CN109195305A

CN109195305A - A kind of flexible board meeting professional standard and its assembly system

Info

Publication number: CN109195305A
Application number: CN201810973810.3A
Authority: CN
Inventors: 不公告发明人
Original assignee: Wuhan Bai Sheng Technology Co Ltd
Current assignee: Wuhan Bai Sheng Technology Co Ltd
Priority date: 2018-08-24
Filing date: 2018-08-24
Publication date: 2019-01-11

Abstract

The present invention relates to a kind of flexible board for meeting professional standard and its assembly systems, including flexible plate body, main via area, standard soldering board region and a pair of of location hole, main via area and standard soldering board region are separately positioned on the both ends of flexible plate body, a pair of of location hole is close to standard soldering board region, and a pair of of location hole is symmetrical along the vertical centerline of flexible plate body；It is equipped with one group of electrical network in main via area and needs the electrical network of the photoelectric device of production or test or the pin of module main via hole correspondingly；The electrical network that one group and main via hole are equipped in standard soldering board region corresponds, and meets standard soldering board as defined in professional standard.The beneficial effects of the present invention are: it is full symmetric to can effectively avoid outer dimension, and pin is abnormal caused by amesiality component welding and assembling, though pad is intensive, it is not easy the case where flexible plate body connects bad docking or even dislocation press-fitting with the pad of test circuit board occur.

Description

A kind of flexible board meeting professional standard and its assembly system

Technical field

The present invention relates to photoelectric communication equipment technical field more particularly to a kind of flexible boards and its dress for meeting professional standard Match system.

Background technique

In the electronic device, referred to as flexible print distributing board (Flexible is widely used in order to constitute its circuit Printed Circuit, FPC) flexible soft board, flexible board is on the flexible sheet substrate of polyimides membrane material etc. The structure of wiring is formed with using the conductor layer of copper foil etc..Its thickness of flexible soft board is thin, and be able to carry out bending, flexure etc. Deformation.Therefore, according to flexible soft board, wiring can be configured in the gap in electronic equipment, or configures wiring in movable part, or Person configures wiring three-dimensionally.

In the case where flexible board is constituted by 2 layers or more, in order to different layers is electrically connected and on flexible substrates Through-hole with circular cross-sectional shape is set as guide hole；And by flexible base board and part or IC, with pin In the case that circuit accommodated in packaging body etc. connects, through-hole can be also set sometimes on flexible substrates, in the opening portion of through-hole Periphery is equipped with the part for exposing the raceways of referred to as pad, and pad is for example with the side with the cricoid flat shape of positive round Formula is formed in the opening portion periphery of through-hole, and pad is electrically connected with the pin for being inserted through through-hole using scolding tin etc..

Due to multiple-plate flexible far below lamina, in the multipaths of photoelectric device and module makes and tests, instead Multiple positioning and assembly can cause to damage to flexible board, not only influence appearance, more influence performance, lead to the product for having used flexible board The flexible board that must more renew at high temperature before sale, high temperature replace during again be easy to product again result in damage with Cause failure.

Summary of the invention

The technical problem to be solved by the present invention is to, provide a kind of to meet the soft of professional standard in view of the drawbacks of the prior art Property plate and its assembly system.

The technical scheme to solve the above technical problems is that

According to one aspect of the present invention, a kind of flexible board meeting professional standard, including flexible plate body, main via hole are provided Region, standard soldering board region and a pair of of location hole, the main via area and the standard soldering board region are separately positioned on described The both ends of flexible plate body, a pair of location hole is close to the standard soldering board region, and a pair of location hole is along the flexibility The vertical centerline of plate body is symmetrical；The light for being equipped with one group of electrical network in the main via area and needing to make or test The electrical network of device pin main via hole correspondingly；One group and the main via hole are equipped in the standard soldering board region The one-to-one standard soldering board of electrical network；Be inserted with test pin in the standard soldering board, the test pin with it is described Standard soldering board is fixedly connected by fixed material layer, and the test pin is electrically connected with the standard soldering board.

The beneficial effects of the present invention are: it is full symmetric to can effectively avoid outer dimension, and pin is amesiality (draws Foot and non-centrosymmetry) the welding of polarity component and assembling caused by it is abnormal, changed by the pad structure to flexible board Into being not easy to occur flexible plate body and test the pad of circuit board connect docking bad or even misplace and be press-fitted though pad is intensive The case where；By the way that fixed material layer is arranged, facilitates and test pin is fixed in standard soldering board.

Based on the above technical solution, the present invention can also be improved as follows.

