CN109274906A - Image processing apparatus - Google Patents
Image processing apparatus Download PDFInfo
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- CN109274906A CN109274906A CN201811291656.8A CN201811291656A CN109274906A CN 109274906 A CN109274906 A CN 109274906A CN 201811291656 A CN201811291656 A CN 201811291656A CN 109274906 A CN109274906 A CN 109274906A
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- 238000006243 chemical reaction Methods 0.000 claims abstract description 104
- 238000003384 imaging method Methods 0.000 claims abstract description 31
- 230000003287 optical effect Effects 0.000 claims description 54
- 230000005622 photoelectricity Effects 0.000 claims description 4
- 230000035945 sensitivity Effects 0.000 abstract description 5
- 230000007423 decrease Effects 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 description 19
- 238000003786 synthesis reaction Methods 0.000 description 18
- 230000005284 excitation Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 238000003860 storage Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000004364 calculation method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
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- 238000005516 engineering process Methods 0.000 description 2
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/024—Details of scanning heads ; Means for illuminating the original
- H04N1/028—Details of scanning heads ; Means for illuminating the original for picture information pick-up
- H04N1/03—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array
- H04N1/031—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array the photodetectors having a one-to-one and optically positive correspondence with the scanned picture elements, e.g. linear contact sensors
Abstract
This application provides a kind of image processing apparatus.The device includes: imaging sensor, including multiple identical photoelectric conversion chips arranged in the first direction, each photoelectric conversion chip includes multiple light-sensitive devices being arranged successively in a second direction, first direction is vertical with second direction, each light-sensitive device includes light receiving area, the area of two light receiving areas of the arbitrary neighborhood in one photoelectric conversion chip is identical and has interval in a second direction, any two interval it is of same size, the center of two photoelectric conversion chips of arbitrary neighborhood has the second spacing in a second direction, first direction and second direction are vertical with the thickness direction of photoelectric conversion chip respectively；Image processing unit is electrically connected with each photoelectric conversion chip, and multiple original images that image processing unit is used to export imaging sensor synthesize composograph, and the resolution ratio of composograph is at least twice of the resolution ratio of original image.The resolution ratio for the image that the device obtains is higher and sensitivity does not decline.
Description
Technical field
This application involves detection fields, in particular to a kind of image processing apparatus.
Background technique
At present, contact type image processing unit is answered extensively in fields such as facsimile machine, scanner, paper currency sorting and false distinguishings
With, with the development of production technology, the needs of production, contact type image processing unit is also gradually applied in industrial production,
Image recognition is carried out, flaw identifies.
The contact type image processing unit of the 600DPI of mainstream has been unable to meet the needs of production at present, needs more high-resolution
The contact type image processing unit of rate is coped with.It include photoelectric conversion chip in existing contact type image processing unit structure,
Photoelectric conversion chip carries out photoelectric conversion for receiving ambient light, and converts optical signals to electric signal.In photoelectric conversion chip
With multiple unthreaded holes, unthreaded hole can be arranged to according to the requirement of resolution sizes by corresponding size.It improves at contact type image
The main method of reason device resolution ratio is to reduce the area of unthreaded hole, increases the density of unthreaded hole, in this way in external light intensity and illumination
Between it is certain under conditions of, the received light quantity of unthreaded hole reduces, and the charge of generation is reduced, i.e., output voltage (sensitivity) also reduces therewith,
It is difficult to accurately identify image；In addition, high-resolution photoelectric conversion chip requires matching used optical lens resolution ratio also to have
High resolution ratio, but the resolution ratio of optical lens has arrived the limit.
Therefore, a kind of contact type image processing unit that can satisfy market to high-resolution demand is needed.
Disclosed information above is used only to reinforce the background technique to technology described herein in the background section
Understanding may include therefore certain information in background technique, these information are to those skilled in the art and not formed
The home known prior art.
Summary of the invention
The main purpose of the application is to provide a kind of image processing apparatus, to solve image procossing dress in the prior art
The problem of caused sensitivity declines when setting the resolution ratio raising of chip.
To achieve the goals above, according to the one aspect of the application, a kind of image processing apparatus is provided, at the image
Reason device includes: imaging sensor, including multiple identical photoelectric conversion chips arranged in the first direction, and each above-mentioned photoelectricity turns
Changing chip includes multiple light-sensitive devices being arranged successively in a second direction, and above-mentioned first direction is vertical with above-mentioned second direction, respectively
Above-mentioned light-sensitive device includes light receiving area, two above-mentioned light receiving areas of the arbitrary neighborhood in an above-mentioned photoelectric conversion chip
Area it is identical and in the above second direction have interval, the above-mentioned interval of any two it is of same size, on arbitrary neighborhood two
The center for stating photoelectric conversion chip has the second spacing, above-mentioned first direction and above-mentioned second direction point in the above second direction
It is not vertical with the thickness direction of above-mentioned photoelectric conversion chip；Image processing unit is electrically connected respectively with each above-mentioned photoelectric conversion chip
It connecing, multiple original images that above-mentioned image processing unit is used to export above-mentioned imaging sensor synthesize a composograph, on
The resolution ratio of composograph is stated as at least twice of the resolution ratio of above-mentioned original image.
