CN109203654A - Diode marking device - Google Patents
Diode marking device Download PDFInfo
- Publication number
- CN109203654A CN109203654A CN201810961628.6A CN201810961628A CN109203654A CN 109203654 A CN109203654 A CN 109203654A CN 201810961628 A CN201810961628 A CN 201810961628A CN 109203654 A CN109203654 A CN 109203654A
- Authority
- CN
- China
- Prior art keywords
- marking
- drying
- gear
- electric conductor
- fixedly connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
- B41F17/08—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on filamentary or elongated articles, or on articles with cylindrical surfaces
- B41F17/14—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on filamentary or elongated articles, or on articles with cylindrical surfaces on articles of finite length
- B41F17/20—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on filamentary or elongated articles, or on articles with cylindrical surfaces on articles of finite length on articles of uniform cross-section, e.g. pencils, rulers, resistors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F23/00—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing
- B41F23/04—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing by heat drying, by cooling, by applying powders
- B41F23/044—Drying sheets, e.g. between two printing stations
- B41F23/0463—Drying sheets, e.g. between two printing stations by convection
- B41F23/0466—Drying sheets, e.g. between two printing stations by convection by using heated air
Abstract
The present invention relates to diode marking devices, including rack, transport mechanism and marking mechanism; marking mechanism includes ring gear; the center of ring gear is equipped with drive shaft; drive shaft is connected with drive rod; the free end of drive rod is rotatably connected to the driving gear engaged with ring gear, and sliding tooth wheel is rotatably connected to sliding block；It is also connected with sliding slot in rack, marking bar is slidably connected in sliding slot, marking bar is connected with marking head, and marking bar is connected with driving frame, and sliding block is slidably connected in driving frame；The top of support rod is equipped with rack segments, rack segments are engaged with drying gear, drying gear is connected with support plate, the other end of support plate is connected with connecting plate, connecting plate is equipped with the first electric conductor and the second electric conductor, and gap is equipped between the first electric conductor and the second electric conductor, sets control switch in gap, the bottom of support plate is equipped with infrared lamp, and infrared lamp is arranged towards transport mechanism.Label will not be made fuzzy when present apparatus drying label.
Description
Technical field
The present invention relates to field of semiconductor processing, and in particular to diode marking device.
Background technique
Semiconductor refers to that a kind of electric conductivity can be controlled, and range can be from insulator to the material between conductor.No matter from section
From the perspective of skill or economic development, the importance of semiconductor is all very huge.Today most electronic product, such as
Core cell in computer, mobile phone or digital audio tape all has extremely close connection with semiconductor.
Semiconductor will usually carry out marking after processing, stamp the model of manufacturer and semiconductor on the semiconductor and criticize
It is secondary, on the one hand, marking can facilitate selecting and distinguishing for consumer；On the other hand, it is easy to chase after when something goes wrong in semiconductor quality
It blames and recalls.But existing semiconductor marking device is during carrying out marking to semiconductor, usually using the side of blowing
Formula accelerates the rate of drying marked after marking, and the drying mode dried is to avoid the label on semiconductor wind blown fuzzy,
Strict control wind speed is wanted, and wind speed is too low can there are problems that slow drying speed.
Summary of the invention
The invention is intended to provide diode marking device, existed with solving label existing for traditional semiconductor marking device
The problem of being blow molded paste is easy in drying process.
In order to achieve the above objectives, technical scheme is as follows: diode marking device, including rack, conveyer
Structure and marking mechanism, marking mechanism are located at the top of transport mechanism, and marking mechanism includes ring gear, and the outer wall of ring gear is fixed to be connected
It is connected to support rod, the center of ring gear is equipped with support column, and support column is fixedly connected on the rack, and is rotatably connected on support column
Drive shaft, drive shaft are connected with driving motor, and drive shaft is fixedly connected with drive rod, and the free end of drive rod is rotatably connected to drive
Moving gear, driving gear are engaged with ring gear, and sliding tooth wheel is rotatably connected to sliding block；Sliding slot is also fixedly connected on support column,
Vertical sliding is connected with marking bar in sliding slot, and marking bar bottom is removably connected with marking head, and marking bar is fixedly connected with and prints
The vertically disposed driving frame of mark post, sliding block are slidably connected in driving frame；The top of support rod is equipped with rack segments, lives on support rod
Dynamic to be connected with drying mechanism, drying mechanism includes support plate, and one end of support plate is rotatably connected to drying gear, drying gear with
Rack segments engagement；The other end of support plate is fixedly connected with connecting plate, and connecting plate is equipped with the first electric conductor and the second electric conductor,
It is equipped with gap between first electric conductor and the second electric conductor, the control switch for controlling drying gear rotation is equipped in gap,
The bottom of support plate is equipped with infrared lamp, and infrared lamp is arranged towards transport mechanism.
