CN109219337A - The positioning carrier of finger ring shape electronic component - Google Patents
The positioning carrier of finger ring shape electronic component Download PDFInfo
- Publication number
- CN109219337A CN109219337A CN201811341097.7A CN201811341097A CN109219337A CN 109219337 A CN109219337 A CN 109219337A CN 201811341097 A CN201811341097 A CN 201811341097A CN 109219337 A CN109219337 A CN 109219337A
- Authority
- CN
- China
- Prior art keywords
- positioning
- electronic component
- ring shape
- finger ring
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- 230000005389 magnetism Effects 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- 239000000969 carrier Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 5
- 238000004080 punching Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 238000005266 casting Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
This application discloses a kind of positioning carriers of finger ring shape electronic component, positioning substrate, contour limit plate and locating plate including being sequentially overlapped setting, and array offers multiple locating slots on the positioning substrate；Locating slot, which is corresponded to, on the contour limit plate offers location hole；Location hole is corresponded on the locating plate and offers the hole SMT, and the locating plate is with a thickness of 0.05~0.3mm.The present invention realizes and positions to finger ring shape electronic component that not only work efficiency is high, but also accurate positioning by positioning substrate, contour limit plate and locating plate combination.
Description
Technical field
This application involves technical field of semiconductors, more particularly to a kind of positioning carrier of finger ring shape electronic component.
Background technique
In conjunction with shown in Fig. 1 and 2, finger ring shape electronic component 10, circuit board generally circular ring shape, surface has at least one
It is a to the region SMT 101.
Surface mounting technique (SurfaceMountTechnology, SMT), it be it is a kind of will be without pin or short leg surface
Assembling component is mounted on to 101 surface of the region SMT, and the circuit load of welding assembly is subject to by the methods of Reflow Soldering or immersed solder
Technology.The premise that circuit load technology is implemented is: electronic component securely being had good positioning, the damage of electronic component is otherwise easily caused
It is bad, and the mode of SMT installation common at present has:
1, finger ring shape electronic component is positioned by fixture, which is usually to pass through punching machine punching press shape on one piece of metal plate
At location hole, electronic component is then positioned directly in positioning hole, is had problems in that: punching machine is stamped and formed out location hole
Mode machining accuracy it is low, cause inaccurate to electronic units fix.
2, by manually realizing the installation of PCB.With this kind of mode, due to factors, the Yi Zao such as operation technique is improper
It at the damage of electronic component, and wastes time and manpower, reduces working efficiency.
Summary of the invention
The purpose of the present invention is to provide a kind of positioning carriers of finger ring shape electronic component, to realize that work efficiency is high, fixed
Position accurately purpose.
To achieve the above object, the invention provides the following technical scheme:
The embodiment of the present application discloses a kind of positioning carrier of finger ring shape electronic component, the positioning base including being sequentially overlapped setting
Plate, contour limit plate and locating plate,
Array offers multiple locating slots on the positioning substrate；
Locating slot, which is corresponded to, on the contour limit plate offers location hole；
Location hole is corresponded on the locating plate and offers the hole SMT, and the locating plate is with a thickness of 0.05~0.3mm.
Preferably, in the positioning carrier of above-mentioned finger ring shape electronic component, the thickness of the positioning substrate is greater than contour
The thickness of limit plate,
The thickness of the contour limit plate is greater than the thickness of locating plate.
Preferably, in the positioning carrier of above-mentioned finger ring shape electronic component, the positioning substrate with a thickness of 5~7mm,
The contour limit plate with a thickness of 1~3mm.
Preferably, in the positioning carrier of above-mentioned finger ring shape electronic component, the bottom of locating slot offers through-hole.
Preferably, in the positioning carrier of above-mentioned finger ring shape electronic component, locating slot is identical with the size of location hole.
Preferably, in the positioning carrier of above-mentioned finger ring shape electronic component, the area in the hole SMT is less than the face of location hole
Product.