Further, the standard soldering board includes the first pad group and the second pad group, the first pad group includes first Pad and the second pad, first pad and second pad are symmetrical about the vertical centerline of the flexible plate body；Institute Stating the second pad group includes third pad and the 4th pad, and the third pad and the 4th pad are about the flexible plate body Vertical centerline it is symmetrical；The cross central line pair of first pad and the third pad about the standard soldering board region Claim, second pad and the 4th pad are symmetrical about the cross central line in the standard soldering board region.

The beneficial effect of above-mentioned further scheme is: the flexible symmetrical standard soldering board layout setting of plate body can effectively be prevented Only component causes welding position to deviate because rotating 180 degree in the welding process, to avoid to other components of periphery Normal weld has an impact, and then promotes the assembling and welding efficiency of component.

Further, the standard soldering board region further includes the first connection line, the first via hole, the second via hole, the second connection Route, third connection line and the 4th connection line, the both ends of first connection line respectively with first pad and institute The connection of the first via hole is stated, the both ends of the third connection line are connected to the third pad and first via hole respectively；Institute The both ends for stating the second connection line are connected to second pad and second via hole respectively, and the two of the 4th connection line End is connected to the 4th pad and second via hole respectively.

The beneficial effect of above-mentioned further scheme is: passing through the first connection line of setting, the first via hole, the second via hole, the Two connection lines, third connection line and the 4th connection line, both facilitate connection the first pad and third pad, the second pad and 4th pad, moreover it is possible to which electric connecting relation is conducting to the flexible plate body back side or other layers.

Further, it is symmetrical to be additionally provided with one group of vertical centerline about the flexible plate body in the standard soldering board region 5th connection line；5th connection line described in one group is connected to the third pad and the 4th pad respectively.

The beneficial effect of above-mentioned further scheme is: facilitating connection third pad and the 4th pad.

Further, further including component, the lower section of the flexible plate body is arranged in the component, and the component erects It is overlapped to center line with the vertical centerline of the flexible plate body；The component includes the first pin and second pin, described First pin and the second pin are symmetrical about the vertical centerline of the component.

Further, the outer profile size of the component is consistent with the outer profile size in the standard soldering board region；It is described The relative position of first pin is corresponding with the position of first pad or the 4th pad, the phase of the second pin It is corresponding with the position of second pad or the third pad to position.

The beneficial effect of above-mentioned further scheme is: regardless of the direction of component when welding, final component It is normal with the welding of standard soldering board, a possibility that abnormal welding can be substantially reduced.

According to another aspect of the invention, a kind of assembly system of flexible board meeting professional standard is provided, institute is used for A kind of assembly of flexible board for meeting professional standard, including pedestal, circuit board, a pair of guide rails mechanism, top plate and pressing plate are stated, it is described Circuit board is fixed at the top of the pedestal, and a pair of guide rail mechanism is vertically symmetrically fixed at the circuit board On, the top plate is fixed at the top of a pair of guide rail mechanism, and the lower section of the top plate is arranged in the pressing plate, and described The both ends of pressing plate are slidably matched with a pair of guide rail mechanism respectively；Push rod device, the push rod dress are equipped on the top plate The top plate is stretched out in the bottom set, and towards the pressing plate；Multiple tension springs are symmetrically arranged in the two sides of the push rod device, it is described The both ends of tension spring are fixedly connected at the top of the bottom of the top plate and the pressing plate respectively；It is set in the bottom symmetrical of the pressing plate There are multiple pressure heads, the lower section of the pressure head is arranged in the flexibility plate body；There are two being set on the circuit board and described in a pair The one-to-one positioning column of location hole.

The beneficial effects of the present invention are: the pad of flexible plate body is correspondingly arranged at below pressure head, positioning is fixed, using pushing away Lever apparatus pushes pressing plate, to make pressure head move down and push down the standard soldering board of flexible plate body, carries out subsequent assembly to facilitate； Tension spring between top plate and pressing plate can play the role of buffering, when push rod device pushes, reduce pressure head to pad Impact, protective standard pad, moreover it is possible to play the role of resetting pressing plate, after completing the assembly of flexible plate body and circuit board, pass through Tension spring realizes the reset of pressing plate, is simple and efficient；It is convenient that flexible plate body is fixed on the positioning additionally by setting positioning column, side Civilian dress matches flexible plate body.

Further, the pressure head is made of elastic material.

The beneficial effect of above-mentioned further scheme is: not only can accurately push down the standard soldering board of flexible plate body, but also can guarantee not Standard soldering board can be damaged by pressure.

Further, being fixed with pressure sensor in the bottom of the push rod device.

