CN109068480A - A kind of flexible board and its assembly system - Google Patents
A kind of flexible board and its assembly system Download PDFInfo
- Publication number
- CN109068480A CN109068480A CN201810972873.7A CN201810972873A CN109068480A CN 109068480 A CN109068480 A CN 109068480A CN 201810972873 A CN201810972873 A CN 201810972873A CN 109068480 A CN109068480 A CN 109068480A
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- Prior art keywords
- pad
- plate body
- flexible
- standard soldering
- pair
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
Abstract
The present invention relates to a kind of flexible board and its assembly systems, including flexible plate body, main via area, standard soldering board region and a pair of of location hole, main via area and standard soldering board region are separately positioned on the both ends of flexible plate body, a pair of of location hole is close to standard soldering board region, and a pair of of location hole is symmetrical along the vertical centerline of flexible plate body；It is equipped with one group of electrical network in main via area and needs the electrical network of the photoelectric device of production or test or the pin of module main via hole correspondingly；The electrical network that one group and main via hole are equipped in standard soldering board region corresponds, and meets standard soldering board as defined in professional standard.The beneficial effects of the present invention are: it is full symmetric to can effectively avoid outer dimension, and pin is abnormal caused by amesiality component welding and assembling, though pad is intensive, it is not easy the case where flexible plate body connects bad docking or even dislocation press-fitting with the pad of test circuit board occur.
Description
Technical field
The present invention relates to photoelectric communication equipment technical field more particularly to a kind of flexible board and its assembly systems.
Background technique
Currently, in rigid printed circuit board (Printed Circuit Bo100rd, PCB), flexible circuit board
During (Flexible Printed Circuit, FPC) or the manufacturing of Rigid Flex, needs to carry out configuration and set
Meter and component (such as resistance, capacitor, integrated circuit) layout designs, and then according to preset path progress wiring and pre-
If position forms pad, so that component is welded to corresponding default pad subsequently through the mode of surface mount or welding
On.For being applicable in the component of surface mounting technology (Surf100ce Mount Technology, SMT) encapsulation, can generally lead to
It crosses SMT placement equipment and is automatically performed attachment, and it is usually necessary to use the modes of human weld to be soldered to electricity for biggish component
On the plate of road.However, and pin full symmetric for outer dimension is first device of amesiality (i.e. pin and non-centrosymmetry)
For part, in human weld or assembly, after component is rotated 180 degree relative to correct welding position, pin is inevitable
Deviate with pad preset on circuit board, leads to not complete welding.And if by where component towards default pad
Positional shift certain distance, although component's feet can be aligned with default pad, entire component is in circuit board
On position have deviated from correct welding position, may cause periphery be the preset pad of other components be blocked or cover
Lid, so that the welding of other components is influenced, once and many components are that there is polar welding exception occur, loss will
It is huge.Therefore, how to prevent outer dimension full symmetric, but pin is amesiality rather than centrosymmetric larger
Component lead to positional shift because rotating 180 degree in the welding process, and then influence other component normal welds of periphery,
The problem of being urgent need to resolve in pad structure of circuit board design.
Summary of the invention
The technical problem to be solved by the present invention is in view of the drawbacks of the prior art, provide a kind of flexible board and its assembly system
System.
The technical scheme to solve the above technical problems is that
According to one aspect of the present invention, a kind of flexible board, including flexible plate body, main via area, standard soldering board are provided
Region and a pair of of location hole, the main via area and the standard soldering board region are separately positioned on the two of the flexible plate body
End, a pair of location hole close to the standard soldering board region, and a pair of location hole along the flexible plate body it is vertical in
Heart line is symmetrical；The electricity of one group of electrical network and the pin of optical device for needing to make or test is equipped in the main via area
Gas network main via hole correspondingly；One group is equipped in the standard soldering board region with the electrical network of the main via hole one by one
Corresponding standard soldering board.