Preferably, in the positioning carrier of above-mentioned finger ring shape electronic component, hollow out is offered on the positioning substrate
Lightening hole, and/or
The lightening hole of hollow out is offered on the contour limit plate, and/or
The lightening hole of hollow out is offered on the locating plate.
Preferably, in the positioning carrier of above-mentioned finger ring shape electronic component, the upper surface of the positioning substrate has been protruded out
Positioning column, cooperation positioning column offers limit hole on the contour limit plate.
Preferably, in the positioning carrier of above-mentioned finger ring shape electronic component, the locating plate is magnetic steel disc,
The contour limit plate has magnetism.
Compared with the prior art, the advantages of the present invention are as follows: the present invention passes through positioning substrate, contour limit plate and locating plate
Combination realizes and positions to finger ring shape electronic component that not only work efficiency is high, but also accurate positioning.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The some embodiments recorded in application, for those of ordinary skill in the art, without creative efforts,
It is also possible to obtain other drawings based on these drawings.
Fig. 1 show the front view of specific embodiment of the invention middle finger ring-type electronic component；
Fig. 2 show the side view of specific embodiment of the invention middle finger ring-type electronic component；
Fig. 3 show the structural schematic diagram of positioning carrier in the specific embodiment of the invention；
Fig. 4 show the top view that substrate is positioned in the specific embodiment of the invention；
Fig. 5 show the side view that substrate is positioned in the specific embodiment of the invention；
Fig. 6 show the top view of contour limit plate in the specific embodiment of the invention；
Fig. 7 show the top view of locating plate in the specific embodiment of the invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out detailed retouch
It states, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the present invention
In embodiment, those of ordinary skill in the art's every other implementation obtained without making creative work
Example, shall fall within the protection scope of the present invention.
As shown in connection with fig. 3, in the embodiment of the application, a kind of positioning carrier 20 of finger ring shape electronic component is disclosed,
Positioning substrate 201, contour limit plate 202 and locating plate 203 including being sequentially overlapped setting.
In one embodiment, it in conjunction with shown in Fig. 4 to Fig. 7, positions array on substrate 201 and offers multiple locating slots 2011；
Locating slot 2011, which is corresponded to, on contour limit plate 202 offers location hole 2021；Location hole, which is corresponded to, on locating plate 203 offers SMT
Hole 2031, locating plate 203 is with a thickness of 0.05~0.3mm.
In the technical solution, positioning substrate 201 preferably uses aluminium/aluminium alloy base plate, steel substrate, in other embodiments,
Can also be using metal substrates such as copper, iron, other alloys, it can also be using the non-metal base plate with certain degree of hardness and intensity.
This case purpose, which is to realize by groove, realizes positioning to finger ring shape electronic component, and each groove respectively corresponds one
Finger ring shape electronic component 10, in order to match finger ring shape electronic component, the preferably rectangle, while its apex angle cambering of locating slot 2011
Processing.
In one embodiment, the thickness for positioning substrate 201 is greater than the thickness of contour limit plate 202, contour limit plate 202
Thickness is greater than the thickness of locating plate 203.
Further, position substrate 201 with a thickness of 5~7mm, contour limit plate 202 with a thickness of 1~3mm.
In the technical solution, the thickness of positioning substrate 201 is less than the diameter of electronic component, and electronic component is set to locating slot
After in 2011, end part includes protruding out to the region SMT in positioning 201 upper surface of substrate thereon, and contour 202 thickness of limit plate is big
The height for being equal to electronic component overhang is caused, while location hole is set in the outside of electronic component.
Contour limit plate 202 can also preferably be used using aluminium/aluminium alloy base plate, steel substrate in other embodiments
The metal substrates such as copper, iron, other alloys, can also be using the non-metal base plate with certain degree of hardness and intensity.
In this case, positioning of the realization to electronic component jointly of substrate 201 and contour limit plate 202 is positioned.Due to positioning base
The thickness of plate 201 and contour limit plate 202 is larger, generally can only form locating slot 2011 and positioning using lathe punch pattern
Hole.
