CN109213091A - A kind of semiconductor chip process equipment method for monitoring state based on document analysis - Google Patents
A kind of semiconductor chip process equipment method for monitoring state based on document analysis Download PDFInfo
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- CN109213091A CN109213091A CN201810677972.2A CN201810677972A CN109213091A CN 109213091 A CN109213091 A CN 109213091A CN 201810677972 A CN201810677972 A CN 201810677972A CN 109213091 A CN109213091 A CN 109213091A
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- semiconductor chip
- process equipment
- chip process
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Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32252—Scheduling production, machining, job shop
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
The invention discloses a kind of semiconductor chip process equipment method for monitoring state based on document analysis, this method comprises the following steps: (1) acquiring the file that semiconductor chip process equipment automatically generates;(2) document analysis is carried out, the text formatting for meeting SECS transport protocol is formed;(3) file of parsing is uploaded to semiconductor chip process equipment condition monitoring system.The method that the invention provides makes the semiconductor chip process equipment of no SECS interface carry out the monitoring to equipment under the premise of without HardwareUpgring, and the semiconductor chip process equipment monitor supervision platform based on SECS interface of present mainstream can be accessed under the premise of only needing and developing on a small quantity, realize the function that equipment reads information, and again with semiconductor chip process equipment without direct interference, it can avoid scrap build, reduce cost, in 8 inches and semicon industry below, there is greater advantage compared with semiconductor chip process equipment to be transformed into itself and supports SECS interface, market application prospect is wide.
Description
Technical field
The invention belongs to the equipment automatization programing system communication technique fields of semiconductor devices manufacture, more particularly to one kind
Semiconductor chip process equipment method for monitoring state based on document analysis.
Background technique
With the continuous innovation of industrial technology, requirement of the existing market to manufacturing enterprise is higher and higher.Especially semiconductor
Industry, since the process of production is extremely complex, it usually needs implement MES, i.e. manufacturing enterprise's production process executes management system, this
The production process of sample executes system, while conjunction with semiconductors chip manufacture equipment automatization program is managed.
The automation of semiconductor semiconductor chip process equipment is usually that semiconductor chip process equipment obtains product information simultaneously
Information is passed by semiconductor chip process equipment automatic programming EAP (Equipment Automation Programing)
It gives manufacturing enterprise's production process and executes management system (MES), feedback information is assigned to half by EAP again after being analyzed by MES
Conductor chip process equipment.Currently, the monitoring of semiconductor factory semiconductor chip process equipment is set by semiconductor chip processing
Standby included SECS module interface is realized, but some domestic semiconductor chip process equipments and old semiconductor chip process equipment
Want to realize at present for the not included semiconductor chip process equipment for reading product information function without this interface
Information read functions usually require to carry out the upgrading of semiconductor chip process equipment or transformation, if processed to domestic semiconductor chip
Equipment or the upgrading of old semiconductor chip process equipment and transformation, then need professional technician that the function for supporting SECS agreement is added
Energy module, preferably with the compatibility of semiconductor chip process equipment and EAP, efficiency is also high, but expense is costly.In addition, simple
It is lower that single semiconductor chip process equipment oneself generation log file carries out parsing recorded cost, but processes with semiconductor chip
The compatibility of equipment or EAP system is not high, and improved efficiency is unobvious.Therefore, in the semiconductor semiconductor for not supporting information to read
Chip manufacture equipment aspect is badly in need of a kind of efficient, cheap, stable information reading technology.
Summary of the invention
Goal of the invention: for the above problem of the existing technology, the present invention provides a kind of partly leading based on document analysis
Body chip manufacture device status monitoring method is parsed using the file that semiconductor chip process equipment oneself generates, and is pressed
It is exported according to the format of SECS, most of semiconductor semiconductor chip process equipment platform softwares can be compatible with.
