CN109216546A - A kind of connection method and flexible display panels of flexible substrate and carrier substrate - Google Patents
A kind of connection method and flexible display panels of flexible substrate and carrier substrate Download PDFInfo
- Publication number
- CN109216546A CN109216546A CN201811066949.6A CN201811066949A CN109216546A CN 109216546 A CN109216546 A CN 109216546A CN 201811066949 A CN201811066949 A CN 201811066949A CN 109216546 A CN109216546 A CN 109216546A
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- China
- Prior art keywords
- carrier substrate
- substrate
- flexible
- flexible substrate
- connection method
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The present invention relates to display equipment technical fields, disclose the connection method and flexible display panels of a kind of flexible substrate and carrier substrate, the connection method of the flexible substrate and carrier substrate, comprising: form the modified layer including polar group in a side surface of flexible substrate；In one side surface of carrier substrate, deposition includes the articulamentum of dangling bonds；Flexible substrate is bonded with carrier substrate so that the polar group of modified layer is bonded connection with the dangling bonds of articulamentum.Flexible substrate is connect by the flexible substrate with the connection method of carrier substrate by being bonded connection type with carrier substrate, cost of manufacture that is easy to connect and saving flexible display panels.
Description
Technical field
The present invention relates to display equipment technical field, in particular to the connection method of a kind of flexible substrate and carrier substrate and
Flexible display panels.
Background technique
In existing flexible display panels production method, liquid polyimide coating on carrier substrate and is solidified
The production of flexible substrate is realized afterwards, then carries out the production of subsequent display device, finally removes finished product from carrier glass.But
The preparation cost of the prior art is higher.
Summary of the invention
The present invention provides the connection method and flexible display panels of a kind of flexible substrate and carrier substrate, above-mentioned flexible liners
Flexible substrate is connect by bottom with the connection method of carrier substrate by being bonded connection type with carrier substrate, easy to connect and saving
The costs of manufacture of flexible display panels.
In order to achieve the above objectives, the present invention the following technical schemes are provided:
A kind of connection method of flexible substrate and carrier substrate, comprising:
The modified layer including polar group is formed in a side surface of flexible substrate；
In one side surface of carrier substrate, deposition includes the articulamentum of dangling bonds；
The flexible substrate is bonded to polar group and the articulamentum so that the modified layer with the carrier substrate
Dangling bonds be bonded connection.
In the connection method of above-mentioned flexible substrate and carrier substrate, a side surface of flexible substrate, which is modified processing, to be made
One side surface forms the modified layer including polar group, and includes the connection of dangling bonds in one side surface of carrier substrate deposition
Layer, after side by flexible substrate with modified layer be bonded towards carrier substrate with carrier substrate with the side of articulamentum, i.e.,
Contact modified layer with articulamentum, at this time due to being bonded between the polar group of modified layer and the dangling bonds of the articulamentum so that
Flexible substrate is bonded connection with carrier substrate；It is the flexible substrate that will have been prepared in above-mentioned connection method provided by the invention
It is connect with carrier substrate, connection type is by the polar group that is formed in flexible base board and the suspension that is formed on carrier substrate
Key bonding connection, connection type is more convenient, and flexible substrate and is consolidated in the prior art make on carrier substrate
Change processing is compared, and cost is saved.
Preferably, when the flexible substrate being bonded with the carrier substrate, by the way of machinery fitting.
Preferably, the modified layer including polar group is formed in a side surface of the flexible substrate, comprising:
Corona treatment is carried out to form the modified layer including polar group to a side surface of the flexible substrate.
Preferably, the polar group includes-NH2 ,-COOH or-OH.
It is preferably, described in articulamentum of one side surface of the carrier substrate deposition including dangling bonds, comprising:
In a side surface deposited amorphous silicon of the carrier substrate to form the articulamentum, the surface shape of the amorphous silicon
At there is dangling bonds.
Preferably, the method for deposited amorphous silicon is vapour deposition process.
Preferably, the flexible substrate is made of polyimide film.
Preferably, thickness 10um~40um of the polyimide film.
Preferably, the carrier substrate is made of glass material.
The present invention also provides a kind of preparation methods of flexible display panels, comprising:
By a side surface of the flexible substrate through the above technical solution in the flexible substrate that provides and carrier substrate
Connection method is connect with carrier substrate；
Display device is made away from the side of the carrier substrate in the flexible substrate；
The flexible substrate and the carrier substrate are removed.
Detailed description of the invention
Fig. 1 is the schematic diagram of the connection method of flexible substrate provided by the invention and carrier substrate.
Icon:
1- carrier substrate；2- articulamentum；3- dangling bonds；4- flexible substrate；5- polar group.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Referring to FIG. 1, the present invention provides the connection method of a kind of flexible substrate 4 and carrier substrate 1, comprising:
The modified layer including polar group 5 is formed in a side surface of flexible substrate 4；
In 1 one side surface of carrier substrate, deposition includes the articulamentum 2 of dangling bonds 3；
Flexible substrate 4 is bonded with carrier substrate 1 so that the polar group 5 of modified layer is bonded with the dangling bonds 3 of articulamentum 2
Connection.
