CN109194041B

CN109194041B - Hall integrated circuit mounting structure

Info

Publication number: CN109194041B
Application number: CN201811269063.1A
Authority: CN
Inventors: 李丹; 赵强; 薛凯
Original assignee: Shaanxi Aero Electric Co Ltd
Current assignee: Shaanxi Aero Electric Co Ltd
Priority date: 2018-10-29
Filing date: 2018-10-29
Publication date: 2021-04-16
Anticipated expiration: 2038-10-29
Also published as: CN109194041A

Abstract

The application provides a hall integrated circuit subassembly mounting structure, hall integrated circuit subassembly includes a plurality of hall integrated circuit modules, and mounting structure includes: the Hall integrated circuit assembly comprises an end cover provided with a center hole and an annular baffle fixedly connected with the end cover, wherein the end cover is positioned in an area defined by the annular baffle and is provided with a mounting groove of the Hall integrated circuit module, so that the Hall integrated circuit module is positioned in the mounting groove when the Hall integrated circuit assembly is mounted on the end cover.

Description

Hall integrated circuit mounting structure

Technical Field

The application relates to the technical field of brushless direct current motors, and particularly provides a Hall integrated circuit mounting structure.

Background

Hall integrated circuit is used for detecting the position of the rotor in the brushless DC motor, and provide the commutation signal for the controller and realize the brushless commutation of the DC motor, Hall integrated circuit installs and forms the printed plate assembly on the printed plate in the existing brushless DC motor, then the reverse side of installing the Hall integrated circuit casing on the printed plate assembly contacts with the plane on the end cover or the casing, fix the printed plate assembly on the end cover or the casing of the motor, the casing of the Hall integrated circuit on the printed plate assembly is in the suspended state, when the motor bears the bigger vibration, the pin of the Hall integrated circuit is easy to break because of the overlarge swing of the casing of the Hall integrated circuit.

Disclosure of Invention

In order to solve at least one of the above technical problems, the present application provides a hall ic assembly mounting structure, the hall ic assembly including a plurality of hall ic modules, the mounting structure including: the Hall integrated circuit assembly comprises an end cover provided with a center hole and an annular baffle fixedly connected with the end cover, wherein the end cover is positioned in an area defined by the annular baffle and is provided with a mounting groove of the Hall integrated circuit module, so that the Hall integrated circuit module is positioned in the mounting groove when the Hall integrated circuit assembly is mounted on the end cover.

According to at least one embodiment of the application, the hall integrated circuit assembly further comprises a printed board and a lead wire connected with the printed board, and the plurality of hall integrated circuit modules are fixedly connected with the printed board and electrically connected with the lead wire.

According to at least one embodiment of the application, the printed board is semicircular, and the plurality of Hall integrated circuit modules are uniformly distributed at the edge of the printed board close to the circle center of the printed board, so that when the Hall integrated circuit assembly is installed on the end cover, the Hall integrated circuit modules are located in the installation groove.

According to at least one embodiment of the present application, a radial width of the mounting groove is greater than a width of the hall ic module.

According to at least one embodiment of the application, the end cover is provided with a mounting hole, the printed board is provided with an adjusting hole, and the printed board penetrates through the adjusting hole through a fixing bolt to be mounted in the mounting hole.

According to at least one embodiment of the present application, the adjusting holes are bar-shaped holes distributed in a circumferential direction of the printed board.

According to at least one embodiment of the application, the inner side of the central hole is provided with a plurality of permanent magnets.

According to at least one embodiment of the present application, the magnetic steel center points of the plurality of permanent magnets face the magnetic field sensitive points of the hall ic module.

In the hall ic mounting structure provided in the embodiment of the present application, the mounting groove is formed in the end cover, so that when the hall ic is mounted on the end cover, the hall ic module is located in the mounting groove, that is, the mounting groove in the end cover is utilized to limit the swing of the hall ic module under the vibration condition, thereby preventing the pin of the hall ic from being broken, and greatly improving the anti-vibration capability of the hall ic and the working reliability of the brushless dc motor.

Drawings

FIG. 1 is a schematic diagram of a Hall integrated circuit assembly provided by an embodiment of the present application;

FIG. 2 is a schematic diagram of a Hall integrated circuit assembly mounting structure provided by an embodiment of the present application;

fig. 3 is a schematic mounting diagram of a hall ic assembly according to an embodiment of the present disclosure.

Wherein:

10. a Hall integrated circuit component; 11. a Hall integrated circuit module; 12. printing a board; 13. a wire; 14. an adjustment hole; 15. fixing the bolt; 20. an end cap; 21. a central bore; 22. an annular baffle; 23. mounting grooves; 24. and (7) installing holes.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant application and are not limiting of the application. It should be noted that, for convenience of description, only the portions related to the present application are shown in the drawings.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

It should be noted that in the description of the present application, the terms of direction or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Furthermore, it should be noted that, in the description of the present application, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those skilled in the art as the case may be.