Diode marking device by adopting the above technical scheme, when practical application, rack plays support and stabilizing equipment connects
The effect connect, transport mechanism carry out marking to semiconductor surface for transmitting target semiconductor to be printed, marking mechanism, specifically,
Drive rod rotates under the drive of drive shaft, so that the driving gear of driving boom end is rotated in interior gear ring internal messing, Jin Ertong
It crosses sliding block and drives driving frame movement, since driving frame is vertically fixedly connected with marking bar, and marking bar vertical sliding is connected to cunning
In slot, moved back and forth so that marking bar is upper and lower along the chute with the movement of driving frame, when marking bar moves downward, marking head
Marking is carried out to semiconductor surface.After semiconductor marking, during being transmitted by transport mechanism, the pin meeting of semiconductor
Be inserted into the gap of connecting plate so that pin in connecting plate the first electric conductor and the second electric conductor be connected to, control support
Infrared lamp on plate lights, and the label of the semiconductor after marking is dried using the infrared light of infrared lamp, avoids traditional benefit
Label caused by being marked with wind is easy fuzzy problem, after the pin of semiconductor is inserted into gap, in meeting top clearance
Control switch so that drying gear rotate and moves up along pinion rack section, drive connecting plate move up, finally make pin and company
Fishplate bar is detached from, so that infrared lamp extinguishes, completes drying process.In the process, when pin quality is there are when problem, pin is inserted into
Infrared lamp can not be made to light after in gap and label is dried.
The beneficial effect of the technical program is:
1. the present apparatus utilizes the property of semiconductor pin conduction, first on pin and connecting plate is made in transmit process
Electric conductor and the connection of the second electric conductor, the infrared lamp controlled in support plate light, and pass through scorching to after marking for infrared lamp light
Semiconductor on label be dried, the present apparatus when label is dried, mark top air velocity there is no
Variation, dry compared to traditional wind, the present apparatus will not lead to the problem of label because of the variation of air velocity and be blow molded paste.
2. the present apparatus can squeeze control switch while pin is connected to the first electric conductor with the second electric conductor, so that
It is moved up while gear is dried along rack segments engagement rotation, so that connecting plate moves up, when moving on to and draw on connecting plate
When foot is detached from, then drying process terminates, since the revolving speed of drying gear is certain, so that the time one that pin is connect with connecting plate
Fixed, i.e. time for lighting of infrared lamp is certain, realizes the certain of drying time, guarantees dry consistency, avoid due to drying
There is the problem of drying effect has differences in Time Inconsistency.
3. the present apparatus utilizes the property of semiconductor pin conduction, on the one hand control infrared lamp, which lights, is dried label；
On the other hand it can also be achieved the detection to pin quality, between pin the first electric conductor of insertion and the second electric conductor, but cannot
When so that infrared lamp lighting, then pin quality is proved there are problem, operator needs to sieve the semiconductor at this time.
Further, restoring board is fixedly connected on support rod, restoring board is located at the lower section of support plate, restoring board and support plate
Between be fixedly connected with reset spring.When pin and connecting plate are detached from, drying course terminates, and pin no longer squeezes control at this time
Switch, drying gear move down resets under the pulling force effect of reset spring, realize and dry automatically reseting for gear and infrared lamp,
It is easy to operate.
Further, transport mechanism includes conveyer belt and transmission wheel, and transmission wheel is connected with stepper motor.With conveyer belt transmission half
Conductor is more stable, stepper motor can intermittency check conveyer belt open, stop, flexibility is high.
Further, the discharge end of conveyer belt is equipped with collecting box.After the label on semiconductor is oven-dried, semiconductor is being transmitted
It under the action of band, is transferred into the collecting box of discharge end, realizes automatic collection, high degree of automation.
Further, conveyer belt is equipped with multiple for fixing the L-shaped fixed block of semiconductor, the opening direction court of fixed block
To the discharge end of conveyer belt.Fixed block plays the role of limiting semiconductor position, avoids semiconductor in marking and drying course
Displacement is generated, guarantees the stability of marking and drying, in addition, fixed block is set as L shape, it can be to the cross for limiting semiconductor simultaneously
Freedom degree in, vertical both direction is further ensured that the fixed stability of semiconductor.