The beneficial effects of the present invention are: it is full symmetric to can effectively avoid outer dimension, and pin is amesiality (draws
Foot and non-centrosymmetry) the welding of polarity component and assembling caused by it is abnormal, changed by the pad structure to flexible board
Into being not easy to occur flexible plate body and test the pad of circuit board connect docking bad or even misplace and be press-fitted though pad is intensive
The case where.
Based on the above technical solution, the present invention can also be improved as follows.
Further, the standard soldering board includes the first pad group and the second pad group, the first pad group includes first
Pad and the second pad, first pad and second pad are symmetrical about the vertical centerline of the flexible plate body；Institute
Stating the second pad group includes third pad and the 4th pad, and the third pad and the 4th pad are about the flexible plate body
Vertical centerline it is symmetrical；The cross central line pair of first pad and the third pad about the standard soldering board region
Claim, second pad and the 4th pad are symmetrical about the cross central line in the standard soldering board region.
The beneficial effect of above-mentioned further scheme is: the flexible symmetrical standard soldering board layout setting of plate body can effectively be prevented
Only component causes welding position to deviate because rotating 180 degree in the welding process, to avoid to other components of periphery
Normal weld has an impact, and then promotes the assembling and welding efficiency of component.
Further, the standard soldering board region further includes the first connection line, the first via hole, the second via hole, the second connection
Route, third connection line and the 4th connection line, the both ends of first connection line respectively with first pad and institute
The connection of the first via hole is stated, the both ends of the third connection line are connected to the third pad and first via hole respectively；Institute
The both ends for stating the second connection line are connected to second pad and second via hole respectively, and the two of the 4th connection line
End is connected to the 4th pad and second via hole respectively.
The beneficial effect of above-mentioned further scheme is: passing through the first connection line of setting, the first via hole, the second via hole, the
Two connection lines, third connection line and the 4th connection line, both facilitate connection the first pad and third pad, the second pad and
4th pad, moreover it is possible to which electric connecting relation is conducting to the flexible plate body back side or other layers.
Further, it is symmetrical to be additionally provided with one group of vertical centerline about the flexible plate body in the standard soldering board region
5th connection line；5th connection line described in one group is connected to the third pad and the 4th pad respectively.
The beneficial effect of above-mentioned further scheme is: facilitating connection third pad and the 4th pad.
Further, further including component, the lower section of the flexible plate body is arranged in the component, and the component erects
It is overlapped to center line with the vertical centerline of the flexible plate body；The component includes the first pin and second pin, described
First pin and the second pin are symmetrical about the vertical centerline of the component.
Further, the outer profile size of the component is consistent with the outer profile size in the standard soldering board region；It is described
The relative position of first pin is corresponding with the position of first pad or the 4th pad, the phase of the second pin
It is corresponding with the position of second pad or the third pad to position.
The beneficial effect of above-mentioned further scheme is: regardless of the direction of component when welding, final component
It is normal with the welding of standard soldering board, a possibility that abnormal welding can be substantially reduced.
According to another aspect of the invention, a kind of assembly system of flexible board is provided, for a kind of flexible board
Assembly, including pedestal, circuit board, a pair of guide rails mechanism, top plate and pressing plate, the circuit board are fixed at the top of the pedestal
Portion, a pair of guide rail mechanism are vertically symmetrically fixed on the circuit board, and the top plate is fixed at described in a pair
At the top of guide rail mechanism, the pressing plate is arranged in the lower section of the top plate, and the both ends of the pressing plate respectively with a pair of guide rail
Mechanism slips cooperation；It is equipped with push rod device on the top plate, the top plate is stretched out in the bottom of the push rod device, and towards institute
State pressing plate；Multiple tension springs are symmetrically arranged in the two sides of the push rod device, the both ends of the tension spring bottom with the top plate respectively
It is fixedly connected at the top of portion and the pressing plate；Multiple pressure heads, the flexibility plate body setting are equipped in the bottom symmetrical of the pressing plate
In the lower section of the pressure head；Set on the circuit board there are two with a pair of one-to-one positioning column of location hole.
