CN109216572B - Flexible composite film, preparation method thereof, flexible substrate and display device - Google Patents

Flexible composite film, preparation method thereof, flexible substrate and display device Download PDF

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CN109216572B
CN109216572B CN201811083775.4A CN201811083775A CN109216572B CN 109216572 B CN109216572 B CN 109216572B CN 201811083775 A CN201811083775 A CN 201811083775A CN 109216572 B CN109216572 B CN 109216572B
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flexible
film layer
filler
flexible film
composite film
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CN109216572A (en
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邱丽霞
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

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  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
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  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The embodiment of the invention provides a flexible composite film, a preparation method thereof, a flexible substrate and a display device, relates to the technical field of display, and can reduce the number of micropores in a flexible film layer. A flexible composite film includes a flexible film layer, and a filler material at least partially dispersed in the flexible film layer for filling micropores in the flexible film layer.

Description

Flexible composite film, preparation method thereof, flexible substrate and display device
Technical Field
The invention relates to the technical field of display, in particular to a flexible composite film, a preparation method thereof, a flexible substrate and a display device.
Background
Compared with the conventional display and lighting device, an Organic Light Emitting Diode (OLED) display has the following advantages: 1. because the OLED display is a self-luminous device, it does not need to use a backlight source to display as other displays (e.g., liquid crystal displays), and thus, compared with a display that needs a backlight source, the OLED display has a faster response speed, a better display effect, and a wider display viewing angle; 2. compared with a liquid crystal display, the preparation process of the OLED display is simpler, and the preparation cost can be as low as several tens of percent of that of the liquid crystal display; 3. OLED displays can be used to make flexible display devices.
At present, the flexible OLED display usually uses polyimide as a substrate, and the polyimide has the advantages of high strength, high toughness, wear resistance, high temperature resistance, corrosion resistance, and the like.
However, as shown in fig. 1, under a Scanning Electron Microscope (SEM), the polyimide film layer includes a very large number of micro holes through which air, moisture, and the like may enter the OLED display, thereby affecting the performance of the OLED display device; when the substrate is glass-peeled off from the glass substrate by laser lift-off, laser can penetrate through the micropores to affect the stability of a display device (such as an OLED light-emitting device and the like) in the OLED display; meanwhile, the surface of the polyimide film layer with the micropores is uneven, so that the preparation difficulty of the OLED display is increased.
Disclosure of Invention
Embodiments of the present invention provide a flexible composite film, a method for manufacturing the same, a flexible substrate, and a display device, which can reduce the number of micropores in a flexible film layer.
In order to achieve the above purpose, the embodiment of the invention adopts the following technical scheme:
in a first aspect, a flexible composite film is provided, which includes a flexible film layer, and a filler material at least partially dispersed in the flexible film layer, the filler material being used to fill micro-pores in the flexible film layer.
Optionally, in the flexible composite film, the mass fraction of the flexible film layer is 80% to 95%, and the mass fraction of the filling material is 5% to 20%.
Optionally, the filler material is hydrophobic.
Optionally, the flexible film layer is made of polyimide, and the filling material is polyvinylidene fluoride-hexafluoropropylene copolymer.
Optionally, the filling material is dispersed in the flexible film layer; or the filling material is partially dispersed in the flexible film layer, and the part of the filling material which is not dispersed in the flexible film layer is stacked with the flexible film layer.
In a second aspect, a flexible substrate is provided, which includes the flexible composite film of the first aspect.
In a third aspect, a display device is provided, which includes the flexible substrate of the second aspect.
In a fourth aspect, a method for preparing a flexible composite film is provided, which includes: forming a transparent adhesive and a filler on a rigid substrate; heating the transparent glue and the filler; after cooling, the transparent adhesive is solidified into a flexible film layer, and the filler is solidified into a filler material dispersed in the flexible film layer.
In a fifth aspect, a method for preparing a flexible composite film is provided, which includes: forming a flexible film layer on a rigid substrate; and forming a filler on one side of the flexible film layer, which is far away from the rigid substrate, heating the filler, and curing the filler into a filler material which is at least partially dispersed in the flexible film layer.
Optionally, the filling material is dispersed in the flexible film layer; or the filling material is partially dispersed in the flexible film layer, and the part of the filling material which is not dispersed in the flexible film layer is stacked with the flexible film layer.
