CN109239422B - Probe card used in resistance value adjusting process of resistor after sintering thick film hybrid circuit - Google Patents
Probe card used in resistance value adjusting process of resistor after sintering thick film hybrid circuit Download PDFInfo
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- CN109239422B CN109239422B CN201811245723.2A CN201811245723A CN109239422B CN 109239422 B CN109239422 B CN 109239422B CN 201811245723 A CN201811245723 A CN 201811245723A CN 109239422 B CN109239422 B CN 109239422B
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- probe
- probe card
- card
- disc
- detachable
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- 239000000523 sample Substances 0.000 title claims abstract description 137
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000005245 sintering Methods 0.000 title claims abstract description 14
- 238000003466 welding Methods 0.000 claims abstract description 33
- 238000003032 molecular docking Methods 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 9
- 230000003014 reinforcing effect Effects 0.000 claims description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000013461 design Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses a probe card used in a resistor resistance adjustment process after thick film hybrid circuit sintering, which comprises a card golden finger and a probe disc, wherein the lower end of the card golden finger is connected to a detachable jumper, the lower part of the detachable jumper is provided with the probe disc, the probe disc is provided with a probe vertical centering bayonet lock, the center of the probe disc is a detachable center part, a quick centering marking is arranged in the detachable center part, a detachable hole is arranged on the diagonal of the quick centering marking, and a multifunctional docking station is arranged below the probe disc. The invention has the following beneficial effects: the probe card can be assembled into a welding jig, and the probe card is multipurpose and can be reused; the probe card is provided with a probe centralizing bayonet, so that the probe welding handle is vertical to the probe card, and the use is convenient; the probe card can be connected with various ports to facilitate the function expansion; for the circuit board with larger measuring point density, adopting various measures to avoid overlarge local probe density; the probe card circuit structure is designed optimally, the cost is low, and the usability is good.
Description
Technical field:
the invention relates to the technical field of thick film hybrid circuit detection, in particular to a probe card used in a resistor resistance value adjusting process of a thick film hybrid circuit after sintering.
The background technology is as follows:
with the development of microelectronic technology, thick film hybrid integrated circuits are increasingly being used in space electronics, satellite communications, computers, automobiles, microwave devices, household appliances, and the like due to the characteristics of low cost, high reliability, and the like. The resistor used in the thick film circuit is usually manufactured by adopting a screen printing and high-temperature sintering method, and the precision of the resistor after sintering is not high due to the inherent poor precision of the manufacturing mode, uneven surface of the substrate, unrepeatability of sintering conditions and the like, so that the resistor resistance after sintering needs to be accurately adjusted.
In comparison, the laser resistor trimming method has become the most commonly used resistor trimming method at present due to the characteristics of high precision, high efficiency, no pollution and the like. The principle is that firstly, the resistance value of the resistance to be adjusted is measured, and if the value is in an adjustable range, laser is turned on to adjust the resistance according to a specified path. The laser emits pulse laser beams to focus very small light spots after being turned on, the effective area of the thick film resistor is cut, melted and evaporated, and the resistance of the thick film resistor is adjusted by changing the effective conductive area or the effective length of the thick film resistor conductor, so that the resistance can only be increased and not reduced.
The first thing to do in the laser resistance adjusting process is the welding assembly of the probe card. The probe card welding assembly refers to welding probes on the probe card according to the surface layer pattern of the substrate to be adjusted, so that all probe heads are positioned on a plane and fully contact with the corresponding positions of the substrate to be adjusted, and the laser resistance adjuster can measure the resistance of the substrate in real time. Therefore, the welding assembly precision of the probe card directly influences the resistance adjusting quality, and the probe card with fine design can have the effect of half the effort on the welding work.
The resistance-adjusting probe card used in the current market has the defects of low welding efficiency, low welding precision, poor reliability and the like. Meanwhile, the debugging and the installation are very inconvenient, and a great deal of modification is required to be made on the laser resistance adjuster, so that the quality and the working efficiency of the welding resistance adjusting probe card are greatly reduced.
