CN109192511A - Capacitance connection structure and capacitor process for filling colloid - Google Patents
Capacitance connection structure and capacitor process for filling colloid Download PDFInfo
- Publication number
- CN109192511A CN109192511A CN201811089135.4A CN201811089135A CN109192511A CN 109192511 A CN109192511 A CN 109192511A CN 201811089135 A CN201811089135 A CN 201811089135A CN 109192511 A CN109192511 A CN 109192511A
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- capacitor
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- gel column
- conducting wire
- rubber column
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/26—Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/0003—Protection against electric or thermal overload; cooling arrangements; means for avoiding the formation of cathode films
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
This application discloses capacitance connection structure and capacitor process for filling colloid, capacitance connection structure provided by the present invention includes at least one capacitor, it further include rubber column gel column and conducting wire, the rubber column gel column is fixed together with capacitor, and the terminals of capacitor are located in the rubber column gel column, the capacitor other end is located at outside rubber column gel column, and the conducting wire is fixed in rubber column gel column, and conducting wire one end connects with the terminals of capacitor, the conducting wire other end is located at outside rubber column gel column；When capacitor has it is multiple when, the terminals of capacitor and capacitor interconnect.This capacitance connection structure has the following beneficial effects: that the connection of the terminals and conducting wire of capacitor is sealed by rubber column gel column, and capacitor one end is located at outside rubber column gel column, and heat dissipation effect is more preferable.
Description
Technical field
The present invention relates to glue field more particularly to a kind of capacitance connection structure and capacitor process for filling colloid.
Background technique
Deep well pump is widely used in farmland discharging-irrigating, industrial and mining enterprises, urban water supply and sewerage and sewage treatment etc., and controller is deep
Indispensable components on well pump, controller include that mainboard, capacitor (can be ABB capacitor or electrolytic capacitor, but due to ABB electricity
It is small to hold capacity, so what is used now is substantially electrolytic capacitor) and other components, since controller is to need to be immersed in liquid
In body (heat dissipation oil), so the junction between capacitor and capacitor must take seal approach, at present for capacitor and capacitor it
Between junction using the sealing means (wrapping up entire capacitor with glue or other materials) of embedding gluing, and use
The heat that the sealing means of embedding gluing can make capacitor generate in use is not easy to distribute, so that the temperature of capacitor
Excessively high, the safety of capacitor cannot ensure.
Summary of the invention
The present invention is in view of the above-mentioned problems, propose a kind of capacitance connection structure and capacitor process for filling colloid.
The technical solution adopted by the present invention is as follows:
A kind of capacitance connection structure, including at least one capacitor, further include rubber column gel column and conducting wire, and the rubber column gel column is fixed with capacitor
It links together, and the terminals of capacitor are located in the rubber column gel column, the capacitor other end is located at outside rubber column gel column, and the conducting wire is fixed on
In rubber column gel column, and conducting wire one end connects with the terminals of capacitor, and the conducting wire other end is located at outside rubber column gel column；When capacitor has it is multiple when, capacitor
It interconnects with the terminals of capacitor.
It has been fixed on together with conducting wire by rubber column gel column sealing in this structure due to capacitor, simultaneously because the terminals of capacitor are
In rubber column gel column, and the other end of capacitor is outside rubber column gel column, so the heat dissipation effect of capacitor is more preferable, when capacitor have it is multiple
When, the terminals of capacitor and capacitor link together, and the terminals of each capacitor are respectively positioned in rubber column gel column.The 1/4 of specific capacitor
~1/2 length (depending on specific degree of heat radiation) is located in rubber column gel column, and the rest part of capacitor is located at outside rubber column gel column.
The connection of the terminals and conducting wire of capacitor is sealed by rubber column gel column in the present apparatus, and capacitor one end is located at outside rubber column gel column, is dissipated
Thermal effect is more preferable.
Optionally, there are two the capacitors, the terminals of two capacitors, which are mutually paired, to link together, and the conducting wire has two
Root connects with the positive terminal of capacitor and negative terminals respectively.
Optionally, the rubber column gel column is linear rubber column gel column.
A kind of capacitor process for filling colloid, includes the following steps:
S1: the terminals of capacitor are linked together with conducting wire, when capacitor has it is multiple when, by the terminals phase of multiple capacitors
Interconnection is connected together；
S2: capacitor is filled in sleeve, and the terminals of capacitor are respectively positioned in sleeve；
S3: bisphenol A epoxide resin or polyurethane, diluent, aluminium hydroxide, barium sulfate, carbon black and amine curing agent are pressed
Ratio mixes resulting mixture, and 2min~3min is stirred under conditions of mixture is placed in 20 DEG C~30 DEG C.