The embodiment of the invention provides a flexible composite film and a preparation method thereof, a flexible substrate and a display device, wherein filling materials are dispersed in a flexible film layer, and part of the filling materials dispersed in the flexible film layer can enter micropores of the flexible film layer and are used for filling the micropores of the flexible film layer; when the flexible composite film is peeled from the rigid substrate in a laser peeling mode, the problem that laser penetrates through the micropores to damage devices in the sealing device can be solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is an SEM image of a polyimide film of the prior art;
FIG. 2 is a schematic view of a flexible composite film according to an embodiment of the present invention;
FIG. 3 is a schematic view of a flexible composite film according to an embodiment of the present invention;
FIG. 4 is an SEM image of a flexible composite film provided by an embodiment of the invention;
fig. 5 is a schematic diagram of a display device according to an embodiment of the invention;
fig. 6 is a schematic diagram of a display device according to an embodiment of the invention;
FIG. 7 is a schematic flow chart of a process for preparing a flexible composite film according to an embodiment of the present invention;
FIG. 8 is a schematic illustration of one manner of forming a clearcoat and filler provided by an embodiment of the present invention;
fig. 9 is a schematic flow chart of a process for preparing a flexible composite film according to an embodiment of the present invention.
Reference numerals:
10-a flexible composite film; 11-a flexible film layer; 12-a filler material; 21-an array substrate; 211-TFT and OLED light emitting devices; 22-pair of cassette substrates; 23-a liquid crystal layer; 100-a rigid substrate; 101-transparent adhesive tape; 102-a filler.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment of the invention provides a flexible composite film 10, which comprises a flexible film layer 11 and a filling material 12 at least partially dispersed in the flexible film layer 11, wherein the filling material 12 is used for filling micropores in the flexible film layer 11.
First, the filling material 12 is dispersed in the flexible film layer 11, and a part of the filling material is located in the micropores of the flexible film layer 11 to fill the micropores of the flexible film layer 11, and a part of the filling material is dispersed in other regions of the flexible film layer 11 except for the micropores. Wherein, the filling material 12 may fill all or part of the micro-pores in the flexible film layer 11 according to the preparation process, the materials of the flexible film layer 11 and the filling material 12, and the usage amount of the flexible film layer 11 and the filling material 12. Preferably, the filler material 12 fills all the pores in the flexible film layer 11.
On this basis, the specific position of the filler material 12 dispersed in the other region except for the micropores in the flexible film layer 11 is not limited. Specifically, the particular material of the filler material 12, the process for making the flexible composite film 10, and the like.
Second, the material of the flexible film layer 11 is not limited, for example, the material of the flexible film layer 11 may be Polyimide (PI).
For the filler material 12, the material is selected in relation to the material of the flexible film layer 11. The filling material 12 should have good intersolubility with the flexible film 11, and the size of the filling material 12 should be smaller than or equal to the size of the micropores in the flexible film 11, and because the flexible composite film 10 prepared from the flexible film 11 and the filling material 12 is still a flexible film, the filling material 12 should also have greater toughness, preferably, the mechanical strength of the filling material 12 is substantially the same as that of the flexible film 11, or much greater than that of the flexible film 11, so that the filling material 12 can be prevented from breaking before the flexible film 11 under the action of mechanical force that the flexible film 11 can bear.
For example, in the case that the material of the flexible film layer 11 is PI, the material of the filling material 12 may be polyvinylidene fluoride-hexafluoropropylene copolymer.
Third, the process for preparing the flexible composite film 10 is not limited, and in particular, it is related to the material of the flexible film layer 11.
For example, the material of the flexible film layer 11 is PI, and the material of the filling material 12 is polyvinylidene fluoride-hexafluoropropylene copolymer, and the heating curing manner may be adopted, so that the filling material 12 is dispersed in the flexible film layer 11 and fills the micropores in the flexible film layer 11.
Here, since both the PI and the polyvinylidene fluoride-hexafluoropropylene copolymer mixed in the solvent have fluidity in a heated state, the polyvinylidene fluoride-hexafluoropropylene copolymer can be mixed in the PI by controlling the heating temperature and the heating time, and then the PI and the polyvinylidene fluoride-hexafluoropropylene copolymer are cooled to form the flexible composite film 10 of the embodiment of the present invention. Since at least a portion of the polyvinylidene fluoride-hexafluoropropylene copolymer is mixed in the PI before cooling, the solid polyvinylidene fluoride-hexafluoropropylene copolymer remains dispersed in the solid PI after cooling.
