CN109202327A - A kind of structure-improved solder - Google Patents
A kind of structure-improved solder Download PDFInfo
- Publication number
- CN109202327A CN109202327A CN201811375503.1A CN201811375503A CN109202327A CN 109202327 A CN109202327 A CN 109202327A CN 201811375503 A CN201811375503 A CN 201811375503A CN 109202327 A CN109202327 A CN 109202327A
- Authority
- CN
- China
- Prior art keywords
- solder
- ontology
- core
- kelly
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 98
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 238000000576 coating method Methods 0.000 claims abstract description 12
- 230000003064 anti-oxidating effect Effects 0.000 claims abstract description 8
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 235000008331 Pinus X rigitaeda Nutrition 0.000 claims 1
- 235000011613 Pinus brutia Nutrition 0.000 claims 1
- 241000018646 Pinus brutia Species 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 5
- 239000003063 flame retardant Substances 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 abstract description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 239000012752 auxiliary agent Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 238000010009 beating Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to a kind of structure-improved solders, including solder ontology, solder resist core, hard lead layer and antioxidation coating, the solder ontology is followed successively by solder resist core from inside to outside, hard lead layer and antioxidation coating, the present invention is by being arranged kelly in solder body end, after the completion of coiling, inside kelly is inserted into through-hole, play the role of fixed solder end, the kelly in outside is laid flat simultaneously, the packaging of coil is not influenced, and kelly lateral wall is equipped with fluoresent coating, when convenient to use, staff timely and effectively finds solder end, it improves work efficiency, by being respectively provided with raised item in the upper and lower of solder side, avoid slipping phenomenon when tin equipment being sent to transmit tin bar, raised item is alternatively arranged as graduation mark simultaneously, cooperate scale inscription, the usage amount of real-time control solder, reduce the waste of material of solder, pass through The fire retardant core of twin-core is set, the wetability and scalability of solder are improved, and then improves the quality of solder welding.
Description
Technical field
The invention belongs to soldering technology field more particularly to a kind of structure-improved solders.
Background technique
Solder is also known as solder stick, is made of tin alloy and auxiliary agent two parts, and solder stick type difference auxiliary agent is also just different,
Aid Portions are to improve the auxiliary heat transfer of solder stick in the welding process, and removal oxidation reduces and is soldered material surface tension, goes
Except soldered material surface and oil contaminant, increase bonding area, the speciality of solder stick is the tin alloy with certain length and diameter
Silk, can be used cooperatively, in electronic welding, solder stick is matched with electric iron in the welding of electronic component with electric iron or laser
It closes, good electric iron provides steady and sustained fusing heat, and solder stick is added to electronic component using the metal as filler
Surface and gap in, fixed electronic component becomes the main component of welding, and the composition of solder stick and the quality of solder stick are close
It is inseparable, it will affect the chemical property and mechanical performance and physical property of solder stick.
But existing solder is easy to aoxidize, if do not used in a short time after solder factory, the surface of solder will
It generates layer oxide film and is easy to appear welding substandard products so that the welding effect of solder reduces, to increase production cost, drop
Low economic benefit, in addition, the outer wall of existing solder be it is smooth, send tin equipment to be easy to appear showing for skidding when sending tin
As, lead to that tin is sent to have some setbacks, while solder coiling complete follower head fixation and using when being quickly found out of end, extract out
It is urgent problem in solder production and use.
Summary of the invention
The present invention is to solve well-known technique and provide a kind of structure-improved solder.
The present invention is adopted the technical scheme that solve well-known technique: a kind of structure-improved tin
Line, including solder ontology, solder resist core, hard lead layer and antioxidation coating, the solder ontology are followed successively by resistance from inside to outside
Solder flux core, hard lead layer and antioxidation coating, the solder resist core is twin-core setting, and it is relative to the straight of solder ontology
Diameter is symmetrical arranged, vertically arranged several through-holes on the solder ontology, the vertical diameter phase of the through hole center line and solder ontology
It is overlapped, this body side surface of solder upper and lower is equipped with several salient lines, and the salient line is between adjacent two through hole, the tin
Line body end upper and lower is additionally provided with strip groove, which is symmetrical arranged, and passes through rotation inside the strip groove
Axis is rotatably connected to kelly.
Further, the kelly length is equal with the maximum height of through-hole, and its diameter is slightly less than through-hole diameter, described
The slewing area of kelly is 90-180 degree, and the kelly lateral surface is equipped with fluoresent coating.
Further, the through-hole and salient line is interlaced and spaced set, i.e., salient line is between through-hole
Center position, and the raised thread end is carved with scale inscription.
Further, the proportion of the solder body interior layer of lead-tin alloy is lead 40%, tin 60%.