Lathe punching press can only generally run through substrate up and down, can not directly form locating slot 2011.In this case, pass through punching first
Hole mode forms through-hole on positioning substrate 201 and is stamped and formed out mounting hole 2012 in through-hole two sides, then in positioning substrate 201
Bottom bottom support plate (not shown) is detachably equipped with by screw, bottom support plate is located at through-hole lower section and surrounds locating slot
2011。
Contour limit plate 202 is affixed on positioning 201 upper surface of substrate, can not only block to mounting hole, while may be used also
To replace the contour limit plate 202 of different-thickness as needed.
In the technical solution, 203 thickness of locating plate is smaller, compares with positioning substrate 201 with contour substrate, and thickness can be with
Ignore.Since thickness is small, high-precision may be implemented using the laser mode production hole SMT 2031 and process, after locating plate 203 is installed,
The hole SMT 2031 to the region SMT to exposing finger ring shape electronic component, it is generally the case that 2031 area of the hole SMT is less than positioning
Hole area.
In one embodiment, the bottom of locating slot 2011 offers through-hole (not shown).
In the technical solution, through-hole can be set multiple, can be used to implement optical alignment.Ensure finger ring shape electronics member
Part is in accurate angle.
In one embodiment, locating slot 2011 is identical with the size of location hole.
In one embodiment, the area in the hole SMT 2031 is less than the area of location hole.
In one embodiment, the lightening hole 2013 for offering hollow out on substrate 201 is positioned, is opened up on contour limit plate 202
There is the lightening hole 2022 of hollow out, the lightening hole 2032 of hollow out is offered on locating plate 203.
In the technical solution, positioning substrate 201, contour limit plate 202 and the corresponding hollow out respectively of about 203 locating plate are formed
On the one hand lightening hole can reduce material cost by lightening hole, can also reduce weight under the premise of the intensity of guarantee.
In one embodiment, the upper surface for positioning substrate 201 has protruded out positioning column 2014, cooperates on contour limit plate 202
Positioning column offers limit hole 2023.Positioning column 2014 is cooperated to offer limit hole 2033 on locating plate 203.
In the technical solution, the quick accurate positioning of contour limit plate 202 is may be implemented in positioning column and limit hole cooperation,
Positioning column is preferably provided with 3,3 positioning columns two sides triangular in shape for being set to positioning substrate 201.
In one embodiment, locating plate 203 is magnetic steel disc, and contour limit plate 202 has magnetism.
In the technical solution, the top surface of contour limit plate 202 is arranged at intervals with multiple blind holes 2024, be installed in blind hole with
The magnetic component that blind hole shape matches, the magnetic texure are specially high temperature magnet, and the shape of blind hole can have any shape, such as
The shape of round, rectangular, polygon etc., high temperature magnet and blind hole matches, and can use casting glue and is fixed in blind hole.
In one embodiment, positioning substrate 201 has magnetism.
In conclusion the present invention is realized by positioning substrate 201, contour limit plate 202 and the combination of locating plate 203 to finger ring
Shape electronic component is positioned, and not only work efficiency is high, but also accurate positioning.
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second ",
" third " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (9)
1. a kind of positioning carrier of finger ring shape electronic component, which is characterized in that the positioning substrate, contour including being sequentially overlapped setting
Limit plate and locating plate,
Array offers multiple locating slots on the positioning substrate；
Locating slot, which is corresponded to, on the contour limit plate offers location hole；
Location hole is corresponded on the locating plate and offers the hole SMT, and the locating plate is with a thickness of 0.05~0.3mm.
2. the positioning carrier of finger ring shape electronic component according to claim 1, which is characterized in that the thickness of the positioning substrate
Degree is greater than the thickness of contour limit plate,
The thickness of the contour limit plate is greater than the thickness of locating plate.
3. the positioning carrier of finger ring shape electronic component according to claim 2, which is characterized in that the thickness of the positioning substrate
Degree is 5~7mm,
The contour limit plate with a thickness of 1~3mm.
4. the positioning carrier of finger ring shape electronic component according to claim 1, which is characterized in that the bottom of locating slot opens up
There is through-hole.
