CN109252081A - A kind of high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy and preparation method thereof - Google Patents
A kind of high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy and preparation method thereof Download PDFInfo
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- CN109252081A CN109252081A CN201811288722.6A CN201811288722A CN109252081A CN 109252081 A CN109252081 A CN 109252081A CN 201811288722 A CN201811288722 A CN 201811288722A CN 109252081 A CN109252081 A CN 109252081A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C29/00—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides
- C22C29/02—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides
- C22C29/06—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds
- C22C29/08—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds based on tungsten carbide
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- C22C1/04—Making non-ferrous alloys by powder metallurgy
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- C22C1/051—Making hard metals based on borides, carbides, nitrides, oxides or silicides; Preparation of the powder mixture used as the starting material therefor
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C29/02—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides
- C22C29/06—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds
- C22C29/067—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds comprising a particular metallic binder
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Abstract
The invention belongs to the technical field of hard alloy, a kind of high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy and preparation method thereof is disclosed.The high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy is using high-entropy alloy as Binder Phase, using tungsten carbide as hard phase;The constituent element of the high-entropy alloy is at least five kinds in Al, Co, Cr, Cu, Fe and Ni, and the atomic percent of every kind of element is 5~35%.Method: carrying out discharge plasma sinter molding after high-entropy alloy powder is mixed with WC powder, obtains high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy.Talide crystal grain of the invention is tiny, and comprehensive mechanical property is good;Without adding grain growth inhibitor;The consumption of cobalt is significantly reduced, the cost of raw material is reduced.
Description
Technical field
The present invention relates to a kind of high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy and preparation method thereof, belong to hard conjunction
Technology for gold field.
Background technique
Hard alloy has high rigidity, good elevated temperature strength and fracture toughness, is industrially widely used,
Cutter, drill bit, the draft of such as metal cutting, because and be known as " industrial tooth ".Hard alloy is by hard phase and bonding
Mutually it is prepared by powder metallurgical technique, hard phase provides high rigidity for hard alloy, and Binder Phase then provides toughness for it, and
Usually as the raising fracture toughness of hardness reduces.In order to improve the comprehensive performance of hard alloy, cost is reduced to adapt to industry
The demand of development, people have mutually carried out a large amount of research to ultra-fine/Nanograin Cemented Carbide, exploitation novel bonding is prepared.Although
Preparing ultra-fine/Nanograin Cemented Carbide can be improved the comprehensive performance of hard alloy, but its complex process, and ultra-fine/nanometer is hard
Fast growth makes it lose ultra-fine/nanocrystalline feature to matter alloy powder during the sintering process, thus needs to be added crystal grain and grow up
Inhibitor.On the other hand, although some novel bondings are mutually developed, there is magnetic and toxicity and be strategic resources
Cobalt be still current most widely used Binder Phase, this is also the significant challenge for preparing novel bonding and mutually facing.
Therefore, in order to further increase the comprehensive mechanical property of hard alloy, while developing the alternative Co's of function admirable
Binder Phase, the present invention propose that it is good to prepare comprehensive mechanical property using discharge plasma sintering using high-entropy alloy as Binder Phase
Ultrafine tungsten carbide hard alloy.
Summary of the invention
The shortcomings that in order to overcome existing Talide and deficiency, it is a kind of with good it is an object of the invention to propose
The ultrafine tungsten carbide hard alloy and preparation method thereof of good comprehensive mechanical property.
Binder Phase is solid solution high-entropy alloy in high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy of the invention, and WC is
Hard phase.Co element can be partially or completely substituted by adjusting constituent element in high-entropy alloy Binder Phase and its content, is effectively reduced
The cost of raw material.The inhibiting effect that the present invention grows up to WC grain using high-entropy alloy, without adding grain growth inhibitor just
The preparation of ultrafine tungsten carbide hard alloy can be achieved, and hard alloy has good comprehensive mechanical property.
The purpose of the invention is achieved by the following technical solution:
A kind of high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy, using high-entropy alloy as Binder Phase, with tungsten carbide (WC)
For hard phase;
The constituent element (ingredient) of the high-entropy alloy is at least five kinds in Al, Co, Cr, Cu, Fe and Ni, and every kind of element
Atomic percent is 5~35%.
High-entropy alloy mass percent in high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy is 5~20%.
