CN106331421B - Imaging sensor and image scanning apparatus - Google Patents
Imaging sensor and image scanning apparatus Download PDFInfo
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- CN106331421B CN106331421B CN201610702884.4A CN201610702884A CN106331421B CN 106331421 B CN106331421 B CN 106331421B CN 201610702884 A CN201610702884 A CN 201610702884A CN 106331421 B CN106331421 B CN 106331421B
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- circuit board
- sensitive chip
- imaging sensor
- light source
- circuit
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/024—Details of scanning heads ; Means for illuminating the original
- H04N1/028—Details of scanning heads ; Means for illuminating the original for picture information pick-up
- H04N1/03—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array
- H04N1/031—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array the photodetectors having a one-to-one and optically positive correspondence with the scanned picture elements, e.g. linear contact sensors
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- Facsimile Heads (AREA)
Abstract
The invention discloses a kind of imaging sensor and image scanning apparatus.Wherein, which includes: lighting device, for irradiating part to be scanned, and transmits the optical signal of part feedback to be scanned；Photosensitive device is connect with lighting device, for converting optical signals to electric signal；Pedestal is connect with photosensitive device and lighting device respectively, for carrying photosensitive device and lighting device.The present invention solves the technical problem that the requirement since the structure bring of the imaging sensor provided in the related technology is at high cost, to the image progress data processing of acquisition is high and scanning accuracy is low.
Description
Technical field
The present invention relates to application of electronic technology field, in particular to a kind of imaging sensor and image scanning apparatus.
Background technique
Contact-type image sensor is mainly used in facsimile machine, scanner, all-in-one multifunctional machine, automatic teller machine, clear
In the equipment such as extension set, apparatus for marking examinating paper, for carrying out image scanning to original copy.Contact-type image sensor used in above equipment is swept
Retouching width is mostly that 183mm, 216mm, longest reach A3 length.
As technology develops, contact-type image sensor has gradually been applied to on-line checking, and the fields such as machine vision are used for
Scanning to some textiles, large-scale map etc., some special purposes require image sensor scan width reach one meter with
On.But contact figure is constrained since board production producer on the market can not produce longer wiring circuit at present
As the sweep length of sensor.Realize that substantially Surface scan is usually there are two types of method, Fig. 1 is in the prior art using multiple shorter
The structural schematic diagram of the contact-type image sensor splicing of sweep length, this mode is common in electronic whiteboard, for example, by using 4
The contact-type image sensor of A4 sweep length interlocks splicing to realize the scanning of large format；Fig. 2 is in the prior art using more
The structural schematic diagram of a shorter circuit board splicing, is combined into a longer circuit board, to realize large-scale scanning.
But the structure of above-mentioned imaging sensor shown in FIG. 1, it uses multiple contact-type image sensors and splices, at
Originally it greatly improves, splices due to using staggered mode, and touch sensor (Contact Image Sensor, referred to as
CIS), wherein CIS1 and CIS3 must on a horizontal line, CIS2 and CIS4 also must on a horizontal line, and two
Scan line must be parallel.And the image mosaic that CIS is spliced into the later period brings very big trouble, and image procossing is calculated
Method proposes very high requirement.Above-mentioned Fig. 2, using multiple printed circuit boards (Printed Circuit Board, abbreviation PCB)
Splicing influences scanning accuracy due to the phenomenon that there are gap, will appear leak source in scanning between PCB.
For above-mentioned since the structure bring of the imaging sensor provided in the related technology is at high cost, to the image of acquisition
The requirement height of data processing and the problem that scanning accuracy is low are carried out, currently no effective solution has been proposed.
Summary of the invention
The embodiment of the invention provides a kind of imaging sensor and image scanning apparatus, at least to solve due to the relevant technologies
The structure bring of the imaging sensor of middle offer is at high cost, and the requirement for carrying out data processing to the image of acquisition is high, and sweeps
Retouch the low technical problem of precision.
According to an aspect of an embodiment of the present invention, a kind of imaging sensor is provided, comprising: lighting device, photoreceptor cartridge
It sets and pedestal, wherein lighting device for irradiating part to be scanned, and transmits the optical signal of part feedback to be scanned；Photosensitive device,
It is connect with lighting device, for converting optical signals to electric signal；Pedestal is connect with photosensitive device and lighting device respectively, is used
In carrying photosensitive device and lighting device.