Further, the top of rack segments is equipped with stop tooth.It is mobile that the stop tooth of rack segments upper end plays restriction drying gear
The effect of range, the displacement for avoiding drying gear from moving on rack segments is excessive and is disengaged from rack segments, guarantees equipment
Stable operation.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the embodiment of the present invention；
Fig. 2 is the side view of connecting plate in the embodiment of the present invention.
Specific embodiment
It is further described below by specific embodiment:
Appended drawing reference in Figure of description include: ring gear 1, support rod 2, drive shaft 3, drive rod 4, driving gear 5,
Sliding block 6, sliding slot 7, marking bar 8, marking head 9, driving frame 10, rack segments 11, support plate 12, drying gear 13, connecting plate 14, the
One electric conductor 15, control switch 17, infrared lamp 18, restoring board 19, reset spring 20, conveyer belt 21, is fixed second electric conductor 16
Block 22, stop tooth 23.
Embodiment is substantially as shown in Fig. 1: diode marking device, including rack, transport mechanism and marking mechanism, passes
Sending mechanism includes conveyer belt 21 and transmission wheel, and transmission wheel is connected with stepper motor, and conveyer belt 21 is equipped with multiple for fixed half
The L-shaped fixed block 22 of conductor, towards the discharge end of conveyer belt 21, the discharge end of conveyer belt 21 set for the opening direction of fixed block 22
There is collecting box.
Marking mechanism is located at the top of conveyer belt 21, and marking mechanism includes ring gear 1, and the outer wall of ring gear 1 is fixedly connected
There is support rod 2, the center of ring gear 1 is equipped with support column, and support column is fixedly connected on the rack, and is rotatably connected on support column
Drive shaft 3, drive shaft 3 are connected with driving motor, and drive shaft 3 is fixedly connected with drive rod 4, and the free end of drive rod 4, which rotates, to be connected
It is connected to driving gear 5, driving gear 5 is engaged with ring gear 1, and driving gear 5 is rotatably connected to sliding block 6；It is also fixed on support column
It is connected with sliding slot 7, vertical sliding is connected with marking bar 8 in sliding slot 7, and 8 bottom thread of marking bar is connected with marking head 9, marking bar 8
It is fixedly connected with and is slidably connected in driving frame 10 with the vertically disposed driving frame 10 of marking bar 8, sliding block 6.
The top of support rod 2 is equipped with rack segments 11, and the top of rack segments 11 is equipped with stop tooth 23, and activity connects on support rod 2
It is connected to drying mechanism, drying mechanism includes support plate 12, and the left end of support plate 12 is rotatably connected to drying gear 13, dries gear
13 engage with rack segments 11；The right end of support plate 12 is fixedly connected with connecting plate 14, and as shown in connection with fig. 2, connecting plate 14 is equipped with
First electric conductor 15 and the second electric conductor 16, the first electric conductor 15 and the second electric conductor 16 are respectively first conductive in the present embodiment
Piece and the second conductive sheet, the first conductive sheet and the second conductive sheet are copper sheet in the present embodiment, and the first electric conductor 15 is led with second
Electric body 16 can offset with the pin of semiconductor, and gap is equipped between the first electric conductor 15 and the second electric conductor 16, is set in gap
There is the control switch 17 rotated counterclockwise for controlling drying gear 13, the bottom of support plate 12 is equipped with infrared lamp 18, infrared lamp
18 are arranged towards conveyer belt 21, are fixedly connected with restoring board 19 on support rod 2, and restoring board 19 is located at the lower section of support plate 12, multiple
Reset spring 20 is fixedly connected between position plate 19 and support plate 12.
Specific implementation process is as follows: being operated first personnel and target semiconductor to be printed is placed on conveyer belt 21, so that partly leading
For the pin of body towards the discharge end of conveyer belt 21, fixed block 22 is defined the position of semiconductor, avoids semiconductor in marking
It is moved with being generated in drying course.Then open stepper motor, conveyer belt 21 is under the drive of stepper motor by semiconductor from a left side
It transmits to the right, when semiconductor is transferred into the underface of marking mechanism, stepper motor is in shutdown status, drives at this point, opening
Dynamic motor, drive shaft 3 rotate clockwise under the drive of driving motor, and drive shaft 3 is rotated clockwise to drive by drive rod 4 and be driven
Moving gear 5 engages ring gear 1 and rotates clockwise, and driving gear 5, which rotates clockwise, drives rotationally connected sliding block 6 clockwise
It is mobile, it can be slided in driving frame 10 in the moving process clockwise of sliding block 6, and drive marking bar 8 in sliding slot 7 by driving frame 10
Interior to reciprocatingly slide above and below, when marking bar 87 slide downwards and marking head 9 and when semiconductor contact along the chute, 9 pair half of marking head is led
Body carries out marking.