S4: by the mixture after stirring toward sleeve inner canister, stop when the terminals of two capacitors are submerged in mixture
Only filling, 3h~4h waits for its solidification under conditions of placing it in 20 DEG C~30 DEG C after stopping encapsulating.
Specifically before carrying out filling mixture operation to capacitor, need first to peel off the insulating film near capacitor terminals, then
Filling mixture operation is carried out again, these can be such that the conducting end in capacitor directly contacts with mixture (can guarantee capacitor in this way
There is no gaps between last rubber column gel column), filling effect is more preferable.While it is noted that capacitor cannot be made to be totally submerged
In mixture, it is necessary to assure it is outer (this is done to radiate) to be located at rubber column gel column for capacitive part after the completion of filling.It is solidifying in mixture
It when forming rubber column gel column, needs to remove in sleeve, sleeve can be the sleeve of diversified forms, can be plastics, be also possible to paper
Matter.It can use glue pouring machine when specific tank mixture and carry out encapsulating operation, also can use the fixation container with sharp mouth and fill.
Optionally, the diluent be glycidol ether or toluene or ethyl alcohol or acetone or butanol or dibutyl ester one kind or
It is several.
Optionally, the amine curing agent is the one or more of polyamide or phenolic aldehyde amine or fatty amine or aromatic amine.
Optionally, the bisphenol A epoxide resin or polyurethane, diluent, aluminium hydroxide, barium sulfate, carbon black and amine are solid
The ratio of agent are as follows: 10:3:10:5:1:7.5.
Optionally, the terminals week edge of the capacitor, which is not wrapped up, is covered with insulating film, and the terminals week of capacitor is along direct
It is contacted with mixture.
Because being enclosed with insulating film outside capacitor, capacitor terminals nearby tear insulating film off, and capacitor is exposed to glue
One end outside column, which is still wrapped up, is covered with insulating film.
The beneficial effects of the present invention are: the connection of the terminals and conducting wire of capacitor is sealed by rubber column gel column, and capacitor one end position
In outside rubber column gel column, heat dissipation effect is more preferable.
Detailed description of the invention:
Fig. 1 is 1 simplified schematic diagram of capacitance connection constructive embodiment；
Fig. 2 is 2 simplified schematic diagram of capacitance connection constructive embodiment；
Fig. 3 is 3 simplified schematic diagram of capacitance connection constructive embodiment.
Each appended drawing reference in figure are as follows: 1, capacitor, 101, terminals, 2, rubber column gel column, 3, conducting wire.
Specific embodiment:
Below with reference to each attached drawing, the present invention will be described in detail.
Embodiment 1:
It as shown in Fig. 1, including two capacitors 1, further include rubber column gel column 2 and conducting wire 3, rubber column gel column 2 and capacitor 1 are fixedly connected on one
It rises, and in the rubber column gel column 2 that is located at of the terminals 101 of capacitor 1,1 other end of capacitor is located at outside rubber column gel column 2, and the conducting wire 3 is fixed on rubber column gel column
On 2, and 3 one end of conducting wire connects with the terminals 101 of capacitor 1, and 3 other end of conducting wire is located at outside rubber column gel column 2；Capacitor 1 connects with capacitor 1
Line end 101 interconnects.1/4~1/2 length of capacitor 1 is located in rubber column gel column, and the rest part of capacitor 1 is located at rubber column gel column 2
Outside.
Embodiment 2:
It as shown in Fig. 2, including a capacitor 1, further include rubber column gel column 2 and conducting wire 3, rubber column gel column 2 and capacitor 1 are fixedly connected on one
It rises, and in the rubber column gel column 2 that is located at of the terminals 101 of capacitor 1,1 other end of capacitor is located at outside rubber column gel column 2, and the conducting wire 3 is fixed on rubber column gel column
On 2, and 3 one end of conducting wire connects with the terminals 101 of capacitor 1, and 3 other end of conducting wire is located at outside rubber column gel column 2.The 1/4~1/2 of capacitor 1
Length is located in rubber column gel column, and the rest part of capacitor 1 is located at outside rubber column gel column 2.