Optionally, lighting device includes: lens, wherein lens, positioned at the light input side of photosensitive device, is used for converged light
Treat the input light obtained after scanned copy irradiation in source.
Further, optionally, lighting device further include: light source, wherein light source is used positioned at the light input side of lens
Light is inputted in providing；Wherein, light source includes at least: single light source or double light sources；The light source type of light source includes at least: reflection-type
Or transmission-type light source.
Further, optionally, photosensitive device includes: sensitive chip and circuit board, wherein sensitive chip, being used for will be saturating
The input light of mirror is converted to electric signal by optical signal；Circuit board is connect with sensitive chip, is converted for receiving sensitive chip
The electric signal arrived.
Optionally, photosensitive device further include: wire, wherein wire is connect with sensitive chip, is used for circuit board
Export electric signal.
Optionally, pedestal includes: frame and base station, wherein base station is connect with circuit board, for carrying circuit board；Frame
Frame is connect with base station, for carrying light source, lens and circuit board, wherein circuit board is located at the inside of frame.
Further, optionally, circuit board includes: circuit board and at least two circuit boards, circuit board and at least two electricity
The splicing of road plate, wherein circuit board, for carrying sensitive chip；Sensitive chip is connect by wire at least two circuit boards,
For sending electric signal at least two circuit boards, wherein sensitive chip is located at the horizontal top of circuit board；At least two circuits
Plate splices side by side, and parallel with circuit board is spliced.
Optionally, circuit board and at least two circuit boards are located at the horizontal top of base station, and circuit board is for carrying photosensitive core
Piece, at least two circuit boards are connect by wire with sensitive chip, wherein at least two circuit boards are wiring circuit.
Optionally, circuit board includes: at least two circuit boards, is spliced side by side between at least two circuit boards, wherein photosensitive
Chip positioned at the horizontal top of base station, and is connect, for exporting electric signal at least two circuit boards by wire；At least
Splice side by side between two circuit boards, positioned at the horizontal top of base station, and sensitive chip configured in parallel, for being connect by wire
Receive electric signal.
Further, optionally, at least two circuit boards are wiring circuit.
Optionally, circuit board 4 includes: circuit board and at least two circuit boards, and at least two circuit boards are located at circuit board
In groove, wherein circuit board is located in frame, for carrying sensitive chip；Sensitive chip is located at the horizontal top of circuit board；
At least two circuit boards splice between at least two circuit boards side by side in the groove of circuit board, by wire with it is photosensitive
Chip connection, for receiving electric signal.
Further, optionally, the groove of circuit board is L-type groove；At least two circuit boards are wiring circuit.
Other side according to an embodiment of the present invention provides a kind of image scanning apparatus, comprising: imaging sensor,
For being scanned to the part to be scanned for being greater than default scan size, wherein imaging sensor includes above-mentioned imaging sensor.