The preparation method of the high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy, comprising the following steps:
Discharge plasma sinter molding is carried out after high-entropy alloy powder is mixed with WC powder, obtains high-entropy alloy Binder Phase
Ultrafine tungsten carbide hard alloy.The condition of the sintering are as follows: pressure >=30MPa of sintering;The temperature of sintering is 1200~1350
℃。
The preparation method of the high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy specifically includes following steps (1) ball
Mill prepares high-entropy alloy powder
Al, Co, Cr, Cu, Fe and Ni powder are uniformly mixed according to a ratio, ball milling, obtain high-entropy alloy powder;The ball milling
It carries out in an inert atmosphere, the inert atmosphere is argon gas;The ball milling refers to first dry grinding then wet-milling, needs drying after wet-milling;
(2) ball mill mixing
High-entropy alloy powder and WC powder are mixed, ball milling, sieving obtains mixture;
The ball milling carries out in an inert atmosphere, and the inert atmosphere is argon gas;The ball milling refers to that first dry grinding is then wet
Mill, needs drying after wet-milling;
(3) discharge plasma sintering forms
Mixture in step (2) is subjected to precompressed, is subsequently placed in progress plasma discharging burning in discharge plasma sintering furnace
Knot, it is cooling, obtain high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy;The condition of the sintering are as follows: the pressure of sintering >=
30MPa;The temperature of sintering is 1200~1350 DEG C.
The sintering specifically refers to vacuumize, and adjusts sintering pressure, is warming up to 795~805 DEG C of heat preservations, is continuously heating to
1200~1350 DEG C of heat preservation sinterings.It is described to be warming up to 795~805 DEG C of heat preservations and be preferably warming up to 800 DEG C of heat preservations.When the heat preservation
Between be 1~2min.The time of 1200~1350 DEG C of heat preservation sinterings is 3~6min.
The present invention compared with the existing technology, have following advantages and effects
(1) a kind of high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy of the present invention uses high-entropy alloy for bonding
Phase can partially or completely substitute Co by adjusting constituent element in high-entropy alloy Binder Phase and its content, guarantee hard alloy
The consumption for reducing Co while energy, effectively reduces the cost of raw material.
(2) a kind of high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy of the present invention uses high-entropy alloy for bonding
Phase, the inhibiting effect grown up to WC grain in sintering process using high-entropy alloy, because without adding grain growth inhibitor just
It can get Ultra-fine Grained WC hard alloy.
(3) a kind of high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy of the present invention, using discharge plasma sintering
Technique carries out consolidation molding.Since discharge plasma sintering has, the rate of heat addition is fast, sintering time is short, sintering temperature is low, cooling
The advantages that rate is big, thus be sintered in short-term can get the good hard alloy of consistency at a relatively low sintering temperature, and can show
It writes and inhibits WC grain growing up during the sintering process, effectively improve the comprehensive mechanical property of hard alloy.
(4) a kind of high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy of the present invention, when use mass fraction for
10% AlCoCrCuFeNi high-entropy alloy is as Binder Phase, and in sintering pressure 30MPa, sintering temperature is 1250 DEG C, when sintering
Between under 5 minutes process conditions, the WC average grain size of hard alloy is 238nm, Vickers hardness 1922HV30, fracture
Toughness is 10.41MPa m1/2.The Al for being 10% by the Binder Phase amount of replacing with score under the conditions of same process0.5CoCrCuFeNi
High-entropy alloy, the WC average grain size of hard alloy are 223nm, Vickers hardness 2070HV30, fracture toughness 10.27MPa
m1/2。
Detailed description of the invention
Fig. 1 is the obtained X-ray diffraction based on high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy of embodiment 1
Figure;
Fig. 2 is the obtained scanning electron microscope (SEM) photograph based on high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy of embodiment 1.
Specific embodiment
Below with reference to embodiment, present invention is further described in detail, and embodiments of the present invention are not limited thereto.
