Technology Innovation Park, Gangwan 1, Jintang Road, Tangjiawan Town, High tech Zone, Zhuhai City, Guangdong Province, 519080 (centralized office area) Patentee after: Zhuhai Tiancheng Advanced Semiconductor Technology Co.,Ltd. Address before: No. 198, Taibai South Road, Yanta District, Xi'an City, Shaanxi Province Patentee before: XI'AN MICROELECTRONICS TECHNOLOGY INSTITUTE |
|
| TR01 | Transfer of patent right |