One side surface of flexible substrate 4 is modified place with the connection method of carrier substrate 1 by above-mentioned flexible substrate 4
It includes the modified layer of polar group 5 that reason, which forms one side surface, and includes dangling bonds 3 in 1 one side surface of carrier substrate deposition
Articulamentum 2, after side by flexible substrate 4 with modified layer towards carrier substrate 1 and carrier substrate 1 there is articulamentum 2
Side fitting, even if modified layer is contacted with articulamentum 2, at this time due to the dangling bonds 3 of the polar group of modified layer 5 and articulamentum 2
Between bonding so that flexible substrate 4 is bonded connection with carrier substrate 1；It is that will make in above-mentioned connection method provided by the invention
The flexible substrate 4 got ready is connect with carrier substrate 1, and connection type is polar group 5 by being formed in flexible base board and carrying
The bonding connection of dangling bonds 3 formed on structure base board 1, connection type is more convenient, and in the prior art on carrier substrate 1
It makes flexible substrate 4 and carries out curing process and compare, save cost.
Specifically, when flexible substrate 4 being bonded with carrier substrate 1, by the way of machinery fitting.
Flexible substrate 4 can be bonded with carrier substrate 1 by the way of machinery fitting, it is easy to operate and will not damage soft
Property substrate 4 and carrier substrate 1, and subsequent stripping process is simple and convenient.
Specifically, the modified layer including polar group 5 is formed in a side surface of flexible substrate 4, comprising:
Corona treatment is carried out to form the modified layer including polar group 5 to a side surface of flexible substrate 4.
Use plasma apparatus to the progress plasma treatment of flexible substrate 4 to form modified layer, it is simple and convenient.
Specifically, polar group 5 includes-NH2 ,-COOH or-OH.
Ion processing is carried out to flexible substrate 4 to form the modified layer including polar group 5, polar group 5 therein wraps
- NH2 ,-COOH and-OH polar group 5 are included but be not limited to, can also include that other are easy to be bonded the polar group 5 of connection.
Specifically, in articulamentum 2 of 1 one side surface of the carrier substrate deposition including dangling bonds 3, comprising:
Carrier substrate 1 a side surface deposited amorphous silicon to form articulamentum 2, the surface of amorphous silicon is formed with dangling bonds
3。
The dangling bonds 3 of the above-mentioned bonding of polar group 5 connection are formed in a side surface of carrier substrate 1, it is preferred to use
Deposited amorphous silicon on carrier substrate 1, the surface of amorphous silicon are formed with dangling bonds 3, can also use and enable to 1 table of carrier substrate
Other articulamentums 2 of face formation dangling bonds 3.
Specifically, the method for deposited amorphous silicon is vapour deposition process.
The method of deposited amorphous silicon is to be vapor-deposited using vapor deposition apparatus, easy to operate.
Specifically, flexible substrate 4 is made of polyimide film.
Specifically, thickness 10um~40um of polyimide film.
Specifically, carrier substrate 1 is made of glass material.
The present invention also provides a kind of preparation methods of flexible display panels, comprising:
By a side surface of flexible substrate 4 through the above technical solution in the flexible substrate 4 that provides and carrier substrate 1 company
Method is connect to connect with carrier substrate 1；
Display device is made away from the side of carrier substrate 1 in flexible substrate 4；
Flexible substrate 4 and carrier substrate 1 are removed.
In the preparation method of above-mentioned flexible display panels, the flexible substrate 4 prepared is connected with carrier substrate 1 first
It connects, connection type is by the polar group 5 that flexible base board is formed and 3 company of bonding of dangling bonds that is formed on carrier substrate 1
It connects, stable connection；Then the side surface that flexible substrate 4 deviates from carrier substrate 1 again makes display device；Finally by flexible substrate
4 remove with carrier substrate 1, complete the preparation of flexible display panels；Flexible liner is made on carrier substrate 1 in the prior art
Bottom 4 and carry out curing process, carry out display device preparation finally by flexible substrate 4 with carrier substrate 1 remove compared with, the present invention
In the preparation method of offer, the easy to connect and removing of flexible substrate 4 and carrier substrate 1 is simple, while cost is greatly saved.
Obviously, those skilled in the art can carry out various modification and variations without departing from this hair to the embodiment of the present invention
Bright spirit and scope.In this way, if these modifications and changes of the present invention belongs to the claims in the present invention and its equivalent technologies
Within the scope of, then the present invention is also intended to include these modifications and variations.
