CN109257913A - 一种基于5g通信的防水散热型基站设备 - Google Patents
一种基于5g通信的防水散热型基站设备 Download PDFInfo
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- CN109257913A CN109257913A CN201811308436.1A CN201811308436A CN109257913A CN 109257913 A CN109257913 A CN 109257913A CN 201811308436 A CN201811308436 A CN 201811308436A CN 109257913 A CN109257913 A CN 109257913A
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 151
- 238000004891 communication Methods 0.000 title claims abstract description 16
- 230000017525 heat dissipation Effects 0.000 claims abstract description 27
- 241000270295 Serpentes Species 0.000 claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 claims abstract description 19
- 239000010949 copper Substances 0.000 claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000000605 extraction Methods 0.000 claims abstract description 17
- 238000010521 absorption reaction Methods 0.000 claims abstract description 13
- 238000007789 sealing Methods 0.000 claims description 9
- 238000005192 partition Methods 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 2
- 235000017281 sodium acetate Nutrition 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000003809 water extraction Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
- 210000000707 wrist Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20181—Filters; Louvers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811308436.1A CN109257913B (zh) | 2018-11-05 | 2018-11-05 | 一种基于5g通信的防水散热型基站设备 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811308436.1A CN109257913B (zh) | 2018-11-05 | 2018-11-05 | 一种基于5g通信的防水散热型基站设备 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109257913A true CN109257913A (zh) | 2019-01-22 |
| CN109257913B CN109257913B (zh) | 2020-01-07 |
Family
ID=65042855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811308436.1A Active CN109257913B (zh) | 2018-11-05 | 2018-11-05 | 一种基于5g通信的防水散热型基站设备 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109257913B (zh) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110769327A (zh) * | 2019-10-15 | 2020-02-07 | 四川豪威尔信息科技有限公司 | 一种散热效果好的防风5g微基站 |
| CN111002856A (zh) * | 2019-12-17 | 2020-04-14 | 重庆国翰能源发展有限公司 | 一种大功率充电机液冷循环系统 |
| CN115604981A (zh) * | 2022-09-06 | 2023-01-13 | 湖北电信实业有限责任公司光电科技分公司(Cn) | 一种智慧社区信息箱 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007056599A3 (en) * | 2005-11-09 | 2007-11-15 | Cooligy Inc | Liquid cooling for backlit displays |
| US7319589B1 (en) * | 2004-04-12 | 2008-01-15 | Heady Gregory S | Cooling system for an electronic display |
| US20140321053A1 (en) * | 2013-04-29 | 2014-10-30 | Brian G. Donnelly | Temperature Regulation Via Immersion In A Liquid |
| US20160120058A1 (en) * | 2014-10-27 | 2016-04-28 | Ebullient, Llc | Fluid distribution unit for two-phase cooling system |
| US20180184549A1 (en) * | 2016-12-28 | 2018-06-28 | Jingway Technology Co., Ltd. | Water cooling device |
| CN207969292U (zh) * | 2018-04-16 | 2018-10-12 | 漳州市泰源环保科技有限公司 | 一种机电设备用散热装置 |
| CN207976809U (zh) * | 2018-01-16 | 2018-10-16 | 闫志文 | 一种计算机硬件专用散热机箱 |
| CN108733181A (zh) * | 2018-05-27 | 2018-11-02 | 安徽尚游文化传媒有限公司 | 用于机箱的水冷板机构 |
-
2018
- 2018-11-05 CN CN201811308436.1A patent/CN109257913B/zh active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7319589B1 (en) * | 2004-04-12 | 2008-01-15 | Heady Gregory S | Cooling system for an electronic display |
| WO2007056599A3 (en) * | 2005-11-09 | 2007-11-15 | Cooligy Inc | Liquid cooling for backlit displays |
| US20140321053A1 (en) * | 2013-04-29 | 2014-10-30 | Brian G. Donnelly | Temperature Regulation Via Immersion In A Liquid |
| US20160120058A1 (en) * | 2014-10-27 | 2016-04-28 | Ebullient, Llc | Fluid distribution unit for two-phase cooling system |
| US20180184549A1 (en) * | 2016-12-28 | 2018-06-28 | Jingway Technology Co., Ltd. | Water cooling device |
| CN207976809U (zh) * | 2018-01-16 | 2018-10-16 | 闫志文 | 一种计算机硬件专用散热机箱 |
| CN207969292U (zh) * | 2018-04-16 | 2018-10-12 | 漳州市泰源环保科技有限公司 | 一种机电设备用散热装置 |
| CN108733181A (zh) * | 2018-05-27 | 2018-11-02 | 安徽尚游文化传媒有限公司 | 用于机箱的水冷板机构 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110769327A (zh) * | 2019-10-15 | 2020-02-07 | 四川豪威尔信息科技有限公司 | 一种散热效果好的防风5g微基站 |
| CN111002856A (zh) * | 2019-12-17 | 2020-04-14 | 重庆国翰能源发展有限公司 | 一种大功率充电机液冷循环系统 |
| CN115604981A (zh) * | 2022-09-06 | 2023-01-13 | 湖北电信实业有限责任公司光电科技分公司(Cn) | 一种智慧社区信息箱 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109257913B (zh) | 2020-01-07 |
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| TR01 | Transfer of patent right |
Effective date of registration: 20230619 Address after: Room 112, Building 10, No. 21, Lane 689, Changxing Road, Jiangbei District, Ningbo City, Zhejiang Province, 315000, Trusteeship 4810 (Business Trusteeship) Patentee after: Ningbo Changxiang Technology Service Co.,Ltd. Address before: 325036 Wenzhou City National University Science Park incubator, No. 38 Dongfang South Road, Ouhai District, Wenzhou, Zhejiang Patentee before: WENZHOU VOCATIONAL & TECHNICAL College |
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Effective date of registration: 20240611 Address after: Building 1, Dongxing, Fugou Industrial Agglomeration Zone, Fugou County, Zhoukou City, Henan Province, 461341 Patentee after: Henan Zhongcabinet Industrial Co.,Ltd. Country or region after: China Address before: Room 112, Building 10, No. 21, Lane 689, Changxing Road, Jiangbei District, Ningbo City, Zhejiang Province, 315000, Trusteeship 4810 (Business Trusteeship) Patentee before: Ningbo Changxiang Technology Service Co.,Ltd. Country or region before: China |
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