In embodiments of the present invention, the light letter of part feedback to be scanned is transmitted for irradiating part to be scanned by lighting device
Number；Photosensitive device is connect with lighting device, for converting optical signals to electric signal；Pedestal, respectively with photosensitive device and illumination
Device connection has achieved the purpose that reduce imaging sensor cost, to realize for carrying photosensitive device and lighting device
Promote the technical effect of scanning accuracy, so solve structure bring due to the imaging sensor provided in the related technology at
This height, the technical problem that the requirement to the image progress data processing of acquisition is high and scanning accuracy is low.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present invention, constitutes part of this application, this hair
Bright illustrative embodiments and their description are used to explain the present invention, and are not constituted improper limitations of the present invention.In the accompanying drawings:
Fig. 1 is the structural representation spliced in the prior art using the contact-type image sensor of multiple shorter sweep lengths
Figure；
Fig. 2 is in the prior art using the structural schematic diagram of multiple shorter circuit board splicings；
Fig. 3 is the structural schematic diagram of imaging sensor according to an embodiment of the present invention；
Fig. 3 a is the structural schematic diagram of light source and lens in a kind of imaging sensor according to an embodiment of the present invention；
Fig. 3 b is the structural schematic diagram of light source and lens in another imaging sensor according to an embodiment of the present invention；
Fig. 4 a is a kind of structural schematic diagram of imaging sensor according to an embodiment of the present invention；
Fig. 4 b is the overhead view knot of the structure one in a kind of imaging sensor according to an embodiment of the present invention in circuit board 4
Structure schematic diagram；
Fig. 4 c is the side vertical side of the structure one in a kind of imaging sensor according to an embodiment of the present invention in circuit board 4
To structural schematic diagram；
Fig. 4 d is the front cross-sectional of the structure two in a kind of imaging sensor according to an embodiment of the present invention in circuit board 4
Structural schematic diagram；
Fig. 4 e is the overhead view of the structure two in a kind of imaging sensor according to an embodiment of the present invention in circuit board 4
Structural schematic diagram；
Fig. 4 f is the side vertical side of the structure two in a kind of imaging sensor according to an embodiment of the present invention in circuit board 4
To structural schematic diagram；
Fig. 4 g is the front cross-sectional of the structure three in a kind of imaging sensor according to an embodiment of the present invention in circuit board 4
Structural schematic diagram；
Fig. 4 h is the overhead view of the structure three in a kind of imaging sensor according to an embodiment of the present invention in circuit board 4
Structural schematic diagram；
Fig. 4 i is the side vertical side of the structure three in a kind of imaging sensor according to an embodiment of the present invention in circuit board 4
To structural schematic diagram.
Specific embodiment
In order to enable those skilled in the art to better understand the solution of the present invention, below in conjunction in the embodiment of the present invention
Attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill people
The model that the present invention protects all should belong in member's every other embodiment obtained without making creative work
It encloses.
Embodiment 1
According to embodiments of the present invention, a kind of embodiment of imaging sensor is provided, Fig. 3 is according to an embodiment of the present invention
The structural schematic diagram of imaging sensor, as shown in figure 3, the imaging sensor includes: lighting device 32, photosensitive device 34 and pedestal
36, wherein
Lighting device 32 for irradiating part to be scanned, and transmits the optical signal of part feedback to be scanned；Photosensitive device 34, with
Lighting device 32 connects, for converting optical signals to electric signal；Pedestal 36 connects with photosensitive device 34 and lighting device 32 respectively
It connects, for carrying photosensitive device 34 and lighting device 32.
Specifically, as shown in figure 3, imaging sensor provided by the embodiments of the present application can be adapted for some textiles,
The scanning of large-scale map etc., or the image for requiring image sensor scan width to reach one meter or more some special purposes are swept
Retouch demand.Wherein, lighting device 32 is treated scanned copy and is irradiated, and the light of part reflection to be scanned is acquired by photosensitive device 34,
And light is converted into electric signal by optical signal, wherein photosensitive device 34 is connect with lighting device 32, and pedestal 36 carries illumination respectively
Device 32 and photosensitive device 34.
In imaging sensor in the embodiment of the present application, transmitted to be scanned by lighting device for irradiating part to be scanned
The optical signal of part feedback；Photosensitive device is connect with lighting device, for converting optical signals to electric signal；Pedestal, respectively with sense
Electro-optical device is connected with lighting device, for carrying photosensitive device and lighting device, has reached the mesh for reducing imaging sensor cost
, to realize the technical effect for promoting scanning accuracy, and then solve the imaging sensor due to providing in the related technology
Structure bring it is at high cost, the technical problem that the requirement for carrying out data processing to the image of acquisition is high and scanning accuracy is low.
Optionally, lighting device 32 includes: light source 1 and lens 2, wherein lens 2, the light positioned at photosensitive device 36 are defeated
Enter side, treats the input light obtained after scanned copy irradiation for converging light source.
Further, optionally, lighting device 32 further include: light source 1, wherein light source 1, the light positioned at lens 2 input
Side, for providing input light；Wherein, light source 1 includes at least: single light source or double light sources；The light source type of light source 1 at least wraps
It includes: reflection-type or transmission-type light source.