Fig. 4 is an SEM image of the flexible composite film 10 according to the embodiment of the present invention, and it can be seen that the number of micro holes in the flexible composite film 10 is greatly reduced compared to the polyimide film of the prior art.
Fourth, the filler material 12 at least partially dispersed in the flexible film layer 11 means: as shown in fig. 2, the filler material 12 may be dispersed throughout the flexible film layer 11; as shown in fig. 3, a part of the filler 12 may be dispersed in the flexible film layer 11, and another part not dispersed in the flexible film layer 11 may be formed into a film and stacked on the flexible film layer 11.
Fifth, the thickness of the flexible composite film 10 is not limited, and is specifically determined according to actual requirements. The preparation of the flexible composite film 10 with different thicknesses can be realized by the dosage of the flexible film layer 11 and the filling material 12.
Sixthly, in the flexible composite film 10, the flexible film layer 11 is a host material, and the mass fraction thereof is larger than that of the filler 12.
Illustratively, in the flexible composite film 10, the mass fraction of the flexible film layer 11 is 80% to 95%, and the mass fraction of the filler 12 is 5% to 20%. At this mass fraction, the filler 12 can be sufficiently dispersed in the flexible film layer 11, and the original toughness of the flexible film layer 11 and thus the toughness of the flexible composite film 10 are not affected by an excessive amount of the filler 12.
For example, the mass fraction of the flexible film layer 11 is 80%, and the mass fraction of the filler 12 is 20%; the mass fraction of the flexible film layer 11 is 90%, and the mass fraction of the filling material 12 is 10%; the mass fraction of the flexible film layer 11 is 95%, and the mass fraction of the filling material 12 is 5%.
The embodiment of the invention provides a flexible composite film 10, wherein a filling material 12 is dispersed in a flexible film layer 11, and a part of the filling material 12 dispersed in the flexible film layer 11 can enter micropores of the flexible film layer 11 and is used for filling the micropores of the flexible film layer 11, so that compared with a polyimide film layer in the prior art, the flexible composite film 10 is a dense composite film layer with a flat surface, and when the flexible composite film 10 is applied to a closed device, air, moisture and the like can be reduced from entering the closed device through the flexible composite film 10, so that the functions and the service lives of all devices in the closed device are influenced; when the flexible composite film 10 is peeled from the rigid substrate by laser peeling, the problem that the laser penetrates through the micropores to damage the devices in the sealing device can be solved.
The rigid substrate may be a glass substrate, for example.
Preferably, the filler material 12 is hydrophobic.
Embodiments of the present invention may further prevent moisture from entering the enclosed device when the flexible composite film 10 is applied to the enclosed device by using the filling material 12 having hydrophobicity.
The embodiment of the invention provides a flexible substrate, which comprises the flexible composite film 10 described in any one of the foregoing embodiments.
First, the use of the flexible substrate is not limited, and the flexible substrate may be a display substrate, for example.
Second, the flexible composite film 10 may be a substrate in a flexible base plate; the flexible composite film 10 may also be an insulating layer on a substrate of a flexible substrate, for example, the insulating layer may be a buffer layer. In view of the fact that the substrate is usually located at the outermost side of the flexible substrate, it is preferable that the flexible composite film 10 is a substrate of the flexible substrate in order to provide a better sealing effect to the flexible substrate.
The embodiment of the invention provides a flexible substrate, which comprises a flexible composite film 10, wherein a filling material 12 is dispersed in a flexible film layer 11 of the flexible composite film 10, and a part of the filling material 12 dispersed in the flexible film layer 11 can enter micropores of the flexible film layer 11 and is used for filling the micropores of the flexible film layer 11, so that compared with a polyimide film layer in the prior art, the flexible composite film 10 is a dense composite film layer with a flat surface, and further the flexible substrate is a dense substrate with a flat surface, when the flexible substrate comprising the flexible composite film 10 is applied to a closed device, air, water and the like can be reduced from entering the closed device through the flexible composite film 10, thereby affecting the functions and the service life of each device in the closed device; when the flexible composite film 10 is peeled from the rigid substrate by laser peeling, the problem that the laser penetrates through the micropores to damage the devices in the sealing device can be solved.