Further, the scaling powder core is that rosin or water-soluble resin etc. are filled, and the solder resist core is
Twin-core is set to through-hole two sides, and is symmetrical arranged relative to through-hole.
Further, the solder ontology both ends of the surface are respectively equipped with the first release film and the second release film.
The present invention has the advantage that as follows with good effect:
1. after the completion of coiling, inside kelly is inserted into through-hole, is played solid by the way that kelly is arranged in solder body end by the present invention
Determine the effect of solder end, while the kelly in outside is laid flat, does not influence the packaging of coil, and kelly lateral wall is applied equipped with fluorescence
Layer, when being easy to use, staff timely and effectively finds solder end, and draws it out, and improves work efficiency.
2. the present invention by being respectively provided with raised item in the upper and lower of solder side, avoids beating when tin equipment being sent to transmit tin bar
Sliding phenomenon, while raised item is alternatively arranged as graduation mark, cooperates scale inscription, the usage amount of real-time control solder reduces solder
Waste of material.
3. the present invention improves the wetability and expansion of solder by the fire retardant core in solder body interior setting twin-core
Malleability further improves the quality of solder welding.
Detailed description of the invention
Fig. 1 is the overall structure diagram of solder provided in an embodiment of the present invention；
Fig. 2 is solder radial section structural schematic diagram provided in an embodiment of the present invention.
In figure: 1, solder ontology；2, solder resist core；3, hard lead layer；4, salient line；5, through-hole；6, antioxidation coating；
7, strip groove；8, kelly；9, rotation axis.
Specific embodiment
In order to further understand the content, features and effects of the present invention, hereby enumerating following embodiment, and cooperate attached drawing
Detailed description are as follows.
A kind of structure-improved solder of the invention is explained in detail below with reference to Fig. 1-2: a kind of structure-improved
Solder, including solder ontology 1, solder resist core 2, hard lead layer 3 and antioxidation coating 6, the solder ontology 1 from inside to outside according to
Secondary is solder resist core 2, hard lead layer 3 and antioxidation coating 6, and the solder resist core 2 is that twin-core is arranged, and it is relative to tin
The diameter symmetry of line ontology 1 is arranged, vertically arranged several through-holes 5 on the solder ontology 1,5 center line of through-hole and solder sheet
The vertical diameter of body 1 coincides, and the 1 side upper and lower of solder ontology is equipped with several salient lines 4, which is located at phase
Between adjacent two through hole 5, the 1 end upper and lower of solder ontology is additionally provided with strip groove 7, which is symmetrical arranged, and institute
It states and kelly 8 is rotatably connected to by rotation axis 9 inside strip groove 7,8 length of kelly is equal with the maximum height of through-hole 5,
And its diameter is slightly less than 5 diameter of through-hole, the slewing area of the kelly 8 is 90-180 degree, and 8 lateral surface of kelly is equipped with glimmering
Light coating, the through-hole 5 and the center position that salient line 4 is interlaced and spaced set, i.e. salient line 4 are between through-hole 5
It sets, and scale inscription is carved in 4 end of the salient line, the proportion of the 1 inside layer of lead-tin alloy 3 of solder ontology is lead 40%, tin
60%, the scaling powder core 2 is that rosin or water-soluble resin etc. are filled, and the solder resist core 2 is set to logical for twin-core
5 two sides of hole, and being symmetrical arranged relative to through-hole 5,1 both ends of the surface of solder ontology are respectively equipped with the first release film and second release
Film.
Working principle: after the completion of coiling, inside kelly 8 is inserted by the way that kelly 8 is arranged in 1 end of solder ontology by the present invention
Enter in through-hole 5, plays the role of fixed solder end, while the kelly 8 in outside is laid flat, do not influence the packaging of coil, and kelly 8
Lateral wall is equipped with fluoresent coating, and when being easy to use, staff timely and effectively finds solder end, and draws it out, and mentions
High working efficiency is avoided when tin equipment being sent to transmit tin bar by being respectively provided with raised item 4 in the upper and lower of 1 side of solder ontology
Slipping phenomenon, while raised item 4 is alternatively arranged as graduation mark, cooperates scale inscription, and the usage amount of real-time control solder reduces tin
The waste of material of line improves the wetability and expansion of solder by the way that the fire retardant core 2 of twin-core is arranged inside solder ontology 1
Malleability further improves the quality of solder welding.
The above is only the preferred embodiments of the present invention, and is not intended to limit the present invention in any form,
Any simple modification made to the above embodiment according to the technical essence of the invention, equivalent variations and modification, belong to
In the range of technical solution of the present invention.