Specifically, light source 1 is configured in the position of frame 5 according to the position of lens 2, or, the structure according to 5 sum of frame
With the position of the position configuration light source 1 of lens 2, similarly, the difference according to business demand configures different light source types, and Fig. 3 a is
The structural schematic diagram of light source and lens in a kind of imaging sensor according to an embodiment of the present invention, Fig. 3 b are to implement according to the present invention
The structural schematic diagram of light source and lens in another imaging sensor of example；
As shown in Figure 3a, the embodiment of the present application provides a kind of single light source reflection, and the position of light source 1 is located at frame 5 in Fig. 3 a
Horizontal right side, by projecting part to be scanned, lens 2 converge the light of part feedback to be scanned；
As shown in Figure 3b, the embodiment of the present application provides a kind of projectiveness light source, and the horizontal top of light source 1 in fig 3b leads to
It crosses and transmits part to be scanned, the light of part feedback to be scanned is received by lens 2.
Light source 1 provided by the embodiments of the present application is only illustrated by taking the type and structure of above-mentioned light source 1 as an example, only to realize
Subject to imaging sensor provided by the embodiments of the present application, specifically without limitation.
Specifically, as shown in fig. 4 a, Fig. 4 a is a kind of structural schematic diagram of imaging sensor according to an embodiment of the present invention,
It is specific as follows:
As shown in fig. 4 a, light source 1 in preferred embodiment in imaging sensor provided by the embodiments of the present application is located at frame 5 and pushes up
Portion is respectively arranged at the horizontal two sides at 5 top of frame, for irradiating part to be scanned；Lens 2 are located at 5 top of frame, and are located at
It is configured at the middle position of the light source 1 of the horizontal two sides at 5 top of frame, is obtained for converging after light source 1 treats scanned copy irradiation
Reflected light.
Specifically, as shown in fig. 4 a, lighting device 32 includes: light source 1 and lens 2, wherein the distribution of light source 1 to frame 5
The left and right sides of horizontal direction, lens 2 are located at the middle position of two side light sources 1, as shown in fig. 4 a, image sensing shown in Fig. 4 a
The structure chart of device is the sectional view of Facad structure, wherein light source 1 is erected at the top of frame 5 in Fig. 4 a, and is distributed in central axis
Two sides, and lens 2 are distributed in the medial axis of two side light sources 1, that is, the cental axial position in Fig. 4 a.
Here light source 1 is for irradiating part to be scanned, and 2 converged light 1 of lens treats the reflection of part to be scanned after scanned copy irradiation
Light.
Further, optionally, photosensitive device 34 includes: sensitive chip 3 and circuit board 4, wherein sensitive chip 3 is used for
The input light of lens 2 is converted into electric signal by optical signal；Circuit board 4 is connect with sensitive chip 3, for receiving photosensitive core
The electric signal that piece 3 is converted to.
Specifically, sensitive chip 3 and circuit board 4, wherein sensitive chip 3 is connect with circuit board 4, for feeding back lens 2
Light, electric signal is converted to by optical signal, and by electric signal transmission to circuit board 4.
Optionally, photosensitive device 34 further include: wire 7, wherein wire 7 is connect with sensitive chip 3, is used for electricity
Road plate 4 exports electric signal.
Specifically, as shown in fig. 4 a, photosensitive device 34 further includes wire 7, wherein sensitive chip 3 by wire 7 with
Circuit board 4 connects, for by the electric signal transmission in sensitive chip 3 to circuit board 4.
Optionally, pedestal 36 includes: frame 5 and base station 6, wherein base station 6 is connect, for carrying circuit with circuit board 4
Plate 4；Frame 5 is connect with base station 6, for carrying light source 1, lens 2 and circuit board 4, wherein circuit board 4 is located at the interior of frame 5
Portion.
Specifically, as shown in fig. 4 a, frame 5 is located on base station 6, light source 1 and lens 2 are set up at the top of frame 5, in frame
Circuit board 4 is set in 5, since sensitive chip 3 fits in circuit board 4, so in the internal configuration circuitry plate 4 of frame 5, wherein
Sensitive chip 3 and 2 consistency from top to bottom of lens.
In the imaging sensor provided in the embodiment of the present application, the structure of circuit board 4 includes three kinds, specific as follows:
Structure one: as shown in fig. 4 a.
