CN109266274A - A kind of high intensity room temperature fast-curing two-component epoxy construction gluing agent - Google Patents
A kind of high intensity room temperature fast-curing two-component epoxy construction gluing agent Download PDFInfo
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- CN109266274A CN109266274A CN201810952821.3A CN201810952821A CN109266274A CN 109266274 A CN109266274 A CN 109266274A CN 201810952821 A CN201810952821 A CN 201810952821A CN 109266274 A CN109266274 A CN 109266274A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
- C08G59/60—Amines together with other curing agents with amides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/06—Polymer mixtures characterised by other features having improved processability or containing aids for moulding methods
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses a kind of high-intensitive room temperature fast-curing two-component epoxy construction gluing agent, component A includes epoxy resin, coupling agent A, filler, and B component includes high imidazoline content modified polyamide curing agent, two distinct types of modified fatty amine curing agent B and curing agent C, toughener, coupling agent B and filler.The present invention solves the problems, such as room temperature curing gluing agent heatproof, speed-raising, toughening；Adhesive is more preferable for the wetting effect and binding ability of substrate, and cavity and delamination occurrence probability become smaller；By adding suitable filler, the operating time of adhesive, mechanical strength, anti-sag are controlled；By the optimum organization being respectively formulated to adhesive, the intensity requirement of adhesive ensure that.Adhesive of the invention can be used for the bonding of the composite materials such as metal material, nonmetallic materials, such as bonding polyurethane, cystosepiment, aluminum honeycomb panel, aluminium sheet, the production for military, civilian carriage body composite laminboard.
Description
Technical field
The invention belongs to adhesive technology fields, and in particular to a kind of high-intensitive room temperature for composite laminboard is quickly solid
Change the gluing agent of two-component epoxy construction.
Background technique
In military, civilian carriage body field, especially Military Shelter field, the composite laminboard of use needs to have excellent power
Performance (test of battenboard impact resistance, the test of battenboard drum peel) and environmental suitability (battenboard thermocycling) are learned, and
And composite laminboard can be with industrial mass production.Therefore, the room temperature curing structural adhesive for composite laminboard is wanted
Ask comparison stringent, adhesive needs to have the features such as being convenient for construction, cure cycle is short, intensity is high, good toughness.
Room temperature curing structural adhesive for composite laminboard mainly has the adhesive for polyurethane and epoxy glue of two-component
Glutinous agent two types.Adhesive for polyurethane is cheap, and room temperature curing speed is fast, general 5~6h of curing time, and room temperature shearing is strong
Degree is no more than 12MPa, using more on civilian carriage body；Curing rate is slower under room temperature for epoxy adhesive, general to solidify
Time needs 4h~20h, but its mechanical strength and environmental suitability are substantially better than adhesive for polyurethane, is modified by optimization,
Its shear strength can be more than 14MPa, be applicable to different environment, using more on military carriage body (shelter).
Adhesive for polyurethane there are the shortcomings that have:
1, heat resistance is poor: the glass transition temperature Tg of adhesive for polyurethane is lower, by prolonged sunlight exposure,
Side reaction can occur for adhesive, be easy to appear cavity and bulge in the adhesive layer interface of composite laminboard, seriously affect compound
The mechanical property of battenboard entirety.
2, structural strength is low: the shear strength of adhesive for polyurethane is usually no more than 12MPa, for the sandwich of special core material
Plate, such as honeycomb sandwich board are easy that Cohesive failure occurs at glue-line, lead to composite laminboard when external load is larger
Failure delamination.
Existing epoxy adhesive there are the shortcomings that have:
1, the operating time is long, and curing time is long: for complicated battenboard, ultra-wide overlength is assembled and is glued with curved surface
Process it is more long, it is therefore desirable to the operating time is more relatively long, but when such epoxy adhesive operation currently on the market
Between it is too long, thus the room temperature curing time is also too long the problem of bring.Such adhesive operating time 1.5h~2h；30~
At 35 DEG C, generally requiring 10~15h can be only achieved intensity requirement；Insulated building is needed to heat battenboard in winter, seriously
Production efficiency is restricted, cost is increased.
