CN109238014A - A kind of thin soft type Infrared stealthy materials and preparation method thereof and composite material comprising it - Google Patents
A kind of thin soft type Infrared stealthy materials and preparation method thereof and composite material comprising it Download PDFInfo
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- CN109238014A CN109238014A CN201811091321.1A CN201811091321A CN109238014A CN 109238014 A CN109238014 A CN 109238014A CN 201811091321 A CN201811091321 A CN 201811091321A CN 109238014 A CN109238014 A CN 109238014A
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- copper
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- thin soft
- type infrared
- sulfide
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/02—Layer formed of wires, e.g. mesh
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F41—WEAPONS
- F41H—ARMOUR; ARMOURED TURRETS; ARMOURED OR ARMED VEHICLES; MEANS OF ATTACK OR DEFENCE, e.g. CAMOUFLAGE, IN GENERAL
- F41H3/00—Camouflage, i.e. means or methods for concealment or disguise
- F41H3/02—Flexible, e.g. fabric covers, e.g. screens, nets characterised by their material or structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/103—Metal fibres
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Agricultural Chemicals And Associated Chemicals (AREA)
Abstract
The invention discloses a kind of thin soft type Infrared stealthy materials and preparation method thereof and include its composite material.The thin soft type Infrared stealthy materials include the sulfide grain layer of copper mesh and the copper for being coated on copper mesh twine surface, it have the characteristics that infrared stealth performance is good, flexible, thickness is small, can random bending fold, which can reduce the infrared signature of target to reduce the infra-red detectable of target.The preparation method is that preparing thin soft type Infrared stealthy materials using metal copper mesh electrochemical corrosive process, have many advantages, such as raw material is cheap and easy to get, preparation process is simple, it is at low cost, be easy to large area preparation;Thin soft type infrared stealth composite material provided by the invention has Scalability.
Description
Technical field
The present invention relates to Infrared stealthy materials fields, more particularly to a kind of thin soft type Infrared stealthy materials and preparation method thereof
With the composite material comprising it.The material can reduce the infrared signature of target to reduce the infra-red detectable of target
Property.
Background technique
With the rapid development of military science technology, modern infrared reconnaissance, point technique have had reached quite high water
It is flat.Photoelectronic imaging satellite can get high-resolution infrared image, and can shoot ground target under conditions of complete dark, especially suitable
In the trend of tank and armored vehicle, monitoring motor driven ballistic missile.Thus make the safety of various military targets and weaponry by
To seriously threatening.For this purpose, to reduce the transmitting of equipment infrared ray and weaken enemy's infrared acquisition efficiency as the infrared stealth skill of objective
Art just receives the great attention of countries in the world, and rapidly develops.
Infrared stealthy materials that are more and being applied to military use are studied at present to be mainly made of absorbent and binder.It inhales
It receives agent and is also referred to as absorbing material or absorbing material, effect mainly absorbs the infrared ray of objective emission, obtains detecting devices
Infrared signal intensity substantially reduces;The main function of binder is to mix, form a film with absorbent, to be coated in target and force
Device is equipped on surface, is played the role of stealthy.Absorbing material has the metal powders such as aluminium and silver, antimony doped tin oxide and Al-Doped ZnO etc.
Semiconductor powder, organic or inorganic pigment and phase-change microcapsule etc.;Binder is mainly inorganic phosphate or inorganic silicate,
And the organic binders such as epoxy resin, acrylic resin.Just because of this, to reach ideal infrared stealth effect and compared with
High adhesive strength generally requires to reach thicker thickness by the Infrared stealthy materials that absorbent and binder form.This
Result in the problems such as it is flexible poor, volume is big, heavy.In addition, the preparation process of this kind of Infrared stealthy materials is complicated, it is related to inhaling
Multiple process procedures, the infrared stealth performances of material such as the synthesis of agent, the synthesis of adhesive, coating preparation, coating is received to be difficult to protect
Barrier;There is also organic solvents to volatilize for coating processes, problem of environmental pollution.
Summary of the invention
For the disadvantages mentioned above of the prior art, one of the objects of the present invention is to provide a kind of thin soft type infrared stealth materials
Material.The thin soft type Infrared stealthy materials are by the sulfide grain layer structure of metal copper mesh and the copper for being coated on copper mesh surface
At it has, and highly flexible, thickness is small, light weight, can random bending fold.