Further, the projection of shape of the above-mentioned light receiving area of any two on the first plane is all the same, and above-mentioned first is flat
Face is parallel with above-mentioned first direction and above-mentioned second direction difference.
Further, projection of shape of the above-mentioned light receiving area in above-mentioned first plane be selected from circle, square, rectangle,
Any one oval with triangle.
Further, there are two above-mentioned photoelectric conversion chips, the maximum of each above-mentioned light receiving area in the above second direction
Width is X, and the width of above-mentioned second spacing is 1/3X~2/3X.
Further, the width of above-mentioned second spacing is 1/2X.
Further, the center of two above-mentioned photoelectric conversion chips of arbitrary neighborhood has between first on above-mentioned first direction
It is Y away from, maximum width of each above-mentioned light receiving area on above-mentioned first direction, above-mentioned first spacing is greater than Y, and preferably above-mentioned first
Spacing is 1/2Y+MY, wherein M is the natural number greater than 0.
Further, above-mentioned imaging sensor further include: framework, including the first accommodating chamber, above-mentioned photoelectric conversion chip position
In above-mentioned first accommodating chamber；Wiring board is located in above-mentioned first accommodating chamber, and above-mentioned photoelectric conversion chip is located at above-mentioned route
On the surface of plate.
Further, above-mentioned framework also has the second accommodating chamber, and above-mentioned second accommodating chamber is connected to above-mentioned first accommodating chamber,
Above-mentioned second accommodating chamber is located at the side far from above-mentioned wiring board of above-mentioned photoelectric conversion chip, and above-mentioned imaging sensor also wraps
Include: two along the spaced light source equipment of above-mentioned first direction, respectively first light source equipment and second light source equipment, two
Above-mentioned light source equipment is located in above-mentioned second accommodating chamber；Two along the spaced optical lens of above-mentioned first direction, respectively
First optical lens and the second optical lens, two above-mentioned optical lenses are located in above-mentioned second accommodating chamber and are located at above-mentioned first
Between light source equipment and above-mentioned second light source equipment, above-mentioned photoelectric conversion chip, which corresponds, receives above-mentioned optical lens outgoing
Light, each light receiving area of an above-mentioned photoelectric conversion chip is for the corresponding light for receiving an above-mentioned optical lens and projecting.
Further, above-mentioned optical lens is set with each above-mentioned light receiving area face of corresponding above-mentioned photoelectric conversion chip
It sets.
Further, above-mentioned second accommodating chamber has opening, above-mentioned image sensing far from the side of above-mentioned first accommodating chamber
Device further include: transparent panel rides upon the side far from above-mentioned second accommodating chamber of above-mentioned opening, the light being emitted from above-mentioned transparent panel
It is incident in each above-mentioned optical lens.
It is multiple by being arranged in a first direction in the image processing apparatus of the application using the technical solution of the application
Photoelectric conversion chip allows imaging sensor to export the identical original image of multiple resolution ratio, and image processing unit is to more
The original image of a equal resolution is synthesized, and twice of the composite diagram that resolution ratio is at least original image resolution is formed
Picture, so that the resolution ratio for the image that the image processing apparatus obtains is higher, such as uses the photoelectric conversion of 600DPI
Chip, then can be obtained by the high-resolution image of 1200DPI after image processing unit, and the image processing apparatus
Sensitivity do not decline.In addition, the scanning speed due to the imaging sensor can use the scanning of single photoelectric conversion chip
Speed, therefore, the scanning speed of the imaging sensor can be figure same resolution ratio and with a photoelectric conversion chip
As twice of the scanning speed of sensor.
Detailed description of the invention
The accompanying drawings constituting a part of this application is used to provide further understanding of the present application, and the application's shows
Meaning property embodiment and its explanation are not constituted an undue limitation on the present application for explaining the application.In the accompanying drawings:
Fig. 1 shows the structural schematic diagram of the embodiment of the imaging sensor of the image processing apparatus according to the application；
Fig. 2 shows the partial structural diagrams of the imaging sensor in a kind of embodiment of the application；
Fig. 3 shows the schematic diagram of two images of imaging sensor output；
Fig. 4 shows a kind of schematic diagram in synthesis region including multiple grids of the application；
Fig. 5 shows the schematic diagram after being provided with the first sub-pixel in synthesis grid；And
Fig. 6 is shown in synthesizing grid provided with after first sub-pixel and second sub-pixel, forms showing for resulting pixel
It is intended to.
Wherein, the above drawings include the following reference numerals:
1, framework；2, transparent panel；3, the first optical lens；4, the second optical lens；5, first light source equipment；6, the second light
Source device；7, wiring board；8, the first photoelectric conversion chip；9, the second photoelectric conversion chip；80, the first light receiving area；90, second
Light receiving area；10, original image；100, original pixels；220, resulting pixel；230, region is synthesized；200, grid；201, first
Sub-pixel；202, the second sub-pixel.
Specific embodiment
It is noted that following detailed description is all illustrative, it is intended to provide further instruction to the application.Unless another
It indicates, all technical and scientific terms used herein has usual with the application person of an ordinary skill in the technical field
The identical meanings of understanding.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular
Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, operation, device, component and/or their combination.