Claims (10)
1. the connection method of a kind of flexible substrate and carrier substrate characterized by comprising
The modified layer including polar group is formed in a side surface of flexible substrate；
In one side surface of carrier substrate, deposition includes the articulamentum of dangling bonds；
The flexible substrate is bonded with the carrier substrate so that the polar group of the modified layer and hanging for the articulamentum
Hang key bonding connection.
2. the connection method of flexible substrate according to claim 1 and carrier substrate, which is characterized in that by the flexible liner
When bottom is bonded with the carrier substrate, by the way of machinery fitting.
3. the connection method of flexible substrate according to claim 1 and carrier substrate, which is characterized in that in the flexible liner
One side surface at bottom forms the modified layer including polar group, comprising:
Corona treatment is carried out to form the modified layer including polar group to a side surface of the flexible substrate.
4. the connection method of flexible substrate according to claim 1 and carrier substrate, which is characterized in that the polar group
Including-NH2 ,-COOH or-OH.
5. the connection method of flexible substrate according to claim 1 and carrier substrate, which is characterized in that described in carrier base
One side surface of plate deposition includes the articulamentum of dangling bonds, comprising:
The carrier substrate a side surface deposited amorphous silicon to form the articulamentum, the surface of the amorphous silicon is formed with
Dangling bonds.
6. the connection method of flexible substrate according to claim 5 and carrier substrate, which is characterized in that deposited amorphous silicon
Method is vapour deposition process.
7. the connection method of flexible substrate according to claim 1 and carrier substrate, which is characterized in that the flexible substrate
It is made of polyimide film.
8. the connection method of flexible substrate according to claim 7 and carrier substrate, which is characterized in that the polyimides
Thickness 10um~40um of film.
9. the connection method of flexible substrate according to claim 1 and carrier substrate, which is characterized in that the carrier substrate
It is made of glass material.
10. a kind of preparation method of flexible display panels characterized by comprising
One side surface of the flexible substrate is passed through such as the described in any item flexible substrates of claim 1-9 and carrier substrate
Connection method is connect with carrier substrate；
Display device is made away from the side of the carrier substrate in the flexible substrate；
The flexible substrate and the carrier substrate are removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811066949.6A CN109216546A (en) | 2018-09-13 | 2018-09-13 | A kind of connection method and flexible display panels of flexible substrate and carrier substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811066949.6A CN109216546A (en) | 2018-09-13 | 2018-09-13 | A kind of connection method and flexible display panels of flexible substrate and carrier substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109216546A true CN109216546A (en) | 2019-01-15 |
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ID=64983321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811066949.6A Pending CN109216546A (en) | 2018-09-13 | 2018-09-13 | A kind of connection method and flexible display panels of flexible substrate and carrier substrate |
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Citations (6)
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|---|---|---|---|---|
| US20070059854A1 (en) * | 2005-09-14 | 2007-03-15 | Chin-Jen Huang | Flexible pixel array substrate and method for fabricating the same |
| CN103956363A (en) * | 2014-03-03 | 2014-07-30 | 上海天马有机发光显示技术有限公司 | Composite substrate and manufacturing method thereof, and flexible display device and manufacturing method thereof |
| CN104487241A (en) * | 2013-04-09 | 2015-04-01 | 株式会社Lg化学 | Laminate, and element comprising substrate manufactured using same |
| CN106448473A (en) * | 2016-12-16 | 2017-02-22 | 京东方科技集团股份有限公司 | Display panel mother board and preparation method of display panel |
| CN106784353A (en) * | 2016-12-28 | 2017-05-31 | 京东方科技集团股份有限公司 | Board unit, display base plate motherboard, display base plate and preparation method, display |
| CN107516666A (en) * | 2017-08-18 | 2017-12-26 | 武汉华星光电技术有限公司 | A kind of flexible OLED display part stripping means and flexible OLED display part |
-
2018
- 2018-09-13 CN CN201811066949.6A patent/CN109216546A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070059854A1 (en) * | 2005-09-14 | 2007-03-15 | Chin-Jen Huang | Flexible pixel array substrate and method for fabricating the same |
| CN104487241A (en) * | 2013-04-09 | 2015-04-01 | 株式会社Lg化学 | Laminate, and element comprising substrate manufactured using same |
| CN103956363A (en) * | 2014-03-03 | 2014-07-30 | 上海天马有机发光显示技术有限公司 | Composite substrate and manufacturing method thereof, and flexible display device and manufacturing method thereof |
| CN106448473A (en) * | 2016-12-16 | 2017-02-22 | 京东方科技集团股份有限公司 | Display panel mother board and preparation method of display panel |
| CN106784353A (en) * | 2016-12-28 | 2017-05-31 | 京东方科技集团股份有限公司 | Board unit, display base plate motherboard, display base plate and preparation method, display |
| CN107516666A (en) * | 2017-08-18 | 2017-12-26 | 武汉华星光电技术有限公司 | A kind of flexible OLED display part stripping means and flexible OLED display part |
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Application publication date: 20190115 |