CN217131401U - Substrate structure - Google Patents
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Abstract
本实用新型提供一种结构简单、散热效率高,且能够实现制造成本的降低的基板结构。本实用新型的基板结构包括基板主体(30)和配置于基板主体(30)的电子零件,基板结构具备电流传感器(40),该电流传感器(40)具备环状的芯(42),在一个基板主体(30)上连接有连接器(33)和穿过芯(42)的电流配线(31)的两端部,连接器(33)连接电流传感器(40)的传感器配线(44)。
The utility model provides a base plate structure with simple structure, high heat dissipation efficiency and reduction of manufacturing cost. The substrate structure of the present invention comprises a substrate main body (30) and electronic components arranged on the substrate main body (30), the substrate structure is provided with a current sensor (40), the current sensor (40) is provided with an annular core (42), A connector (33) and both ends of the current wiring (31) passing through the core (42) are connected to the substrate body (30), and the connector (33) is connected to the sensor wiring (44) of the current sensor (40). .
Description
技术领域technical field
本公开涉及基板结构。The present disclosure relates to substrate structures.
背景技术Background technique
专利文献1中公开有一种电流传感器,该电流传感器如下构成:冲裁高相对磁导率特性的金属磁性板,在以900℃以上的温度进行了氢中热处理的磁芯的内侧设置接近磁隙的第一V槽和接近磁路的根部的第二V槽,在与第二V槽对置的磁路的根部设置基板支承部,从磁隙插入实施了在插入磁芯的内侧安装有止动件的绕阻的线圈线轴,在两个V槽位置向内侧折弯磁芯,将基板、线圈线轴以及磁芯一体地成形。Patent Document 1 discloses a current sensor configured by punching out a metal magnetic plate with high relative permeability characteristics, and providing a near magnetic gap inside a magnetic core heat-treated in hydrogen at a temperature of 900° C. or higher. The first V-slot and the second V-slot close to the base of the magnetic circuit, a substrate support part is provided at the base of the magnetic circuit opposite to the second V-slot, and the insertion from the magnetic gap is implemented. The coil bobbin of the winding of the moving element is bent inward at two V-slot positions, and the substrate, the coil bobbin, and the magnetic core are integrally formed.
现有技术文献prior art literature
专利文献Patent Literature
专利文献1:日本特开平05-052871号公报Patent Document 1: Japanese Patent Application Laid-Open No. 05-052871
发明内容SUMMARY OF THE INVENTION
实用新型所要解决的技术课题The technical problem to be solved by the utility model
本公开提供结构简单、散热效率高,且可实现制造成本的降低的基板结构。The present disclosure provides a substrate structure with a simple structure, high heat dissipation efficiency, and reduced manufacturing cost.
用于解决技术课题的技术方案Technical solutions for solving technical problems
本公开提供一种基板结构,其包括基板主体和配置于所述基板主体的电子零件,其中,该基板结构具备电流传感器,该电流传感器具备环状的芯,在一个所述基板主体上连接有连接器和穿过所述芯的电流配线的两端部,所述连接器连接所述电流传感器的传感器配线。The present disclosure provides a substrate structure including a substrate main body and electronic components arranged on the substrate main body, wherein the substrate structure includes a current sensor, the current sensor includes a ring-shaped core, and one of the substrate main bodies is connected with a A connector and both ends of the current wiring passing through the core, the connector connecting the sensor wiring of the current sensor.
实用新型的效果The effect of the utility model
本公开的基板结构在进行基板主体的更换的情况下,无需进行电流配线的连接的卸下作业及电流传感器的传感器配线的卸下作业。因此,在更换基板主体时,能够抑制产生新基板主体上的连接错误及电流传感器的安装方向的错误等。In the board structure of the present disclosure, when the board body is replaced, it is not necessary to perform the work of removing the connection of the current wiring and the work of removing the sensor wiring of the current sensor. Therefore, when the board main body is replaced, it is possible to suppress the occurrence of a connection error on the new board main body, an error in the mounting direction of the current sensor, and the like.
