CN109194804A - A kind of phone housing convenient for heat dissipation - Google Patents
A kind of phone housing convenient for heat dissipation Download PDFInfo
- Publication number
- CN109194804A CN109194804A CN201811119703.0A CN201811119703A CN109194804A CN 109194804 A CN109194804 A CN 109194804A CN 201811119703 A CN201811119703 A CN 201811119703A CN 109194804 A CN109194804 A CN 109194804A
- Authority
- CN
- China
- Prior art keywords
- mobile phone
- backboard
- main body
- shell main
- cooling chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The invention discloses a kind of phone housings convenient for heat dissipation, including mobile phone shell main body, mobile phone shell main body includes backboard and encloses the frame set on backboard surrounding, frame connect the cavity to form accommodating mobile phone with backboard, the front of backboard offers radiating groove, the inside of radiating groove is fitted with heat conductive graphite piece, the upper surface of heat conductive graphite piece is fitted with copper foil, mobile phone shell main body further includes liquid cooling chamber, liquid cooling chamber is located at the back of mobile phone shell main body, coolant liquid, the back side connection of liquid cooling chamber and backboard are sealed in liquid cooling chamber.Phone housing of the invention, the phone housing offers radiating groove in the front of backboard, heat conductive graphite piece is fitted in the inside of radiating groove, copper foil is fitted in the upper surface of heat conductive graphite piece, heat conductive graphite piece and copper foil have high-termal conductivity, can reduce the temperature of mobile phone shell main body efficiently by the heat derives at mobile phone back, user will not feel obvious hot when holding mobile phone for a long time, improve the usage experience of user.
Description
Technical field
The present invention relates to electronic product accessories technical fields, and in particular to a kind of phone housing convenient for heat dissipation.
Background technique
Present mobile phone price is more and more expensive, and the function of mobile phone is also more and more, therewith it is increased be mobile phone components,
But consumer also pursues more and more thinner mobile phone now, due to the increase of functional parts, interior of mobile phone part is more compact,
The heat dissipation performance of mobile phone is affected, temperature is excessively high to will affect the fluency and service life that mobile phone itself is run.
Existing protective casing of cell phone is set in mobile phone in phone housing, and the heat for reducing mobile phone and outside air is handed over
It changes, is less useful for the heat dissipation of mobile phone itself, it is therefore desirable to is a kind of to accelerate the radiating shell that mobile phone cools down to solve the above problems.
Summary of the invention
To be solved by this invention is that the mobile phone shell heat dissipation performance that existing mobile phone uses is poor, and temperature is excessively high to will affect mobile phone sheet
The technical issues of fluency and service life of body operation, is, and it is an object of the present invention to provide a kind of phone housing convenient for heat dissipation.
The present invention is achieved through the following technical solutions:
A kind of phone housing convenient for heat dissipation, including mobile phone shell main body, the mobile phone shell main body include that backboard and enclosing is set to
The frame of backboard surrounding, the frame connect the cavity to form accommodating mobile phone with backboard, and the front of backboard offers radiating groove, institute
The inside for stating radiating groove is fitted with heat conductive graphite piece, and the upper surface of the heat conductive graphite piece is fitted with copper foil, the heat conductive graphite
The sum of the thickness of piece and copper foil is identical as the depth of radiating groove, and the mobile phone shell main body further includes liquid cooling chamber, the liquid
Body cooling chamber is located at the back of mobile phone shell main body, and coolant liquid, the liquid cooling chamber are sealed in liquid cooling chamber
It is connect with the back side of backboard.
Preferred embodiment, the liquid cooling chamber are equipped with blow vent and fluid-through port, and the blow vent and fluid-through port are equipped with
Seal cock body.
Preferred embodiment, the coolant liquid are glycol-cooled liquid.
The side wall corner of preferred embodiment, the mobile phone shell main body is fixedly connected with corner protective pad.
Preferred embodiment, the backboard of the mobile phone shell main body, frame, liquid cooling chamber are that plastics flexible glue is integrally formed knot
Structure.
The junction of preferred embodiment, two adjacent frames is equipped with baffle, and the baffle extends into cavity, baffle
It is parallel with backboard.