It should be understood that when element (such as layer, film, region or substrate) is described as at another element "upper", this yuan
Part can be directly on another element, or intermediary element also may be present.Moreover, in specification and claims, when
When description has element " connected " to another element, which " can be directly connected to " to another element, or pass through third element
" connected " to another element.
As background technique is introduced, the resolution ratio of image processing apparatus chip in the prior art is caused when improving
Sensitivity decline, as above in order to solve the problems, such as, present applicant proposes a kind of image processing apparatus.
In a kind of typical embodiment of the application, a kind of image processing apparatus is provided, the image processing apparatus packet
Include imaging sensor and image processing unit.
Wherein, imaging sensor includes multiple identical photoelectric conversion chips arranged in the first direction, as shown in Fig. 2,
Each above-mentioned photoelectric conversion chip includes multiple light-sensitive devices being arranged successively in a second direction, above-mentioned first direction and above-mentioned second
Direction is vertical, and each above-mentioned light-sensitive device includes light receiving area, on two of the arbitrary neighborhood in an above-mentioned photoelectric conversion chip
State light receiving area area it is identical and in the above second direction have interval, the above-mentioned interval of any two it is of same size, appoint
The center for two neighboring above-mentioned photoelectric conversion chip of anticipating has the second spacing in the above second direction, if tool there are three or
Three or more photoelectric conversion chips, then, the second spacing of any two photoelectric conversion chip in a second direction can phase
Together, it can also be different, above-mentioned first direction and above-mentioned second direction are vertical with the thickness direction of above-mentioned photoelectric conversion chip respectively,
Imaging sensor exports multiple original images, and the corresponding photoelectric conversion chip of an original image, i.e. a photoelectric conversion
Chip correspondence can export an original image, since the center of multiple photoelectric conversion chips has between second in a second direction
Away from, so that the corresponding test point of the original image that any two photoelectric conversion chip obtains is different, due to any two
Photoelectric conversion chip is identical, and the number of its corresponding original pixels should be identical in this way, the size of the original image of acquisition
Also identical, the corresponding test point of corresponding original pixels is different on such position, so that corresponding two originals in position
The gray value of beginning pixel may be different.
Image processing unit is electrically connected with each above-mentioned photoelectric conversion chip, and above-mentioned image processing unit is used for will be above-mentioned
Multiple original images of imaging sensor output synthesize a composograph, and the resolution ratio of above-mentioned composograph is above-mentioned original graph
At least twice of the resolution ratio of picture.Shown in fig. 1 is only including two photoelectric conversion chips being arranged successively along first direction
Imaging sensor, respectively the first photoelectric conversion chip 8 and the second photoelectric conversion chip 9, since Fig. 1 is sectional view, so light
The arranging situation of electric conversion chip in a second direction does not show that.
In above-mentioned image processing apparatus, by the way that multiple photoelectric conversion chips are arranged in a first direction, so that image passes
Sensor can export the identical original image of multiple resolution ratio, image processing unit to the original images of multiple equal resolutions into
Row synthesis forms twice of the composograph that resolution ratio is at least original image resolution, so that the image processing apparatus
The resolution ratio of obtained image is higher, such as uses the photoelectric conversion chip of 600DPI, then passing through image processing unit
It can be obtained by the high-resolution image of 1200DPI afterwards.In addition, the scanning speed due to the imaging sensor can be using single
The scanning speed of a photoelectric conversion chip (600DPI), therefore, the scanning speed of the imaging sensor can be same resolution ratio
And twice of scanning speed of the imaging sensor with a photoelectric conversion chip (1200DPI).
It includes part that the shape of the photosensitive reception area of any two of the application, which may be the same or different difference here,
Different different from whole, as long as area is identical, those skilled in the art can connect arbitrarily photosensitive according to the actual situation
It receives area and is set as same or different shape.
In order to simplify the structure and technique of photoelectric conversion chip, in a kind of embodiment of the application, as shown in Fig. 2, arbitrarily
The projection of shape of two above-mentioned photosensitive reception areas on the first plane is all the same, above-mentioned first plane and above-mentioned first direction and upper
It is parallel to state second direction difference.
The shape of the projection of the photosensitive reception area of the application on the first plane can choose any shape in the prior art
Shape, including any regularly or irregularly shape, those skilled in the art simultaneously can be according to the actual situation by photosensitive reception areas
It is set as suitable shape.
In a kind of specific embodiment of the application, projection of shape choosing of the above-mentioned photosensitive reception area in above-mentioned first plane
From circle, square, rectangle, any one oval with triangle.In photoelectric conversion chip as shown in Figure 2, above-mentioned light
Projection of shape of the quick reception area in above-mentioned first plane is rectangle.
In a kind of specific embodiment, as depicted in figs. 1 and 2, there are two above-mentioned photoelectric conversion chips, and such image passes
The structure of sensor is simpler, and can guarantee that the resolution ratio for the composograph that the image processing apparatus obtains is original image
Twice.In order to further ensure the accuracy of composograph, in a kind of embodiment of the application, each above-mentioned light receiving area is above-mentioned
Maximum width in second direction is X, and the width of above-mentioned second spacing is 1/3X~2/3X.