Further, optionally, circuit board 4 includes: circuit board 4a and at least two circuit board 4b, circuit board 4a and at least
Two circuit board 4b splicings, wherein circuit board 4a, for carrying sensitive chip 3；Sensitive chip 3 passes through wire 7 and at least two
A circuit board 4b connection, for sending electric signal at least two circuit board 4b, wherein sensitive chip 3 is located at circuit board 4a's
Horizontal top；At least two circuit board 4b splice side by side, and parallel with circuit board 4a are spliced.
Optionally, circuit board 4a and at least two circuit board 4b is located at the horizontal top of base station 6, and circuit board 4a is for carrying
Sensitive chip 3, at least two circuit board 4b are connect by wire 7 with sensitive chip 3, wherein at least two circuit board 4b are
Wiring circuit.
Specifically, in fig.4, circuit board 4 includes two class circuit boards, that is, circuit board 4a and at least two circuit board 4b,
In fig. 4b, Fig. 4 b is the overhead view of the structure one in a kind of imaging sensor according to an embodiment of the present invention in circuit board 4
Structural schematic diagram；As shown in Figure 4 b, it is put on base station 6 to having three pieces of circuit boards, circuit board 4a, circuit board 4b and circuit board
4c, wherein sensitive chip 3 is placed on circuit board 4a, and circuit board 4a is non-wiring circuit, that is, is not had inside circuit board 4a
There is circuit, therefore circuit board 4a can be used for carrying sensitive chip 3, and the length of circuit board 4a can extend into and photosensitive core
The length of piece 3 is identical；
In addition, as shown in Figure 4 b, circuit board 4b and circuit board 4c are same type circuit boards, that is, wiring circuit, circuit board
4b and circuit board 4c is connect by wire 7 with sensitive chip 3, the electric signal being converted to for obtaining sensitive chip 3.
Wherein, Fig. 4 c is the side of the structure one in a kind of imaging sensor according to an embodiment of the present invention in circuit board 4
The structural schematic diagram of vertical direction, as illustrated in fig. 4 c, bearer circuit plate 4a and circuit board 4b on base station 6, wherein sensitive chip 3
On circuit board 4a, connect by wire 7 with circuit board 4b, wherein in conjunction with Fig. 4 b and Fig. 4 c it is found that circuit board 4b and
Circuit board 4c laid out in parallel.
Structure two: as shown in Fig. 4 d, Fig. 4 e and Fig. 4 f, Fig. 4 d is in a kind of imaging sensor according to an embodiment of the present invention
The structural schematic diagram of the front cross-sectional of structure two in circuit board 4；Fig. 4 e is a kind of image sensing according to an embodiment of the present invention
The structural schematic diagram of the overhead view of structure two in device in circuit board 4；Fig. 4 f is a kind of image according to an embodiment of the present invention
The structural schematic diagram in the side vertical direction of the structure two in sensor in circuit board 4.
Optionally, circuit board 4 includes: to splice side by side between at least two circuit board 4b, at least two circuit board 4b,
In, sensitive chip 3 positioned at the horizontal top of base station 6, and is connect, for exporting at least two circuit board 4b by wire 7
Electric signal；Splice side by side between at least two circuit board 4b, positioned at the horizontal top of base station 6, and 3 configured in parallel of sensitive chip,
For receiving electric signal by wire 7.
Further, optionally, at least two circuit board 4b are wiring circuit.
Specifically, as shown in figure 4d, sensitive chip 3 is connect with base station 6, fit on base station 6,4 wire 7 of circuit board with
Sensitive chip 3 connects；Based on Fig. 4 d, in conjunction with Fig. 4 e it is found that on base station 6, sensitive chip 3 splices side by side is arranged in a row, until
Few two circuit board 4b splice side by side, parallel with sensitive chip 3, and are connect by wire 7 with sensitive chip 3, electric in Fig. 4 e
Road plate 4b and circuit board 4c are wiring circuit；Pass through gold it is found that being put on base station 6 to 3 circuit board 4b of sensitive chip in conjunction with Fig. 4 f
Belong to silk 7 to connect with sensitive chip 3.