Preferred embodiment, plastics flexible glue are silica gel.
Compared with prior art, the present invention having the following advantages and benefits: of the invention a kind of convenient for heat dissipation
Phone housing, the phone housing offer radiating groove in the front of backboard, are fitted with heat conductive graphite piece in the inside of radiating groove,
The upper surface of heat conductive graphite piece is fitted with copper foil, and heat conductive graphite piece and copper foil have high-termal conductivity, can be efficiently by cell phone back
The heat derives in portion.It is provided with liquid cooling chamber at the back of mobile phone shell main body simultaneously, is sealed in the liquid cooling chamber
Coolant liquid is absorbed by the indoor coolant liquid of liquid cooling chamber in the heat that heat conductive graphite piece and copper foil heat pass out, reduces hand
The temperature of chassis body, user will not feel obvious hot, improve the usage experience of user when holding mobile phone for a long time.
Detailed description of the invention
Attached drawing described herein is used to provide to further understand the embodiment of the present invention, constitutes one of the application
Point, do not constitute the restriction to the embodiment of the present invention.In the accompanying drawings:
Fig. 1 is structural front view of the invention;
Fig. 2 is A-A sectional view in Fig. 1.
Label and corresponding parts title in attached drawing:
1- backboard, 2- frame, 3- radiating groove, 4- liquid cooling chamber, 5- fluid-through port, 6- blow vent, the corner 7- protective pad,
8- baffle.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer, below with reference to embodiment and attached drawing, to this
Invention is described in further detail, and exemplary embodiment of the invention and its explanation for explaining only the invention, are not made
For limitation of the invention.
Embodiment
As depicted in figs. 1 and 2, a kind of phone housing convenient for heat dissipation of the present invention, including mobile phone shell main body, mobile phone shell main body
Including backboard 1 and the frame 2 set on 1 surrounding of backboard is enclosed, frame 2 connect the cavity for forming accommodating mobile phone with backboard 1.In backboard 1
Front offer radiating groove 3, be fitted with heat conductive graphite piece in the inside of radiating groove 3, the upper surface of heat conductive graphite piece is fitted with
The sum of the thickness of copper foil, heat conductive graphite piece and copper foil is identical as the depth of radiating groove 3, and heat conductive graphite piece and copper foil have high thermal conductivity
Property, it can be efficiently by the heat derives at mobile phone back.Mobile phone shell main body further includes liquid cooling chamber 4, liquid cooling chamber 4
Positioned at the back of mobile phone shell main body, coolant liquid is sealed in liquid cooling chamber 4, coolant liquid is glycol-cooled liquid, liquid
Cooling chamber 4 connect with the back side of backboard 1.Liquid cooling chamber 4 is equipped with blow vent 6 and fluid-through port 5, blow vent 6 and logical liquid
Mouth 5 is equipped with sealing cock body.
Preferred embodiment scheme, the side wall corner of mobile phone shell main body are fixedly connected with corner protective pad 7, corner protective pad 7
The structural strength of mobile phone shell main body is improved, the wearability of mobile phone shell main body is improved, improves the service life of mobile phone shell main body.
Preferred embodiment scheme, the backboard 1 of the mobile phone shell main body, frame 2, liquid cooling chamber 4 be silica gel one at
Type structure.The mobile phone shell main body of silica gel material can high temperature resistant, arrogate to oneself that anti-marquis's property, insulating properties be good, stable material quality.And it can absorb
It collides with and mobile phone bring is impacted, to mitigate the damage to mobile phone.
The junction of preferred embodiment scheme, two adjacent frames 2 is equipped with baffle 8, and baffle 8 extends into cavity, keeps off
Piece 8 is parallel with backboard 1, and baffle 8 is for preventing mobile phone from deviating from out of mobile phone shell main body cavity.
Above-described specific embodiment has carried out further the purpose of the present invention, technical scheme and beneficial effects
It is described in detail, it should be understood that being not intended to limit the present invention the foregoing is merely a specific embodiment of the invention
Protection scope, all within the spirits and principles of the present invention, any modification, equivalent substitution, improvement and etc. done should all include
Within protection scope of the present invention.
