CN1092696C - Chemical Machinery grinding compsn. - Google Patents
Chemical Machinery grinding compsn. Download PDFInfo
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- CN1092696C CN1092696C CN 97116569 CN97116569A CN1092696C CN 1092696 C CN1092696 C CN 1092696C CN 97116569 CN97116569 CN 97116569 CN 97116569 A CN97116569 A CN 97116569A CN 1092696 C CN1092696 C CN 1092696C
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Abstract
The present invention relates to a chemical and mechanical grinding composition which comprises 5 to 50 wt. % of calcined silicon dioxide and 0.1 to 10 wt. % of organic alkali, wherein the alkali is selected from hydroxyalkyl amine shown in a formula (I); R, R' and R' in the formula respectively represent hydroxyalkyl with hydrogen number or carbon number of 1 to 6, and polyamine base alkali shown in a formula (II); R1, R2, R3, R4, R5, R6 and R7 in the formula respectively represent hydrogen, an alkyl group with carbon number of 1 to 6, an amine alkyl group or hydroxyalkyl; n1 is integral number of 0 to 4, and n2 and n3 respectively are integral number of 0 to 6.
Description
The present invention relates to a kind of Chemicomechanically grinding composition, this abrasive composition comprises the pyrogenic silica (fumed silica) of 5～50 weight %, and the organic bases of 0.1～10 weight %.Particular words, this abrasive composition is used for the surface of grinding semiconductor.
In semi-conductor industry, the grinding semiconductor chip surface is a kind of technology of widespread use, so that the having an even surface of semiconductor wafer, and reduces the thickness of semiconductor wafer.Generally speaking, this Ginding process is that semiconductor wafer is placed on the spin finishing plane of being furnished with grinding head, uses the Chemicomechanically grinding composition slurries that comprise abrasive grains on wafer surface, to promote mill efficiency.The abrasive grains that is usually used in the Chemicomechanically grinding composition comprises colloidal silica (colloidal silica) and pyrogenic silica.In this abrasive composition except that comprising abrasive grains, usually can be by adding one or several bases, to adjust the pH value of this abrasive composition.
United States Patent (USP) the 4th, 169 is to use the adulterant of colloidal silica or silica gel (silicagel) and water-soluble amine for No. 337, with the abrasive composition as grinding semiconductor surface usefulness.
United States Patent (USP) the 5th, 230, No. 833 announcements comprise the abrasive composition of colloidal silica, organic bases and sterilant.
The prior art that above-mentioned use colloidal silica is made abrasive composition all has the common shortcoming.At first, the particle size dispersion inequality of colloidal silica is though grind quality with control.Secondly, use colloidal silica to be difficult for making solid content greater than 20% high purity abrasive composition.Therefore, use pyrogenic silica with the manufacturing chemistry Machinery grinding composition at present usually.The preparation method of this kind abrasive composition comprises with high shear force and stirring, and pyrogenic silica is suspended in water, add in addition one or several bases to adjust the pH value of slurries, the pyrogenic silica of stable suspersion.
United States Patent (USP) the 2nd, 984, No. 629 is to disclose the method for alkali metal base with the stable suspersion pyrogenic silica of using.
United States Patent (USP) the 5th, 382, the abrasive composition that is disclosed for No. 272 is to add people's cerium oxide and zirconium white in pyrogenic silica, to increase the speed that scrapes off of abrasive composition.
United States Patent (USP) the 5th, 264 is for No. 010 to merge to use pyrogenic silica and colloidal silica, and adds cerium oxide and scrape off speed with increase, uses various tensio-active agents and potassium hydroxide or ammoniacal liquor to come the silica fume particles of stable suspersion simultaneously.
Yet the abrasive composition of above-mentioned use pyrogenic silica also has shortcoming to exist.With the pH value of alkali metal base (for example potassium hydroxide or sodium hydroxide) adjustment abrasive composition, no doubt can make abrasive composition obtain splendid stability, but because of K
+With Na
+Be the minimum ion that easily moves, easily infiltrate in the wafer and cause the pollution of wafer, reduce the quality of semiconductor element.If adopt ammoniacal liquor to adjust the pH value of abrasive composition, though can avoid K
+With Na
+Pollution, so because of ammoniacal liquor is easy to volatilization, except that produce malodorous, also can pollute and reduce its quality processing procedure.