Structure three: as shown in Fig. 4 g, Fig. 4 h and Fig. 4 i, Fig. 4 g is in a kind of imaging sensor according to an embodiment of the present invention
The structural schematic diagram of the front cross-sectional of structure three in circuit board 4；Fig. 4 h is a kind of image sensing according to an embodiment of the present invention
The structural schematic diagram of the overhead view of structure three in device in circuit board 4；Fig. 4 i is a kind of image according to an embodiment of the present invention
The structural schematic diagram in the side vertical direction of the structure three in sensor in circuit board 4.
Optionally, circuit board 4 includes: that circuit board 4a and at least two circuit board 4b, at least two circuit board 4b are located at electricity
In the groove of road plate 4a, wherein circuit board 4a is located in frame 5, for carrying sensitive chip 3；Sensitive chip 3 is located at circuit
The horizontal top of plate 4a；At least two circuit board 4b, in the groove of circuit board 4a, between at least two circuit board 4b side by side
Splicing, is connect, for receiving electric signal with sensitive chip 3 by wire 7.
Further, optionally, the groove of circuit board 4a is L-type groove；At least two circuit board 4b are wiring circuit.
Specifically, as shown in figure 4g, sensitive chip 3 is located at the horizontal top of circuit board 4, connected by wire 7,
In, there is no the structure of base station 6 in Fig. 4 g, circuit board 4 is located at the inside of frame 5, sensitive chip 3 with lens 2 are online is aligned.Difference
In structure one, in structure three, as shown in figure 4h, although circuit board 4 and including two class circuit boards, circuit board 4a, circuit board
4b and circuit board 4c (that is, at least two circuit board 4b mentioned in the embodiment of the present application), circuit board 4a is still non-wired circuit
Plate, for carrying sensitive chip 3, circuit board 4b and circuit board 4c are wiring circuit, and difference is that circuit board 4a is equipped with recessed
Slot, for carrying circuit board 4b and circuit board 4c；Referring in particular to Fig. 4 i, as shown in figure 4i, the side view of circuit board 4a such as L
Type, circuit board 4b are placed in the recessed position of circuit board 4a, and circuit board 4b is connect by wire 7 with sensitive chip 3.
To sum up, in conjunction with Fig. 3 to Fig. 4 i, the structure of imaging sensor provided by the embodiments of the present application is specific as follows:
Imaging sensor provided by the embodiments of the present application, for scanning large-scale part to be scanned.In order to realize object above
A kind of imaging sensor such as Fig. 4 a to Fig. 4 i is provided, band is generated for irradiating part to be scanned including light source 1 and needs to be swept
The reflected light for retouching part information is converted into optical signal the sensitive chip 3 of electric signal, takes for converging the lens 2 of these reflected lights
The circuit board 4 for carrying sensitive chip 3, carries the base station 6 of circuit board, further includes the frame 5 for accommodating light source 1, lens 2, circuit board 4.
Wherein, circuit board 4 is spliced using multiple circuit boards；It carries on the circuit board 4 of sensitive chip 3 without electricity
Road, using the circuit board of non-wiring；The circuit board 4 of sensitive chip 3 is carried using a circuit board；It is mentioned for sensitive chip 3
It is formed by the way of splicing for the circuit board 4 of various signals；The circuit board 4 for providing working signal for sensitive chip 3 can be with
Using wiring circuit；Wherein, wiring circuit is at least spliced by two circuit boards.
The application is further described below with reference to specific example:
Example 1: a kind of imaging sensor is as shown in Fig. 4 a to Fig. 4 c, counter structure one, the light that light source 1 issues, through wait sweep
After retouching part reflection, is converged at by lens 2 and carry out photoelectric conversion on sensitive chip 3, electric signal passes through circuit board using wire 7
4 transmission outward, 6 be the base station for carrying circuit board 4, and 5 be the frame for carrying above-mentioned component.Its feature is as shown in Figure 4 b, circuit board 4
Circuit board 4a and Duo Gen wiring circuit 4b, the 4c not being routed by one are spliced into.Wherein circuit board 4a is for carrying photosensitive core
Piece 3, since random length can be made without circuit inside circuit board 4a.There is circuit inside circuit board 4b and 4c, passes through metal
Silk 7 is connect with sensitive chip 3, provides various working signals and output analog signal for sensitive chip 3.This example sensitive chip 3
It is arranged on a circuit board 4a, there is no splicing seam between sensitive chip 3, also guarantees while realizing substantially Surface scan
Scanning accuracy.Wiring circuit is according to the needs of sweep length, it is not limited to which two circuit boards splicings can be mostly with electricity
The splicing of road plate.