Embodiment 3
As shown in Fig. 3, including three capacitors 1, further include rubber column gel column 2 and conducting wire (be not drawn into conducting wire attached drawing 3, conducting wire with
Capacitor and conducting wire and the fit system of rubber column gel column as shown in embodiment 1 and embodiment 2), rubber column gel column 2 and capacitor 1 are fixedly connected on one
It rises, and in the rubber column gel column 2 that is located at of the terminals 101 of capacitor 1, the terminals 101 between capacitor 1 and capacitor 1 are connected to by conducting wire
Together, 1 other end of capacitor is located at outside rubber column gel column 2, and conducting wire is fixed in rubber column gel column 2, and 101 phase of terminals of 3 one end of conducting wire and capacitor 1
It connects, the conducting wire other end is located at outside rubber column gel column 2；1/4~1/2 length of capacitor 1 is located in rubber column gel column, and the rest part of capacitor 1 is located at glue
Outside column 2.It should be noted that in the present embodiment rubber column gel column be it is rectangular, being also possible to circular work in other embodiments, other are more
Side shape
The present invention also provides a kind of capacitor process for filling colloid, include the following steps:
S1: the terminals of capacitor are linked together with conducting wire, when capacitor has it is multiple when, by the terminals phase of multiple capacitors
Interconnection is connected together；
S2: capacitor is filled in sleeve, and the terminals of capacitor are respectively positioned in sleeve；
S3: bisphenol A epoxide resin, diluent, aluminium hydroxide, barium sulfate, carbon black and amine curing agent are mixed in proportion
Resulting mixture stirs 2min~3min under conditions of mixture is placed in 20 DEG C~30 DEG C.
S4: by the mixture after stirring toward sleeve inner canister, stop when the terminals of two capacitors are submerged in mixture
Only filling, 3h~4h waits for its solidification under conditions of placing it in 20 DEG C~30 DEG C after stopping encapsulating.
Specifically before carrying out filling mixture operation to capacitor, need first to peel off the insulating film near capacitor terminals, then
Filling mixture operation is carried out again, these can be such that the conducting end in capacitor directly contacts with mixture (can guarantee capacitor in this way
There is no gaps between last rubber column gel column), filling effect is more preferable.While it is noted that capacitor cannot be made to be totally submerged
In mixture, it is necessary to assure it is outer (this is done to radiate) to be located at rubber column gel column for capacitive part after the completion of filling.It is solidifying in mixture
It when forming rubber column gel column, needs to remove in sleeve, sleeve can be the sleeve of diversified forms, can be plastics, be also possible to paper
Matter.It can use glue pouring machine when specific tank mixture and carry out encapsulating operation, also can use the fixation container with sharp mouth and fill.
Further, diluent is one kind or several of glycidol ether or toluene or ethyl alcohol or acetone or butanol or dibutyl ester
Kind.
Further, amine curing agent is the one or more of polyamide or phenolic aldehyde amine or fatty amine or aromatic amine.
Further, the ratio of bisphenol A epoxide resin, diluent, aluminium hydroxide, barium sulfate, carbon black and amine curing agent
Are as follows: 10:3:10:5:1:7.5.
The above description is only a preferred embodiment of the present invention, not thereby limits scope of patent protection of the invention, all
It is directly or indirectly to be used in other relevant technologies with equivalent structure transformation made by description of the invention and accompanying drawing content
Field similarly includes within the scope of the present invention.
Claims (8)
1. a kind of capacitance connection structure, including at least one capacitor；It is characterized in that, further including rubber column gel column and conducting wire, the rubber column gel column
It is fixed together with capacitor, and the terminals of capacitor are located in the rubber column gel column, the capacitor other end is located at outside rubber column gel column, described
Conducting wire is fixed in rubber column gel column, and conducting wire one end connects with the terminals of capacitor, and the conducting wire other end is located at outside rubber column gel column；When capacitor have it is more
When a, the terminals of capacitor and capacitor interconnect.
2. capacitance connection structure as described in claim 1, which is characterized in that there are two the capacitors, the wiring of two capacitors
End, which is mutually paired, to link together, and the conducting wire has two, connects respectively with the positive terminal of capacitor and negative terminals.
3. capacitance connection structure as claimed in claim 2, which is characterized in that the rubber column gel column is linear rubber column gel column.