2, the operating time is short, and curing time is short: the compacting of routine shelter big plate at present include metal framework, packing material,
Thermal insulation board, spool bury iron, covering composition.Each component product requires adhesive bonding, and applies pressure.For curved surface
, large-sized battenboard, the required operating time can more long, so if there are no apply if the adhesive operating time is too short
Plus-pressure, adhesive just have cured, and bonding is just bad.Quick-setting epoxy construction gluing agent, at 25 DEG C, the operating time
Only 10~15min；It at 30~35 DEG C, generally requires 4~5h and reaches initial strength, for large-sized battenboard
The battenboard of (3000mm × 9000mm) or abnormal curved surface do not complete sizing gel.The reasonable operating time gives worker
The sufficient gluing time, and efficiency can be improved in reasonable curing time, cost efficiency, general room temperature control is 15 DEG C~40
DEG C, 40~90min of operating time, curing time, 6~7h was relatively met the requirements.
3, solidify it is insufficient: in practical applications, many epoxy adhesives use and not up to ideal cure parameter；
Meanwhile curing agent is not sufficiently reactive with resin, smell is larger.The epoxy adhesive of room temperature curing need curing degree reach 80% with
On, competence exertion ideal effect, otherwise glue-line understands embrittlement, and structural strength is lower, therefore the parameter of room temperature curing is had to rationally,
It is easy to accomplish.
4, flowing down problems: for the battenboard of special core material, such as honeycomb class battenboard, when adhesive viscosity is small,
When to the sizing of upper and lower covering, glue can be flowed in honeycomb pore, lead to junction starved, influence intensity；Adhesive viscosity is excessive
When, gluing is laborious, poor to the core materials binding force such as foam.Therefore, reasonable adhesive viscosity and applicability, just can guarantee adhesive
With the good wetability of core material, it is easy to use simultaneously.
In addition, military, civilian carriage body field, the epoxy adhesive for composite laminboard are also contemplated that following several respects
The problem of:
1, impact flexibility: core material is partially soft compared to for covering and adhesive, therefore adhesive is as in core material and covering
Between medium, it is necessary to have good toughness, general epoxy resin adhesive rigidity is stronger, and military, civilian carriage body is placed in high machine
In dynamic carrier vehicle, by jolting for various complex road conditions, the shock loading being subject to is larger, it is necessary to carry out to Formulaion of epoxy resin excellent
Change adjustment, have excellent toughness, realizes the continuous transmitting of interlayer load, stress is avoided to concentrate.
2, temperature tolerance: compared to general epoxy adhesive, military, civilian carriage body is right due to often exposing under surroundings
The requirement of temperature is more harsh, needs to have high Tg, keeps glue-line chemical stability.
3, mechanical strength: under normal circumstances, the preparation manipulation time is moderate, curing time is moderate, solidification is abundant, viscosity is suitable
In, toughness epoxy adhesive good, with high Tg when, the mechanical strength of epoxy adhesive can decrease, and need to formula
It is adjusted, so that the mechanical strength of adhesive reaches the requirement of military, civilian carriage body.
Summary of the invention
Goal of the invention: present invention aims in view of the deficiencies of the prior art, provide a kind of height for composite laminboard
Intensity room temperature fast-curing two-component epoxy construction gluing agent.
Technical solution: the purpose of the invention is achieved by the following technical solution:
The present invention provides a kind of high-intensitive room temperature fast-curing two-component epoxy construction gluing agent, the adhesive includes
Component A and B component, based on parts by weight,
The component A includes following raw material: 100~120 parts of epoxy resin, 2~4 parts of coupling agent A, 10~30 parts of filler；
The B component includes following raw material: 50~80 parts of imidazoline content modified polyamide curing agent A high, two kinds of differences
The modified fatty amine curing agent B and curing agent C of type, 10~25 parts of curing agent B, 10~30 parts of curing agent C, toughener 10~
25 parts, 2~4 parts of coupling agent B, 10~30 parts of filler；
Component A and the weight ratio of B component mixing are 100:(40~50 in the adhesive).
Based on epoxy resin and toughener, by the coordinated of three kinds of curing agent, the agent of room temperature curing gluing is solved
The problem of heatproof, speed-raising, toughening；By the synergistic effect of two types coupling agent, one pack system single type coupling agent, glue are compared
Glutinous agent is more preferable for the wetting effect and binding ability of substrate, and cavity and delamination occurrence probability become smaller；It is suitably filled out by addition
Material, controls the operating time of adhesive, mechanical strength, anti-sag；By the optimum organization being respectively formulated to adhesive, guarantee gluing
The intensity requirement of agent.