The invention comprises the following steps:
the invention aims to solve the technical problem of providing the probe card which can improve the welding efficiency of the probe card and the probe, is used in the process of adjusting the resistance value of the resistor after the thick film hybrid circuit is sintered, has strong functions, can be reused, has a simple structure and is convenient to install and maintain.
The technical problems to be solved by the invention are realized by adopting the following technical scheme:
the utility model provides a probe card that thick film hybrid circuit sintering back resistance adjustment in-process used, includes integrated circuit board golden finger and probe dish, the lower extreme of integrated circuit board golden finger is connected to removable wire jumper, the below of removable wire jumper is equipped with the probe dish, be equipped with the probe on the probe dish and right the bayonet lock, the next the bayonet lock department is right perpendicularly to the probe is equipped with the probe dish and strengthens the hole, the center of probe dish is removable central part, be equipped with quick centering marking in the removable central part, be provided with removable trompil on the diagonal of quick centering marking, probe dish below is equipped with multi-functional docking station.
Preferably, the board card is equipped with the board card combination hole all around, the reserve probe card is connected to the other end in board card combination hole, board card and reserve probe card pass through board card combination hole connection combination, are as the welded platform.
Preferably, the quick centering mark comprises a first quick centering mark, wherein a second quick centering mark, a third quick centering mark, a fourth quick centering mark and a fifth quick centering mark are sequentially arranged in the first quick centering mark, the distances between the five quick centering marks are equal, and the size of the quick centering mark is gradually reduced.
Preferably, the board card is an R-foot rectangular 32/64-way expandable probe welding disc, and both sides are circuit substrates.
Preferably, the detachable jumper and the probe vertical righting bayonet lock are both arranged on the probe card needle channel. The vertical fixation of the test probe is convenient.
The invention has the following beneficial effects:
(1) The probe card can be assembled into a welding jig, and the probe card is multipurpose and can be reused;
(2) The probe card is provided with a probe centralizing bayonet, so that the probe welding handle is vertical to the probe card, and the use is convenient;
(3) The probe card can be connected with various ports to facilitate the function expansion;
(4) For the circuit board with larger measuring point density, adopting various measures to avoid overlarge local probe density;
(5) The probe card circuit structure is designed optimally, the cost is low, and the usability is good.
Description of the drawings:
FIG. 1 is a schematic plan view of the present invention;
FIG. 2 is a schematic diagram of a rapid centering reticle in accordance with the present invention;
FIG. 3 is a schematic diagram of a pin of a card finger according to the present invention;
FIG. 4 is a schematic diagram of a detachable jumper pin according to the present invention;
FIG. 5 is a schematic diagram of a pin of a 32/64-way inspection window pad according to the present invention;
FIG. 6 is a schematic diagram of a pin of the multifunctional docking station of the present invention;
wherein: 1-a board card golden finger; 2-removable jumpers; 3-probe plate; 4-the probe vertically centers the bayonet lock; 5-a removable center portion; 6-quick centering of the marking line; 601-a first fast centering line; 602-a second rapid centering mark; 603-third quick centering line; 604-fourth quick centering marks; 605-fifth quick centering mark; 7-a detachable hole; 8-probe disc reinforcing holes; 9-a multi-function docking station; 10-a board card combination hole.
The specific embodiment is as follows:
in the description of the present invention, it should be noted that the azimuth or positional relationship indicated by the terms "vertical", "upper", "lower", "horizontal", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or element referred to must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
The invention is further described with reference to the following detailed drawings in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the implementation of the invention easy to understand.