In order to further increase the accuracy for the composograph that image processing apparatus obtains, a kind of embodiment of the application
In, as shown in Fig. 2, the width of above-mentioned second spacing is 1/2X.
In another embodiment of the application, the center of two above-mentioned photoelectric conversion chips of arbitrary neighborhood is in above-mentioned first party
There is the first spacing upwards, maximum width of each above-mentioned light receiving area on above-mentioned first direction is Y, and above-mentioned first spacing is greater than
Y enables to two rows of light receiving areas on first direction not to be overlapped in structure in this way.
In order to guarantee that two rows of light receiving areas can scan all pixels point on first direction, preferably above-mentioned first spacing
For 1/2Y+MY, wherein M is the natural number greater than 0.
In a kind of specific embodiment of the application, as shown in Figure 1, above-mentioned imaging sensor further includes framework 1 and route
Plate 7, framework 1 include the first accommodating chamber, and above-mentioned photoelectric conversion chip is located in above-mentioned first accommodating chamber；Wiring board 7 is located at above-mentioned
In first accommodating chamber, and above-mentioned photoelectric conversion chip is located on the surface of above-mentioned wiring board 7, which is conducting wire plate.
In another embodiment of the application, as shown in Figure 1, above-mentioned framework also has the second accommodating chamber, above-mentioned second holds
Chamber of receiving is connected to above-mentioned first accommodating chamber, and above-mentioned second accommodating chamber is located at the separate above-mentioned wiring board 7 of above-mentioned photoelectric conversion chip
Side, above-mentioned imaging sensor further includes two light source equipments and two optical lenses, and two light source equipments are respectively first
Light source equipment 5 and second light source equipment 6, two above-mentioned light source equipments are located in above-mentioned second accommodating chamber；Two optical lenses point
Not Wei the first optical lens 3 and the second optical lens 4, two above-mentioned optical lenses are located in above-mentioned second accommodating chamber and are located at upper
It states between first light source equipment 5 and above-mentioned second light source equipment 6, above-mentioned photoelectric conversion chip, which corresponds, receives above-mentioned optical lens
Each light receiving area of the light of mirror outgoing, an above-mentioned photoelectric conversion chip receives what an above-mentioned optical lens projected for corresponding
Light.Two light source equipments and two optical lenses are arranged each along first direction interval.
When being worked using above-mentioned imaging sensor, the illumination that light source equipment issues is mapped on determinand, the figure on determinand
Picture, text etc. generate reflected light and excitation light, and a part of reflected light and excitation light scanned on determinand enters in optical lens,
The reflected light and excitation light that the optical lens other end comes out are irradiated in photoelectric conversion chip, and photoelectric conversion chip is receiving
Optical signal is converted into electric signal, and determinand constantly moves, and documented image, text information will be read continuously and remove thereon
Come, completes the image information scanning process of determinand.Above-mentioned light source, optical lens and photoelectric conversion chip corresponds, i.e.,
The light that one light source issues is entered after determinand in a corresponding optical lens, and the emergent light of optical lens is irradiated to
A corresponding photoelectric conversion chip, and this part light needs to enter the light receiving area of photoelectric conversion chip.
Above-mentioned light receiving area and optical lens face setting, the i.e. emergent light of optical lens can shine directly into up and down
In light receiving area, certainly, light receiving area and optical lens may not be face setting up and down, the emergent light of such optical lens
It is entered back into light receiving area by reflecting device etc..
In order to simplify the structure of image sensor chip, in a kind of embodiment of the application, above-mentioned optical lens with it is corresponding
Above-mentioned photoelectric conversion chip each above-mentioned light receiving area face setting.
In another embodiment of the application, as shown in Figure 1, above-mentioned second accommodating chamber far from above-mentioned first accommodating chamber one
Side has opening, and above-mentioned imaging sensor further includes transparent panel 2, and transparent panel 2 rides upon holding far from above-mentioned second for above-mentioned opening
Receive the side of chamber, the light being emitted from above-mentioned transparent panel 2 is incident in each above-mentioned optical lens.Transparent panel on the one hand can be to framework
Interior structure is protected, on the other hand, it is ensured that most light can by transparent panel reach optical lens or to
It surveys on object, specifically, the light that light source issues is irradiated on determinand by transparent panel, and image, text on determinand etc. generate
Reflected light and excitation light, a part of reflected light and excitation light scanned on determinand enter in optical lens by transparent panel.
It should be noted that in the art, photoelectric conversion chip is also referred to as image sensor chip.
It should be noted that the image processing unit of the application can for it is in the prior art it is any can be to multiple original
The unit that image is synthesized, it is former that those skilled in the art can select suitable image processing unit to carry out according to the actual situation
The synthesis of beginning image.
In a kind of embodiment of the application, as shown in figure 3, above-mentioned original image 10 includes multiple original pixels 100, and more
The original pixels of a above-mentioned original image 10 correspond, and the corresponding region of each above-mentioned original pixels is synthesis region 230, above-mentioned
Image composing unit includes grid dividing module, gray scale assignment module and computing module.