An embodiment of the present invention provides a display device, including the flexible substrate described in the foregoing embodiment.
First, as shown in fig. 5, the display device may be a liquid crystal display; as shown in fig. 6, the display device may also be an OLED display.
When the display device is a liquid crystal display, the backlight provides the display device with a light source for display. The display panel comprises an array substrate 21, a box aligning substrate 22 and a liquid crystal layer 23 arranged between the two, wherein the array substrate 21 can comprise a Thin Film Transistor (TFT), a pixel electrode electrically connected with a drain electrode of the TFT; further, a common electrode may be included. The opposing substrate 22 may include a black matrix and a color film. Here, the color film may be disposed on the cassette alignment substrate 22 or on the array substrate 21; the common electrode may be provided on the array substrate 21 or on the counter substrate 22. On this basis, the liquid crystal display device may also include polarizers disposed on the sides of the display panel close to and away from the backlight source, respectively.
When the display device is an OLED display, since the OLED display is a self-luminous device, a light source for display can be provided to itself. The OLED display includes an array substrate 21 and a facing substrate (i.e., an encapsulation substrate) 22. Among them, the array substrate 21 may include TFTs and an OLED light emitting device 211 including an anode electrically connected to a drain electrode of the TFT, a cathode, and an organic material functional layer between the anode and the cathode. On this basis, the OLED display may further include a protective layer on a side of the cell substrate 22 facing away from the array substrate 21.
Depending on the structure included in the flexible substrate, the flexible substrate may be used as the array substrate 21 or the counter substrate 22.
Second, the display device may be a display panel or a display including a display panel.
The embodiment of the invention provides a display device, which comprises a flexible substrate with a flexible composite film 10, wherein filling materials 12 are dispersed in a flexible film layer 11 of the flexible composite film 10, and part of the filling materials 12 dispersed in the flexible film layer 11 can enter micropores of the flexible film layer 11 and are used for filling the micropores of the flexible film layer 11, so that compared with a polyimide film layer in the prior art, the flexible composite film 10 is a dense composite film layer with a flat surface, and further the flexible substrate is a dense substrate with a flat surface, when the flexible substrate comprising the flexible composite film 10 is applied to a display device, air, water and the like can be reduced from entering the display device through the flexible composite film 10, thereby affecting the stability and the service life of display devices (such as an OLED display device and a TFT) in the display device; when the flexible composite film 10 is peeled from the rigid substrate by laser peeling, the problem that the display device in the enclosed device is damaged by laser passing through the micro-holes can be improved.
The embodiment of the invention provides a preparation method of a flexible composite film 10, which can be realized by the following steps as shown in fig. 7:
s11, transparent adhesive 101 and filler 102 are formed on rigid substrate 100.
First, the transparent adhesive 101 and the filler 102 are not limited to the formation method, and the transparent adhesive 101 and the filler 102 may be formed by, for example, a coating method or an inkjet printing method (as shown in fig. 8).
Second, the order of forming the transparent adhesive 101 and the filler 102 is not limited, and the transparent adhesive 101 may be formed first and then the filler 102 may be formed; the filling agent 102 can be formed first, and then the transparent adhesive 101 can be formed; of course, the transparent adhesive 101 and the filler 102 may be simultaneously formed to be mixed together.
Third, since the transparent adhesive 101 and the filler 102 contain a solvent and have a certain fluidity, the transparent adhesive 101 and the filler 102 can be uniformly mixed by the fluidity on the rigid substrate 100.
Fourth, the material of the transparent adhesive 101 is not limited, and for example, the material of the transparent adhesive 101 may be PI.
For the filler 102, the material is selected according to the material of the transparent adhesive 101. The filler 102 should have good intersolubility with the transparent adhesive 101, and the size of the filler 102 should be smaller than or equal to the size of the micropores in the flexible film layer 11, and because the flexible composite film 10 prepared from the transparent adhesive 101 and the filler 102 is still a flexible film layer, the filler 102 should also have greater toughness, and preferably, the mechanical strength of the filler 102 is substantially the same as that of the transparent adhesive 101 or much greater than that of the transparent adhesive 101, so that the filler 12 can be prevented from being broken before the flexible film layer 11 under the mechanical force bearable by the flexible film layer 11 after the flexible composite film 10 is formed in the subsequent process.