For avoiding above-mentioned shortcoming, United States Patent (USP) the 5th, 139 is to use the pH value of the abrasive composition that quaternary ammonium salt adjustment comprises pyrogenic silica for No. 571.So, must can make abrasive composition reach higher pH by heavy addition, after finishing in the grinding stage,, will make follow-up cleaning stage extremely be difficult for carrying out for removing a large amount of quaternary ammonium salts because of the alkalescence of quaternary ammonium salt is lower.
Therefore, in semiconductor fabrication, the Chemicomechanically grinding composition of the preferable character of demand tool still, wherein must not contain alkalimetal ion, the volatility of not having that easily moves in order to the bases of stablizing pyrogenic silica, and alkalescence is high, to overcome shortcoming of the prior art, prepare high-quality semiconductor element.In addition, this bases also needs splendid water-soluble of tool, can very easily remove in cleaning stage and can not remain in wafer above, and this bases can make the lower viscosity of gained Chemicomechanically grinding composition slurries tool, operates in order to using.
The purpose of this invention is to provide a kind of Chemicomechanically grinding composition, this abrasive composition comprises the pyrogenic silica of 5～50 weight %, and the organic bases of 0.1～10 weight %, and described alkali is to be selected from hydroxyalkyl amine and polyamines base alkali.
The above-mentioned organic bases that is selected from hydroxyalkyl amine and polyamines base alkali has following characteristic: (1) molecule itself is big, is difficult for infiltrating wafer; (2) boiling point is all far above water, and is not volatile; (3) alkalescence is strong; (4) splendid water-soluble of tool is easy to remove and can not residues on the wafer; (5) can reduce the gravitation between silicon dioxide molecules in the slurries, silica dioxide granule more easily is scattered in the slurries, so the lower viscosity of the whole tool of slurries helps using operation.Therefore, but above-mentioned organic bases stable suspersion silica fume particles can not polluted semiconductor fabrication again, and can prepare high-quality semiconductor element.
The invention provides a kind of Chemicomechanically grinding composition, this abrasive composition comprises the pyrogenic silica of 5～50 weight %, the organic bases of 0.1～10 weight %, and it is to be selected from hydroxyalkyl amine and polyamines base alkali.
Content according to the pyrogenic silica that abrasive composition of the present invention comprised is 5～50 weight %, and preferable content is 15～30 weight %.The pyrogenic silica that uses in the present invention is general commercially available person, can utilize silicon tetrachloride combustion reactions preparation and getting in oxyhydrogen flame, and its reaction formula is as follows:
The pyrogenic silica molecule that is produced in the combustion processes forms little aggregate through the cohesion of cold back, and these little aggregates are become one through running foul of each other, form three-dimensional paniculate chain-cluster body.Because that pyrogenic silica has is big as purity height, specific surface area, and advantage such as narrow diameter distribution, so be applicable to as the friction particle in the Chemicomechanically grinding composition and use.
The content of the organic bases that abrasive composition comprised according to the present invention is 0.1～10 weight %, and preferable content is 1.5～5 weight %.The organic bases that uses in the present invention is to be selected from hydroxyalkyl amine and polyamines base alkali, and to adjust the pH value of abrasive composition.
Described hydroxyalkyl amine can be and comprises one, two or three substituent amine of hydroxyalkyl, and its chemical formula is suc as formula shown in (I):
R, R ' and R in the formula " can be identical or different, represent hydrogen or hydroxyalkyl separately, the carbon number of hydroxyalkyl is preferably 1～6.
Particularly, this hydroxyalkyl amine can be trolamine, diethanolamine, thanomin, tri-isopropanolamine, diisopropanolamine (DIPA), Yi Bingchunan, butanolamine or its mixture, wherein is preferably trolamine or thanomin.
This polyamines base alkali is suc as formula shown in (II):
R in the formula
1, R
2, R
3, R
4, R
5, R
6And R
7Can be identical or different, represent hydrogen, alkyl, amine alkyl or hydroxyalkyl separately, each substituent carbon number is preferably 1～6, is more preferred from 1～3; n
1Be 0～4 integer, represent amido heavily to cover unitary number, n
1Be preferably 0 or 1; And n
2And n
3On behalf of carbochain, respectively do for oneself 0～6 integer heavily cover unitary number, n
2And n
3Be preferably 0～3 integer.