To achieve the above object, the invention adopts the following technical scheme:
Thin soft type Infrared stealthy materials proposed by the present invention include copper mesh and the copper for being coated on copper mesh twine surface
Sulfide grain layer;The metal copper mesh is the metal copper mesh of 50~500 mesh, and material is one of red copper, brass, phosphor-copper, institute
The diameter for stating twine is 10~200 microns;The sulfide grain of the copper is CuS, Cu2S、Cu2-xOne of S (1 > X > 0) or its
Composition, grain shape are one or a combination set of needle-shaped, rodlike, sheet, flower-shaped, spherical object, and the sulfide grain of copper is at least
One dimension is in 0.01~100 micron range;The sulfide clad of copper with a thickness of 0.1 micron~1 millimeter, copper in clad
Sulfide grain between have gap, the void size be 0.01~100 micron.
The second object of the present invention is to provide a kind of method for preparing aforementioned thin soft type Infrared stealthy materials, it has original
Expect cheap and easy to get, simple process, it is low in cost, be easy to the features such as larger in area.
The preparation method of thin soft type Infrared stealthy materials proposed by the present invention, comprising the following steps:
1) metal copper mesh acetone, distilled water are cleaned out, is put into sulfide solution;
2) using metal copper mesh as anode, graphite electrode is cathode, applies DC voltage, carries out electrochemical corrosion;
3) electrochemical corrosion after a certain period of time, is cut off the power, and takes out metal copper mesh, completely obtains metallic copper wash with distilled water
The thin soft type Infrared stealthy materials that net/copper sulfide grain is constituted.
Sulfide described in step 1) is one kind of vulcanized sodium, potassium sulfide, hydrogen sulfide, thioacetamide;The sulfide
The concentration of aqueous solution is 0.01~2 mol/L.
DC voltage described in step 2) is 0.1~30V;The electrochemical corrosion time is 30 seconds~6 hours.
The third object of the present invention is to provide a kind of thin soft type infrared stealth composite material, including at least a compound list
Member, the recombiner unit include basal layer and functional layer, and the basal layer is one of cotton, fiber crops, terylene, silk, nylon facing material;
The functional layer is above-mentioned thin soft type Infrared stealthy materials, and the basal layer and the functional layer are adhesively fixed integrally.
Preferably, the thin soft type infrared stealth composite material, including one or more recombiner units, it is the multiple compound
The thickness of functional layer can be identical or different in unit.
Preferably, the thin soft type infrared stealth composite material, including a recombiner unit and multiple functional layers are described more
A functional layer is bonded and fixed at the surface of functional layer described in the recombiner unit.
Compared with prior art, the present invention at least has the advantages that
(1) metallic copper net have good flexibility can arbitrarily bending fold without damage.50 mesh~500 mesh metallic copper
Net can absorb the far infrared wave compared with long-wave band;The sulfide material of copper can absorb the near-infrared wave of short-wave band;Needle-shaped, stick
Micro-nano-scale gap between the sulfide micro-nano-scale particle and particle of the copper such as shape, sheet, flower-shaped, spherical, can be with
Pass through infrared and far infrared wave absorption in realization the effects of light trapping, sub-wavelength matching;The coupling of said effect makes
Metal copper mesh/copper sulfide grain layer Infrared stealthy materials of the invention have excellent infrared stealth effect, so as to make
Infrared stealthy materials are relatively thin.
(2) it using metal copper mesh and dissolvable sulfide aqueous solution as primary raw material, is prepared using electrochemical corrosive process thin
Soft type Infrared stealthy materials, have many advantages, such as raw material is cheap and easy to get, preparation process is simple, it is at low cost, be easy to large area preparation;It is logical
Cross metal copper mesh type and mesh number, sulphidic species and concentration, voltage, the control of electrochemical corrosion time, it may be convenient to adjust
Control the structure and its infrared stealth performance of metal copper mesh/copper sulfide grain composite material.
(3) the thin soft type infrared stealth composite material has Scalability, can be cut into required size and shape.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of specific embodiment of the invention.In figure: metal copper mesh 1, the sulfide grain of copper
Layer 2.
Fig. 2 is the low power stereoscan photograph (a) and table of the thin soft type Infrared stealthy materials of one kind of the embodiment of the present invention 1
The high power stereoscan photograph (b) of the sulfide of the copper in face.
Fig. 3 is the low power stereoscan photograph (a) and table of the thin soft type Infrared stealthy materials of one kind of the embodiment of the present invention 2
The high power stereoscan photograph (b) of the sulfide of the copper in face.