After semiconductor marking, stepper motor restarting, conveyer belt 21 transmits to the right the semiconductor continuation after marking, when
When the pin of semiconductor is inserted into the gap of connecting plate 14, stepper motor is again at shutdown status, at this point, pin and first
Electric conductor 15 offsets and is connected to the second electric conductor 16, so that infrared lamp 18 lights, the infrared light that infrared lamp 18 issues half-and-half is led
Label on body carries out scorching drying, and during label is oven-dried, marking the air velocity of top, there is no variation, marks
Note will not be obscured because of wind.Meanwhile when pin is inserted into the gap between the first electric conductor 15 and the second electric conductor 16,
Pin can squeeze control switch 17, and control drying gear 13 rotates counterclockwise after control switch 17 is squeezed, due to drying tooth
Wheel 13 is engaged with rack segments 11, and drying gear 13 is rotated counterclockwise and can be moved up along rack segments 11, and then is driven support plate 12 and connected
Fishplate bar 14 moves up, at this point, semiconductor remains stationary position under the restriction of fixed block 22, it is de- with pin when being moved on on connecting plate 14
From when, due between the first electric conductor 15 and the second electric conductor 16 be equipped with gap, the first electric conductor 15 and the second electric conductor 16 are not
It is connected to again, infrared lamp 18 extinguishes, and drying course is completed, since the revolving speed of drying gear 13 is certain, so that pin and connecting plate 14
The time of connection is certain, i.e. the time that lights of infrared lamp 18 is certain, realizes the certain of drying time, guarantees dry consistent
Property, avoid the problem that drying effect occur since drying time is inconsistent has differences.
At this point, stepper motor is again started up, the semiconductor continuation after drying is transmitted to the right, semiconductor is transferred into transmission
Case collection is collected after to discharge end.After pin and connecting plate 14 are detached from, so that pin no longer squeezes control switch 17, drying
Gear 13 is without the power rotated counterclockwise, at this point, drying gear 13 moves down reset under the pulling force effect of reset spring 20,
Automatically reseting for support plate 12 and infrared lamp 18 is driven, it is easy to operate.
After the pin of semiconductor is inserted into the gap between the first electric conductor 15 and the second electric conductor 16, infrared lamp does not work
It rises, then it represents that there are problems for the pin quality of the semiconductor, and operator is needed individually to carry out the careful detection to pin, realize
The process of pin quality is detected in drying course simultaneously.
What has been described above is only an embodiment of the present invention, the common sense such as well known specific technical solution and/or characteristic in scheme
It does not describe excessively herein.It should be pointed out that for those skilled in the art, before not departing from technical solution of the present invention
It puts, several modifications and improvements can also be made, these also should be considered as protection scope of the present invention, these all will not influence this
Invent the effect and patent practicability implemented.The scope of protection required by this application should be based on the content of the claims,
The records such as the specific embodiment in specification can be used for explaining the content of claim.
Claims (6)
1. diode marking device, it is characterised in that: including rack, transport mechanism and marking mechanism, marking mechanism position
In the top of transport mechanism, marking mechanism includes ring gear, and the outer wall of ring gear is fixedly connected with support rod, the center of ring gear
Equipped with support column, support column is fixedly connected on the rack, and drive shaft is rotatably connected on support column, and drive shaft is connected with driving
Motor, drive shaft are fixedly connected with drive rod, and the free end of drive rod is rotatably connected to driving gear, drive gear and ring gear
Engagement, sliding tooth wheel are rotatably connected to sliding block；Sliding slot is also fixedly connected on the support column, vertical sliding is connected in sliding slot
Marking bar, marking bar bottom are removably connected with marking head, marking bar be fixedly connected with the vertically disposed driving frame of marking bar,
The sliding block is slidably connected in driving frame；The top of the support rod is equipped with rack segments, is connected with drying on support rod
Mechanism, the drying mechanism include support plate, and one end of support plate is rotatably connected to drying gear, and drying wheel and rack section is nibbled
It closes；The other end of support plate is fixedly connected with connecting plate, and connecting plate is equipped with the first electric conductor and the second electric conductor, and first is conductive
It is equipped with gap between body and the second electric conductor, the control switch for controlling drying gear rotation is equipped in gap, support plate
Bottom is equipped with infrared lamp, and infrared lamp is arranged towards transport mechanism.
2. diode according to claim 1 marking device, it is characterised in that: be fixedly connected on the support rod multiple
Position plate, restoring board are located at the lower section of support plate, reset spring are fixedly connected between restoring board and support plate.