The beneficial effects of the present invention are: the pad of flexible plate body is correspondingly arranged at below pressure head, positioning is fixed, using pushing away
Lever apparatus pushes pressing plate, to make pressure head move down and push down the standard soldering board of flexible plate body, carries out subsequent assembly to facilitate；
Tension spring between top plate and pressing plate can play the role of buffering, when push rod device pushes, reduce pressure head to pad
Impact, protective standard pad, moreover it is possible to play the role of resetting pressing plate, after completing the assembly of flexible plate body and circuit board, pass through
Tension spring realizes the reset of pressing plate, is simple and efficient；It is convenient that flexible plate body is fixed on the positioning additionally by setting positioning column, side
Civilian dress matches flexible plate body.
Based on the above technical solution, the present invention can also be improved as follows.
Further, the pressure head is made of elastic material.
The beneficial effect of above-mentioned further scheme is: not only can accurately push down the standard soldering board of flexible plate body, but also can guarantee not
Standard soldering board can be damaged by pressure.
Further, being fixed with pressure sensor in the bottom of the push rod device.
The beneficial effect of above-mentioned further scheme is: by the way that pressure sensor is arranged, being applied to for monitoring push rod device
Pressure on pressing plate avoids push rod device pressure excessive, leads to pressure head to monitor the pressure that pressure head is applied on standard soldering board
It damages standard soldering board by pressure, influences assembling quality.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the flexible plate body of the present invention；
Fig. 2 is the structural schematic diagram of component of the present invention；
Fig. 3 is the expanded schematic diagram of flexible plate body and component in the embodiment of the present invention one；
Fig. 4 is the expanded schematic diagram of flexible plate body and component in the embodiment of the present invention two；
Fig. 5 is the structural schematic diagram of assembly system of the present invention；
In attached drawing, component names representated by each label are as follows:
1, pedestal, 2, circuit board, 21, positioning column, 3, guide rail mechanism, 4, top plate, 5, tension spring, 7, push rod device, 71, pressure
Sensor, 8, pressing plate, 81, pressure head, 100, flexible plate body, 110, main via area, 111, main via hole, 120, location hole, 130,
Standard soldering board region, 131 first pad groups, the 1311, first pad, the 1312, second pad, the 132, second pad group, 1321,
Three pads, the 1322, the 4th pad, the 133, first connection line, the 134, second connection line, 135, third connection line, 136,
4th connection line, the 137, first via hole, the 138, second via hole, the 139, the 5th connection line, 200, component, 210, first draws
Foot, 220, second pin, the 230, first expansion baseline, the 240, second expansion baseline.
Specific embodiment
The principle and features of the present invention will be described below with reference to the accompanying drawings, and the given examples are served only to explain the present invention, and
It is non-to be used to limit the scope of the invention.
As shown in Figure 1, a kind of flexible board comprising flexible plate body 100, main via area 110, standard soldering board region 130
With a pair of of location hole 120, the main via area 110 and the standard soldering board region 130 are separately positioned on the flexible plate body
100 both ends, a pair of location hole 120 is close to the standard soldering board region 130, and a pair of location hole 120 is along described
The vertical centerline of flexible plate body 100 is symmetrical；One group of electrical network is equipped in the main via area 110 and need to make or
The electrical network main via hole 111 correspondingly of the pin of optical device of person's test；One is equipped in the standard soldering board region 130
The one-to-one standard soldering board of electrical network of group and the main via hole 111.