Claims (4)
1. a kind of structure-improved solder, including solder ontology (1), solder resist core (2), hard lead layer (3) and anti-oxidation
Layer (6), which is characterized in that the solder ontology (1) is followed successively by solder resist core (2), hard lead layer (3) from inside to outside and prevents
Oxide layer (6), the solder resist core (2) is twin-core setting, and it is arranged relative to the diameter symmetry of solder ontology (1), institute
It is mutually be overlapped with the vertical diameter of solder ontology (1) to state vertically arranged several through-holes (5), through-hole (5) center line on solder ontology (1)
It closes, solder ontology (1) side upper and lower is equipped with several salient lines (4), which is located at adjacent two through hole (5)
Between, solder ontology (1) end upper and lower is additionally provided with strip groove (7), which is symmetrical arranged, and described
It is rotatably connected to kelly (8) inside strip groove (7) by rotation axis (9), the maximum of kelly (8) length and through-hole (5)
Highly equal, and its diameter is slightly less than through-hole (5) diameter, the slewing area of the kelly (8) is 90-180 degree, and the kelly
(8) lateral surface is equipped with fluoresent coating, the through-hole (5) and salient line (4) interlaced and spaced set, i.e. salient line
(4) center position between through-hole (5), and scale inscription is carved in the salient line (4) end.
2. a kind of structure-improved solder according to claim 1, which is characterized in that the internal lead of the solder ontology (1)
The proportion of tin alloy layers (3) is lead 40%, tin 60%.
3. a kind of structure-improved solder according to claim 1, which is characterized in that the scaling powder core (2) is pine
Fragrant or water-soluble resin etc. is filled, and the solder resist core (2) is set to through-hole (5) two sides for twin-core, and relative to logical
Hole (5) is symmetrical arranged.
4. a kind of structure-improved solder according to claim 1, which is characterized in that solder ontology (1) both ends of the surface
It is respectively equipped with the first release film and the second release film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811375503.1A CN109202327A (en) | 2018-11-19 | 2018-11-19 | A kind of structure-improved solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811375503.1A CN109202327A (en) | 2018-11-19 | 2018-11-19 | A kind of structure-improved solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109202327A true CN109202327A (en) | 2019-01-15 |
Family
ID=64996007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811375503.1A Pending CN109202327A (en) | 2018-11-19 | 2018-11-19 | A kind of structure-improved solder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109202327A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB191503310A (en) * | 1915-03-02 | 1915-10-28 | Arthur Edward Collett | Improvements in or relating to Plumbers' Solder or Metal in Strips or Bars. |
| CN85106862A (en) * | 1985-09-07 | 1986-10-29 | 福建师范大学 | Tin solder wire with an active core |
| CN2858433Y (en) * | 2005-11-17 | 2007-01-17 | 黄通明 | Direction locking device of amphibious all terrain vehicle |
| CN204603584U (en) * | 2015-04-08 | 2015-09-02 | 中山翰华锡业有限公司 | A kind of porous solder stick |
| CN206982018U (en) * | 2017-07-06 | 2018-02-09 | 深圳市爱佳法实业股份有限公司 | One kind welds special solder |
| CN206982016U (en) * | 2017-07-06 | 2018-02-09 | 深圳市爱佳法实业股份有限公司 | A kind of environmental-friendly lead-free is easy to the solder stick of welding |
| CN207986412U (en) * | 2017-12-31 | 2018-10-19 | 姚涛 | A kind of cable and wire winding roll |
-
2018
- 2018-11-19 CN CN201811375503.1A patent/CN109202327A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB191503310A (en) * | 1915-03-02 | 1915-10-28 | Arthur Edward Collett | Improvements in or relating to Plumbers' Solder or Metal in Strips or Bars. |
| CN85106862A (en) * | 1985-09-07 | 1986-10-29 | 福建师范大学 | Tin solder wire with an active core |
| CN2858433Y (en) * | 2005-11-17 | 2007-01-17 | 黄通明 | Direction locking device of amphibious all terrain vehicle |
| CN204603584U (en) * | 2015-04-08 | 2015-09-02 | 中山翰华锡业有限公司 | A kind of porous solder stick |
| CN206982018U (en) * | 2017-07-06 | 2018-02-09 | 深圳市爱佳法实业股份有限公司 | One kind welds special solder |
| CN206982016U (en) * | 2017-07-06 | 2018-02-09 | 深圳市爱佳法实业股份有限公司 | A kind of environmental-friendly lead-free is easy to the solder stick of welding |
| CN207986412U (en) * | 2017-12-31 | 2018-10-19 | 姚涛 | A kind of cable and wire winding roll |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20240209 |
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| AD01 | Patent right deemed abandoned |