5. the positioning carrier of finger ring shape electronic component according to claim 1, which is characterized in that locating slot and location hole
Size is identical.
6. the positioning carrier of finger ring shape electronic component according to claim 1, which is characterized in that the area in the hole SMT is less than
The area of location hole.
7. the positioning carrier of finger ring shape electronic component according to claim 1, which is characterized in that opened on the positioning substrate
Lightening hole equipped with hollow out, and/or
The lightening hole of hollow out is offered on the contour limit plate, and/or
The lightening hole of hollow out is offered on the locating plate.
8. the positioning carrier of finger ring shape electronic component according to claim 1, which is characterized in that described to position the upper of substrate
Surface has protruded out positioning column, and cooperation positioning column offers limit hole on the contour limit plate.
9. the positioning carrier of finger ring shape electronic component according to claim 1, which is characterized in that the locating plate is magnetism
Steel disc,
The contour limit plate has magnetism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811341097.7A CN109219337A (en) | 2018-11-12 | 2018-11-12 | The positioning carrier of finger ring shape electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811341097.7A CN109219337A (en) | 2018-11-12 | 2018-11-12 | The positioning carrier of finger ring shape electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109219337A true CN109219337A (en) | 2019-01-15 |
Family
ID=64996277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811341097.7A Pending CN109219337A (en) | 2018-11-12 | 2018-11-12 | The positioning carrier of finger ring shape electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109219337A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110252611A (en) * | 2019-06-12 | 2019-09-20 | 景旺电子科技(龙川)有限公司 | A kind of earphone class FPC dispensing carrier structure and its dispensing process in flakes |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101286462A (en) * | 2008-05-27 | 2008-10-15 | 北京海升天达科技有限公司 | Sealing apparatus, sealing method and encapsulation method of integrated circuit chip |
| CN201601900U (en) * | 2009-10-20 | 2010-10-06 | 富葵精密组件(深圳)有限公司 | Flexible printed circuit board holding device |
| CN201898696U (en) * | 2010-12-09 | 2011-07-13 | 深圳顺络电子股份有限公司 | Device for chip component surface mounting |
| US20140055969A1 (en) * | 2012-08-21 | 2014-02-27 | Apple Inc. | Board assemblies with minimized warpage and systems and methods for making the same |
| CN103635034A (en) * | 2013-11-19 | 2014-03-12 | 利华科技(苏州)有限公司 | BGA (ball grid array) chip bonding pad printing solder paste positioning jig |
| CN103702518A (en) * | 2014-01-06 | 2014-04-02 | 王海浪 | OLED (organic light emitting diode) flexible circuit board magnetic carrier |
| CN204524492U (en) * | 2015-03-03 | 2015-08-05 | 大族激光科技产业集团股份有限公司 | Pcb board fixture for laser welding |
| CN105452918A (en) * | 2013-07-05 | 2016-03-30 | 古河电气工业株式会社 | Optical module, optical module mounting method, optical module-mounted circuit substrate, optical module evaluation kit system, circuit substrate and communication system |
| CN206611654U (en) * | 2017-02-28 | 2017-11-03 | 江阴科利达电子有限公司 | A kind of large scale FPC production carrier structure |
| CN207189066U (en) * | 2017-08-25 | 2018-04-06 | 河北时硕微芯科技有限公司 | A kind of magnetic force carrier for pressure welding |
| CN207505248U (en) * | 2017-10-20 | 2018-06-15 | 惠州市盈海数码电器有限公司 | Turntable phonograph circuit board installation localization tool |
| CN209563134U (en) * | 2018-11-12 | 2019-10-29 | 昆山东野电子有限公司 | The positioning carrier of finger ring shape electronic component |
-
2018