The standard soldering board includes the first pad group 131 and the second pad group 132, and the first pad group 131 includes the
One pad 1311 and the second pad 1312, first pad 1311 and second pad 1312 are about the flexible plate body
100 vertical centerline is symmetrical；The second pad group 132 includes third pad 1321 and the 4th pad 1322, the third
Pad 1321 and the 4th pad 1322 are symmetrical about the vertical centerline of the flexible plate body 100；First pad
1311 and the third pad 1321 it is symmetrical about the cross central line in the standard soldering board region 130, second pad
1312 and the 4th pad 1322 it is symmetrical about the cross central line in the standard soldering board region 130.
The standard soldering board region 130 further includes the first connection line 133, the first via hole 137, the second via hole 138, second
Connection line 134, third connection line 135 and the 4th connection line 136, the both ends of first connection line 133 respectively with
First pad 1311 is connected to first via hole 137, the both ends of the third connection line 135 respectively with the third
Pad 1321 is connected to first via hole 137；The both ends of second connection line 134 respectively with second pad 1312
Be connected to second via hole 138, the both ends of the 4th connection line 136 respectively with the 4th pad 1322 and described
The connection of two via holes 138.
It is symmetrical that one group of vertical centerline about the flexible plate body 100 is additionally provided in the standard soldering board region 130
5th connection line 139；5th connection line 139 described in one group respectively with the third pad 1321 and the 4th pad
1322 connections.
5th connection line 139 is for establishing the first pad group 131 and the second pad group 132 and periphery
Electrical connection between circuit or electronic component.
First via hole 137 and second via hole 138 can also be blind hole.
As shown in Fig. 2, further including component 200, the lower section of the flexible plate body 100, institute is arranged in the component 200
The vertical centerline for stating component 200 is overlapped with the vertical centerline of the flexible plate body 100；The component 200 includes the
One pin 210 and second pin 220, first pin 210 and the second pin 220 are about the perpendicular of the component 200
It is symmetrical to center line.
The component 200 is polarity device, and first pin 210 and the second pin 220 have different pole
Property.
The outer profile size of the component 200 is consistent with the outer profile size in the standard soldering board region 130；Described
The relative position of one pin 210 is corresponding with the position of first pad 1311 or the 4th pad 1322, and described
The relative position of two pins 220 is corresponding with the position of second pad 1312 or the third pad 1321.
As shown in figure 3, embodiment one, is equipped with the first expansion baseline between the flexibility plate body 100 and the component 200
230, when the flexible plate body 100 is converted into the component 200 along the first expansion baseline 230, i.e., when first device
When part 200 is soldered on the flexible plate body 100, first pin 210 is correspondingly connected with the 4th pad 1322, institute
Second pin 220 is stated to be correspondingly connected with the third pad 1321；First pad 1311 and second pad 1312 are equal
Vacantly, that is, stating between the first pad 1311 and second pad 1312 and the component 200 does not have electric connecting relation.
As shown in figure 4, embodiment two, is equipped with the second expansion baseline between the flexibility plate body 100 and the component 200
240, when the flexible plate body 100 is converted into the component 200 along the second expansion baseline 240, i.e., when first device
When part 200 is soldered on the flexible plate body 100, first pin 210 is correspondingly connected with second pad 1312, institute
Second pin 220 is stated to be correspondingly connected with first pad 1311；The third pad 1321 and the 4th pad 1322 are equal
Vacantly, that is, stating between third pad 1321 and the 4th pad 1322 and the component 200 does not have electric connecting relation.
To sum up, according to the pad distribution mode in standard soldering board region 130, regardless of the polarity of component 200 when welding
How, the welding of final component 200 and pad in standard soldering board region 1002 is normal, and can substantially reduce abnormal welding can
It can property.