The application has found under study for action: toughener is added in respectively in epoxy resin and modified fat amine curing agent in,
Add toughener effect in the epoxy not satisfactory, toughener and the curing agent synergistic effect being added in curing agent are more preferable.
Curing agent C is used cooperatively by the application with toughener, and curing agent C play the role of it is main, while playing toughening, tool
The mechanical strength got ready.Toughener is used cooperatively with curing agent C, can complete split-phase while quickly establishing shear strength,
Micron-scale phase separation is formed, island structure is formed, improves the impact flexibility of adhesive.
Preferably, epoxy resin is liquid bisphenol A epoxy resin in the component A, as matrix resin.
It is further preferred that epoxy resin is in liquid bisphenol A epoxy resin NPEL-128, E331 in the component A
One or two.
Preferably, coupling agent A is epoxy coupling agents in the component A, and coupling agent B is double amino coupleds in the B component
Agent.Double amino coupling agents are used cooperatively with the epoxy coupling agents in component A in B component, form synergistic effect.
It is further preferred that the coupling agent A is the one or more of epoxy coupling agents KBM403, KH561, KH562.It mentions
The binding force of high core material and covering, covering and frame.
It is further preferred that the coupling agent B is the one or more of double amino coupling agent KBM603, KH791, KH602.
Preferably, filler is 1000~5000 mesh silicon powders, 80~200 mesh barium sulfate crystal whiskers in the component A and B component
One or both of.Shear strength is improved, the operating time is extended, controls adhesive viscosity.
Preferably, the high imidazoline content modified polyamide curing agent A is one or more of Ek3140a, V140.
Curing agent B and curing agent C is two distinct types of modified fatty amine curing agent, the different from structure.By
Very big in pure fatty amine brittleness, volatility is big, and toxicity is also larger, it is therefore desirable to modified.Modification be that part primary amine is anti-
It should fall, having plenty of Manny, this reacts addition；Different groups can be connect on basic amine hardener, the group number connect is not
Together, the differences such as the position connect, the number of the reactive hydrogen of obtained modified fatty amine curing agent and position are with regard to different.The application exists
It is found in research, the influence that the structure of modified fatty amine curing agent is distinguished to performance is very big.
Preferably, the curing agent B is one or more of modified fatty amine curing agent JH5473 or JH5432s.
Preferably, the curing agent C is one or more of modified fatty amine curing agent B-X or V-I70.
Preferably, toughener is liquid nitrile rubber in the B component.Control the toughness of adhesive.Curing agent C and liquid
Nitrile rubber is used cooperatively, and can be completed split-phase while quickly establishing shear strength, be formed micron-scale phase separation, form sea
Island structure improves the impact flexibility of adhesive.
High intensity room temperature fast-curing two-component epoxy construction gluing agent provided by the invention can be used for metal material, non-gold
Belong to the bonding of the composite materials such as material, such as bonding polyurethane, cystosepiment, aluminum honeycomb panel, aluminium sheet, it is multiple for military, civilian carriage body
The production of co-clip core plate.
The utility model has the advantages that the present invention based on epoxy resin and toughener, by the coordinated of three kinds of curing agent, solves
The problem of room temperature curing gluing agent heatproof, speed-raising, toughening；By the synergistic effect of two types coupling agent, one pack system is compared
Single type coupling agent, adhesive are more preferable for the wetting effect and binding ability of substrate, and cavity and delamination occurrence probability become smaller；
By adding suitable filler, the operating time of adhesive, mechanical strength, anti-sag are controlled；Pass through what is be respectively formulated to adhesive
Optimum organization ensure that the intensity requirement of adhesive.
Specific embodiment
Technical solution of the present invention is described in detail below by specific embodiment, but protection scope of the present invention is not
It is confined to the embodiment.
The curing agent B: modified fatty amine curing agent JH5473, JH5432s that the present invention uses；Curing agent C: modified fatty amine
Curing agent B-X, V-I70 are all from Shenzhen Jia Dida.