Embodiment 1
A kind of preparation method of high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy, comprising the following steps:
1) purity is greater than 99.9%, Al, Co, Cr, Cu, Fe and Ni massage that ratio of the average grain diameter less than 45 μm is
The proportion of 1:1:1:1:1:1 weighs, and is placed in hard alloy ball grinder after mixing, and is packed into firmly according to the ratio of grinding media to material of 10:1
Matter Alloy Balls In Milling is filled with high-purity argon gas after vacuumizing ball grinder;It then dry grinds 40 hours, connects under 300 revs/min of revolving speed
Carry out wet-milling (wet grinding media is ethyl alcohol) in 2 hours, obtain high-entropy alloy powder;By high-entropy alloy powder after the completion of mechanical milling process
End be put into vacuum oven 70 DEG C at a temperature of it is 48 hours dry, and cross 300# sub-sieve, granulation;
2) high-entropy alloy powder of 15g step 1) and 135g purity are greater than 99.5%, the WC powder that average grain diameter is 0.8 μm
End, is placed in tank mixing 5 hours on mixed powder machine, dry grinding in 30 hours is then carried out under the protection of argon gas, and it is small then to carry out 2
When wet-milling;Wherein ratio of grinding media to material when ball milling is 5:1, and wet grinding media is ethyl alcohol, and the revolving speed of ball milling is 300 revs/min;Ball milling mistake
Mixed-powder is placed in drying in vacuum oven after the completion of journey, crosses 100# sub-sieve, granulation obtains mixed-powder;
3) mixed-powder of 25g step 2) is fitted into the die cavity that graphite jig diameter is 20mm and is tentatively pressed into sample,
Sample is fitted into discharge plasma sintering furnace, vacuum is evacuated to less than 10Pa, adjusts sintering pressure to 30MPa, then with 100
DEG C/heating rate of min is warming up to 800 DEG C and keeps the temperature 2 minutes, convenient for the gas release adsorbed in powder, then it is warming up to 1250 DEG C
(100 DEG C/min of heating rate) keeps the temperature 5 minutes, finally cools to 100 DEG C with the furnace, i.e., acquisition WC average grain size is 238nm,
Vickers hardness is 1922HV30, fracture toughness is 10.41MPa m1/2The ultrafine tungsten carbide hard based on high-entropy alloy Binder Phase
Alloy.Fig. 1 is the obtained X-ray diffractogram based on high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy of embodiment 1;Figure
2 be the obtained scanning electron microscope (SEM) photograph based on high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy of embodiment 1.
Embodiment 2
A kind of preparation method of high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy, comprising the following steps:
1) purity is greater than 99.9%, Al, Co, Cr, Cu, Fe and Ni massage that ratio of the average grain diameter less than 45 μm is
The proportion of 1:1:1:1:1:1 weighs, and is placed in hard alloy ball grinder after mixing, and is packed into firmly according to the ratio of grinding media to material of 10:1
Matter Alloy Balls In Milling is filled with high-purity argon gas after vacuumizing ball grinder;It then dry grinds 40 hours, connects under 300 revs/min of revolving speed
Carry out wet-milling (wet grinding media is ethyl alcohol) in 2 hours, obtain high-entropy alloy powder;By high-entropy alloy powder after the completion of mechanical milling process
End be put into vacuum oven 70 DEG C at a temperature of it is 48 hours dry, and cross 300# sub-sieve, granulation;
2) high-entropy alloy powder of 7.5g step 1) and 142.5g purity are greater than 99.5%, average grain diameter is 0.8 μm
WC powder, be placed in tank in mixing 5 hours on mixed powder machine, dry grinding in 30 hours is then carried out under the protection of argon gas, then into
Row wet-milling in 2 hours;Wherein ratio of grinding media to material when ball milling is 5:1, and wet grinding media is ethyl alcohol, and the revolving speed of ball milling is 300 revs/min;
Mixed-powder is placed in drying in vacuum oven after the completion of mechanical milling process, crosses 100# sub-sieve, granulation obtains mixed-powder;
3) the mixed-powder 25g for weighing step 2) is fitted into the die cavity that graphite jig diameter is 20mm and is tentatively pressed into sample
Product;Sample is fitted into discharge plasma sintering furnace, is evacuated to vacuum less than 10Pa, adjusts sintering pressure to 30MPa, then with
The heating rate of 100 DEG C/min is warming up to 800 DEG C and keeps the temperature 2 minutes, convenient for the gas release adsorbed in powder, then is warming up to 1250
DEG C (100 DEG C/min of heating rate) keeps the temperature 5 minutes, finally cools to 100 DEG C with the furnace, i.e. acquisition WC average grain size is
256nm, Vickers hardness 2033HV30, fracture toughness is 9.71MPa m1/2The ultrafine tungsten carbide based on high-entropy alloy Binder Phase
Hard alloy.