For example, in the case that the material of the transparent adhesive 101 is PI, the material of the filler 102 may be polyvinylidene fluoride-hexafluoropropylene copolymer.
S12, heating the transparent adhesive tape 101 and the filling agent 102; after cooling, the transparent adhesive 101 is solidified into the flexible film layer 11, and the filler 102 is solidified into the filler 12 dispersed in the flexible film layer 11.
First, a part of the filling material 12 is located in the micro holes of the flexible film layer 11 to fill the micro holes of the flexible film layer 11, and a part of the filling material is dispersed in other regions of the flexible film layer 11 except for the micro holes.
On this basis, the specific position of the filler material 12 dispersed in the other region except for the micropores in the flexible film layer 11 is not limited. Specifically, the specific material of the filler material 12, and the heating temperature and heating time.
Secondly, the curing of the filler 102 into the filler 12 dispersed in the flexible film layer 11 means: as shown in fig. 2, the filler 102 is heated and cooled, and then solidified to be the filler 12 dispersed throughout the flexible film layer 11.
Third, the thickness of the flexible composite film 10 is not limited, and is specifically determined by actual requirements. The preparation of the flexible composite film 10 with different thicknesses can be realized by the dosage of the flexible film layer 11 and the filling material 12.
Fourth, in the flexible composite film 10, the flexible film layer 11 is a host material, and the mass fraction thereof is larger than the mass fraction of the filler 12.
Illustratively, in the flexible composite film 10, the mass fraction of the flexible film layer 11 is 80% to 95%, and the mass fraction of the filler 12 is 5% to 20%. At this mass fraction, the filler 12 can be sufficiently dispersed in the flexible film layer 11, and the original toughness of the flexible film layer 11 and thus the toughness of the flexible composite film 10 are not affected by an excessive amount of the filler 12.
For example, the mass fraction of the flexible film layer 11 is 80%, and the mass fraction of the filler 12 is 20%; the mass fraction of the flexible film layer 11 is 90%, and the mass fraction of the filling material 12 is 10%; the mass fraction of the flexible film layer 11 is 95%, and the mass fraction of the filling material 12 is 5%.
Fifth, regarding the heating time and the heating temperature, depending on the materials of the flexible film layer 11 and the filler material 12, it should be understood by those skilled in the art that the heating time and the heating temperature should be set with the purpose of sufficiently dispersing the filler material 12 in the flexible film layer 11.
The embodiment of the invention provides a method for preparing a flexible composite film 10, which has the same technical effect as the flexible composite film 10 of the previous embodiment, and is not repeated herein.
In addition to the above, a flexible film may be formed on the rigid substrate 100, and the material of the flexible film may be the same as that of the transparent adhesive tape 101, and then the steps S11 and S12 may be performed. The transparent adhesive 101 and the filler 102 are heated and the flexible film is heated to be in a molten state, and then solidified to be a part of the flexible film layer 11 when cooled.
The embodiment of the invention provides a preparation method of a flexible composite film 10, which can be realized by the following steps as shown in fig. 9:
s21, the flexible film layer 11 is formed on the rigid substrate 100.
First, the filler 102 is not limited to the form of forming the filler 102, and the filler 102 may be formed by, for example, a coating method or an ink-jet printing method (as shown in fig. 8).
Second, the material of the flexible film layer 11 is not limited, for example, the material of the flexible film layer 11 may be PI.
The filler 102 is selected from a material that is related to the material of the flexible film layer 11. The filler 102 should have good intersolubility with the heated flexible film layer 11 in a molten state, and the size of the filler 102 should be smaller than or equal to the size of the micropores in the flexible film layer 11, and because the flexible composite film 10 prepared from the flexible film layer 11 and the filler 102 is still a flexible film layer, the filler 102 should also have greater toughness, preferably, the mechanical strength of the filler 102 is substantially the same as that of the flexible film layer 11 or much greater than that of the flexible film layer 11, so that the filler 12 can be prevented from being broken before the flexible film layer 11 under the mechanical force bearable by the flexible film layer 11 after the flexible composite film 10 is formed in a subsequent process.
For example, in the case that the material of the flexible film layer 11 is PI, the material of the filler 102 may be polyvinylidene fluoride-hexafluoropropylene copolymer.
S22, forming the filler 102 on the side of the flexible film layer 11 away from the rigid substrate 100, and heating the filler 102 to solidify the filler 102 into the filler 12 at least partially dispersed in the flexible film layer 11.