Specific embodiment
The following further describes the technical solution of the present invention with reference to embodiments.
Embodiment 1
300 mesh red copper net acetone, distilled water are cleaned out, are put into the potassium sulfide aqueous solution of 0.2 mol/L;With
Red copper net is anode, and graphite electrode is cathode, applies the DC voltage of 1V, carries out electrochemical corrosion;After electrochemical corrosion 1h, cut
Copper mesh is taken out in power-off source, and it is infrared completely to obtain the thin soft type that metal copper mesh/copper sulfide grain layer is constituted wash with distilled water
Stealth material.
Obtaining thin soft type Infrared stealthy materials is by red copper silk screen and sheet Cu7S4(being confirmed through X-ray diffraction) stratum granulosum
Composition, structure is as shown in Figure 2.Wherein the diameter of copper wire is 10~30 microns, sheet Cu7S4It is wrapped in copper mesh silk table face, is wrapped
About 10~40 microns of the thickness of covering layer;Cu7S4Piece with a thickness of 0.1~0.3 micron, size is 5~40 microns;Cu7S4Piece and piece
Between with 0.1~10 micron of gap.There is the material good flexibility can arbitrarily bending fold and have without damaging
There is excellent infrared stealth effect, the material, the human body temperature detected and environment are placed between human body and infrared thermal imager
Temperature (25 DEG C) is identical.
Embodiment 2
200 mesh brass screen acetone, distilled water are cleaned out, are put into the hydrogen sulfide solution of 0.05 mol/L;With
Brass screen is anode, and graphite electrode is cathode, applies the DC voltage of 6V, carries out electrochemical corrosion;After electrochemical corrosion 2h, cut
Copper mesh is taken out in power-off source, and it is infrared completely to obtain the thin soft type that metal copper mesh/copper sulfide grain layer is constituted wash with distilled water
Stealth material.
Obtaining thin soft type Infrared stealthy materials is by brass wire mesh and Cu2S (confirms) that stratum granulosum is formed through X-ray diffraction
, structure is as shown in Figure 3.Wherein the diameter of copper wire is 30~50 microns, Cu2S particle is wrapped in copper wire surface, wrapping layer
About 20~30 microns of thickness;Cu2The shape of S particle is flower-shaped, needle-shaped, sheet, and the length of elongated piece is 100~500 nanometers,
The size of flower-shaped particle is 1~50 micron, and the size of sheet-like particle is 1~5 micron;Cu2It is micro- with 0.1~10 between S particle
The gap of rice.The material have good flexibility can arbitrarily bending fold without damage, and have excellent infrared stealth
Effect, places the material between human body and thermal infrared imager, and the human body temperature detected is 1 DEG C more slightly higher than environment temperature (25 DEG C).
Embodiment 3
50 mesh phosphor-copper net acetone, distilled water are cleaned out, are put into the sodium sulfide solution of 2 mol/Ls;With phosphor-copper
Net is anode, and graphite electrode is cathode, applies the DC voltage of 30V, carries out electrochemical corrosion;After electrochemical corrosion 6h, cutting
Power supply takes out copper mesh, and it is infrared hidden completely to obtain the thin soft type that metal copper mesh/copper sulfide grain layer is constituted wash with distilled water
Stature material.
Obtain thin soft type Infrared stealthy materials (confirms) that stratum granulosum is formed with CuS by phosphor-copper silk screen through X-ray diffraction
's.Wherein the diameter of copper wire is 100~200 microns, and CuS particle is wrapped in copper wire surface, the thickness of wrapping layer about 500~1000
Micron;The shape of CuS particle be it is needle-shaped, rodlike, length be 500~1000 microns, 30~100 microns of diameter;It is needle-shaped and rodlike
There is 10~100 microns of gap between CuS particle.The material have good flexibility can arbitrarily bending fold without damage
It is bad, and there is excellent infrared stealth effect, the material, the human body temperature detected are placed between human body and thermal infrared imager
It is 2 DEG C more slightly higher than environment temperature (25 DEG C).
Embodiment 4
500 mesh red copper net acetone, distilled water are cleaned out, the thioacetyl amine aqueous solution of 0.01 mol/L is put into
In;Using red copper net as anode, graphite electrode is cathode, applies the DC voltage of 0.1V, carries out electrochemical corrosion;Electrochemical corrosion
It after 30s, cuts off the power, takes out copper mesh, completely obtain the thin of metal copper mesh/copper sulfide grain layer composition wash with distilled water
Soft type Infrared stealthy materials.