Technical solution: to achieve the purpose of the present invention, the technical scheme adopted by the invention is that: one kind being based on document analysis
Semiconductor chip process equipment method for monitoring state, which is characterized in that this method comprises the following steps:
(1) path of the text/image log file generated in real time on semiconductor chip process equipment computer is shared;
(2) above-mentioned path is accessed by intermediate equipment, above-mentioned text/image log file is copied in local device;
(3) local parsing or server parsing are selected, text/image log file is read, traverses the ginseng recorded in file
Number, selection parameter as needed is calculated, and forms the status data of semiconductor chip process equipment;
(4) status data of semiconductor chip process equipment in step (3) is integrated into the data of SECS protocol format, and
The data of above-mentioned SECS protocol format are sent to equipment automatization programing system, and the device statistics mistake of host computer is recorded
In process control system database;
(5) host computer is monitored by the function of device statistics Process Control System, when semiconductor chip process equipment
When data are abnormal, semiconductor chip process equipment is executed in management system in manufacturing enterprise's production process and is hung as delay machine shape
State, and Facilities Engineer is notified to handle.
Wherein, in the step (2), semiconductor chip process equipment is acquired using the file acquisition software in intermediate equipment
The file of generation.
Wherein, in the step (3), calculating includes maximum value, minimum value, variance, mean value calculation.
Wherein, it in the step (3), when data parse, if it is text, then directly opens and is parsed;If it is figure
Piece, then the text information of first analysis diagram on piece, then text information is stored and is parsed at text file.
Wherein, in the step (5), host computer supervises semiconductor chip process equipment data by statistical method
Control notifies engineer to handle in time when finding that data occur abnormal.
The utility model has the advantages that compared with prior art, technical solution disclosed by the invention has the advantages that
(1) by being parsed to the file of the spontaneous generation of semiconductor chip process equipment, without adding to semiconductor chip
Construction equipment itself carries out any transformation;
(2) any work that will not interfere semiconductor chip process equipment influences the work of semiconductor chip process equipment
Stability;
(3) local parsing can choose according to intermediate computer ability or server parses, accelerate analyzing efficiency;
(4) virtual SECS interface is used, the good compatibility with numerous semiconductor chip process equipments management platform;
(5) it is parsed at once after file generated, staff can timely see feedback information in computer end.
Detailed description of the invention
Fig. 1 is that the semiconductor chip process equipment of SECS interface usually acquires data flow diagram;
Fig. 2 is that the semiconductor chip process equipment without SECS interface usually acquires data flow diagram;
Fig. 3 uses semiconductor chip process equipment in the case of the present invention program to acquire data flow diagram;
Software configuration interface under Fig. 4 the present invention program;
Fig. 5 system structure diagram.
Specific embodiment
Further description of the technical solution of the present invention with reference to the accompanying drawings and examples.
A kind of semiconductor chip process equipment method for monitoring state based on document analysis disclosed by the invention, including it is following
Step:
(1) set up environment: semiconductor chip process equipment can be processed in semiconductor chip when often finishing a piece of disk and be set
The log file for recording operating status in detail is left on standby equipment computer, which may be text it could also be possible that figure
Piece, wherein semiconductor chip process equipment and equipment computer are integrated, also, semiconductor chip process equipment does not have SECS to connect
Mouthful.The path of the text/image log file generated in real time is found on equipment computer, and is shared, and an additional calculating is passed through
Machine accesses to this document folder, this computer is connected to semiconductor chip process equipment and server, we term it in
Between computer;
(2) acquire: intermediate computer generates semiconductor chip process equipment every some cycles in equipment computer
Real-time text/image file is scanned, and if there is updating, newly-generated file is just copied to local counted by intermediate computer
According to acquisition;
(3) multichannel parses: local parsing can choose according to the ability of intermediate computer or server parses, if it is
Text is directly opened, and the text information on picture analytic technique capturing pictures is first used if it is picture, is stored text information
File content is read into memory text file as TXT File Open at text file, it is general as air pressure, temperature,
The parameter informations such as flow show in table form, traverse parameter information line by line, carry out according to their own needs to parameters
Such as the operation of maximum value, minimum value, variance, average value;
(4) send: SECS standard is used between unified each production semiconductor chip process equipment and produces semiconductor
Communication between chip manufacture equipment and control semiconductor chip process equipment, is mark most basic in semiconductor manufacturing process
It is quasi-.SECS agreement send the characteristics of be 1. transmission length byte N, i.e., N number of data and two verification and, entire data are known as 1
The data of a block;2. being transferred to the state of listening to after being sent completely.During this period, if if having received response letter within the T2 time
Number, judge that the signal is ACK, if not failure is then sent, retransmits ENQ foundation and shake hands, retransmission data, RTY times most,
Success is sent if having received ack signal within the T2 time, is transferred to wait state, data stream format is message format.