Work as n
1=0 o'clock, this polyamines base alkali was suc as formula two amido alkali shown in (III):
Two nitrogen-atoms connect by the carbochain that is unsubstituted or is substituted, and carbochain is heavily covered unit number n
2Be 0～6 integer, be preferably 0～3 integer, work as n
2Greater than 1 o'clock, R
6Can be identical or different.Particularly, this two amidos alkali can be quadrol, propylene diamine, butanediamine, pentamethylene diamine, 1,2-diamines propane, the N-methyl ethylenediamine, dimethyl-ethylenediamine, the N-ethylethylenediamine, the N-methyl isophthalic acid, the 3-propylene diamine, the 3-dimethylaminopropylamine, N-sec.-propyl quadrol, N, N, N ', N '-tetramethyl-diamines methane, N, N, N '-trimethylammonium quadrol, N, N, N ', N '-Tetramethyl Ethylene Diamine, 1, the 6-hexanediamine, N, the N-diethyl ethylenediamine, N, N-dimethyl-N '-ethylethylenediamine, N, N, N ', N '-tetramethyl--1, the 4-butanediamine, N, N, N '-triethyl quadrol, 1,3-diamino-2-hydroxypropyl alkane, 2-(2-aminoethyl)-ethanol, N, N '-two (2-hydroxyethyl) quadrol, N, N, N ', N '-four (2-hydroxypropyl) quadrol, 1, two (trihydroxymethylaminomethane base) propane of 3-, or its mixture, wherein be preferably quadrol.
In addition, the substituent R on the nitrogen-atoms
1, R
2, R
3And R
4Can two twenty percent ring, for example R
1Can with R
2Form many Yuans rings, R
1Also can with R
3Form many Yuans rings.Particularly, R
1With R
2The two amido alkali of Cheng Huan can be 1-(2-amino-ethyl) tetramethyleneimine, 2-(aminomethyl)-1-ethyl pyrrolidine, 2-(2-amino-ethyl)-1-crassitude, bihyrrolidinyl methane, 4-pyrrolidyl tetramethyleneimine, 4-(2-amino-ethyl morpholine or its mixture, and R
1With R
3The two amido alkali of Cheng Huan can be hexahydropyrazine, 1-methyl hexahydropyrazine, 1,4-dimethyl hexahydropyrazine, 2-methyl hexahydropyrazine, 2,6-dimethyl hexahydropyrazine, 1-(2-hydroxyethyl) hexahydropyrazine, 1-(2-amino-ethyl) hexahydropyrazine or its mixture wherein are preferably hexahydropyrazine.
Moreover, connect the substituent R on the carbon bond between two nitrogen-atoms
6One with nitrogen-atoms on substituent R
1, R
2, R
3And R
4Also can form many Yuans rings, for example R
1Can with R
6Form many Yuans rings.Particularly, R
1With R
6The two amido alkali of Cheng Huan can be 2-(aminomethyl)-1-ethyl pyrrolidine, the amino hexahydropyridine of 2-(2-aminoethyl)-1-crassitude, 3-, 1-methyl-4-(methylamino)-hexahydropyridine, 4-(aminomethyl)-hexahydropyridine, 4-amino-2,2,6,6-tetramethyl-hexahydropyridine or its mixture.
Work as n
1=1 o'clock, this polyamines base alkali was suc as formula three amido alkali shown in (IV):
Three nitrogen-atoms are to be unsubstituted or carbon bond through getting connects with two, and carbon bond heavily covers unitary number n
2And n
3Respectively do for oneself 0～6 integer is preferably 0～3 integer, works as n
2Greater than 1 o'clock, R
6Can be identical or different, and work as n
3Greater than 1 o'clock, R
7Can be identical or different.Particularly, this three amidos alkali can be diethyl triamine, N-(2-amino-ethyl)-1,3-propylene diamine, 3,3 '-imido grpup dipropyl amine, spermidine or its mixture, wherein be preferably diethyl triamine.