附图说明Description of drawings
图1是实施方式1的空调的室外机的立体图。FIG. 1 is a perspective view of an outdoor unit of an air conditioner according to Embodiment 1. FIG.
图2是表示实施方式1的基板主体的主视图。FIG. 2 is a front view showing a substrate main body according to Embodiment 1. FIG.
图3是表示实施方式1的基板主体的立体图。3 is a perspective view showing a substrate main body according to Embodiment 1. FIG.
图4是表示实施方式1的电流传感器的芯的说明图。4 is an explanatory diagram showing the core of the current sensor according to the first embodiment.
图5是表示实施方式1的电流配线和电流传感器的关系的说明图。5 is an explanatory diagram showing the relationship between the current wiring and the current sensor according to the first embodiment.
图6是表示实施方式1的电流传感器和基板主体的关系的说明图。6 is an explanatory diagram showing the relationship between the current sensor and the substrate main body according to the first embodiment.
具体实施方式Detailed ways
(作为本公开基础的见解等)(Insights, etc., on which this disclosure is based)
在实用新型发明人等想到本公开时,具有如下磁传感器,在磁芯的磁路中设置磁隙,在磁路的间隙之间设置磁检测元件,对磁路实施绕阻并向该绕阻流通被测定电流,由此检测电流值。When the present inventors thought of the present disclosure, there is a magnetic sensor in which a magnetic gap is provided in a magnetic circuit of a magnetic core, a magnetic detection element is provided between the gaps of the magnetic circuit, and winding resistance is applied to the magnetic circuit and the winding resistance is connected to the magnetic circuit. The current value is detected by flowing the current to be measured.
在这种磁传感器中进行的是,将初级侧的电流配线的两端部分别连接于不同的基板,将磁传感器的检测用的配线与一基板连接。In such a magnetic sensor, both ends of the primary-side current wiring are connected to different substrates, respectively, and the detection wiring of the magnetic sensor is connected to one substrate.
但是,在将初级侧的电流配线的两端分别连接于不同的基板的情况下,在通过维修检查等更换基板时,需要卸下电流配线及电流传感器。另外,实用新型发明人等发现在组装电流配线及电流传感器时,可能产生电流传感器的忘记安装、安装位置的错误、电流传感器的安装方向的错误等之类的课题,为了解决该课题,构成本公开的主题。However, when both ends of the primary-side current wiring are connected to different substrates, the current wiring and the current sensor need to be removed when the substrate is replaced by maintenance and inspection. In addition, the inventors of the utility model discovered that when assembling the current wiring and the current sensor, problems such as forgetting to install the current sensor, wrong installation position, wrong installation direction of the current sensor, etc. may occur. In order to solve the problem, the subject of the present disclosure.
因此,本公开提供一种基板结构,在更换基板主体时,无需卸下电流配线及电流传感器,能够抑制产生新基板主体中的连接错误及电流传感器的安装方向的错误等。Therefore, the present disclosure provides a board structure that does not require removal of the current wiring and the current sensor when the board body is replaced, and can suppress the occurrence of connection errors in the new board body, errors in the mounting direction of the current sensor, and the like.
以下,参照附图详细地说明实施方式。但是,有时省略必要以上的详细说明。例如,有时省略已经众所周知的事项的详细说明、或对实质上相同的结构的重复说明。这是为了避免以下的说明过于冗长,使本领域技术人员容易理解。Hereinafter, embodiments will be described in detail with reference to the drawings. However, the detailed description more than necessary may be omitted in some cases. For example, detailed descriptions of already well-known matters or repeated descriptions of substantially the same structures may be omitted. This is to prevent the following description from being too long and to make it easy for those skilled in the art to understand.
此外,附图及以下的说明是为了使本领域技术人员充分理解本公开而提供的,并不意图通过这些来限定实用新型注册请求的范围所记载的主题。In addition, the accompanying drawings and the following description are provided for those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the scope of the utility model registration request.