Embodiment 1:
The preparation of component A: 100 parts by weight of bisphenol A type epoxy resin NPEL-128,2 weight of epoxy coupling agents KH561
Part, 120 mesh barium sulfate crystal whisker, 10 parts by weight are stirred at room temperature uniformly；
The preparation of B component: 60 parts by weight of modified polyamide curing agent V140,10 weight of modified fatty amine curing agent JH5473
Measure part, 20 parts by weight of modified fatty amine curing agent B-X, 15 parts by weight of liquid nitrile rubber, double 3 weights of amino coupling agent KH791
Part is measured, 120 mesh barium sulfate crystal whisker, 10 parts by weight are stirred at room temperature uniformly；
Component A and B component are stirred evenly according to the ratio of weight ratio 100:50, obtain light brown adhesive.
Embodiment 2:
The preparation of component A: 110 parts by weight of bisphenol A type epoxy resin E-331,2.5 parts by weight of epoxy coupling agents KH562,
1000 mesh silicon powder, 20 parts by weight are stirred at room temperature uniformly；
The preparation of B component: 50 parts by weight of modified polyamide curing agent Aek3140a, modified fatty amine curing agent JH5473
15 parts by weight, 10 parts by weight of modified fatty amine curing agent V-I70,11 parts by weight of liquid nitrile rubber, double amino coupling agents
2 parts by weight of KH602,1200 mesh silicon powder, 20 parts by weight are stirred at room temperature uniformly；
Component A and B component are stirred evenly according to the ratio of weight ratio 100:45, obtain light brown adhesive.
Embodiment 3:
The preparation of component A: 120 parts by weight of bisphenol A type epoxy resin NPEL-128,4 weight of epoxy coupling agents KBM403
Part, 5000 mesh silicon powder, 30 parts by weight are stirred at room temperature uniformly；
The preparation of B component: 80 parts by weight of modified polyamide curing agent V140, modified fatty amine curing agent JH5432s 25
Parts by weight, 15 parts by weight of modified fatty amine curing agent B-X, 15 parts by weight of modified fatty amine curing agent V-I70, liquid butyronitrile rubber
25 parts by weight of glue, double 4 parts by weight of amino coupling agent KBM603,5000 mesh silicon powder, 30 parts by weight are stirred at room temperature uniformly；
Component A and B component are stirred evenly according to the ratio of weight ratio 100:40, obtain light brown adhesive.
The performance test results of adhesive obtained by Examples 1 to 3 are shown in Table 1:
The performance test results of each embodiment adhesive of table 1 summarize
Military composite laminboard is suppressed under the conditions of 35 DEG C × 6h using adhesive obtained by Examples 1 to 3, using two-sided aluminium
Metal skin (Al) evaluates cementability, toughness and the heat resistance of adhesive for core material uses polyurethane (PU).Evaluation knot
Fruit is shown in Table 2:
The performance evaluation of military composite laminboard is made in the adhesive of the present invention of table 2
It can be seen that high intensity room temperature fast-curing two-component epoxy construction gluing agent provided by the invention solves room temperature
The problem of curing adhesive heatproof, speed-raising, toughening；Adhesive is more preferable for the wetting effect and binding ability of substrate, cavity and
Delamination occurrence probability becomes smaller；The operating time of adhesive is moderate, and mechanical strength is good, anti-sag；It ensure that the intensity of adhesive
It is required that can be used for the bonding of the composite materials such as metal material, nonmetallic materials, as bonding polyurethane, cystosepiment, aluminum honeycomb panel,
Aluminium sheet etc., the production for military, civilian carriage body composite laminboard.
As described above, must not be explained although the present invention has been indicated and described referring to specific preferred embodiment
For the limitation to invention itself.It without prejudice to the spirit and scope of the invention as defined in the appended claims, can be right
Various changes can be made in the form and details for it.
Claims (10)
1. a kind of high intensity room temperature fast-curing two-component epoxy construction gluing agent, which is characterized in that the adhesive includes A group
Part and B component, based on parts by weight,
The component A includes following raw material: 100~120 parts of epoxy resin, 2~4 parts of coupling agent A, 10~30 parts of filler；
The B component includes following raw material: 50~80 parts of imidazoline content modified polyamide curing agent A high, two kinds of different types
Modified fatty amine curing agent B and curing agent C, 10~25 parts of curing agent B, 10~30 parts of curing agent C, toughener 10~25
Part, 2~4 parts of coupling agent B, 10~30 parts of filler；
Component A and the weight ratio of B component mixing are 100:(40~50 in the adhesive).