Can comprise according to abrasive composition of the present invention, for example, water is as solvent.In preparation process, water can be made so that this abrasive composition is the slurries shape.Be preferably and use general conventional deionized water, to remove the impurity that may contain in the water.
In the present invention, be to prepare this Chemicomechanically grinding composition with general ordinary method.At first pyrogenic silica is added in the entry, stir, till pyrogenic silica suspends in water fully, and form slurries so that the agitator of high shear force is lasting.Back continuation add water so that pyrogenic silica reaches required solid content in the slurries, the solid content of slurries is 20%～50% in the present invention, is preferably 25%～30%, to prepare highly purified abrasive composition slurries.Then add organic bases and continue to stir, to less than 11, otherwise easily cause pyrogenic silica partly to be dissolved in the water with the pH value of adjusting slurries, and the stability of reduction suspension.The preferable pH value of these slurries scope is 9.0～10.6.After being filtered again, promptly make according to Chemicomechanically grinding composition of the present invention.
This preparation process can be carried out under any suitable temperature, and preferable temperature of reaction is 20～40 ℃.
Following examples further specify implementation detail of the present invention, but non-in order to limiting the scope of the invention, and anyly have the knack of modification and the change that this operator can reach easily, all are covered by in the scope of the present invention.
Embodiment 1
The pyrogenic silica that uses in present embodiment (the Aerosil series product that Degussa company produces) character is as follows:
PH value circle of (1) 2% waterborne suspension is between 3.6～4.3;
(2) specific surface area is 70～130 meters
2/ gram; And
(3) proportion is≤0.07 grams per milliliter.
Under room temperature, lentamente 25 kilograms above-mentioned pyrogenic silica is added in 30 kilograms the deionized water, continue to stir, suspend fully up to pyrogenic silica with the agitator of high shear force.
The deionized water that then adds 26.5 kilograms again dilutes the solid content of slurries for being slightly larger than 30%.Add 1.3 kilograms of trolamines, it can be dissolved in rapidly in the slurries, continues to continue to stir after 3 hours, and the pH value of gained slurries is 9.2.Filtered again, make thus according to Chemicomechanically grinding composition of the present invention, it is the slurries of solid content 30%, measures this abrasive composition in Brookfield (Brookfield) viscosity (unit is a centipoise) that reaches after 24 hours after 72 days, and it the results are shown in table 1.
Embodiment 2
Use the preparation process identical with embodiment 1, only with 0.73 kilogram of replacement of quadrol trolamine, the pH value of gained slurries is 10.1.Make according to Chemicomechanically grinding composition of the present invention, it is the slurries of solid content 30%, measures this magnetic mill composition in the viscosity that reaches after 24 hours after 72 days, and it the results are shown in table 1.
Embodiment 3
Use the preparation process identical with embodiment 1, only with 1.15 kilograms of replacements of thanomin trolamine, the pH value of gained slurries is 9.1.Make according to Chemicomechanically grinding composition of the present invention, it is the slurries of solid content 30%, measures this abrasive composition after 24 hours and in 72 days viscosity, and it the results are shown in table 1.
Embodiment 4
Use the preparation process identical with embodiment 1, only with 0.82 kilogram of replacement of hexahydropyrazine trolamine, the pH value of gained slurries is 9.4.Make according to Chemicomechanically grinding composition of the present invention, it is the slurries of solid content 30%, measures this abrasive composition in the viscosity that reaches after 24 hours after 72 days, and it the results are shown in table 1.Embodiment 5
Use the preparation process identical with embodiment 1, only with 0.71 kilogram of replacement of diethyl triamine trolamine, the pH value of gained slurries is 10.1.Make according to Chemicomechanically grinding composition of the present invention, it is the slurries of solid content 30%, measures this abrasive composition in the viscosity that reaches after 24 hours after 72 days, and it the results are shown in table 1.Comparative example 1
Use the preparation process identical with embodiment 1, only with 0.22 kilogram of replacement of potassium hydroxide trolamine, the pH value of gained slurries is 10.5.Make the relatively Chemicomechanically grinding composition of usefulness, it is the slurries of solid content 30%, measures this abrasive composition in the viscosity that reaches after 24 hours after 72 days, and it the results are shown in table 1.Comparative example 2
Use the preparation process identical with embodiment 1, only with 1.03 kilograms of replacements of ammonium hydroxide trolamine, the pH value of gained slurries is 10.5.Make the relatively Chemicomechanically grinding composition of usefulness, it is the slurries of solid content 30%, measures the viscosity that this abrasive composition reached after 72 days in 24 hours, and it the results are shown in table 1.Comparative example 3
Use precious (CABOT) SC-1 that company produced of commercially available visitor to use the source of Chemicomechanically grinding composition as a comparison.SC-1 contains the pyrogenic silica slurries for what adjust the pH value through potassium hydroxide, and the solid content of these slurries is 30%, and the pH value is 10.5.Because the date of buying SC-1, for behind 72 days of this product date of built, so only measure its viscosity after 72 days, it the results are shown in table 1.The result relatively
As shown in table 1, the viscosity of the solid content 30% Chemicomechanically grinding composition slurries of comparing embodiment 1 to 5 and comparative example 1 to 3, abrasive composition slurries according to the present invention reached the equal lower viscosity of tool after 72 days in 24 hours, the intermolecular attraction that shows pyrogenic silica in these slurries is less, and the preferable dispersiveness of tool.