Wherein, grid dividing module is electrically connected with above-mentioned image acquisition unit, above-mentioned grid dividing module be used for according to
Each above-mentioned synthesis region 230 is divided into N row N and arranges a grid 200, specifically, such as works as image by the quantity for stating original image 10
Acquiring unit obtains two original images, then grid dividing module is divided into the grid that 2 rows 2 arrange for region is synthesized, works as figure
When obtaining three original images as acquiring unit, grid dividing module is divided into the grid that 2 rows 2 arrange for region is synthesized, such as Fig. 4 institute
Show；
Gray scale assignment module is electrically connected with above-mentioned grid dividing module, and above-mentioned gray scale assignment mould is used for multiple reciprocal correspondences
The gray values of above-mentioned original pixels correspond gray value as multiple above-mentioned grids 200, multiple first sub-pixels of formation
201, the orientation of multiple above-mentioned first sub-pixels 201 is identical as the orientation of mutual corresponding multiple above-mentioned test points,
For example, when two original images obtained are respectively the first original image and the second original image, wherein the first original image
The test point of any one test point and corresponding second original image putting in order in a first direction, then, the two
Two the first sub-pixels that original pixels on original image are correspondingly formed putting in order in a first direction.It specifically can be with
Referring to Fig. 3 and Fig. 5, the P1 (i, j) in Fig. 5 is the original pixels on the first original image, and P2 (i, j) is on the second original image
Original pixels, in Fig. 3, the first original image is upper left original image, and the second original image is the image of lower right, this
In upper left side and lower right be the direction judged in face of paper or computer screen, and multiple above-mentioned first sub-pixels
201 in same a line and not in same row；
Computing module is electrically connected with above-mentioned gray scale assignment module and above-mentioned grid dividing module, and above-mentioned computing module is used
In calculating other not by the upper of tax gray value according to the gray value of above-mentioned first sub-pixel 201 in each above-mentioned synthesis region 230
The gray value of grid 200 is stated, forms multiple second sub-pixels 202, and then above-mentioned synthesis region 230 corresponds and forms synthesized image
Element 220, multiple above-mentioned resulting pixel 220 form above-mentioned composograph.Just the original image of multiple low resolution is synthesized in this way
For high-resolution composograph.
Specifically, above-mentioned computing module calculate in each above-mentioned synthesis region 230 with respectively not by the above-mentioned net of tax gray value
The average value of the gray value of adjacent multiple above-mentioned first sub-pixels 201 of lattice 200 obtains each not by the above-mentioned grid of tax gray value
200 gray value.In embodiment as shown in Figure 5, the grid of blank is not by the grid of tax gray value, using others
The gray value of grid through being assigned calculates the gray value of the grid that these are not assigned, that is, utilizes the gray scale of the first sub-pixel
Value calculates not by the corresponding gray value of the grid of tax gray value.Specific formula for calculation is
Wherein, i indicates the column sequence of grid, and j indicates mesh row sequence, and n indicates on original image pixel number in the transverse direction
Maximum value, m indicate the maximum value of the pixel number on longitudinal direction on original figure, and longitudinal direction is first direction.Above-mentioned P (2i, 1)
The gray value for indicating the grid of the even column of the first row, as i=n, P (2n, 1) indicates the last one even column of the first row
The gray value of grid.P (1,2j) indicates that the gray value of the grid of the even number line of first row, P (1,2m) indicate the last of first row
The gray value of the grid of one even number line, P (2i-1,2j) indicate the corresponding gray value of grid of the column second from the bottom of even number line, P
The corresponding gray value of grid of the row second from the bottom of (2i, 2j-1) even column, P (2n-1,2j) indicate the second from the bottom of even number line
The corresponding gray value of the grid of column, the corresponding gray value of grid of the row second from the bottom of P (2i, 2m-1) even column.
In order to obtain more accurate gray value, in a kind of embodiment of the application, above-mentioned computing module calculates each above-mentioned
Synthesize in region 230 with respectively not by the gray scale of adjacent all above-mentioned first sub-pixels 201 of the above-mentioned grid 200 of tax gray value
The average value of value obtains each not by the gray value of the above-mentioned grid 200 of tax gray value.As top calculation formula, using one
The gray values of all first sub-pixels around abortive haul lattice calculates its corresponding gray value.
In another embodiment of the application, above-mentioned image processing apparatus further include control unit, program storage unit (PSU) and
Display unit, control unit are electrically connected with above-mentioned image acquisition unit and above-mentioned image composing unit, above-mentioned control list
Member is at least controlling the work of above-mentioned image acquisition unit and above-mentioned image composing unit；Program storage unit (PSU) and above-mentioned control
Unit processed and above-mentioned image composing unit are electrically connected, above procedure storage unit for store above-mentioned control unit and
State the program of image composing unit execution；Display unit is electrically connected respectively with above-mentioned image composing unit and above-mentioned control unit
It connects, above-mentioned display unit is used to show the image of above-mentioned image composing unit synthesis.
In another embodiment of the application, above-mentioned image processing apparatus further includes image storage unit, and image storage is single
First to be electrically connected with above-mentioned image composing unit and above-mentioned control unit, above-mentioned image storage unit is for storing above-mentioned figure
The above-mentioned composograph synthesized as synthesis unit.