4. a kind of capacitor process for filling colloid suitable for the capacitance connection structure as described in 1~3 Arbitrary Term of right, which is characterized in that packet
Include following steps:
S1: the terminals of capacitor are linked together with conducting wire, when capacitor has it is multiple when, the terminals of multiple capacitors are mutually interconnected
It is connected together；
S2: capacitor is filled in sleeve, and the terminals of capacitor are respectively positioned in sleeve；
S3: in proportion by bisphenol A epoxide resin or polyurethane, diluent, aluminium hydroxide, barium sulfate, carbon black and amine curing agent
Resulting mixture is mixed, 2min~3min is stirred under conditions of mixture is placed in 20 DEG C~30 DEG C；
S4: by the mixture after stirring toward sleeve inner canister, stop filling when the terminals of two capacitors are submerged in mixture
It fills, 3h~4h waits for its solidification under conditions of placing it in 20 DEG C~30 DEG C after stopping encapsulating.
5. capacitor process for filling colloid as claimed in claim 4, which is characterized in that the diluent be glycidol ether or toluene or
The one or more of ethyl alcohol or acetone or butanol or dibutyl ester.
6. capacitor process for filling colloid as claimed in claim 4, which is characterized in that the amine curing agent is polyamide or phenolic aldehyde amine
Or the one or more of fatty amine or aromatic amine.
7. capacitor process for filling colloid as claimed in claim 4, which is characterized in that the bisphenol A epoxide resin or polyurethane, dilution
Agent, aluminium hydroxide, barium sulfate, carbon black and amine curing agent ratio are as follows: 10:3:10:5:1:7.5.
8. capacitor process for filling colloid as claimed in claim 4, which is characterized in that do not wrap up covering in the terminals week edge of the capacitor
There is an insulating film, and the terminals week of capacitor with mixture along directly contacting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811089135.4A CN109192511A (en) | 2018-09-18 | 2018-09-18 | Capacitance connection structure and capacitor process for filling colloid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811089135.4A CN109192511A (en) | 2018-09-18 | 2018-09-18 | Capacitance connection structure and capacitor process for filling colloid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109192511A true CN109192511A (en) | 2019-01-11 |
Family
ID=64908254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811089135.4A Pending CN109192511A (en) | 2018-09-18 | 2018-09-18 | Capacitance connection structure and capacitor process for filling colloid |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109192511A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203536224U (en) * | 2013-09-26 | 2014-04-09 | 铜陵市佳龙飞电容器有限公司 | Upper-lower epoxy resin seal structure for plastic housing capacitor |
| US20160249474A1 (en) * | 2012-12-13 | 2016-08-25 | Prologium Holding Inc. | Package structure of electronic modules with silicone sealing frame and the manufacturing method thereof |
| CN205959771U (en) * | 2016-02-04 | 2017-02-15 | 南通成晟电子实业有限公司 | Encapsulating cost is reduced special condenser of motor |
| CN107286887A (en) * | 2017-07-28 | 2017-10-24 | 上海回天新材料有限公司 | A kind of epoxyn and preparation method thereof |
| CN206742077U (en) * | 2017-03-24 | 2017-12-12 | 绍兴市上虞宏佳电子科技有限公司 | A kind of thin film capacitor of rapid heat dissipation |
| CN107722913A (en) * | 2017-09-15 | 2018-02-23 | 广东普赛达密封粘胶有限公司 | A kind of neoprene modified flame-retardant polyurethane sealant and preparation method thereof |
-
2018
- 2018-09-18 CN CN201811089135.4A patent/CN109192511A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160249474A1 (en) * | 2012-12-13 | 2016-08-25 | Prologium Holding Inc. | Package structure of electronic modules with silicone sealing frame and the manufacturing method thereof |
| CN203536224U (en) * | 2013-09-26 | 2014-04-09 | 铜陵市佳龙飞电容器有限公司 | Upper-lower epoxy resin seal structure for plastic housing capacitor |
| CN205959771U (en) * | 2016-02-04 | 2017-02-15 | 南通成晟电子实业有限公司 | Encapsulating cost is reduced special condenser of motor |
| CN206742077U (en) * | 2017-03-24 | 2017-12-12 | 绍兴市上虞宏佳电子科技有限公司 | A kind of thin film capacitor of rapid heat dissipation |
| CN107286887A (en) * | 2017-07-28 | 2017-10-24 | 上海回天新材料有限公司 | A kind of epoxyn and preparation method thereof |
| CN107722913A (en) * | 2017-09-15 | 2018-02-23 | 广东普赛达密封粘胶有限公司 | A kind of neoprene modified flame-retardant polyurethane sealant and preparation method thereof |
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Application publication date: 20190111 |