Embodiment 6
Use the preparation process identical with embodiment 1, the deionized water that only after adding pyrogenic silica, adds 44 kilograms again, for being slightly larger than 25%, and the trolamine usage quantity of adding is 1.2 kilograms with the dilution of the solid content of slurries, and the pH value of gained slurries is 9.2.Make according to Chemicomechanically grinding composition of the present invention, it is the slurries of solid content 25%, measures this abrasive composition in the viscosity that reaches after 24 hours after 72 days, and it the results are shown in table 2.
Embodiment 7
Use the preparation process identical with embodiment 6, only with 0.66 kilogram of replacement of quadrol trolamine, the pH value of gained slurries is 10.1.Make according to Chemicomechanically grinding composition of the present invention, it is the slurries of solid content 25%, measures this abrasive composition in the viscosity that reaches after 24 hours after 72 days, and it the results are shown in table 2.Embodiment 8
Use the preparation process identical with embodiment 6, only with 1.0 kilograms of replacements of thanomin trolamine, the pH value of gained slurries is 9.1.Make according to Chemicomechanically grinding composition of the present invention, it is the slurries of solid content 25%, measures this abrasive composition in the viscosity that reaches after 24 hours after 72 days, and it the results are shown in table 2.
Embodiment 9
Use the preparation process identical with embodiment 6, only with 0.75 kilogram of replacement of hexahydropyrazine trolamine, the pH value of gained slurries is 9.4.Make according to Chemicomechanically grinding composition of the present invention, it is the slurries of solid content 25%, measures this abrasive composition in the viscosity that reaches after 24 hours after 72 days, and it the results are shown in table 2.
Embodiment 10
Use the preparation process identical with embodiment 6, only with 0.65 kilogram of replacement of diethyl triamine trolamine, the pH value of gained slurries is 10.1.Make according to Chemicomechanically grinding composition of the present invention, it is the slurries of solid content 25%, measures this abrasive composition in the viscosity that reaches after 24 hours after 72 days, and it the results are shown in table 2.Comparative example 4
Use the preparation process identical with embodiment 6, only with 0.19 kilogram of replacement of potassium hydroxide trolamine, the pH value of gained slurries is 10.5.Make the relatively Chemicomechanically grinding composition of usefulness, it is the slurries of solid content 25%, measures this abrasive composition in the viscosity that reaches after 24 hours after 72 days, and it the results are shown in table 2.Comparative example 5
Use the preparation process identical with embodiment 6, only with 0.91 kilogram of replacement of ammonium hydroxide trolamine, the pH value of gained slurries is 10.5.Make the relatively Chemicomechanically grinding composition of usefulness, it is the slurries of solid content 25%, measures this abrasive composition in the viscosity that reaches after 24 hours after 72 days, and it the results are shown in table 2.Comparative example 6
Use the commercially available SS-25 that objective precious company produced to use the source of Chemicomechanically grinding composition as a comparison.SS-25 contains the pyrogenic silica slurries for what adjust the pH value through potassium hydroxide, and the solid content of these slurries is 25%, and the pH value is 10.4.Because the date of buying SS-25, for behind 72 days of this product date of built, so only measure its viscosity after 72 days, it the results are shown in table 2.The result relatively
As shown in table 2, the viscosity of the solid content 25% Chemicomechanically grinding composition slurries of comparing embodiment 6 to 10 and comparative example 4 to 6, abrasive composition slurries according to the present invention are in reaching the equal lower viscosity of tool after 72 days after 24 hours, the intermolecular attraction that shows pyrogenic silica in these slurries is less, and the preferable dispersiveness of tool.