The beneficial effect of above-mentioned further scheme is: by the way that pressure sensor is arranged, being applied to for monitoring push rod device Pressure on pressing plate avoids push rod device pressure excessive, leads to pressure head to monitor the pressure that pressure head is applied on standard soldering board It damages standard soldering board by pressure, influences assembling quality.

Detailed description of the invention

Fig. 1 is the structural schematic diagram of the flexible plate body of the present invention；

Fig. 2 is the enlarged structure schematic diagram at standard soldering board of the present invention；

Fig. 3 is the structural schematic diagram of component of the present invention；

Fig. 4 is the expanded schematic diagram of flexible plate body and component in the embodiment of the present invention one；

Fig. 5 is the expanded schematic diagram of flexible plate body and component in the embodiment of the present invention two；

Fig. 6 is the structural schematic diagram of assembly system of the present invention；

In attached drawing, component names representated by each label are as follows:

1, pedestal, 2, circuit board, 21, positioning column, 3, guide rail mechanism, 4, top plate, 5, tension spring, 7, push rod device, 71, pressure Sensor, 8, pressing plate, 81, pressure head, 100, flexible plate body, 110, main via area, 111, main via hole, 120, location hole, 130, Standard soldering board region, 131 first pad groups, the 1311, first pad, the 1312, second pad, the 132, second pad group, 1321, Three pads, the 1322, the 4th pad, the 133, first connection line, the 134, second connection line, 135, third connection line, 136, 4th connection line, the 137, first via hole, the 138, second via hole, the 139, the 5th connection line, 141, test pin, 142, fixation Material layer, 200, component, the 210, first pin, 220, second pin, the 230, first expansion baseline, the 240, second expansion base Line.

Specific embodiment

The principle and features of the present invention will be described below with reference to the accompanying drawings, and the given examples are served only to explain the present invention, and It is non-to be used to limit the scope of the invention.

As shown in Figure 1, a kind of flexible board for meeting professional standard comprising flexible plate body 100, main via area 110, mark Quasi- welding disking area 130 and a pair of of location hole 120, the main via area 110 and the standard soldering board region 130 are separately positioned on The both ends of the flexibility plate body 100, a pair of location hole 120 is close to the standard soldering board region 130, and a pair of positioning Hole 120 is symmetrical along the vertical centerline of the flexible plate body 100；One group of electrical network is equipped in the main via area 110 With the electrical network main via hole 111 correspondingly for the pin of optical device for needing to make or test；In the standard soldering board area The one-to-one standard soldering board of electrical network of one group with the main via hole 111 is equipped in domain 130.

The standard soldering board includes the first pad group 131 and the second pad group 132, and the first pad group 131 includes the One pad 1311 and the second pad 1312, first pad 1311 and second pad 1312 are about the flexible plate body 100 vertical centerline is symmetrical；The second pad group 132 includes third pad 1321 and the 4th pad 1322, the third Pad 1321 and the 4th pad 1322 are symmetrical about the vertical centerline of the flexible plate body 100；First pad 1311 and the third pad 1321 it is symmetrical about the cross central line in the standard soldering board region 130, second pad 1312 and the 4th pad 1322 it is symmetrical about the cross central line in the standard soldering board region 130.

As shown in Fig. 2, test pin 141 is inserted in the standard soldering board, the test pin 141 and the standard Pad passes through fixed material layer 142 and is fixedly connected, and the test pin 141 is electrically connected with the standard soldering board.

It should be noted that standard soldering board includes the first pad 1311, the second pad 1312, third pad 1321 and the 4th Pad 1322, the standard soldering board in Fig. 2 is by taking the first pad 1311 as an example.

Scolding tin, solder or conductive adhesive can be used in the fixation material of the fixed material layer 142.

The standard soldering board region 130 further includes the first connection line 133, the first via hole 137, the second via hole 138, second Connection line 134, third connection line 135 and the 4th connection line 136, the both ends of first connection line 133 respectively with First pad 1311 is connected to first via hole 137, the both ends of the third connection line 135 respectively with the third Pad 1321 is connected to first via hole 137；The both ends of second connection line 134 respectively with second pad 1312 Be connected to second via hole 138, the both ends of the 4th connection line 136 respectively with the 4th pad 1322 and described The connection of two via holes 138.

It is symmetrical that one group of vertical centerline about the flexible plate body 100 is additionally provided in the standard soldering board region 130 5th connection line 139；5th connection line 139 described in one group respectively with the third pad 1321 and the 4th pad 1322 connections.

5th connection line 139 is for establishing the first pad group 131 and the second pad group 132 and periphery Electrical connection between circuit or electronic component.

First via hole 137 and second via hole 138 can also be blind hole.