As shown in figure 5, a kind of assembly system of flexible board, for a kind of assembly of flexible board, including pedestal 1, electricity
Road plate 2, a pair of guide rails mechanism 3, top plate 4 and pressing plate 8, the circuit board 2 are fixed at the top of the pedestal 1, Yi Duisuo
It states guide rail mechanism 3 to be vertically symmetrically fixed on the circuit board 2, the top plate 4 is fixed at a pair of guide rail machine
The top of structure 3, the pressing plate 8 are arranged in the lower section of the top plate 4, and the both ends of the pressing plate 8 respectively with a pair of guide rail machine
Structure 3 is slidably matched；Push rod device 7 is equipped on the top plate 4, the top plate 4, and court are stretched out in the bottom of the push rod device 7
To the pressing plate 8；Be symmetrically arranged with multiple tension springs 5 in the two sides of the push rod device 7, the both ends of the tension spring 5 respectively with it is described
The bottom of top plate 4 is fixedly connected with the top of the pressing plate 8；Multiple pressure heads 81 are equipped in the bottom symmetrical of the pressing plate 8, it is described
The lower section of the pressure head 81 is arranged in flexible plate body 100；Set on the circuit board 2 there are two with a pair of location hole 120
One-to-one positioning column 21.
The push rod device 7 is the controllable cylinder or electric pushrod pushed, facilitates the lifting of control push rod device 7.
The pressure head 81 is made of elastic material, not only can accurately push down the pad of flexible plate body 100, but also can guarantee and will not press
Bad pad.
Pressure sensor 71 is fixed in the bottom of the push rod device 7；The pressure sensor 71 and the pressing plate 8
For on-fixed connection structure.
By the way that pressure sensor 71, the pressure being applied on pressing plate 8 for monitoring push rod device 7, to monitor pressure is arranged
First 81 are applied to the pressure on pad, avoid 7 pressure of push rod device excessive, cause pressure head 81 to damage pad by pressure, influence assembling quality.
The guide rail of the guide rail mechanism 3 can avoid flexible plate body 100 and rearward, to drop far from the positioning column 21
The positioning difficulty of less flexible plate body 100.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (9)
1. a kind of flexible board, it is characterised in that: including flexible plate body (100), main via area (110), standard soldering board region
(130) and a pair of of location hole (120), the main via area (110) and the standard soldering board region (130) are separately positioned on institute
State the both ends of flexible plate body (100), a pair of location hole (120) is close to the standard soldering board region (130), and described in a pair
Location hole (120) is symmetrical along the vertical centerline of the flexible plate body (100)；One is equipped in the main via area (110)
The electrical network main via hole (111) correspondingly of group electrical network and the pin of optical device for needing to make or test；Institute
State the one-to-one standard soldering board of electrical network that one group with the main via hole (111) are equipped in standard soldering board region (130).
2. a kind of flexible board according to claim 1, it is characterised in that: the standard soldering board includes the first pad group (131)
With the second pad group (132), the first pad group (131) includes the first pad (1311) and the second pad (1312), described
First pad (1311) and second pad (1312) are symmetrical about the vertical centerline of the flexible plate body (100)；It is described
Second pad group (132) includes third pad (1321) and the 4th pad (1322), the third pad (1321) and described
Four pads (1322) are symmetrical about the vertical centerline of the flexible plate body (100)；First pad (1311) and described
Three pads (1321) are symmetrical about the cross central line of the standard soldering board region (130), second pad (1312) and institute
The cross central line that the 4th pad (1322) is stated about the standard soldering board region (130) is symmetrical.
3. a kind of flexible board according to claim 2, it is characterised in that: the standard soldering board region (130) further includes first
Connection line (133), the first via hole (137), the second via hole (138), the second connection line (134), third connection line (135)
With the 4th connection line (136), the both ends of first connection line (133) respectively with first pad (1311) and described
First via hole (137) connection, the both ends of the third connection line (135) respectively with the third pad (1321) and described the
One via hole (137) connection；The both ends of second connection line (134) respectively with second pad (1312) and described second
Via hole (138) connection, the both ends of the 4th connection line (136) respectively with the 4th pad (1322) and second mistake
Hole (138) connection.
4. a kind of flexible board according to claim 3, it is characterised in that: be additionally provided with one in the standard soldering board region (130)
Vertical centerline symmetrical fiveth connection line (139) of the group about the flexible plate body (100)；5th connecting line described in one group
Road (139) is connected to the third pad (1321) and the 4th pad (1322) respectively.