Table 1
Solid content 30% Chemicomechanically grinding composition slurries
| Make an addition to the alkali in the pyrogenic silica slurries | Brookfield viscosity after 24 hours (centipoise) | Brookfield viscosity after 72 days (centipoise) | |
| Embodiment 1 | Trolamine | 20 | 22 |
| Embodiment 2 | Quadrol | 25 | 31 |
| Embodiment 3 | Thanomin | 18 | 20 |
| Embodiment 4 | Hexahydropyrazine | 27 | 34 |
| Embodiment 5 | Diethyl triamine | 35 | 36 |
| Comparative example 1 | Potassium hydroxide | 48 | 57 |
| Comparative example 2 | Ammonium hydroxide | 52 | 76 |
| Comparative example 3 | (SC-1)* | - | 61 |
* for relatively using the source of Chemicomechanically grinding composition.
Table 2
Solid content 25% Chemicomechanically grinding composition slurries
| Make an addition to the alkali in the pyrogenic silica slurries | Brookfield viscosity after 24 hours (centipoise) | Brookfield viscosity after 72 days (centipoise) | |
| Embodiment 6 | Trolamine | 8 | 8 |
| Embodiment 7 | Quadrol | 8 | 10 |
| Embodiment 8 | Thanomin | 6 | 6 |
| Embodiment 9 | Hexahydropyrazine | 7 | 7 |
| Embodiment 10 | Diethyl triamine | 9 | 10 |
| Comparative example 4 | Potassium hydroxide | 10 | 10 |
| Comparative example 5 | Ammonium hydroxide | 12 | 15 |
| Comparative example 6 | (SC-1)** | - | 10 |
* is for relatively using the source of Chemicomechanically grinding composition.
Claims (14)
1. Chemicomechanically grinding composition, it comprises the pyrogenic silica of 5～50 weight %, the organic bases of 0.1～20 weight % and the water of surplus, and described alkali is selected from suc as formula the hydroxyalkyl amine shown in (I):
R, R ' and R in the formula " hydroxyalkyl of representing hydrogen or carbon number 1～6 separately reaches suc as formula the polyamines base alkali shown in (II):
R in the formula
1, R
2, R
3, R
4, R
5, R
6And R
7Represent the alkyl of hydrogen, carbon number 1～6, amine alkyl or the hydroxyalkyl of carbon number 1～6, the perhaps R of carbon number 1～6 separately
1With R
2, R
1With R
3, or R
1With R
6Can Cheng Huan, n
1Be 0～4 integer, and n
2And n
3Respectively do for oneself 0～6 integer.
2. abrasive composition according to claim 1, wherein said hydroxyalkyl amine is selected from trolamine, diethanolamine, thanomin, tri-isopropanolamine, diisopropanolamine (DIPA), Yi Bingchunan and butanolamine.
3. abrasive composition according to claim 2, wherein said hydroxyalkyl amine are trolamine or thanomin.
4. abrasive composition according to claim 1, wherein n
2And n
3Respectively do for oneself 0～3 integer.
5. abrasive composition according to claim 1 is wherein worked as n
1Be 0 o'clock, described polyamines base alkali is two amido alkali shown in the formula (III):
R wherein
1, R
2, R
3, R
4And R
6Represent the alkyl of hydrogen, carbon number 1～6, amine alkyl or the hydroxyalkyl of carbon number 1～6, the perhaps R of carbon number 1～6 separately
1With R
2, R
1With R
3, or R
1With R
6Can Cheng Huan, and n
2It is 0～6 integer.