Example 2: a kind of imaging sensor is as shown in Fig. 4 d to Fig. 4 f, counter structure two, the light that light source 1 issues, through wait sweep
After retouching part reflection, is converged at by lens 2 and carry out photoelectric conversion on sensitive chip 3, electric signal passes through circuit board using wire 7
4 transmission outward, 6 be the base station for carrying circuit board 4, and 5 be the frame for carrying above-mentioned component.Its feature as shown in fig 4e, photosensitive core
Piece 3 is directly bonded on base station 6, and circuit board 4 is spliced by wiring circuit 4b and 4c, is connected by wire 7 and sensitive chip 3
It connects, provides various working signals and output analog signal for sensitive chip 3.As shown in fig. 4f, this example sensitive chip is arranged in
On base station 6, only wiring circuit is by the way of splicing, and there is no splicing seams between sensitive chip 3, is realizing large format
Scanning accuracy is also ensured while scanning.Wiring circuit is according to the needs of sweep length, it is not limited to two circuit boards
Splicing can be more circuit board splicings.
Example 3: a kind of imaging sensor is as shown in Fig. 4 g to Fig. 4 i, counter structure three, the light that light source 1 issues, through wait sweep
After retouching part reflection, is converged at by lens 2 and carry out photoelectric conversion on sensitive chip 3, electric signal passes through circuit board using wire 7
4 transmission outward, 5 be the frame for carrying above-mentioned component.As shown in figure 4h, sensitive chip 3 is bonded on the circuit board 4 its feature, electricity
There is no circuit inside the plate 4a of road, be made L shape, wiring circuit on 4a, passes through wire 7 and photosensitive core by 4b and 4c splicing
Piece 3 connects, and provides various working signals and output analog signal for sensitive chip.As shown in figure 4i, this example sensitive chip is arranged
On the circuit board 4, only wiring circuit is by the way of splicing, and there is no splicing seams between sensitive chip 3, in reality for column
Now substantially Surface scan while also ensure scanning accuracy.Wiring circuit is according to the needs of sweep length, it is not limited to two
The splicing of root circuit board can be more circuit board splicings.
Embodiment 2
Other side according to an embodiment of the present invention provides a kind of image scanning apparatus, comprising: imaging sensor,
For being scanned to the part to be scanned for being greater than default scan size, wherein imaging sensor includes any width in Fig. 3 to Fig. 4 i
Shown in imaging sensor.
The serial number of the above embodiments of the invention is only for description, does not represent the advantages or disadvantages of the embodiments.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also answered
It is considered as protection scope of the present invention.
Claims (10)
1. a kind of imaging sensor characterized by comprising lighting device, photosensitive device and pedestal, wherein
The lighting device for irradiating part to be scanned, and transmits the optical signal of the part feedback to be scanned；
The photosensitive device is connect with the lighting device, for the optical signal to be converted to electric signal；
The pedestal is connect with the photosensitive device and the lighting device respectively, for carrying the photosensitive device and described
Lighting device；
Wherein, the photosensitive device includes: sensitive chip (3) and circuit board (4), wherein the sensitive chip (3), being used for will
The input light of lens (2) is converted to electric signal by optical signal；The circuit board (4), connect with the sensitive chip (3), uses
In the electric signal that the reception sensitive chip (3) is converted to；
Wherein, the circuit board (4) includes: circuit board (4a) and at least two circuit boards (4b), the circuit board (4a) and institute
State at least two circuit boards (4b) splicing, wherein the circuit board (4a), for carrying the sensitive chip (3)；It is described photosensitive
Chip (3) is connect by wire (7) at least two circuit board (4b), is used for at least two circuit board (4b)
Send the electric signal, wherein the sensitive chip (3) is located at the horizontal top of the circuit board (4a)；Described at least two
Circuit board (4b) splices side by side, and parallel with the circuit board (4a) is spliced；
Wherein, the circuit board (4a) uses non-wiring circuit；At least two circuit board (4b) uses wiring circuit.