EAP system is equipment automatization programing system, for comprehensive bottoms such as receiving device state, control equipment work
Machine operation.By the daemon software write, according to upper EAP system equipment automated programming system (Equipment
Automation Programing) the SECS protocol format integral data stream that can identify, form message format, and to EAP system
System issues handshaking information in a manner of a semiconductor chip process equipment, forms virtual partly leading with SECS module
The status message of semiconductor chip process equipment is sent to EAP system, while recording data into and setting by body chip manufacture equipment
In standby statistical process control system (E-SPC, Equipment-Statistical Process Control) database.
(5) it monitors: opening E-SPC service monitoring on host computer server and upload to the data in E-SPC database, lead to
The function of crossing E-SPC, when semiconductor chip process equipment data are more than control line or the unilateral exception continuously drifted about occur,
It is delay machine state that semiconductor chip process equipment, which executes extension in management system (MES) in manufacturing enterprise's production process, and notifies to set
Standby engineer.
The step (1) carries environment and is divided into semiconductor chip process equipment part and intermediate computer part, due to half
Conductor chip process equipment is more fragile, is easy to lead to semiconductor chip process equipment delay machine due to compatibility issue, and included
Computer performance is poor, therefore the file copy of semiconductor chip process equipment to intermediate computer is handled, step here
Suddenly (1) is the perforation that physical path is carried out by ICP/IP protocol;
It is raw using the file acquisition software acquisition semiconductor chip process equipment on intermediate computer in the step (2)
At file;
In the step (3), to picture file carry out picture parsing, if intermediate computer is functional local into
Row parsing needs to occupy vast resources if intermediate computer configures, system is undesirable or parsing is excessively complicated, uses
Server-side parses data;
In the step (4), SECS is the communication interface of the standard of semicon industry, the most of use of semicon industry
In equipment automatization programing system (EAP, the Equipment Automation of semiconductor chip process equipment manipulation
Programing SECS protocol communication) is used, is accessed by the low exploitation degree that EAP may be implemented in the simulation to SECS, EAP system
The case where system can pass through log judges the working condition of equipment, facilitates and calculates the data such as utilization rate of equipment and installations, discovery produced in time
Excess load production and idle point in journey, reasonable distribution production, improve the management level of production scheduling;
In the step (5), device statistics process control E-SPC (Equipment-Statistical Process
Control) block to carry out semiconductor chip process equipment state to semiconductor chip process equipment by statistical method
The system of control handles the data above transmitted, is judged, carries out the operation such as reminding.
Technical solution of the present invention is further introduced with specific embodiment below.
The invention discloses a kind of semiconductor chip process equipment method for monitoring state based on document analysis, this method packet
Include following steps:
(1) moral dragon scribing machine is a semiconductor chip process equipment for being exclusively used in semiconductor chip cutting, is finished often
A text log file can be generated after a piece of original piece in D disk, records every status information during doing disk, such as moral in detail
Each second corresponding pressure of cutter head, scribing depth, cavity air pressure, water velocity etc. when imperial scribing machine works.
(2) the D disk of moral dragon scribing machine equipment computer is shared out, and moral dragon scribing machine equipment computer and intermediate computations
Machine is got up with network connection, the log file in the accessible moral dragon scribing machine equipment computer D disk of intermediate computer.
(3) the D disk for refreshing primary equipment computer in intermediate computer every 10 seconds, by script software, when there is new log text
In the backup file of file copy to intermediate computer when part generates.
(4) log file is opened, the calculating of maximum value, minimum value, average value and variance is carried out to all data.