6. abrasive composition according to claim 5, wherein said two amido alkali are selected from quadrol, propylene diamine, butanediamine, pentamethylene diamine, 1,2-diamines propane, the N-methyl ethylenediamine, dimethyl-ethylenediamine, the N-ethylethylenediamine, the N-methyl isophthalic acid, the 3-propylene diamine, the 3-dimethylaminopropylamine, N-sec.-propyl quadrol, N, N, N ', N '-tetramethyl-diamines methane, N, N, N '-trimethylammonium quadrol, N, N, N ', N '-Tetramethyl Ethylene Diamine, 1, the 6-hexanediamine, N, the N-diethyl ethylenediamine, N, N-dimethyl-N '-ethylethylenediamine, N, N, N ', N '-tetramethyl--1, the 4-butanediamine, N, N, N '-triethyl quadrol, 1,3-diamino-2-hydroxypropyl alkane, 2-(2-aminoethyl)-ethanol, N, N '-two (2-hydroxyethyl) quadrol, N, N, N ', N '-four (2-hydroxypropyl) quadrol, and 1, two (trihydroxymethylaminomethane base) propane of 3-.
7. abrasive composition according to claim 6, wherein said two amido alkali are quadrol.
8. abrasive composition according to claim 5, wherein R
1With R
2Cheng Huan, and described two amido alkali are to be selected from 1-(2-aminoethyl) tetramethyleneimine, 2-(aminomethyl)-1-ethyl pyrrolidine, 2-(2-amino-ethyl)-1-crassitude, bihyrrolidinyl methane, 4-pyrrolidyl tetramethyleneimine, and 4-(2-amino-ethyl) morpholine.
9. abrasive composition according to claim 5, wherein R
1With R
3Cheng Huan, and described two amido alkali are selected from hexahydropyrazine, 1-methyl hexahydropyrazine, 1,4-dimethyl hexahydropyrazine, 2-methyl hexahydropyrazine, 2,6-dimethyl hexahydropyrazine, 1-(2-hydroxyethyl) hexahydropyrazine, and 1-(2-amino-ethyl) hexahydropyrazine.
10. abrasive composition according to claim 9, wherein said two amido alkali are hexahydropyrazine.
11. abrasive composition according to claim 5, wherein R
1With R
6Cheng Huan, and described two amido alkali are to be selected from 2-(aminomethyl)-1-ethyl pyrrolidine, the amino hexahydropyridine of 2-(2-amino-ethyl)-1-crassitude, 3-, 1-methyl-4-(methylamino)-hexahydropyridine, 4-(aminomethyl)-hexahydropyridine, and 4-amino-2,2,6,6-tetramethyl-hexahydropyridine.
12. abrasive composition according to claim 1 is wherein worked as n
1Be 1 o'clock, this polyamines base alkali is three basic alkali shown in the formula (IV):
R wherein
1, R
2, R
3, R
4, R
5, R
6And R
7Represent the alkyl of hydrogen, carbon number 1～6, amine alkyl or the hydroxyalkyl of carbon number 1～6, the perhaps R of carbon number 1～6 separately
1With R
2, R
1With R
3, or R
1With R
6Can Cheng Huan, and n
2And n
3Respectively do for oneself 0～6 integer.
13. abrasive composition according to claim 12, wherein said three amido alkali are selected from diethyl triamine, N-(2-amino-ethyl)-1,3-propylene diamine, 3,3 '-the imido grpup dipropyl amine, and spermidine.
14. abrasive composition according to claim 13, wherein said three amido alkali are diethyl triamine.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 97116569 CN1092696C (en) | 1997-10-08 | 1997-10-08 | Chemical Machinery grinding compsn. |
| HK99104307A HK1019231A1 (en) | 1997-10-08 | 1999-10-04 | Chemical mechanical polishing composition |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 97116569 CN1092696C (en) | 1997-10-08 | 1997-10-08 | Chemical Machinery grinding compsn. |
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| Publication Number | Publication Date |
|---|---|
| CN1213684A CN1213684A (en) | 1999-04-14 |
| CN1092696C true CN1092696C (en) | 2002-10-16 |
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|---|---|---|---|
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-
1997
- 1997-10-08 CN CN 97116569 patent/CN1092696C/en not_active Expired - Fee Related
-
1999
- 1999-10-04 HK HK99104307A patent/HK1019231A1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1213684A (en) | 1999-04-14 |
| HK1019231A1 (en) | 2000-01-28 |
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