Embodiment 3
A kind of preparation method of high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy, comprising the following steps:
1) purity is greater than 99.9%, Al, Co, Cr, Cu, Fe and Ni massage that ratio of the average grain diameter less than 45 μm is
The proportion of 0.5:1:1:1:1:1 weighs, and is placed in hard alloy ball grinder after mixing, and is packed into according to the ratio of grinding media to material of 10:1
Hard alloy abrading-ball is filled with high-purity argon gas after vacuumizing ball grinder;Then dry grind 40 hours under 300 revs/min of revolving speed,
Then the wet-milling (wet grinding media is ethyl alcohol) for carrying out 2 hours, obtains high-entropy alloy powder;By high-entropy alloy after the completion of mechanical milling process
Powder be put into vacuum oven 70 DEG C at a temperature of it is 48 hours dry, and cross 300# sub-sieve, granulation;
2) high-entropy alloy powder of 15g step 1) and 135g purity are greater than 99.5%, the WC powder that average grain diameter is 0.8 μm
End, is placed in tank mixing 5 hours on mixed powder machine, dry grinding in 30 hours is then carried out under the protection of argon gas, and it is small then to carry out 2
When wet-milling;Wherein ratio of grinding media to material when ball milling is 5:1, and wet grinding media is ethyl alcohol, and the revolving speed of ball milling is 300 revs/min;Ball milling mistake
Mixed-powder is placed in drying in vacuum oven after the completion of journey, crosses 100# sub-sieve, granulation obtains mixed-powder;
3) the mixed-powder 25g for weighing step 2) is fitted into the die cavity that graphite jig diameter is 20mm and is tentatively pressed into sample
Sample is fitted into discharge plasma sintering furnace by product, is evacuated to vacuum less than 10Pa, adjusts sintering pressure to 30MPa, then with
The heating rate of 100 DEG C/min is warming up to 800 DEG C and keeps the temperature 2 minutes, convenient for the gas release adsorbed in powder, then is warming up to 1250
DEG C (100 DEG C/min of heating rate) keeps the temperature 5 minutes, finally cools to 100 DEG C with the furnace, i.e. acquisition WC average grain size is
223nm, Vickers hardness 2070HV30, fracture toughness is 10.27MPa m1/2The ultra-fine carbonization based on high-entropy alloy Binder Phase
Tungsten hard alloy.
Embodiment 4
A kind of preparation method of high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy, comprising the following steps:
1) purity is greater than 99.9%, Al, Co, Cr, Cu, Fe and Ni massage that ratio of the average grain diameter less than 45 μm is
The proportion of 1.5:1:1:1:1:1 weighs, and is placed in hard alloy ball grinder after mixing, and is packed into according to the ratio of grinding media to material of 10:1
Hard alloy abrading-ball is filled with high-purity argon gas after vacuumizing ball grinder.Then dry grind 40 hours under 300 revs/min of revolving speed,
Then the wet-milling (wet grinding media is ethyl alcohol) for carrying out 2 hours, obtains high-entropy alloy powder;By high-entropy alloy after the completion of mechanical milling process
Powder be put into vacuum oven 70 DEG C at a temperature of it is 48 hours dry, and cross 300# sub-sieve, granulation;
2) high-entropy alloy powder of 15g step 1) and 135g purity are greater than 99.5%, the WC powder that average grain diameter is 0.8 μm
End, is placed in tank mixing 5 hours on mixed powder machine, dry grinding in 30 hours is then carried out under the protection of argon gas, and it is small then to carry out 2
When wet-milling;Wherein ratio of grinding media to material when ball milling is 5:1, and wet grinding media is ethyl alcohol, and the revolving speed of ball milling is 300 revs/min;Ball milling mistake
Mixed-powder is placed in drying in vacuum oven after the completion of journey, crosses 100# sub-sieve, granulation obtains mixed-powder;
3) the mixed-powder 25g for weighing step 2) is fitted into the die cavity that graphite jig diameter is 20mm and is tentatively pressed into sample
Product;Sample is fitted into discharge plasma sintering furnace, is evacuated to vacuum less than 10Pa, adjusts sintering pressure to 30MPa, then with
The heating rate of 100 DEG C/min is warming up to 800 DEG C and keeps the temperature 2 minutes, convenient for the gas release adsorbed in powder, then is warming up to 1250
DEG C (100 DEG C/min of heating rate) keeps the temperature 5 minutes, finally cools to 100 DEG C with the furnace, i.e. acquisition WC average grain size is
238nm, Vickers hardness 2127HV30, fracture toughness is 9.89MPa m1/2The ultrafine tungsten carbide based on high-entropy alloy Binder Phase
Hard alloy.