(实施方式1)(Embodiment 1)
以下,使用附图说明实施方式1。Hereinafter, Embodiment 1 will be described with reference to the drawings.
[1-1.结构][1-1. Structure]
[1-1-1.室外机的结构][1-1-1. Structure of outdoor unit]
图1是本实施方式的空调的室外机1的立体图。图2是基板主体的主视图。图3是基板主体的立体图。FIG. 1 is a perspective view of an outdoor unit 1 of an air conditioner according to the present embodiment. FIG. 2 is a front view of the substrate main body. 3 is a perspective view of a substrate body.
如图1所示,本实施方式的室外机1是通过沿着侧面配置的室外热交换器向内部吸入空气,将该空气与制冷剂进行热交换并从另一侧面吹出的被称为所谓的侧流方式或侧吹型的室外机。As shown in FIG. 1 , the outdoor unit 1 of the present embodiment sucks air into the interior through an outdoor heat exchanger arranged along the side surface, exchanges heat with the refrigerant, and blows out the air from the other side surface, so-called so-called Side-flow or side-blown outdoor unit.
如图1所示,室外机1具备长边方向沿着上下方向延伸的箱状的框体(壳体)10。在本实施方式中,框体10的各部均由钢板形成。As shown in FIG. 1 , the outdoor unit 1 includes a box-shaped casing (housing) 10 extending in the vertical direction in the longitudinal direction. In this embodiment, each part of the
框体10具备:形成框体10的底面的底面面板11、形成顶面的顶面面板12、形成前面的一部分的前面面板13、形成侧面的侧面面板14、和形成背面的背面面板15。The
在框体10的内部设置有隔板16。利用隔板16将框体10的内部空间隔开成热交换室17和机械室18。A
前面面板13是与隔板16和侧面面板14一起包围热交换室17的板状部件。在前面面板13上,沿着框体10的上下方向并排设置有两个排气口20。该排气口20是使框体10的外部和热交换室17连通的开口。在本实施方式中,在排气口20设置有网状的保护部件21。The
在热交换室17中设置有室外热交换器22和两个送风机23。An outdoor heat exchanger 22 and two
本实施方式的室外热交换器22沿着框体10的高度方向延伸,以与框体10的侧面和背面对置的方式,折弯成俯视框体10时为大致L字状,并收容于热交换室17中。The outdoor heat exchanger 22 of the present embodiment extends in the height direction of the
本实施方式的送风机23是具备螺旋桨状的叶轮的所谓的轴流风机。送风机23中的每一个被配置为轴流方向朝向排气口20。The
在机械室18的内部收容有压缩机24、膨胀阀等形成制冷回路的各种设备、将它们相互连接的制冷剂配管、以及电装零件25。The inside of the
在机械室18中,压缩机24被载置固定于底面面板11上。In the
隔板16是沿着框体10的上下方向以规定的高度尺寸延伸,并且沿着框体10的前后方向延伸的板状部件。The
隔板16通过下端与底面面板11连结而固定于框体10上,上端抵接于顶面面板12。隔板16将位于框体10的前面侧的端部与前面面板13连结,将位于框体10的背面侧的端部与背面板连结。The
此外,虽未图示,但在隔板16的上端设置有将机械室18和热交换室17连通的切口。In addition, although not shown, the upper end of the
[1-1-2.基板主体的结构][1-1-2. Structure of the substrate body]
如图1所示,在机械室18的上方安装有电装零件25。电装零件25具备形成规定的导电图案的基板主体30。As shown in FIG. 1 ,
如图2和图3所示,基板主体30以规定间隔与隔板16大致平行地配置。As shown in FIGS. 2 and 3 , the substrate
在基板主体30上搭载有晶体管、电容器、电阻等各种电子零件。Various electronic components such as transistors, capacitors, and resistors are mounted on the