Example 1
Referring to fig. 1-6, a probe card used in a resistance value adjusting process of a thick film hybrid circuit after sintering comprises a board card golden finger 1 and a probe disc 3, wherein the lower end of the board card golden finger 1 is connected to a detachable jumper wire 2, the lower part of the detachable jumper wire 2 is provided with a probe disc 3, the probe disc 3 is provided with a probe vertical centering bayonet lock 4, a probe disc reinforcing hole 8 is arranged next to the probe disc vertical centering bayonet lock 4, the center of the probe disc 3 is a detachable center part 5, a quick centering mark 6 is arranged in the detachable center part 5, a detachable opening 7 is arranged on the diagonal of the quick centering mark 6, and a multifunctional docking station 9 is arranged below the probe disc 3.
In this embodiment, the board card is an R-pin rectangular 32/64-way expandable probe bonding pad, and both sides are circuit substrates.
In this embodiment, the detachable jumper 2 and the probe vertical centering bayonet 4 are both disposed on the probe card passage. The vertical fixation of the test probe is convenient. The probe card is provided with a probe centralizing bayonet, so that a probe welding handle is perpendicular to the probe card, and the probe card is convenient to use: the probe card is soldered requiring the probe handle to be substantially perpendicular to the soldering surface, thus ensuring that the probe pins do not slide during inspection. The invention designs the probe centralizing bayonet specially aiming at the requirement, and greatly shortens the resistance adjusting preparation process.
And (3) design innovation:
(1) The probe card can be connected with various ports to facilitate the function expansion.
The invention is designed with a docking station with which tasks such as expanding channels and performing active detection can be accomplished.
(2) And (3) adopting various measures to avoid overlarge local probe density for the circuit board with larger measuring point density.
Because the thick film hybrid circuit is smaller in general board card, the density of the resistance-adjusting device to be detected is larger, and the welding density of the probe is often large, so that the problems are brought to welding and use. The invention successfully avoids the trouble through a plurality of methods, and a user can reasonably and uniformly distribute the probes through the methods of dividing welding points, connecting detachable jumpers and the like.
(3) The probe card circuit structure is designed optimally, the cost is low, and the usability is good.
The multi-redundancy circuit design is adopted, multiple functions are integrated, the circuit design is optimized to the greatest extent, more complex operation is simplified, the operation is easy to master, and the detection applicability is improved.
And (3) optimizing and innovating performance:
(1) Appearance design compatible with mainstream standard test card
Which is fully compatible in size with 6.5 x 8.125 inch standard probe cards.
(2) Optimized window design
The effective area of the window is optimized to 65 x 65mm (the actual effective window is 50 x 50mm after the probe length is 15 mm) after the distortion of the vibrating mirror and the optimal cost ratio of the thick film circuit are considered.
(3) Unique, novel and attractive pad design
The 32/64-way expandable probe pad is designed into an attractive round rectangle, so that the position of the test probe is convenient to fix; the reinforced bonding pad is designed to reduce the warping phenomenon of the copper foil caused by the repeated welding of the soldering iron; the reinforced bonding pad can be used for realizing the mode of multi-needle bundling to preliminarily fix the post-braze welding connection, so that the aim of optimizing the number of compression channels can be fulfilled. The single pads may also be separated to form a dual pad extension when the extension function is used, with jumper connection points behind each pad.
(4) Convenient detachable jumper wire interface
The detachable jumper design is designed at the leading-out part of the front end of the golden finger of the board card, so that the connection relation between the measuring point and the leading-out end is convenient to optimize, and the aim of optimizing the number of compression channels can be achieved.
Example 2
Referring to fig. 1, the structure of the present embodiment is substantially the same as that of embodiment 1, and the details are not repeated, wherein a board card combination hole 10 is formed around the board card, the other end of the board card combination hole 10 is connected to a standby probe card, and the board card and the standby probe card are connected and combined through the board card combination hole 10 to serve as a soldering platform.
The probe card can be assembled into a welding jig, and the probe card is multipurpose and can be reused: in the welding process, the welding surface and the probe pins are not on the same plane, and the probe pins are approximately on the same plane after the welding is finished, so that certain difficulty is caused to the welding, and the common solution is to manufacture a special jig to facilitate the welding. The invention skillfully solves the problem, and the standby probe card is directly used as a welding platform through combination.