2. high intensity room temperature fast-curing two-component epoxy construction gluing agent according to claim 1, which is characterized in that institute
Stating epoxy resin in component A is one or both of liquid bisphenol A epoxy resin NPEL-128, E331.
3. high intensity room temperature fast-curing two-component epoxy construction gluing agent according to claim 1, which is characterized in that institute
Stating coupling agent A in component A is epoxy coupling agents, and coupling agent B is double amino coupling agents in the B component.
4. high intensity room temperature fast-curing two-component epoxy construction gluing agent according to claim 3, which is characterized in that institute
State the one or more that coupling agent A is epoxy coupling agents KBM403, KH561, KH562.
5. high intensity room temperature fast-curing two-component epoxy construction gluing agent according to claim 3, which is characterized in that institute
State the one or more that coupling agent B is double amino coupling agent KBM603, KH791, KH602.
6. high intensity room temperature fast-curing two-component epoxy construction gluing agent according to claim 1, which is characterized in that institute
Stating filler in component A and B component is one or both of 1000~5000 mesh silicon powders, 80~200 mesh barium sulfate crystal whiskers.
7. high intensity room temperature fast-curing two-component epoxy construction gluing agent according to claim 1, which is characterized in that institute
Stating curing agent A is one or more of high imidazoline content modified polyamide Ek3140a, V140.
8. high intensity room temperature fast-curing two-component epoxy construction gluing agent according to claim 1, which is characterized in that institute
Stating curing agent B is one or more of modified fatty amine curing agent JH5473 or JH5432s.
9. high intensity room temperature fast-curing two-component epoxy construction gluing agent according to claim 1, which is characterized in that institute
Stating curing agent C is one or more of modified fatty amine curing agent B-X or V-I70.
10. high intensity room temperature fast-curing two-component epoxy construction gluing agent according to claim 1, which is characterized in that
Toughener is liquid nitrile rubber in the B component.
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| CN201810952821.3A CN109266274B (en) | 2018-08-21 | 2018-08-21 | High-strength room-temperature fast-curing two-component epoxy structural adhesive |
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| CN201810952821.3A CN109266274B (en) | 2018-08-21 | 2018-08-21 | High-strength room-temperature fast-curing two-component epoxy structural adhesive |
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| CN111876118A (en) * | 2020-07-29 | 2020-11-03 | 中国林业科学研究院林产化学工业研究所 | Lightweight high-toughness military shelter structural adhesive and preparation method thereof |
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| CN113025250A (en) * | 2021-04-22 | 2021-06-25 | 中国南方电网有限责任公司超高压输电公司检修试验中心 | Special adhesive for hollow composite insulator and preparation method thereof |
| CN114989758A (en) * | 2022-07-15 | 2022-09-02 | 溧阳二十八所系统装备有限公司 | Two-component epoxy adhesive |
| CN116355568A (en) * | 2023-03-24 | 2023-06-30 | 核工业理化工程研究院 | Adhesive sealant special for rubber ring and preparation method thereof |
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| CN111909644A (en) * | 2020-07-21 | 2020-11-10 | 上海康达化工新材料集团股份有限公司 | Epoxy composition for bonding honeycomb sandwich structure |
| CN111876118A (en) * | 2020-07-29 | 2020-11-03 | 中国林业科学研究院林产化学工业研究所 | Lightweight high-toughness military shelter structural adhesive and preparation method thereof |
| CN113025250A (en) * | 2021-04-22 | 2021-06-25 | 中国南方电网有限责任公司超高压输电公司检修试验中心 | Special adhesive for hollow composite insulator and preparation method thereof |
| CN114989758A (en) * | 2022-07-15 | 2022-09-02 | 溧阳二十八所系统装备有限公司 | Two-component epoxy adhesive |
| CN116355568A (en) * | 2023-03-24 | 2023-06-30 | 核工业理化工程研究院 | Adhesive sealant special for rubber ring and preparation method thereof |
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| CN109266274B (en) | 2020-11-06 |
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