在本实施方式中,在基板主体30上连接有初级侧的两条电流配线31、31。电流配线31将其两端部通过软钎焊(焊接)连接于基板主体30的规定的端子32。此外,也可以通过螺丝或快接端子固定于端子32。In the present embodiment, two primary-side current wirings 31 and 31 are connected to the substrate
电流配线31相对于端子32间的距离具有更长的线长。因此,在将电流配线31与端子32连接的状态下,电流配线31弧状地保持成其中央部从基板主体30分开的状态。The
电流配线31例如是用于向压缩机24等流通较大电流的电流配线31。The
在电流配线31上分别设置有电流传感器40、40。电流传感器40具备在中央形成有孔部41的环状的芯42。电流配线31配置为穿过电流传感器40的芯42的孔部41。
然后,电流传感器40的芯42通过扎带或胶带等保持部件43固定于电流配线31上。Then, the
电流传感器40具备传感器配线44。The
在基板主体30的连接电流配线31的端子32之间安装有传感器用的连接器33。在连接器33上连接有两个电流传感器40的传感器配线44。A
两个电流传感器40的传感器配线44以不与基板主体30的表面接触的方式被胶带(线带、束带)45而汇集一起。The
在电流传感器40的芯42的外周面上贴附有对于芯42显示识别电流传感器40的标识及电流的方向的标签46。On the outer peripheral surface of the
此外,在基板主体30的表面侧设置有包覆基板主体30的前面面板50(参照图6)。Moreover, the front panel 50 (refer FIG. 6) which covers the board|substrate
图4是说明电流传感器40的芯42的说明图。图5是表示电流配线31和电流传感器40的关系的说明图。图6是表示电流传感器40和基板主体30的关系的说明图。FIG. 4 is an explanatory diagram illustrating the
如图4所示,将电流传感器40的芯42的内半径设为d1,将芯42的外半径设为d2,如图5所示,将芯42固定位置处的从初级侧配线到距基板的高度设为h。另外,如图6所示,将初级侧的电流配线31的直径设为将前面面板50和基板主体30的距离设为H。As shown in FIG. 4 , the inner radius of the
在该情况下,基板主体30和芯42的外周面的空间距离m1为:In this case, the spatial distance m1 between the outer peripheral surfaces of the substrate
因此,以确保m1>0的方式确定h,h根据初级侧的电流配线31的长度或向基板主体30的连接位置进行调整。Therefore, h is determined so as to ensure m1>0, and h is adjusted according to the length of the primary-side
另外,基板主体30和前面面板50的空间距离m2为:In addition, the spatial distance m2 between the substrate
m2=H-h-d1-d2。m2=H-h-d1-d2.
因此,以确保m2>0的方式确定H,H根据初级侧的电流配线31的长度或向基板主体30的连接位置进行调整。Therefore, H is determined so as to ensure m2>0, and H is adjusted according to the length of the primary-side
[1-2.动作][1-2. Action]
接着,对以上那样构成的室外机1说明其动作。Next, the operation of the outdoor unit 1 configured as described above will be described.
当室外机1开始工作时,送风机23开始旋转驱动。通过该送风机23的旋转驱动,外部气体经由室外热交换器22流入热交换室17,与室外热交换器22进行热交换后,排出至室外机的外部。When the outdoor unit 1 starts to operate, the
而且,在基板主体30发生了故障的情况下,全部更换基板主体30。Moreover, when the board|substrate
即,在本实施方式中,在一个基板主体30上连接电流配线31的两端部,并且被各电流配线31插通的电流传感器40的传感器配线44也与相同的基板主体30的连接器33连接。That is, in the present embodiment, both ends of the
因此,在进行基板主体30的更换的情况下,无需进行电流配线31的连接的卸下作业及电流传感器40的传感器配线44的卸下作业。Therefore, when replacing the board
[1-3.效果等][1-3. Effects, etc.]