As shown in figure 3, further including component 200, the lower section of the flexible plate body 100, institute is arranged in the component 200 The vertical centerline for stating component 200 is overlapped with the vertical centerline of the flexible plate body 100；The component 200 includes the One pin 210 and second pin 220, first pin 210 and the second pin 220 are about the perpendicular of the component 200 It is symmetrical to center line.

The component 200 is polarity device, and first pin 210 and the second pin 220 have different pole Property.

The outer profile size of the component 200 is consistent with the outer profile size in the standard soldering board region 130；Described The relative position of one pin 210 is corresponding with the position of first pad 1311 or the 4th pad 1322, and described The relative position of two pins 220 is corresponding with the position of second pad 1312 or the third pad 1321.

As shown in figure 4, embodiment one, is equipped with the first expansion baseline between the flexibility plate body 100 and the component 200 230, when the flexible plate body 100 is converted into the component 200 along the first expansion baseline 230, i.e., when first device When part 200 is soldered on the flexible plate body 100, first pin 210 is correspondingly connected with the 4th pad 1322, institute Second pin 220 is stated to be correspondingly connected with the third pad 1321；First pad 1311 and second pad 1312 are equal Vacantly, that is, stating between the first pad 1311 and second pad 1312 and the component 200 does not have electric connecting relation.

As shown in figure 5, embodiment two, is equipped with the second expansion baseline between the flexibility plate body 100 and the component 200 240, when the flexible plate body 100 is converted into the component 200 along the second expansion baseline 240, i.e., when first device When part 200 is soldered on the flexible plate body 100, first pin 210 is correspondingly connected with second pad 1312, institute Second pin 220 is stated to be correspondingly connected with first pad 1311；The third pad 1321 and the 4th pad 1322 are equal Vacantly, that is, stating between third pad 1321 and the 4th pad 1322 and the component 200 does not have electric connecting relation.

To sum up, according to the pad distribution mode in standard soldering board region 130, regardless of the polarity of component 200 when welding How, the welding of final component 200 and pad in standard soldering board region 1002 is normal, and can substantially reduce abnormal welding can It can property.

As shown in fig. 6, a kind of assembly system for the flexible board for meeting professional standard, a kind of meet professional standard for described Flexible board assembly, including pedestal 1, circuit board 2, a pair of guide rails mechanism 3, top plate 4 and pressing plate 8, the fixation of circuit board 2 sets It sets at the top of the pedestal 1, a pair of guide rail mechanism 3 is vertically symmetrically fixed on the circuit board 2, the top plate 4 are fixed at a pair of 3 top of the guide rail mechanism, and the pressing plate 8 is arranged in the lower section of the top plate 4, and the pressing plate 8 Both ends are slidably matched with a pair of guide rail mechanism 3 respectively；Push rod device 7, the push rod device 7 are equipped on the top plate 4 Bottom stretch out the top plate 4, and towards the pressing plate 8；Multiple tension springs 5, institute are symmetrically arranged in the two sides of the push rod device 7 The both ends for stating tension spring 5 are fixedly connected with the top of the bottom of the top plate 4 and the pressing plate 8 respectively；In the bottom of the pressing plate 8 Multiple pressure heads 81 are symmetrically arranged with, the lower section of the pressure head 81 is arranged in the flexibility plate body 100；It is equipped on the circuit board 2 Two and the one-to-one positioning column 21 of a pair of location hole 120.

The push rod device 7 is the controllable cylinder or electric pushrod pushed, facilitates the lifting of control push rod device 7.

The pressure head 81 is made of elastic material, not only can accurately push down the pad of flexible plate body 100, but also can guarantee and will not press Bad pad.

Pressure sensor 71 is fixed in the bottom of the push rod device 7；The pressure sensor 71 and the pressing plate 8 For on-fixed connection structure.

By the way that pressure sensor 71, the pressure being applied on pressing plate 8 for monitoring push rod device 7, to monitor pressure is arranged First 81 are applied to the pressure on pad, avoid 7 pressure of push rod device excessive, cause pressure head 81 to damage pad by pressure, influence assembling quality.

The guide rail of the guide rail mechanism 3 can avoid flexible plate body 100 and rearward, to drop far from the positioning column 21 The positioning difficulty of less flexible plate body 100.

The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.