3. diode according to claim 1 marking device, it is characterised in that: the transport mechanism include conveyer belt and
Transmission wheel, transmission wheel are connected with stepper motor.
4. diode according to claim 3 marking device, it is characterised in that: the discharge end of the conveyer belt, which is equipped with, to be received
Header.
5. diode according to claim 3 or 4 marking device, it is characterised in that: the conveyer belt is equipped with multiple
For fixing the L-shaped fixed block of semiconductor, the discharge end of the opening direction of fixed block towards conveyer belt.
6. diode according to claim 5 marking device, it is characterised in that: the top of the rack segments is equipped with stop
Tooth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810961628.6A CN109203654B (en) | 2018-08-22 | 2018-08-22 | Label printing device for diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810961628.6A CN109203654B (en) | 2018-08-22 | 2018-08-22 | Label printing device for diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109203654A true CN109203654A (en) | 2019-01-15 |
| CN109203654B CN109203654B (en) | 2020-05-12 |
Family
ID=64989487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810961628.6A Active CN109203654B (en) | 2018-08-22 | 2018-08-22 | Label printing device for diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109203654B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114377816A (en) * | 2020-10-22 | 2022-04-22 | 洪江区新顺安纸业有限责任公司 | Waste recovery device for packaging paper production |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6160568A (en) * | 1997-05-27 | 2000-12-12 | Sdl, Inc. | Laser marking system and method of energy control |
| CN101577215A (en) * | 2009-06-02 | 2009-11-11 | 汕头市良得电子科技有限公司 | Detective marking machine with bridge rectifier integrated block |
| US20110164104A1 (en) * | 2008-09-29 | 2011-07-07 | Coherent, Inc. | Diode-laser marker with one-axis scanning mirror mounted on a translatable carriage |
| CN202805947U (en) * | 2012-08-30 | 2013-03-20 | 徐志春 | Automatic laser marking machine for LED energy-saving lamps |
| CN205685957U (en) * | 2016-06-27 | 2016-11-16 | 宁波泰伦特气模有限公司 | Drying unit |
| CN107538741A (en) * | 2017-08-12 | 2018-01-05 | 西安电子科技大学 | The printing of non-deployed curved surface conductive pattern and multi-photon curing integrated system and method |
| CN108127264A (en) * | 2017-12-20 | 2018-06-08 | 重庆军航科技有限公司 | The marking device of transistor |
| CN108128026A (en) * | 2017-12-21 | 2018-06-08 | 重庆轩腾科技有限公司 | A kind of camera marking device |
-
2018
- 2018-08-22 CN CN201810961628.6A patent/CN109203654B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6160568A (en) * | 1997-05-27 | 2000-12-12 | Sdl, Inc. | Laser marking system and method of energy control |
| US20110164104A1 (en) * | 2008-09-29 | 2011-07-07 | Coherent, Inc. | Diode-laser marker with one-axis scanning mirror mounted on a translatable carriage |
| CN101577215A (en) * | 2009-06-02 | 2009-11-11 | 汕头市良得电子科技有限公司 | Detective marking machine with bridge rectifier integrated block |
| CN202805947U (en) * | 2012-08-30 | 2013-03-20 | 徐志春 | Automatic laser marking machine for LED energy-saving lamps |
| CN205685957U (en) * | 2016-06-27 | 2016-11-16 | 宁波泰伦特气模有限公司 | Drying unit |
| CN107538741A (en) * | 2017-08-12 | 2018-01-05 | 西安电子科技大学 | The printing of non-deployed curved surface conductive pattern and multi-photon curing integrated system and method |
| CN108127264A (en) * | 2017-12-20 | 2018-06-08 | 重庆军航科技有限公司 | The marking device of transistor |
| CN108128026A (en) * | 2017-12-21 | 2018-06-08 | 重庆轩腾科技有限公司 | A kind of camera marking device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114377816A (en) * | 2020-10-22 | 2022-04-22 | 洪江区新顺安纸业有限责任公司 | Waste recovery device for packaging paper production |
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| Publication number | Publication date |
|---|---|
| CN109203654B (en) | 2020-05-12 |
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Effective date of registration: 20221101 Address after: 646606 Building 12, Yingtian Intelligent Terminal Industrial Park, No. 9, Liangang Road, Shangzhuang Village, Luohan Street, South Sichuan Lingang District, Sichuan Free Trade Zone, Luzhou, Sichuan Patentee after: Luzhou Loongson Micro Technology Co.,Ltd. Address before: 401326 no.66-75, sendi Avenue, Xipeng Town, Jiulongpo District, Chongqing Patentee before: CHONGQING JIALINGXIN TECHNOLOGY CO.,LTD. |
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