Comparative example
A kind of preparation method of Talide, comprising the following steps:
1) purity is weighed greater than 99.9%, Co powder 15g and 135g purity of the average grain diameter less than 45 μm is greater than 99.5%,
The WC powder that average grain diameter is 0.8 μm is placed in tank mixing 5 hours on mixed powder machine, 30 is then carried out under the protection of argon gas
Then the dry grinding of hour carries out wet-milling in 2 hours;Wherein ratio of grinding media to material is 5:1, and wet grinding media is ethyl alcohol, and the revolving speed of ball milling is 300
Rev/min;Mixed-powder is placed in drying in vacuum oven after the completion of mechanical milling process, crosses 100# sub-sieve, granulation is mixed
Close powder;
2) the mixed-powder 25g for weighing step 1) is fitted into the die cavity that graphite jig diameter is 20mm and is tentatively pressed into sample
Product.Sample is fitted into discharge plasma sintering furnace, is evacuated to vacuum less than 10Pa, adjusts sintering pressure to 30MPa, then with
The heating rate of 100 DEG C/min is warming up to 800 DEG C and keeps the temperature 2 minutes, convenient for the gas release adsorbed in powder, then is warming up to 1250
DEG C (100 DEG C/min of heating rate) keeps the temperature 5 minutes, finally cools to 100 DEG C with the furnace, and acquisitions WC average grain size is 536nm,
Vickers hardness is 1736HV30, fracture toughness is 12.99MPa m1/2WC-Co hard alloy.
Under same process parameter, the WC average grain size of WC-Co hard alloy is noticeably greater than high-entropy alloy Binder Phase
Ultrafine tungsten carbide hard alloy WC average grain size, vickers hardness hv30It is super significantly lower than high-entropy alloy Binder Phase
The Vickers hardness of thin Talide, but its fracture toughness is higher than the ultrafine tungsten carbide hard conjunction of high-entropy alloy Binder Phase
The fracture toughness of gold.Meanwhile the comprehensive mechanical property of the ultrafine tungsten carbide hard alloy of high-entropy alloy Binder Phase is better than on an equal basis
The commercial WC-CO hard alloy of granularity, as Chen et al. report trade mark is its Vickers hardness of the WC-Co hard alloy of EF05 and breaks
Splitting toughness is respectively 1900HV30, 9.1MPa m1/2。
Claims (9)
1. a kind of high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy, it is characterised in that: using high-entropy alloy as Binder Phase, with carbon
Change tungsten is hard phase;
The constituent element of the high-entropy alloy is at least five kinds in Al, Co, Cr, Cu, Fe and Ni, and the atomic percent of every kind of element
It is 5~35%.
2. high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy according to claim 1, it is characterised in that: the high entropy closes
Gold mass percent in high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy is 5~20%.
3. the preparation method of high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy according to claim 1 or claim 2, feature exist
In: the following steps are included:
Discharge plasma sinter molding is carried out after high-entropy alloy powder is mixed with WC powder, and it is ultra-fine to obtain high-entropy alloy Binder Phase
Talide.
4. the preparation method of high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy according to claim 3, it is characterised in that:
The condition of the sintering are as follows: pressure >=30MPa of sintering;The temperature of sintering is 1200~1350 DEG C.
5. the preparation method of high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy according to claim 3, it is characterised in that:
Specifically includes the following steps:
(1) ball milling prepares high-entropy alloy powder
Al, Co, Cr, Cu, Fe and Ni powder are uniformly mixed according to a ratio, ball milling, obtain high-entropy alloy powder;The ball milling is lazy
It is carried out under property atmosphere;
(2) ball mill mixing
High-entropy alloy powder and WC powder are mixed, ball milling, sieving obtains mixture;The ball milling carries out in an inert atmosphere;
(3) discharge plasma sintering forms
Mixture in step (2) is subjected to precompressed, is subsequently placed in discharge plasma sintering furnace and carries out discharge plasma sintering, it is cold
But, high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy is obtained;The condition of the sintering are as follows: pressure >=30MPa of sintering;It burns
The temperature of knot is 1200~1350 DEG C.
6. the preparation method of high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy according to claim 5, it is characterised in that:
The sintering specifically refers to vacuumize, and adjusts sintering pressure, is warming up to 795~805 DEG C of heat preservations, is continuously heating to 1200~1350
DEG C heat preservation sintering.
7. the preparation method of high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy according to claim 6, it is characterised in that:
It is described to be warming up to 795~805 DEG C of heat preservations to be warming up to 800 DEG C of heat preservations.
8. the preparation method of high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy according to claim 6, it is characterised in that:
The soaking time is 1~2min;The time of 1200~1350 DEG C of heat preservation sinterings is 3~6min.
9. the preparation method of high-entropy alloy Binder Phase ultrafine tungsten carbide hard alloy according to claim 5, it is characterised in that:
Inert atmosphere described in step (1) is argon gas;The ball milling refers to first dry grinding then wet-milling, needs drying after wet-milling;
Inert atmosphere described in step (2) is argon gas;The ball milling refers to first dry grinding then wet-milling, needs drying after wet-milling.
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