Obtaining thin soft type Infrared stealthy materials is by red copper silk screen and spherical Cu1.98S (being confirmed through X-ray diffraction)
Granulosa composition.Wherein the diameter of copper wire is 10~20 microns, spherical Cu1.98S is wrapped in copper wire surface, the thickness of wrapping layer
About 0.1~5 micron;Cu1.98The size of S particle is 0.01~1 micron;Cu1.98There is 0.01~1 micron of sky between S particle
Gap.The material have good flexibility can arbitrarily bending fold without damage, and have excellent infrared stealth effect,
The material is placed between human body and thermal infrared imager, the human body temperature detected is identical as environment temperature (25 DEG C).
As can be seen from the above embodiments, thin soft type Infrared stealthy materials of the invention have good flexibility can be random
Bending fold has excellent infrared stealth effect without damaging;Preparation method of the invention have raw material it is cheap and easy to get,
Preparation process is simple, it is at low cost, be easy to the advantages that large area preparation.
It should be understood that the above-mentioned statement for present pre-ferred embodiments is more detailed, can not therefore think
It is the limitation to the invention patent protection scope, scope of patent protection of the invention should be determined by the appended claims.
Claims (8)
1. a kind of thin soft type Infrared stealthy materials, it is characterised in that: the thin soft type Infrared stealthy materials include copper mesh and
It is coated on the sulfide grain layer of the copper on copper mesh twine surface;The metal copper mesh is the metal copper mesh of 50~500 mesh, material
Matter is one of red copper, brass, phosphor-copper, and the diameter of the twine is 10~200 microns;The sulfide grain of the copper be CuS,
Cu2S、Cu2-xOne or a combination set of S (1 > X > 0) object, grain shape be one of needle-shaped, rodlike, sheet, flower-shaped, spherical or its
Composition, at least one dimension of the sulfide grain of the copper is in 0.01~100 micron range;The sulfide of the copper coats
Layer with a thickness of 0.1 micron~1 millimeter, there is gap, the void size is in clad between the sulfide grain of copper
0.01~100 micron.
2. a kind of preparation method of thin soft type Infrared stealthy materials, which is characterized in that it the following steps are included:
1) metal copper mesh acetone, distilled water are cleaned out, is put into sulfide solution;
2) using metal copper mesh as anode, graphite electrode is cathode, applies DC voltage, carries out electrochemical corrosion certain time;
3) electrochemical corrosion after a certain period of time, is cut off the power, and takes out metal copper mesh, completely obtains metallic copper wash with distilled water
The thin soft type Infrared stealthy materials that net/copper sulfide grain is constituted.
3. the preparation method of thin soft type Infrared stealthy materials according to claim 2, it is characterised in that: described in step 1)
Sulfide be vulcanized sodium, potassium sulfide, hydrogen sulfide, thioacetamide one kind.
4. the preparation method of thin soft type Infrared stealthy materials according to claim 2, which is characterized in that described in step 1)
The concentration of sulfide solution is 0.01~2 mol/L.
5. the preparation method of thin soft type Infrared stealthy materials according to claim 2, which is characterized in that described in step 2)
DC voltage be 0.1~30V;The electrochemical corrosion time is 30 seconds~6 hours.
6. a kind of thin soft type infrared stealth composite material, which is characterized in that include at least a recombiner unit, the recombiner unit
Including basal layer and functional layer, the basal layer is one of cotton, fiber crops, terylene, silk, nylon facing material;The functional layer is power
Benefit require 1 described in thin soft type Infrared stealthy materials.
7. thin soft type infrared stealth composite material according to claim 6, which is characterized in that including one or more compound
Unit, the thickness of functional layer is identical or different in the multiple recombiner unit.
8. thin soft type infrared stealth composite material as claimed in claim 6, which is characterized in that including a recombiner unit and multiple
The surface of the functional layer described in the recombiner unit is adhesively fixed in functional layer, the multiple functional layer.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111974415A (en) * | 2020-08-31 | 2020-11-24 | 北京化工大学 | Copper sulfide/brass mesh electrode material with nanosheet array structure and preparation method and application thereof |
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2018
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111974415A (en) * | 2020-08-31 | 2020-11-24 | 北京化工大学 | Copper sulfide/brass mesh electrode material with nanosheet array structure and preparation method and application thereof |
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Application publication date: 20190118 |