Claims (7)
1. a kind of phone housing convenient for heat dissipation, including mobile phone shell main body, which is characterized in that the mobile phone shell main body includes backboard
With enclose the frame set on backboard surrounding, the frame connect the cavity to be formed and accommodate mobile phone with backboard, and the front of backboard offers
Radiating groove, the inside of the radiating groove are fitted with heat conductive graphite piece, and the upper surface of the heat conductive graphite piece is fitted with copper foil, described
The sum of the thickness of heat conductive graphite piece and copper foil is identical as the depth of radiating groove, and the mobile phone shell main body further includes liquid cooling chamber
Room, the liquid cooling chamber are located at the back of mobile phone shell main body, and coolant liquid, the liquid are sealed in liquid cooling chamber
The connection of the back side of cooling chamber and backboard.
2. a kind of phone housing convenient for heat dissipation according to claim 1, which is characterized in that in the liquid cooling chamber
Equipped with blow vent and fluid-through port, the blow vent and fluid-through port are equipped with sealing cock body.
3. a kind of phone housing convenient for heat dissipation according to claim 1, which is characterized in that the coolant liquid is ethylene glycol
Coolant liquid.
4. a kind of phone housing convenient for heat dissipation according to claim 1, which is characterized in that the side of the mobile phone shell main body
Wall corner is fixedly connected with corner protective pad.
5. a kind of phone housing convenient for heat dissipation according to claim 1, which is characterized in that the backboard of mobile phone shell main body,
Frame, liquid cooling chamber are plastics flexible glue integrated formed structure.
6. a kind of phone housing convenient for heat dissipation according to claim 1, which is characterized in that the company of two adjacent frames
It meets place and is equipped with baffle, the baffle extends into cavity, and baffle is parallel with backboard.
7. a kind of phone housing convenient for heat dissipation according to claim 5, which is characterized in that the plastics flexible glue is silicon
Glue.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811119703.0A CN109194804A (en) | 2018-09-25 | 2018-09-25 | A kind of phone housing convenient for heat dissipation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811119703.0A CN109194804A (en) | 2018-09-25 | 2018-09-25 | A kind of phone housing convenient for heat dissipation |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109194804A true CN109194804A (en) | 2019-01-11 |
Family
ID=64909847
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811119703.0A Withdrawn CN109194804A (en) | 2018-09-25 | 2018-09-25 | A kind of phone housing convenient for heat dissipation |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109194804A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111416900A (en) * | 2020-03-10 | 2020-07-14 | 欧阳杰 | Physical cooling mobile phone shell |
CN112154374A (en) * | 2019-11-25 | 2020-12-29 | 深圳市大疆创新科技有限公司 | Camera heat dissipation shell, camera heat dissipation accessory and camera |
CN112437572A (en) * | 2020-11-30 | 2021-03-02 | 华为技术有限公司 | Power adapter |
CN113543612A (en) * | 2021-09-15 | 2021-10-22 | 南昌龙旗信息技术有限公司 | Mobile phone heat dissipation device |
-
2018
- 2018-09-25 CN CN201811119703.0A patent/CN109194804A/en not_active Withdrawn
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112154374A (en) * | 2019-11-25 | 2020-12-29 | 深圳市大疆创新科技有限公司 | Camera heat dissipation shell, camera heat dissipation accessory and camera |
WO2021102630A1 (en) * | 2019-11-25 | 2021-06-03 | 深圳市大疆创新科技有限公司 | Camera heat dissipation case, camera heat dissipation accessory and camera |
CN111416900A (en) * | 2020-03-10 | 2020-07-14 | 欧阳杰 | Physical cooling mobile phone shell |
CN112437572A (en) * | 2020-11-30 | 2021-03-02 | 华为技术有限公司 | Power adapter |
CN113543612A (en) * | 2021-09-15 | 2021-10-22 | 南昌龙旗信息技术有限公司 | Mobile phone heat dissipation device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190111 |
|
WW01 | Invention patent application withdrawn after publication |