如上,在本实施方式,具备基板主体30和配置于基板主体30的电子零件,且具备电流传感器40,该电流传感器40具备环状的芯42,在一个基板主体30上连接有连接器33和穿过芯42的电流配线31的两端部,该连接器33连接电流传感器40的传感器配线44。As described above, in the present embodiment, the substrate
由此,在进行基板主体30的更换的情况下,无需进行电流配线31的连接的卸下作业及电流传感器40的传感器配线44的卸下作业。因此,在更换基板主体30时,能够抑制产生新基板主体30中的连接错误及电流传感器40的安装方向的错误等。Thereby, when the board
另外,在本实施方式中,电流传感器40利用保持部件43相对于电流配线31固定。In addition, in the present embodiment, the
由此,能够抑制电流传感器40相对于电流配线31移动。Thereby, the movement of the
另外,在本实施方式中,电流配线31设置两条,分别设置于两条电流配线31的电流传感器40的传感器配线44与一个连接器33连接。In addition, in the present embodiment, two
由此,能够集中设置电流传感器40的传感器配线44。Thereby, the sensor wirings 44 of the
另外,在本实施方式中,以确保基板主体30和芯42的外周面的空间距离的方式,设定电流配线31的高度位置。In addition, in this embodiment, the height position of the
由此,能够抑制基板主体30和芯42的外周面接触。因此,能够抑制电流传感器40与基板主体30接触而产生短路等。Thereby, the contact between the outer peripheral surfaces of the substrate
另外,在本实施方式中,具备包覆基板主体30的表面的前面面板50,以确保前面面板50和芯42的外周面的空间距离的方式设定电流配线31的高度位置。In addition, in this embodiment, the
由此,能够抑制前面面板50和芯42的外周面接触。因此,能够抑制电流传感器40与前面面板50接触而产生短路等。Thereby, the contact between the
(其它实施方式)(Other Embodiments)
如上,作为本申请中公开的技术的示例,说明了实施方式1。但是,本公开中的技术不限定于此,还能够适用于进行了变更、置换、附加、省略等的实施方式。As above, Embodiment 1 has been described as an example of the technology disclosed in this application. However, the technology in the present disclosure is not limited to this, and can be applied to embodiments in which changes, substitutions, additions, omissions, and the like are made.
因此,以下,示例其它的实施方式。Therefore, other embodiments are exemplified below.
在实施方式1中,以将基板结构应用于空调的室外机的情况为例进行了说明,但除此之外,只要是搭载有电流配线31及电流传感器40的基板主体30,则也可应用于任意的基板结构。In Embodiment 1, the case where the substrate structure is applied to an outdoor unit of an air conditioner has been described as an example, but other than this, the
[由上述实施方式支持的结构][Structure supported by the above embodiment]
上述实施方式支持以下的结构。The above-described embodiment supports the following structures.
(结构1)(Structure 1)
一种基板结构,其包括基板主体和配置于上述基板主体的电子零件,其中,该基板结构具备电流传感器,该电流传感器具备环状的芯,在一个上述基板主体上连接有连接器和穿过上述芯的电流配线的两端部,上述连接器连接上述电流传感器的传感器配线。A board structure including a board body and an electronic component disposed on the board body, wherein the board structure includes a current sensor, the current sensor includes a ring-shaped core, and a connector and a pass-through are connected to one of the board bodies. Both ends of the current wiring of the core, and the connector is connected to the sensor wiring of the current sensor.
根据该结构,在进行基板主体的更换的情况下,无需进行电流配线的连接的卸下作业及电流传感器的传感器配线的卸下作业。因此,在更换基板主体时,能够抑制产生新基板主体中的连接错误及电流传感器的安装方向的错误等。According to this structure, when replacing|exchanging a board|substrate main body, it becomes unnecessary to perform the removal work of the connection of a current wiring, and the removal work of the sensor wiring of a current sensor. Therefore, when the board main body is replaced, it is possible to suppress the occurrence of connection errors in the new board main body, errors in the mounting direction of the current sensor, and the like.
(结构2)(Structure 2)
根据结构1所记载的基板结构,其中,上述电流传感器利用保持部件相对于上述电流配线固定。According to the board structure of the structure 1, the said current sensor is fixed with respect to the said current wiring by the holding member.