(5) calculated value is integrated into the file packet for meeting SECS format, be sent to equipment automatization programing system (EAP,
Equipment Automation Programing), EAP system can by the generation situation and content of log ,-judge equipment
Working condition, facilitate and calculate the data such as utilization rate of equipment and installations, find the excess load production and idle point in production process in time,
Reasonable distribution production, improves the management level of production scheduling, while recording data into device statistics Process Control System (E-
SPC, Equipment-Statistical Process Control) database in.
(6) E-SPC system is the Upper system on server, and the data that E-SPC system comes up to upload judge, such as
Fruit notes abnormalities, and locks in systems to semiconductor chip process equipment, and notify Facilities Engineer.Such as when scribing machine knife
When head pressure anomaly, pressure value variance can occur obviously to fluctuate, and when variance reaches 5, can determine whether abnormal possibility, send postal
Part notifies Facilities Engineer, but not delay machine;When variance reaches 20, determine exception occur, semiconductor core in MES system
Piece process equipment is cut to delay machine state, does not allow to continue to use, and broadcasts and Facilities Engineer is notified to handle in time, and alarm
Prompt.Equally, can also monitor in any log file such as scribing depth, cavity air pressure, water velocity, cavity temperature has record
Parameter.
The acquisition of product information is realized by above step, which has the advantage that
(1) without carrying out any transformation to semiconductor chip process equipment itself, expense is low, technically simple;
(2) image analysis can be used for not generating the semiconductor chip process equipment of text file, expansion can data
The source of acquisition;
(3) virtual SECS interface is used, increases the compatibility with Upper system, Upper system secondary development amount is significantly
Reduce and carries out secondary development even without to it.
Claims (5)
1. a kind of semiconductor chip process equipment method for monitoring state based on document analysis, which is characterized in that this method includes
Following steps:
(1) path of the text/image log file generated in real time on semiconductor chip process equipment computer is shared;
(2) above-mentioned path is accessed by intermediate computer, above-mentioned text/image log file is copied in intermediate computer;
(3) local parsing or server parsing are selected, text/image log file is read, traverses the parameter recorded in file, root
According to needing selection parameter to be calculated, and form the status data of semiconductor chip process equipment;
(4) status data of semiconductor chip process equipment in step (3) is integrated into the data of SECS protocol format, and upper
The data for stating SECS protocol format are sent to equipment automatization programing system, and be recorded host computer device statistics it is excessively program-controlled
In system database processed;
(5) host computer is monitored by the function of device statistics Process Control System, when semiconductor chip process equipment data
When being abnormal, it is delay machine state that semiconductor chip process equipment, which is executed extension in management system in manufacturing enterprise's production process,
And it is handled.
2. a kind of semiconductor chip process equipment method for monitoring state based on document analysis according to claim 1,
It is characterized in that, further includes in the step (2), processed using the file acquisition software acquisition semiconductor chip on intermediate computer
The file that equipment generates.
3. a kind of semiconductor chip process equipment method for monitoring state based on document analysis according to claim 1,
It is characterized in that, in the step (3), calculating includes maximum value, minimum value, variance, average value.
4. a kind of semiconductor chip process equipment method for monitoring state based on document analysis according to claim 1,
It is characterized in that, in the step (3), when data parse, if it is text, then directly opens and parsed;If it is picture, then
The text information of first analysis diagram on piece, then text information is stored and is parsed at text file.
5. a kind of semiconductor chip process equipment method for monitoring state based on document analysis according to claim 1,
It being characterized in that, in the step (5), host computer is monitored semiconductor chip process equipment data by statistical method,
When finding that data occur abnormal, engineer is notified to handle in time.
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Cited By (3)
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CN114115926A (en) * | 2022-01-28 | 2022-03-01 | 深圳微迅信息科技有限公司 | Program sharing method, system, computer equipment and readable storage medium |
CN115114007A (en) * | 2022-08-25 | 2022-09-27 | 江苏京创先进电子科技有限公司 | Camera scheduling control method for scribing machine |
CN116257244A (en) * | 2022-09-06 | 2023-06-13 | 无锡芯享信息科技有限公司 | Flow code conversion system for chip manufacturing EAP system |
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CN116257244B (en) * | 2022-09-06 | 2023-10-03 | 无锡芯享信息科技有限公司 | Flow code conversion system for chip manufacturing EAP system |
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