Claims

1. a kind of flexible board for meeting professional standard, it is characterised in that: including flexible plate body (100), main via area (110), Standard soldering board region (130) and a pair of of location hole (120), the main via area (110) and the standard soldering board region (130) The both ends of the flexible plate body (100) are separately positioned on, a pair of location hole (120) is close to the standard soldering board region (130), and a pair of location hole (120) is symmetrical along the vertical centerline of the flexible plate body (100)；In the main via area It is equipped with one group of electrical network in domain (110) and is led correspondingly with the electrical network for the pin of optical device for making or testing is needed Via hole (111)；One group of one a pair of electrical network with the main via hole (111) is equipped in the standard soldering board region (130) The standard soldering board answered；It is inserted in the standard soldering board test pin (141), the test pin (141) and the standard Pad passes through fixed material layer (142) and is fixedly connected, and the test pin (141) is electrically connected with the standard soldering board.

2. a kind of flexible board for meeting professional standard according to claim 1, it is characterised in that: the standard soldering board includes the One pad group (131) and the second pad group (132), the first pad group (131) include the first pad (1311) and the second weldering Disk (1312), first pad (1311) and second pad (1312) about the flexible plate body (100) it is vertical in Heart line is symmetrical；The second pad group (132) includes third pad (1321) and the 4th pad (1322), the third pad (1321) and the 4th pad (1322) is symmetrical about the vertical centerline of the flexible plate body (100)；First pad (1311) and the third pad (1321) is symmetrical about the cross central line of the standard soldering board region (130), and described second Pad (1312) and the 4th pad (1322) are symmetrical about the cross central line of the standard soldering board region (130).

3. a kind of flexible board for meeting professional standard according to claim 2, it is characterised in that: the standard soldering board region It (130) further include the first connection line (133), the first via hole (137), the second via hole (138), the second connection line (134), Three connection lines (135) and the 4th connection line (136), the both ends of first connection line (133) are respectively with described first Pad (1311) is connected to first via hole (137), and the both ends of the third connection line (135) are welded with the third respectively Disk (1321) is connected to first via hole (137)；The both ends of second connection line (134) respectively with second pad (1312) be connected to second via hole (138), the both ends of the 4th connection line (136) respectively with the 4th pad (1322) it is connected to second via hole (138).

4. a kind of flexible board for meeting professional standard according to claim 3, it is characterised in that: the standard soldering board region (130) one group of symmetrical 5th connection line (139) of vertical centerline about the flexible plate body (100) is additionally provided in；One Group the 5th connection line (139) is connected to the third pad (1321) and the 4th pad (1322) respectively.

5. a kind of flexible board for meeting professional standard according to claim 3, it is characterised in that: it further include component (200), Component (200) setting is in the lower section of the flexible plate body (100), the vertical centerline of the component (200) and institute The vertical centerline for stating flexible plate body (100) is overlapped；The component (200) includes the first pin (210) and second pin (220), the vertical centerline pair of first pin (210) and the second pin (220) about the component (200) Claim.

6. a kind of flexible board for meeting professional standard according to claim 5, it is characterised in that: the component (200) Outer profile size is consistent with the outer profile size of the standard soldering board region (130)；The relative position of first pin (210) It is corresponding with the position of first pad (1311) or the 4th pad (1322), the phase of the second pin (220) It is corresponding with the position of second pad (1312) or the third pad (1321) to position.

7. a kind of assembly system for the flexible board for meeting professional standard, it is characterised in that: any described for claim 1 to 6 A kind of assembly for the flexible board meeting professional standard, including pedestal (1), circuit board (2), a pair of guide rails mechanism (3), top plate (4) With pressing plate (8), the circuit board (2) is fixed at the top of the pedestal (1), and a pair of guide rail mechanism (3) is vertical right Title is fixed on the circuit board (2), and the top plate (4) is fixed at the top of a pair of guide rail mechanism (3), described Pressing plate (8) setting is in the lower section of the top plate (4), and the both ends of the pressing plate (8) are sliding with a pair of guide rail mechanism (3) respectively Dynamic cooperation；Push rod device (7) are equipped on the top plate (4), the top plate (4) is stretched out in the bottom of the push rod device (7), and Towards the pressing plate (8)；It is symmetrically arranged with multiple tension springs (5) in the two sides of the push rod device (7), the both ends of the tension spring (5) It is fixedly connected respectively at the top of the bottom of the top plate (4) and the pressing plate (8)；It is set in the bottom symmetrical of the pressing plate (8) Have multiple pressure heads (81), the flexibility plate body (100) is arranged in the lower section of the pressure head (81)；It is set on the circuit board (2) There are two with the one-to-one positioning column (21) of a pair of location hole (120).

8. a kind of assembly system according to claim 7, it is characterised in that: the pressure head (81) is made of elastic material.

9. a kind of assembly system according to claim 7, it is characterised in that: in the bottom of the push rod device (7), fixation is set There are pressure sensor (71).