Fig. 1 is a schematic structural diagram of a hall ic assembly according to an embodiment of the present disclosure.

As shown in fig. 1, the hall ic assembly includes a hall ic module 11, a printed board 12 and a conducting wire 13, wherein the printed board 12 is in a semicircular shape, a plurality of hall ic modules 11 are disposed on the printed board 12, and the hall ic module 11 is fixedly connected to the printed board 12, for example, by soldering pins of the hall ic module 11 to the printed board 12; the lead 13 is electrically connected to the hall ic module 11, for example, the lead 12 is soldered to a pin of the hall ic module 11; the plurality of hall ic modules 11 are uniformly distributed at the edge of the printed board 12 close to the center of the circle.

Fig. 2 is a schematic structural diagram of a hall ic assembly mounting structure provided in the embodiment of the present application, and fig. 3 is a schematic mounting diagram of a hall ic assembly provided in the embodiment of the present application.

As shown in fig. 2 and 3, the hall ic assembly mounting structure includes an end cover 20 having a central hole 21, and an annular baffle 22 fixedly connected to the end cover 20, where the end cover 20 is located in an area surrounded by the annular baffle 22, and is provided with a mounting groove 23 of the hall ic module 11, the mounting groove 23 is located outside the central hole 21, and a radial width of the mounting groove 23 is greater than a width of the hall ic module 11, so that when the hall ic assembly is mounted on the end cover 20, the hall ic modules 11 are all located in the mounting groove 23.

In some optional embodiments, the end cap 20 is provided with a mounting hole 24, the printed board 12 is provided with an adjusting hole 14, the adjusting hole 14 is a strip-shaped hole distributed along the circumferential direction of the printed board 12, when the hall ic assembly 10 is mounted on the end cap 20, the fixing bolt 15 penetrates through the adjusting hole 14 and is connected to the mounting hole 24 to fix the hall ic assembly, and due to the existence of the adjusting hole 14, the mounting position of the hall ic assembly 10 on the end cap 20 can be adjusted.

In some alternative embodiments, a plurality of permanent magnets are disposed inside the central hole 21 of the end cap 20, and magnetic steel central points of the plurality of permanent magnets face the magnetic field sensitive point of the hall ic module 11.

So far, the technical solutions of the present application have been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the present application is obviously not limited to these specific embodiments. Equivalent changes or substitutions of related technical features can be made by those skilled in the art without departing from the principle of the present application, and the technical scheme after the changes or substitutions will fall into the protection scope of the present application.

Claims

1. A hall ic assembly mounting structure, the hall ic assembly (10) including a plurality of hall ic modules (11), characterized in that the mounting structure comprises:

the Hall IC module comprises an end cover (20) provided with a central hole (21) and an annular baffle plate (22) fixedly connected with the end cover (20), wherein the end cover (20) is positioned in an area surrounded by the annular baffle plate (22) and is provided with a mounting groove (23) of the Hall IC module (11), so that when the Hall IC module (10) is mounted on the end cover (20), the Hall IC module (11) is positioned in the mounting groove (23);

the inner side of the central hole (21) is provided with a plurality of permanent magnets, and the magnetic steel central points of the permanent magnets are over against the magnetic field sensitive point of the Hall integrated circuit module (11);

the Hall integrated circuit assembly (10) further comprises a printed board (12) and a lead (13) connected with the printed board, the Hall integrated circuit modules (11) are fixedly connected with the printed board (12) and are electrically connected with the lead (13), wherein welding points of the lead (13) and the printed board (12) are respectively arranged on two board surfaces of the printed board (12);

the printed board (12) is semicircular, and the Hall integrated circuit modules (11) are uniformly distributed at the edge of the printed board (12) close to the circle center of the printed board, so that when the Hall integrated circuit assembly (10) is installed on the end cover (20), the Hall integrated circuit modules (11) are positioned in the installation groove (23).

2. The hall ic assembly mounting structure according to claim 1, wherein the radial width of the mounting groove (23) is larger than the width of the hall ic module (11).

3. The hall ic assembly mounting structure according to claim 1, wherein the end cap (20) is provided with a mounting hole (24), the printed board (12) is provided with an adjusting hole (14), and the printed board (12) is mounted in the mounting hole (24) through the adjusting hole (14) by a fixing bolt (15).

4. The hall ic assembly mounting structure according to claim 3, wherein the adjusting holes (14) are strip-shaped holes distributed in a circumferential direction of the printed board (12).