2. imaging sensor according to claim 1, which is characterized in that the lighting device includes: lens (2), wherein
The lens (2), positioned at the light input side of the photosensitive device, after converging light source to the part irradiation to be scanned
Obtained input light.
3. imaging sensor according to claim 2, which is characterized in that the lighting device further include: light source (1),
In,
The light source (1) is located at the light input side of the lens (2), is used to provide the described input light；Wherein, the light
Source (1) includes at least: single light source or double light sources；The light source type of the light source (1) includes at least: reflection-type or transmission-type light
Source.
4. imaging sensor according to claim 1, which is characterized in that the photosensitive device further include: wire (7),
Wherein, the wire (7), connect with the sensitive chip (3), for exporting the electric signal to the circuit board (4).
5. imaging sensor according to claim 2, which is characterized in that the pedestal includes: frame (5) and base station (6),
Wherein,
The base station (6), connect with the circuit board (4), for carrying the circuit board (4)；
The frame (5), connect with the base station (6), for carrying the light source (1), lens (2) and circuit board (4),
In, the circuit board (4) is located at the inside of the frame (5).
6. imaging sensor according to claim 5, which is characterized in that the circuit board (4a) and at least two electricity
Road plate (4b) is located at the horizontal top of the base station (6), and the circuit board (4a) is described for carrying the sensitive chip (3)
At least two circuit boards (4b) are connect by wire (7) with the sensitive chip (3), wherein at least two circuit board
(4b) is wiring circuit.
7. imaging sensor according to claim 5, which is characterized in that the circuit board (4) includes: at least two circuits
Plate (4b) splices side by side between at least two circuit board (4b), wherein
The sensitive chip (3) is located at the horizontal top of the base station (6), and passes through wire (7) and at least two electricity
Road plate (4b) connection, for exporting the electric signal；
Splice side by side between at least two circuit board (4b), is located at the horizontal top of the base station (6), with the photosensitive core
Piece (3) configured in parallel, for receiving the electric signal by the wire (7).
8. imaging sensor according to claim 5, which is characterized in that the circuit board (4) include: circuit board (4a) and
At least two circuit boards (4b), at least two circuit board (4b) are located in the groove of the circuit board (4a), wherein
The circuit board (4a) is located in the frame (5), for carrying the sensitive chip (3)；
The sensitive chip (3) is located at the horizontal top of the circuit board (4a)；
At least two circuit board (4b), in the groove of the circuit board (4a), at least two circuit board (4b)
Between splice side by side, connect by wire (7) with the sensitive chip (3), for receiving the electric signal.
9. imaging sensor according to claim 8, which is characterized in that the groove of the circuit board (4a) is L-type groove；
At least two circuit board (4b) is wiring circuit.
10. a kind of image scanning apparatus characterized by comprising
Imaging sensor, for being scanned to the part to be scanned for being greater than default scan size, wherein described image sensor packet
It includes: imaging sensor described in any one of claims 1 to 9.
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| CN201610702884.4A CN106331421B (en) | 2016-08-22 | 2016-08-22 | Imaging sensor and image scanning apparatus |
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| CN201610702884.4A CN106331421B (en) | 2016-08-22 | 2016-08-22 | Imaging sensor and image scanning apparatus |
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| CN106331421B true CN106331421B (en) | 2019-04-09 |
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| CN108124075B (en) * | 2017-11-15 | 2024-07-02 | 威海华菱光电股份有限公司 | Image sensor |
| CN108769498B (en) * | 2018-08-23 | 2024-04-12 | Oppo广东移动通信有限公司 | Combinable photosensitive chip, camera module and electronic equipment |
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| US9247095B2 (en) * | 2012-12-19 | 2016-01-26 | Canon Components, Inc. | Image sensor unit, image reading apparatus, and image forming apparatus |
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| CN102696216A (en) * | 2009-12-28 | 2012-09-26 | 佳能元件股份有限公司 | Contact-type image sensor unit and image reading device using same |
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