Example 3
Referring to fig. 1-2, the structure of the present embodiment is substantially the same as that of embodiment 1, and the details are not repeated, the fast centering mark 6 includes a first fast centering mark 601, a second fast centering mark 602, a third fast centering mark 603, a fourth fast centering mark 604 and a fifth fast centering mark 605 are sequentially disposed in the first fast centering mark 601, and the distances between the five fast centering marks 6 are equal and gradually reduced.
The working principle of the invention is as follows:
the probe card is designed into an attractive R-angle rectangular 32/64-path expandable probe pad, and adopts a double-sided circuit substrate, and the size of the probe card is completely compatible with a standard probe card. The central effective operation window is optimally designed to be 50 x 50mm.
The front of the probe card is provided with 32 channel probe welding discs, each channel can be directly welded with probes, and the probe card can be detachably divided into two independent channels according to requirements to respectively weld the probes, so that the maximum number of the 32 channels can be expanded to 64.
Each channel of the probe card is provided with a detachable jumper wire and a probe vertical righting bayonet lock, so that the vertical fixation of the test probes is convenient, and at most 3 probes can be fixed in one channel. Each channel is provided with 3 reinforcing holes, so that the copper foil warping caused by repeated welding can be avoided, and the reinforcing holes can be used for bundling a plurality of probes to optimize the number of the channels.
The central part of the spare probe card is designed to be provided with a quick centering marking line so as to facilitate quick and accurate centering positioning of the thick film substrate of the board to be tested (the central part must be removed when the spare probe card is actually used as the probe card). The standby probe card with the middle part not removed is selected and can be used as a component to be connected into a probe card welding jig frame through the four corner support components. The jig frame has the functions of facilitating probe welding and convenient storage.
The probe card is also provided with a powerful docking station, and an expansion interface can be installed according to the requirement, for example, active test and an add-on board card are carried out to realize the one-bit control 32/64-way conversion expansion function.
The foregoing has shown and described the basic principles and main features of the present invention and the advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (4)
1. The utility model provides a probe card that thick film hybrid circuit sintering back resistance value adjustment in-process used which characterized in that: the multifunctional electric wire connector comprises a board golden finger (1) and a probe disc (3), wherein the lower end of the board golden finger (1) is connected to a detachable jumper wire (2), the probe disc (3) is arranged below the detachable jumper wire (2), a probe vertical centralizing bayonet (4) is arranged on the probe disc (3), a probe disc reinforcing hole (8) is formed in the position, close to the probe disc vertical centralizing bayonet (4), of the probe disc (3) and is a detachable central part (5), a quick centering marking (6) is arranged in the detachable central part (5), a detachable opening (7) is formed in the diagonal line of the quick centering marking (6), and a multifunctional docking station (9) is arranged below the probe disc (3);
the probe card is provided with a board card combination hole (10) around, the other end of the board card combination hole (10) is connected with a standby probe card, and the probe card and the standby probe card are connected and combined through the board card combination hole (10) to serve as a welding platform.
2. The probe card for use in the adjustment of resistance after sintering of thick film hybrid circuit of claim 1, wherein: the quick centering marking (6) comprises a first quick centering marking (601), a second quick centering marking (602), a third quick centering marking (603), a fourth quick centering marking (604) and a fifth quick centering marking (605) are sequentially arranged in the first quick centering marking (601), and the distances among the five quick centering markings (6) are equal and gradually reduced.
3. The probe card for use in the adjustment of resistance after sintering of thick film hybrid circuit of claim 1, wherein: the probe card is an R-pin rectangular 32/64-path expandable probe welding disc, and both sides are circuit substrates.