根据该结构,能够抑制电流传感器相对于电流配线移动。According to this structure, movement of the current sensor with respect to the current wiring can be suppressed.
(结构3)(Structure 3)
根据结构1或结构2所记载的基板结构,其中,上述电流配线设置两条,分别设置于两条上述电流配线的上述电流传感器的上述传感器配线与一个上述连接器连接。The substrate structure according to Structure 1 or Structure 2, wherein two current wirings are provided, and the sensor wirings of the current sensors provided on the two current wirings are connected to one of the connectors.
根据该结构,能够集中设置电流传感器的传感器配线。According to this structure, the sensor wiring of a current sensor can be provided collectively.
(结构4)(Structure 4)
根据结构1~结构3中任一项所记载的基板结构,其中,以确保上述基板主体和上述芯的外周面的空间距离的方式,设定上述电流配线的高度位置。The board structure according to any one of Structures 1 to 3, wherein the height position of the current wiring is set so as to ensure a spatial distance between the board main body and the outer peripheral surface of the core.
根据该结构,能够抑制基板主体和芯的外周面接触。因此,能够抑制电流传感器与基板主体接触而产生短路等。According to this configuration, it is possible to suppress the contact between the substrate main body and the outer peripheral surface of the core. Therefore, it is possible to suppress the occurrence of a short circuit or the like due to contact of the current sensor with the substrate main body.
(结构5)(Structure 5)
根据结构1~结构4中任一项所记载的基板结构,其中,具备包覆上述基板主体的表面的前面面板,以确保上述前面面板和上述芯的外周面的空间距离的方式,设定上述电流配线的高度位置。The substrate structure according to any one of Configurations 1 to 4, wherein the front panel is provided which covers the surface of the substrate main body, and the above-mentioned front panel is set so as to ensure a spatial distance between the front panel and the outer peripheral surface of the core. The height position of the current wiring.
根据该结构,能够抑制前面面板和芯的外周面接触。因此,能够抑制电流传感器与前面面板接触而产生短路等。According to this structure, the contact between the front panel and the outer peripheral surface of the core can be suppressed. Therefore, it is possible to suppress the occurrence of a short circuit or the like due to contact of the current sensor with the front panel.
产业上的可利用性Industrial Availability
本公开可利用于基板结构,该基板结构能够在更换基板主体时,抑制产生新基板主体中的连接错误及电流传感器的安装方向的错误等。The present disclosure can be applied to a board structure capable of suppressing the occurrence of connection errors in the new board body, errors in the mounting direction of the current sensor, and the like when the board body is replaced.
附图标记说明Description of reference numerals
1 室外机1 Outdoor unit
10 框体(壳体)10 Frame (shell)
16 隔板16 Separator
17 热交换室17 Heat Exchange Chamber
18 机械室18 Mechanical Room
20 排气口20 Exhaust port
21 保护部件21 Protective parts
22 室外热交换器22 Outdoor heat exchanger
23 送风机23 Blower
24 压缩机24 compressor
25 电装零件25 Denso Parts
30 基板主体30 Substrate body
31 电流配线31 Current wiring
32 端子32 terminals
33 连接器33 Connector
40 电流传感器40 Current sensor
41 孔部41 hole
42 芯42 cores
43 保持部件43 Holding parts
44 传感器配线44 Sensor wiring
45 胶带45 Tape
46 标签46 Labels
50 前面面板。50 Front panel.
Claims (5)
Priority Applications (1)
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CN202220730455.9U CN217131401U (en) | 2022-03-31 | 2022-03-31 | Substrate structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202220730455.9U CN217131401U (en) | 2022-03-31 | 2022-03-31 | Substrate structure |
Publications (1)
Publication Number | Publication Date |
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CN217131401U true CN217131401U (en) | 2022-08-05 |
Family
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CN202220730455.9U Active CN217131401U (en) | 2022-03-31 | 2022-03-31 | Substrate structure |
Country Status (1)
Country | Link |
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CN (1) | CN217131401U (en) |
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