- 2018-11-12 CN CN201811341097.7A patent/CN109219337A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101286462A (en) * | 2008-05-27 | 2008-10-15 | 北京海升天达科技有限公司 | Sealing apparatus, sealing method and encapsulation method of integrated circuit chip |
| CN201601900U (en) * | 2009-10-20 | 2010-10-06 | 富葵精密组件(深圳)有限公司 | Flexible printed circuit board holding device |
| CN201898696U (en) * | 2010-12-09 | 2011-07-13 | 深圳顺络电子股份有限公司 | Device for chip component surface mounting |
| US20140055969A1 (en) * | 2012-08-21 | 2014-02-27 | Apple Inc. | Board assemblies with minimized warpage and systems and methods for making the same |
| CN105452918A (en) * | 2013-07-05 | 2016-03-30 | 古河电气工业株式会社 | Optical module, optical module mounting method, optical module-mounted circuit substrate, optical module evaluation kit system, circuit substrate and communication system |
| CN103635034A (en) * | 2013-11-19 | 2014-03-12 | 利华科技(苏州)有限公司 | BGA (ball grid array) chip bonding pad printing solder paste positioning jig |
| CN103702518A (en) * | 2014-01-06 | 2014-04-02 | 王海浪 | OLED (organic light emitting diode) flexible circuit board magnetic carrier |
| CN204524492U (en) * | 2015-03-03 | 2015-08-05 | 大族激光科技产业集团股份有限公司 | Pcb board fixture for laser welding |
| CN206611654U (en) * | 2017-02-28 | 2017-11-03 | 江阴科利达电子有限公司 | A kind of large scale FPC production carrier structure |
| CN207189066U (en) * | 2017-08-25 | 2018-04-06 | 河北时硕微芯科技有限公司 | A kind of magnetic force carrier for pressure welding |
| CN207505248U (en) * | 2017-10-20 | 2018-06-15 | 惠州市盈海数码电器有限公司 | Turntable phonograph circuit board installation localization tool |
| CN209563134U (en) * | 2018-11-12 | 2019-10-29 | 昆山东野电子有限公司 | The positioning carrier of finger ring shape electronic component |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110252611A (en) * | 2019-06-12 | 2019-09-20 | 景旺电子科技(龙川)有限公司 | A kind of earphone class FPC dispensing carrier structure and its dispensing process in flakes |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| NO334972B1 (en) | Removable electromagnetic interference screen | |
| CN102275025A (en) | Jig for reflux-welding metal substrate | |
| US20070113717A1 (en) | Cutting fixture for printed circuit board mounted with electronic components | |
| CN201601900U (en) | Flexible printed circuit board holding device | |
| CN209563134U (en) | The positioning carrier of finger ring shape electronic component | |
| CN109219337A (en) | The positioning carrier of finger ring shape electronic component | |
| CN216123063U (en) | Spring carrier for welding PCB and FPC | |
| CN103737143A (en) | Welding tool for antenna lining plate and micro connector | |
| CN106312429B (en) | High-precision holds projection welding tool | |
| CN209358930U (en) | The positioning carrier of three-dimensional shape electronic component | |
| CN209676638U (en) | A kind of localization tool of FPC connecting plate attachment | |
| CN103203982A (en) | Three-dimensional mask plate for printing | |
| KR200473125Y1 (en) | Reballing apparatus | |
| CN210475793U (en) | Multi-fixing and positioning furnace passing carrier | |
| CN107039384B (en) | Surface-mounted element | |
| CN112911829B (en) | FC-BGA crosses stove protection device | |
| CN216775142U (en) | Furnace-passing jig for double-sided flexible circuit board | |
| JP6489525B2 (en) | Electric device manufacturing method, manufacturing jig, and removal jig | |
| CN220606183U (en) | Novel jig for BGA dense products | |
| CN219724872U (en) | Polygonal pin brazing jig | |
| CN216286053U (en) | Multi-functional lift laminating tool | |
| CN210629961U (en) | Printed circuit board for high power use | |
| CN202663667U (en) | Reflow welding jig locating with high accuracy | |
| CN215091747U (en) | Circuit breaker shell welding tool | |
| CN211090175U (en) | Auxiliary jig for reinforcing sheet attached to printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190115 |