In a kind of specific embodiment of the application, above-mentioned image processing apparatus further includes bus, is led between each unit
Bus electrical connection is crossed, i.e., by bus come receiving and transmitting signal, bus is signal wire.
In order to enable those skilled in the art can clearly understand the technical solution and technical effect of the application, with
Under will illustrate in conjunction with specific embodiments.
Embodiment
Image processing apparatus includes that imaging sensor, image processing unit, display unit, program storage unit (PSU), image are deposited
Storage unit, control unit and bus.Wherein, as depicted in figs. 1 and 2, imaging sensor arranges along a first direction including two
Photoelectric conversion chip, respectively the first photoelectric conversion chip 8 and the second photoelectric conversion chip 9, each photoelectric conversion chip packet
Multiple light-sensitive devices arranged along second direction are included, each light-sensitive device includes a light receiving area, i.e., each photoelectric conversion core
Piece includes multiple light receiving areas arranged along second direction, and the first photoelectric conversion chip 8 includes multiple first light receiving areas 80,
Second photoelectric conversion chip 9 includes multiple second light receiving areas 90.
Each above-mentioned light receiving area be rectangle reception area, i.e., on the first plane be projected as rectangle, in above-mentioned second direction
On width be X, width in a first direction is Y, the center of the first photoelectric conversion chip and the second photoelectric conversion chip
Center is 1/2X in the width of the second spacing of second direction, and the width of the first spacing in a first direction is 1/2Y+Y, i.e.,
The corresponding any two original pixels 100 for two original images 10 that two photoelectric conversion chips obtain are wrong in a first direction
Position 1/2Y+Y, misplace 1/2X in a second direction, and two original images 10 that two photoelectric conversion chips obtain are as shown in Figure 3.
Imaging sensor further includes framework 1,7, two light source equipments of wiring board, two optical lenses and transparent panel 2.Its
In, framework 1 includes the first accommodating chamber and the second accommodating chamber of connection, and photoelectric conversion chip is located in above-mentioned first accommodating chamber, on
The side far from above-mentioned wiring board 7 that the second accommodating chamber is located at above-mentioned photoelectric conversion chip is stated, two above-mentioned optical lenses are located at
In above-mentioned second accommodating chamber and between above-mentioned first light source equipment 5 and above-mentioned second light source equipment 6, above-mentioned second accommodating chamber
Side far from above-mentioned first accommodating chamber has opening, and transparent panel 2 rides upon separate above-mentioned second accommodating chamber of above-mentioned opening
Side, two optical lenses are arranged each along first direction interval.
First light source equipment 5, the first optical lens 3 and the first photoelectric conversion chip 8 are correspondingly arranged, second light source equipment 6,
Second optical lens 4 and the second photoelectric conversion chip 9 are correspondingly arranged.
At work, determinand is placed on the top of transparent panel 2 to the image processing apparatus, what first light source equipment 5 issued
Light is irradiated on determinand by transparent panel, and image, text on determinand etc. generate reflected light and excitation light, scans determinand
On a part of reflected light and excitation light enter in the first optical lens 3 by transparent panel 2, the first optical lens 3 is another to be brought out
The reflected light and excitation light come are irradiated in the first photoelectric conversion chip 8, the first optical signal received of photoelectric conversion chip 8
It is converted into electric signal.The light that second light source equipment 6 issues is irradiated on determinand by transparent panel 2, image, text on determinand
Word etc. generates reflected light and excitation light, and a part of reflected light and excitation light scanned on determinand enters second by transparent panel 2
In optical lens 4, the reflected light and excitation light that 4 other end of the second optical lens comes out are irradiated in the second photoelectric conversion chip 9,
Second optical signal received of photoelectric conversion chip 9 is converted into electric signal.
The original image that image processing unit obtains photoelectric conversion chip synthesizes, the resolution of the two original images
Rate is all 600DPI, and the Data Synthesis of two original images has just been obtained the synthesis of 1200DPI resolution ratio by image processing unit
Image.Also, 2 times faster than same high resolution sensor of the scanning speed of the image processing apparatus.
Specifically, image processing unit includes grid dividing module, gray scale assignment module and computing module.
Wherein, grid dividing module is electrically connected with above-mentioned image acquisition unit, and above-mentioned grid dividing module will synthesize region
It is divided into the grid 200 of 2 rows 2 column, as shown in Figure 4；
Gray scale assignment module is electrically connected with above-mentioned grid dividing module, and above-mentioned gray scale assignment mould is used for mutually right by two
The gray value for the above-mentioned original pixels answered corresponds the gray value as two above-mentioned grids 200, forms two the first sub- pictures
Element 201, as shown in figure 5, the P1 (i, j) in Fig. 5 is the original pixels on the first original image, P2 (i, j) referring to Fig. 3 and Fig. 5
For the original pixels on the second original image, in Fig. 3, the first original image is upper left original image, the second original image
For the image of lower right, upper left side and lower right here is the direction judged in face of paper or computer screen；
Computing module is electrically connected with above-mentioned gray scale assignment module and above-mentioned grid dividing module, and above-mentioned computing module is used
In calculating other not by the upper of tax gray value according to the gray value of above-mentioned first sub-pixel 201 in each above-mentioned synthesis region 230
State the gray value of grid 200, specifically, computing module calculate in each above-mentioned synthesis region 230 with respectively not by tax gray value
The average value of the gray value of above-mentioned all adjacent above-mentioned first sub-pixels 201 of grid 200 obtains each not by the upper of tax gray value
The gray value of grid 200 is stated, and then forms multiple second sub-pixels 202, and then above-mentioned synthesis region 230 corresponds to be formed and close
Pixel 220, as shown in fig. 6, multiple above-mentioned resulting pixel 220 form above-mentioned composograph.So just by multiple low resolution
Original image synthesize high-resolution composograph.