First, the filling material 12 is dispersed in the flexible film layer 11, and a part of the filling material is located in the micropores of the flexible film layer 11 to fill the micropores of the flexible film layer 11, and a part of the filling material is dispersed in other regions of the flexible film layer 11 except for the micropores.
On this basis, the specific position of the filler material 12 dispersed in the other region except for the micropores in the flexible film layer 11 is not limited. Specifically, the specific material of the filler material 12, and the heating temperature and heating time.
Second, the filler 102 is cured into the filler material 12 at least partially dispersed in the flexible film layer 11, which means that: as shown in fig. 2, the filler 102 is heated and cooled, and then solidified into the filler 12 dispersed in the flexible film layer 11; as shown in fig. 3, the filler 102 is heated and cooled, and then solidified into the filler 12, a part of which is dispersed in the flexible film layer 11 and another part of which is not dispersed in the flexible film layer 11, and which can be formed into a film and is stacked on the flexible film layer 11.
Third, the thickness of the flexible composite film 10 is not limited, and is specifically determined by actual requirements. The preparation of the flexible composite film 10 with different thicknesses can be realized by the dosage of the flexible film layer 11 and the filling material 12.
Fourth, in the flexible composite film 10, the flexible film layer 11 is a host material, and the mass fraction thereof is larger than the mass fraction of the filler 12.
Illustratively, in the flexible composite film 10, the mass fraction of the flexible film layer 11 is 80% to 95%, and the mass fraction of the filler 12 is 5% to 20%. At this mass fraction, the filler 12 can be sufficiently dispersed in the flexible film layer 11, and the original toughness of the flexible film layer 11 and thus the toughness of the flexible composite film 10 are not affected by an excessive amount of the filler 12.
For example, the mass fraction of the flexible film layer 11 is 80%, and the mass fraction of the filler 12 is 20%; the mass fraction of the flexible film layer 11 is 90%, and the mass fraction of the filling material 12 is 10%; the mass fraction of the flexible film layer 11 is 95%, and the mass fraction of the filling material 12 is 5%.
Fifth, regarding the heating time and the heating temperature, depending on the materials of the flexible film layer 11 and the filler material 12, it should be understood by those skilled in the art that the heating time and the heating temperature should be set with the purpose of sufficiently dispersing the filler material 12 in the flexible film layer 11.
The embodiment of the invention provides a method for preparing a flexible composite film 10, which has the same technical effect as the flexible composite film 10 of the previous embodiment, and is not repeated herein.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims (9)

1. A flexible composite film comprising a flexible film layer, and a filler material at least partially dispersed in the flexible film layer, the filler material being for filling pores in the flexible film layer;
the filler material is hydrophobic.
2. The flexible composite film according to claim 1, wherein the flexible composite film comprises 80-95 wt% of the flexible film layer and 5-20 wt% of the filler.
3. The flexible composite film according to any one of claims 1-2, wherein the material of the flexible film layer is polyimide, and the material of the filler material is polyvinylidene fluoride-hexafluoropropylene copolymer.
4. The flexible composite film of claim 1 wherein the filler material is dispersed throughout the flexible film layer;
or the filling material is partially dispersed in the flexible film layer, and the part of the filling material which is not dispersed in the flexible film layer is stacked with the flexible film layer.
5. A flexible substrate comprising the flexible composite film according to any one of claims 1 to 4.
6. A display device comprising the flexible substrate according to claim 5.
7. A method for preparing a flexible composite film, comprising:
forming a transparent adhesive and a filler on a rigid substrate;
heating the transparent glue and the filler; after cooling, the transparent adhesive is solidified into a flexible film layer, and the filler is solidified into a filler material dispersed in the flexible film layer;
the filler material is hydrophobic.
8. A method for preparing a flexible composite film, comprising:
forming a flexible film layer on a rigid substrate;
forming a filler on one side, away from the rigid substrate, of the flexible film layer, and heating the filler, wherein the filler is solidified into a filler material at least partially dispersed in the flexible film layer;
the filler material is hydrophobic.
9. The method of claim 8, wherein the filler material is dispersed throughout the flexible film layer;
or the filling material is partially dispersed in the flexible film layer, and the part of the filling material which is not dispersed in the flexible film layer is stacked with the flexible film layer.
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