5. a kind of flexible board according to claim 3, it is characterised in that: further include component (200), the component
(200) it is arranged in the lower section of the flexible plate body (100), the vertical centerline of the component (200) and the flexible plate body
(100) vertical centerline is overlapped；The component (200) includes the first pin (210) and second pin (220), and described the
One pin (210) and the second pin (220) are symmetrical about the vertical centerline of the component (200).
6. a kind of flexible board according to claim 5, it is characterised in that: the outer profile size of the component (200) and institute
The outer profile size for stating standard soldering board region (130) is consistent；The relative position of first pin (210) and first pad
(1311) or the position of the 4th pad (1322) is corresponding, the relative position of the second pin (220) and described the
The position of two pads (1312) or the third pad (1321) is corresponding.
7. a kind of assembly system of flexible board, it is characterised in that: for a kind of any dress of flexible board of claim 1 to 6
Match, including pedestal (1), circuit board (2), a pair of guide rails mechanism (3), top plate (4) and pressing plate (8), circuit board (2) fixation is set
The top in the pedestal (1) is set, a pair of guide rail mechanism (3) is vertically symmetrically fixed on the circuit board (2), institute
It states top plate (4) to be fixed at the top of a pair of guide rail mechanism (3), the pressing plate (8) is arranged under the top plate (4)
Side, and the both ends of the pressing plate (8) are slidably matched with a pair of guide rail mechanism (3) respectively；It is equipped with and pushes away on the top plate (4)
The top plate (4) is stretched out in lever apparatus (7), the bottom of the push rod device (7), and towards the pressing plate (8)；It is filled in the push rod
The two sides for setting (7) are symmetrically arranged with multiple tension springs (5), the both ends of the tension spring (5) respectively with the bottom of the top plate (4) and described
Pressing plate is fixedly connected at the top of (8)；Multiple pressure heads (81) are equipped in the bottom symmetrical of the pressing plate (8), the flexibility plate body
(100) it is arranged in the lower section of the pressure head (81)；Set on the circuit board (2) there are two with a pair of location hole (120)
One-to-one positioning column (21).
8. a kind of assembly system according to claim 7, it is characterised in that: the pressure head (81) is made of elastic material.
9. a kind of assembly system according to claim 7, it is characterised in that: in the bottom of the push rod device (7), fixation is set
There are pressure sensor (71).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810972873.7A CN109068480A (en) | 2018-08-24 | 2018-08-24 | A kind of flexible board and its assembly system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810972873.7A CN109068480A (en) | 2018-08-24 | 2018-08-24 | A kind of flexible board and its assembly system |
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| Publication Number | Publication Date |
|---|---|
| CN109068480A true CN109068480A (en) | 2018-12-21 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810972873.7A Withdrawn CN109068480A (en) | 2018-08-24 | 2018-08-24 | A kind of flexible board and its assembly system |
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| CN (1) | CN109068480A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109655469A (en) * | 2018-12-27 | 2019-04-19 | 深圳市燕麦科技股份有限公司 | A kind of the docking test device and its docking test method of flexible circuit board |
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| CN105430898A (en) * | 2015-12-29 | 2016-03-23 | 广东欧珀移动通信有限公司 | Pad structure, circuit board and mobile terminal using pad structure |
| CN206260139U (en) * | 2016-12-26 | 2017-06-16 | 信利光电股份有限公司 | A kind of pcb board |
| CN207475974U (en) * | 2017-11-24 | 2018-06-08 | 华显光电技术（惠州）有限公司 | Circuit board and electronic equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109655469A (en) * | 2018-12-27 | 2019-04-19 | 深圳市燕麦科技股份有限公司 | A kind of the docking test device and its docking test method of flexible circuit board |
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Application publication date: 20181221 |