Specific calculation formula is as follows:
Wherein, i indicates the column sequence of grid, and j indicates mesh row sequence, and n indicates on original image pixel number in the transverse direction
Maximum value, m indicate the maximum value of the pixel number on longitudinal direction on original figure, and longitudinal direction is first direction.Above-mentioned P (2i, 1)
The gray value for indicating the grid of the even column of the first row, as i=n, P (2n, 1) indicates the last one even column of the first row
The gray value of grid.P (1,2j) indicates that the gray value of the grid of the even number line of first row, P (1,2m) indicate the last of first row
The gray value of the grid of one even number line, P (2i-1,2j) indicate the corresponding gray value of grid of the column second from the bottom of even number line, P
The corresponding gray value of grid of the row second from the bottom of (2i, 2j-1) even column, P (2n-1,2j) indicate the second from the bottom of even number line
The corresponding gray value of the grid of column, the corresponding gray value of grid of the row second from the bottom of P (2i, 2m-1) even column.
Control unit is electrically connected with above-mentioned image acquisition unit and above-mentioned image processing unit, above-mentioned control unit
For controlling the work of other units；Program storage unit (PSU) passes through bus and above-mentioned control unit and above-mentioned image processing unit
It is electrically connected, the program that above procedure storage unit is used to store above-mentioned control unit and above-mentioned image processing unit executes；
Display unit is electrically connected by bus and above-mentioned image processing unit and above-mentioned control unit, and above-mentioned display unit is used for
Show the image of above-mentioned image processing unit synthesis；Image storage unit passes through bus and above-mentioned image processing unit and above-mentioned
Control unit is electrically connected, and above-mentioned image storage unit is used to store the above-mentioned composite diagram of above-mentioned image processing unit synthesis
Picture.
It can be seen from the above description that the application the above embodiments realize following technical effect:
In the image processing apparatus of the application, by the way that multiple photoelectric conversion chips are arranged in a first direction, so that image
Sensor can export the identical original image of multiple resolution ratio, original image of the image processing unit to multiple equal resolutions
It is synthesized, forms twice of the composograph that resolution ratio is at least original image resolution, so that image procossing dress
The resolution ratio for the image set is higher, such as uses the photoelectric conversion chip of 600DPI, then passing through image procossing list
It can be obtained by the high-resolution image of 1200DPI after member.In addition, the scanning speed due to the imaging sensor can use
The scanning speed of single photoelectric conversion chip, therefore, the scanning speed of the imaging sensor can for same resolution ratio and have
There is twice of the scanning speed of the imaging sensor of a photoelectric conversion chip.
The foregoing is merely preferred embodiment of the present application, are not intended to limit this application, for the skill of this field
For art personnel, various changes and changes are possible in this application.Within the spirit and principles of this application, made any to repair
Change, equivalent replacement, improvement etc., should be included within the scope of protection of this application.
Claims (10)
1. a kind of image processing apparatus, which is characterized in that described image processing unit includes:
Imaging sensor, including multiple identical photoelectric conversion chips arranged in the first direction, each photoelectric conversion chip
Including multiple light-sensitive devices being arranged successively in a second direction, the first direction is vertical with the second direction, each light
Sensing device includes light receiving area, the area phase of two light receiving areas of the arbitrary neighborhood in a photoelectric conversion chip
There are together and in this second direction interval, of same size, two photoelectricity of arbitrary neighborhood at interval described in any two
The center of conversion chip has the second spacing in this second direction, the first direction and the second direction respectively with institute
The thickness direction for stating photoelectric conversion chip is vertical；
Image processing unit is electrically connected with each photoelectric conversion chip, and described image processing unit is used for the figure
The multiple original images exported as sensor synthesize a composograph, and the resolution ratio of the composograph is the original image
Resolution ratio at least twice.
2. image processing apparatus according to claim 1, which is characterized in that light receiving area described in any two is flat first
Projection of shape on face is all the same, and first plane is parallel with the first direction and second direction difference.
3. image processing apparatus according to claim 2, which is characterized in that the light receiving area is in first plane
Projection of shape selected from circle, square, rectangle, any one oval with triangle.
4. image processing apparatus according to claim 1, which is characterized in that there are two the photoelectric conversion chips, each institute
Stating the maximum width of light receiving area in this second direction is X, and the width of second spacing is 1/3X~2/3X.