4. The probe card for use in the adjustment of resistance after sintering of thick film hybrid circuit of claim 1, wherein: the detachable jumper (2) and the probe vertical centralizing bayonet lock (4) are both arranged on the probe card channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811245723.2A CN109239422B (en) | 2018-10-24 | 2018-10-24 | Probe card used in resistance value adjusting process of resistor after sintering thick film hybrid circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811245723.2A CN109239422B (en) | 2018-10-24 | 2018-10-24 | Probe card used in resistance value adjusting process of resistor after sintering thick film hybrid circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109239422A CN109239422A (en) | 2019-01-18 |
| CN109239422B true CN109239422B (en) | 2023-11-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811245723.2A Active CN109239422B (en) | 2018-10-24 | 2018-10-24 | Probe card used in resistance value adjusting process of resistor after sintering thick film hybrid circuit |
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| Country | Link |
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| CN (1) | CN109239422B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5539676A (en) * | 1993-04-15 | 1996-07-23 | Tokyo Electron Limited | Method of identifying probe position and probing method in prober |
| US6480012B1 (en) * | 1999-06-21 | 2002-11-12 | Mitsubishi Denki Kabushiki Kaisha | Probe card device |
| CN101561452A (en) * | 2008-04-18 | 2009-10-21 | 京元电子股份有限公司 | Locating method |
| CN201967246U (en) * | 2010-12-31 | 2011-09-07 | 博嘉圣（福州）微电子科技有限公司 | PCB (printed circuit board) suitable for semiconductor test blade probe |
| CN202903835U (en) * | 2012-11-09 | 2013-04-24 | 扬州芯际半导体有限公司 | A prober card |
| CN203720217U (en) * | 2014-01-13 | 2014-07-16 | 中芯国际集成电路制造(北京)有限公司 | Probe card possessing wire jumper structure |
| CN106249049A (en) * | 2016-08-25 | 2016-12-21 | 华东光电集成器件研究所 | A kind of device improving extreme value thick-film resistor laser trimming precision |
| CN107078072A (en) * | 2014-09-30 | 2017-08-18 | 东京毅力科创株式会社 | Positional precision inspection method, positional precision check device and position detection unit |
| CN108107243A (en) * | 2017-12-26 | 2018-06-01 | 深圳市道格特科技有限公司 | Fast assembling-disassembling probe card |
| CN209167385U (en) * | 2018-10-24 | 2019-07-26 | 安徽爱意爱机电科技有限公司 | The resistance trimming probe card of multifunctional thick film hybrid circuit |
-
2018
- 2018-10-24 CN CN201811245723.2A patent/CN109239422B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5539676A (en) * | 1993-04-15 | 1996-07-23 | Tokyo Electron Limited | Method of identifying probe position and probing method in prober |
| US6480012B1 (en) * | 1999-06-21 | 2002-11-12 | Mitsubishi Denki Kabushiki Kaisha | Probe card device |
| CN101561452A (en) * | 2008-04-18 | 2009-10-21 | 京元电子股份有限公司 | Locating method |
| CN201967246U (en) * | 2010-12-31 | 2011-09-07 | 博嘉圣（福州）微电子科技有限公司 | PCB (printed circuit board) suitable for semiconductor test blade probe |
| CN202903835U (en) * | 2012-11-09 | 2013-04-24 | 扬州芯际半导体有限公司 | A prober card |
| CN203720217U (en) * | 2014-01-13 | 2014-07-16 | 中芯国际集成电路制造(北京)有限公司 | Probe card possessing wire jumper structure |
| CN107078072A (en) * | 2014-09-30 | 2017-08-18 | 东京毅力科创株式会社 | Positional precision inspection method, positional precision check device and position detection unit |
| CN106249049A (en) * | 2016-08-25 | 2016-12-21 | 华东光电集成器件研究所 | A kind of device improving extreme value thick-film resistor laser trimming precision |
| CN108107243A (en) * | 2017-12-26 | 2018-06-01 | 深圳市道格特科技有限公司 | Fast assembling-disassembling probe card |
| CN209167385U (en) * | 2018-10-24 | 2019-07-26 | 安徽爱意爱机电科技有限公司 | The resistance trimming probe card of multifunctional thick film hybrid circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109239422A (en) | 2019-01-18 |
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