5. image processing apparatus according to claim 4, which is characterized in that the width of second spacing is 1/2X.
6. image processing apparatus according to claim 1, which is characterized in that two photoelectric conversion chips of arbitrary neighborhood
Center there is the first spacing in said first direction, the maximum width of each light receiving area in said first direction is
Y, first spacing are greater than Y, and preferably described first spacing is 1/2Y+MY, wherein M is the natural number greater than 0.
7. image processing apparatus according to claim 1, which is characterized in that described image sensor further include:
Framework (1), including the first accommodating chamber, the photoelectric conversion chip are located in first accommodating chamber；
Wiring board (7) is located in first accommodating chamber, and the photoelectric conversion chip is located at the surface of the wiring board (7)
On.
8. image processing apparatus according to claim 7, which is characterized in that the framework (1) also has the second accommodating chamber,
Second accommodating chamber is connected to first accommodating chamber, and second accommodating chamber is located at the separate institute of the photoelectric conversion chip
State the side of wiring board (7), described image sensor further include:
Two along the spaced light source equipment of the first direction, respectively first light source equipment (5) and second light source equipment
(6), two light source equipments are located in second accommodating chamber；
Two along the spaced optical lens of the first direction, respectively the first optical lens (3) and the second optical lens
(4), two optical lenses are located in second accommodating chamber and are located at the first light source equipment (5) and second light
Between source device (6), the photoelectric conversion chip corresponds the light for receiving the optical lens outgoing, and the photoelectricity turns
Each light receiving area of chip is changed for the corresponding light for receiving an optical lens and projecting.
9. image processing apparatus according to claim 8, which is characterized in that the optical lens and the corresponding photoelectricity
Each light receiving area face setting of conversion chip.
10. image processing apparatus according to claim 8, which is characterized in that second accommodating chamber is far from described first
The side of accommodating chamber has opening, described image sensor further include:
Transparent panel (2) rides upon the side far from second accommodating chamber of the opening, is emitted from the transparent panel (2)
Light is incident in each optical lens.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811291656.8A CN109274906A (en) | 2018-10-31 | 2018-10-31 | Image processing apparatus |
| PCT/CN2019/085024 WO2020087897A1 (en) | 2018-10-31 | 2019-04-29 | Image processing apparatus |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811291656.8A CN109274906A (en) | 2018-10-31 | 2018-10-31 | Image processing apparatus |
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| CN201811291656.8A Withdrawn CN109274906A (en) | 2018-10-31 | 2018-10-31 | Image processing apparatus |
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| WO (1) | WO2020087897A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020087897A1 (en) * | 2018-10-31 | 2020-05-07 | 威海华菱光电股份有限公司 | Image processing apparatus |
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| JPH02248152A (en) * | 1989-03-22 | 1990-10-03 | Matsushita Electric Ind Co Ltd | Contact type image sensor |
| US20050094222A1 (en) * | 2003-10-29 | 2005-05-05 | Tseng Hsin-Fu | High resolution, high sensitivity image scanner having noise cancellation improvements |
| CN108040187A (en) * | 2017-10-25 | 2018-05-15 | 威海华菱光电股份有限公司 | Contact-type image sensor |
| CN207909164U (en) * | 2017-11-30 | 2018-09-25 | 北京集创北方科技股份有限公司 | Optical detection apparatus and electronic equipment |
| CN209267691U (en) * | 2018-10-31 | 2019-08-16 | 威海华菱光电股份有限公司 | Image processing apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012024359B4 (en) * | 2012-12-13 | 2014-10-30 | Tichawa IP GmbH | Sensor arrangement for line by line optical scanning |
| CN203072041U (en) * | 2013-03-08 | 2013-07-17 | 威海华菱光电股份有限公司 | Contact image sensor |
| CN109218558B (en) * | 2018-10-31 | 2020-11-06 | 威海华菱光电股份有限公司 | Image processing method, image processing apparatus, storage medium, and processor |
| CN109274906A (en) * | 2018-10-31 | 2019-01-25 | 威海华菱光电股份有限公司 | Image processing apparatus |
-
2018
- 2018-10-31 CN CN201811291656.8A patent/CN109274906A/en not_active Withdrawn
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2019
- 2019-04-29 WO PCT/CN2019/085024 patent/WO2020087897A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02248152A (en) * | 1989-03-22 | 1990-10-03 | Matsushita Electric Ind Co Ltd | Contact type image sensor |
| US20050094222A1 (en) * | 2003-10-29 | 2005-05-05 | Tseng Hsin-Fu | High resolution, high sensitivity image scanner having noise cancellation improvements |
| CN108040187A (en) * | 2017-10-25 | 2018-05-15 | 威海华菱光电股份有限公司 | Contact-type image sensor |
| CN207909164U (en) * | 2017-11-30 | 2018-09-25 | 北京集创北方科技股份有限公司 | Optical detection apparatus and electronic equipment |
| CN209267691U (en) * | 2018-10-31 | 2019-08-16 | 威海华菱光电股份有限公司 | Image processing apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020087897A1 (en) * | 2018-10-31 | 2020-05-07 | 威海华菱光电股份有限公司 | Image processing apparatus |
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